TWI777806B - Circuit board with test marks - Google Patents

Abstract

A circuit board with test marks is provided to solve the problem of slow and time-consuming test of conventional circuit boards. It comprises: a double-sided board, both sides of the double-sided board respectively have at least one use area and a waste area, the at least one use area has plural identical circuit units, the waste area is located at the outer periphery of the at least one use area, the at least one use area is rectangular, the at least one use area has two imaginary lines, and the two imaginary lines respectively form a straight line and pass through two set of opposite corners of the at least one use area; and both sides of the double-sided board respectively have four marking parts located at the waste area, each of the imaginary lines has two marking parts, the two marking parts on each imaginary line are respectively located on two opposite sides of the at least one use area, and the four marking parts respectively have plural test marks.

Description

Circuit board with inspection marks

The present invention relates to a circuit board, especially a circuit board with detection marks.

Thanks to today's technology, a large number of electronic products exist in our lives. In order to facilitate use and present more delicate effects, there is a gradual trend of miniaturization. On the contrary, the area of circuit units in electronic products is also shrinking. The circuit unit is fabricated on a conventional circuit board. Under the premise that the area of the circuit unit is shrinking, the number of circuit units on the circuit board is also increasing day by day. In some applications, a conventional circuit board can have tens of thousands of the circuit units at the same time.

However, the quality of each of the circuit units must be confirmed through a testing procedure. The above-mentioned conventional circuit board has a large number of such circuit units, which results in a slow and time-consuming detection work.

In view of this, the conventional circuit board design still needs to be improved.

In order to solve the above problems, the purpose of the present invention is to provide a circuit board with detection marks, which can easily and quickly detect the circuit board.

The directionality or similar terms used throughout the present disclosure, such as "front", "back", "left", "right", "top (top)", "bottom (bottom)", "inside", "outside" , "sideways", etc., mainly refer to the directions of the attached drawings, and the directional or similar terms are only used for auxiliary description and The embodiments of the present invention are understood and not intended to limit the present invention.

The use of the quantifier "a" or "an" for the elements and components described throughout the present invention is only for convenience and provides a general meaning of the scope of the present invention; in the present invention, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

The circuit board with detection mark of the present invention comprises: a double-sided board, two sides of the double-sided board respectively have at least one use area and a waste area, the at least one use area has the same number of circuit units, the waste area Located on the outer periphery of the at least one use area, the at least one use area is rectangular, the at least one use area has two imaginary lines, and the two imaginary lines pass through the two diagonal corners of the at least one use area in a straight line respectively; Each surface has four marking parts respectively located in the waste area, and each imaginary line has two marking parts respectively, and the two marking parts on each virtual line are respectively located on two opposite sides of the at least one use area, and the four marking parts respectively have Several detection marks, the detection marks include an isolation layer detection mark, the isolation layer detection mark has a conductive layer, the conductive layer has a plurality of notches extending from the edge to the center, and the plurality of notches are along the conductive layer. The circumference is evenly spaced, the conductive layer is provided with an isolation layer, the area of the isolation layer is smaller than the area of the conductive layer, and the isolation layer covers a part of the plurality of notches.

The circuit board with detection mark of the present invention comprises: a double-sided board, two sides of the double-sided board respectively have at least one use area and a waste area, the at least one use area has the same number of circuit units, the waste area Located on the outer periphery of the at least one use area, the at least one use area is rectangular, the at least one use area has two imaginary lines, and the two imaginary lines pass through two diagonal corners of the at least one use area in a straight line respectively; Each surface has four marking parts respectively located in the waste area, and each imaginary line has two marking parts respectively, and the two marking parts on each virtual line are respectively located on two opposite sides of the at least one use area, and the four marking parts respectively have Several detection marks, the plurality of detection marks include a wire detection mark, the wire detection mark has at least three groups of wires, each group of wires has two wires, The two conductors of each group of conductors are parallel to each other, wherein the two groups of conductors extend in opposite directions respectively, and at least one group of conductors is perpendicular to the other two groups of conductors.

Accordingly, in the circuit board with inspection marks of the present invention, the waste areas on each side of the double-sided board have the four mark parts, and each of the mark parts is located at the most difficult part of the process to meet the specifications. The detection result of a detection mark can be used to determine the range, area and size of the at least one use area, the exposure position and range of the isolation layers of the plurality of circuit units, the position and size of the laser drilling hole, and the conductive material in the drilling hole. Whether the filling is complete, and whether the line lengths and line widths of the plurality of line units conform to the process specification, are convenient and quick to detect the circuit board.

Wherein, the isolation layer may be solder resist paint. In this way, the isolation layer has the function of protecting each circuit in the plurality of circuit units.

Wherein, there may be a third distance between the edge of the isolation layer located in each of the gaps and the outer edge of the conductive layer, and there may be a fourth distance between the edge of the isolation layer located in each of the gaps and the inner edge of each of the gaps distance. In this way, by measuring the third distance and the fourth distance, it can be determined whether the exposed positions and ranges of the isolation layers of the plurality of circuit units meet the performance of the process specification.

Wherein, the several detection marks may include a drilling detection mark, the drilling detection mark has a conductive layer, the conductive layer has a drilling predetermined area, the drilling detection mark also has a first drilling hole, the first drilling A drill hole penetrates the double panel, the first drill hole is located in the drill hole predetermined area, and the area of the drill hole predetermined area is larger than that of the first drill hole. In this way, by measuring the drilling detection mark, it can be judged whether the drilling positions and sizes of the plurality of circuit units conform to the function of the process specification.

Wherein, the conductive layer may be a conductive material such as copper and aluminum. In this way, the material of the conductive layer is the same as the circuit material in the circuit unit, and it can be determined by measuring the conductive layer whether the circuit units meet the performance of the process specification.

Wherein, the pre-drilled area can be connected to at least a flow channel, and the at least flow channel extends toward the outer edge of the conductive layer. In this way, the at least one flow channel can be used for the agent and etching of the conductive layer The overflow of the reactant has the effect of preventing the accumulation of the chemical and the etching reactant, thereby preventing the formation of etching errors.

Wherein, the at least flow channel can communicate with the predetermined drilling area and the outer edge of the conductive layer. In this way, the at least one flow channel can flow out the chemical agent and the etching reactant for etching the conductive layer, which has the effect of preventing the chemical agent and the etching reactant from remaining in the conductive layer.

Wherein, the drilling detection mark may have a second drilling hole, the second drilling hole penetrates the double-sided panel, the conductive layer may have a hole filling predetermined area, and the hole filling predetermined area covers the second drilling hole, forming the The conductive material of the conductive layer fills the second drilled hole. In this way, by inspecting the longitudinal section of the second drill hole, it can be used to judge whether the conductive material inside the drill holes of the plurality of circuit units is completely filled to meet the function of the process specification.

Wherein, there may be a first distance between the two drilling detection marks located on the same long side of the rectangular use area, and there may be a first distance between the two drilling detection marks located on the same short side of the rectangular at least one use area. has a second distance. In this way, by measuring the first distance and the second distance, it can be determined whether the change of the length dimension of the at least one usage area complies with the effect of the process specification.

Wherein, there may be a fifth distance between the hole edge of the first drill hole of the drill hole detection mark and the edge of the drill hole predetermined area. In this way, by measuring the fifth distance, it can be determined whether the laser drilling positions and sizes of the plurality of circuit units conform to the effect of the process specification.

Wherein, the wire detection mark may have four groups of wires. In this way, the wire detection mark can be used to determine the detection positions in four directions, which has the effect of improving the detection accuracy.

Wherein, the wire detection mark can be copper or aluminum conductive material. In this way, the material of the wire detection mark is the same as the circuit material in the circuit unit, and it can be judged whether the circuit units conform to the function of the process specification by measuring the conductive layer.

Wherein, each of the wires may have a length and a width respectively. Thus, the system can By measuring the length and the width, it is judged whether the line length and line width of the plurality of line units conform to the function of the process specification.

Wherein, there may be a distance between the two wires of each group of wires. In this way, it can be determined by measuring the spacing whether the circuit spacing of the plurality of circuit units complies with the performance of the process specification.

〔this invention〕

1: Double panel

11: Use area

12: Waste area

13: Diagonal

14: Imaginary line

2: Isolation layer detection mark

21: Conductive layer

22: isolation layer

3: Drilling detection mark

31: Conductive layer

32: Drilling reservation area

33: First drilling

34: Second Drill

35: Filling predetermined area

4: Wire detection mark

41, 41a, 41b: Wire

42, 42a, 42b: Wire

43, 43a, 43b: Wire

44, 44a, 44b: Wire

B: Section line

C: runner

D1: first distance

D2: Second distance

D3: The third distance

D4: Fourth distance

D5: Fifth distance

D6: Spacing

L: length

M: Marker

S: Notch

U: line unit

W: width

[FIG. 1] A front view of a preferred embodiment of the present invention.

[Fig. 2] A front view of the separator detection mark of the present invention.

[FIG. 3] A front view of the drilling detection mark of the present invention.

[FIG. 4] The front surface of the lead wire detection mark of the present invention.

In order to make the above-mentioned and other objects, features and advantages of the present invention more obvious and easy to understand, the preferred embodiments of the present invention are exemplified below, and are described in detail as follows in conjunction with the accompanying drawings:

Please refer to FIG. 1 , which is a preferred embodiment of a circuit board with detection marks according to the present invention, which includes a double-sided board 1 and a plurality of marking parts M, and the marking parts M are located on the double-sided board 1 .

The double-sided board 1 can be made of materials such as polyimide, polyester resin, glass fiber or other suitable insulating materials, so that the double-sided board 1 has a light weight and a thickness Thin, soft and bendable properties, the two sides of the double-sided panel 1 can be plated with copper. Two surfaces of the double-sided panel 1 respectively have at least one use area 11 and a waste area 12 , the waste area 12 is located on the outer periphery of the at least one use area 11 , and the at least one use area 11 is in a rectangular shape The at least one use area 11 has two imaginary lines 14 , and the two imaginary lines 14 pass through two diagonal corners 13 of the at least one use area 11 in a straight line respectively. After the circuit board is fabricated, the waste area 12 can be cut out of use.

The at least one usage area 11 may be a strip with the same number of circuit units U, the circuit units U are a block formed by a plurality of circuits composed of conductive materials, and have electrical signals as electrical signals For processing and loop functions, the circuit units U can be used to manufacture electronic products. For example, each of the circuit units U can be combined with optoelectronic materials to form a sub-millimeter light emitting diode (mini LED). In this embodiment, the number of the at least one use area 11 is several, each use area 11 is rectangular, and each imaginary line 14 is a diagonal line passing through the two diagonal corners 13, so that each use area 11 can be There are two imaginary lines 14, respectively.

The plurality of marking portions M are formed on the double-sided panel 1 together with the plurality of circuit units U. The two sides of the double-sided board respectively have four marking portions M located in the waste area 12 , which may not occupy the space of the at least one use area 11 . Each of the imaginary lines 14 has two marking portions M, the two marking portions M are respectively located on two opposite sides of the at least one use area 11 , and each of the marking portions M has several detection marks respectively. In this way, the detection marks are located at the farthest distance from the center of the at least one use area 11 , which is also the most difficult part in the processes of deposition, isolation layer exposure, etching, and hole filling. Therefore, the detection results located at the plurality of detection marks can be used as the basis for determining whether the plurality of circuit units U conform to the process specification, that is, when the detection result determines that the plurality of detection marks conform to the process specification, it can be determined that the at least one The number of line units U in the use area 11 can also meet the process specification.

In this embodiment, the four marking portions M on each surface of the double-sided panel 1 are respectively close to the four diagonal corners 13 of each of the usage areas 11 . The distance between each of the marking parts M can be used to detect whether the length dimension of the at least one use area 11 changes correctly, and moreover, several detection marks of each of the marking parts M have key characteristics of the lines in each of the line units U, The critical feature can be, for example, a barrier exposure The position and range of the light, the position and size of the laser drill hole, the filling state of the conductive material inside the drill hole, the length of the line, the width of the line and the distance between the lines, etc. In this embodiment, the several detection marks may include an isolation layer detection mark 2 , a drilling detection mark 3 and a wire detection mark 4 .

Please refer to FIG. 2 , the isolation layer detection mark 2 can be used to judge whether the exposure position and range of the isolation layer meet the process specification. The isolation layer detection mark 2 has a conductive layer 21 , and the conductive layer 21 can be copper, aluminum materials with good electrical conductivity. The conductive layer 21 has several notches S extending from the edge to the center, and the plurality of notches S are formed along the circumference of the conductive layer 21 at average intervals. The conductive layer 21 has an isolation layer 22, and the isolation layer 22 can be solder resist paint. The area of the isolation layer 22 is smaller than that of the conductive layer 21 , and the isolation layer 22 covers a part of the plurality of notches S.

Please refer to FIG. 3 , the drilling detection mark 3 can be used to determine whether the position and size of the laser drilling hole and whether the filling state of the conductive material in the drilling hole conforms to the process specification. The drilling detection mark 3 has a conductive layer 31 , the conductive layer 31 can also be made of materials with good conductivity such as copper and aluminum. The conductive layer 31 has a pre-drilled area 32 , and the pre-drilled area 32 can be formed by etching the conductive layer 31 . The drilling detection mark 3 also has a first drilling hole 33 , the first drilling hole 33 is laser drilling through the double-sided panel 1 , and the first drilling hole 33 is located in the drilling predetermined area 32 . The area of the predetermined hole area 32 is larger than that of the first bore hole 33 . The pre-drilled area 32 can be connected to at least a flow channel C, the at least flow channel C extends toward the outer edge of the conductive layer, and the at least flow channel C can be used for overflow of chemicals and etching reactants for etching the conductive layer 31 . Preferably, the at least flow channel C can communicate with the predetermined drilling area 32 and the outer edge of the conductive layer 31 , whereby the at least flow channel C can flow out the reagent and the etching reactant for etching the conductive layer 31 .

The drilling detection mark 3 may further have a second drilling hole 34 , and the second drilling hole 34 is drilled through the double-sided panel 1 by laser drilling. The conductive layer 31 may have a hole filling predetermined area 35 , the hole filling predetermined area 35 covers the second hole 34 , and the conductive material forming the conductive layer 31 may fill the second hole 34 .

Please refer to FIG. 4 , the wire detection mark 4 can be used to determine whether the line length, line width and line spacing of each line unit U meet the process specification, and the wire detection mark 4 can be copper, aluminum, etc. conductivity The wire detection mark 4 has at least three sets of wires 41, 42, 43, each set of wires 41, 42, 43 has two wires 41a, 41b; 42a, 42b; 43a, 43b, each set of wires 41, 42 43 of the two conductors 41a, 41b; 42a, 42b; 43a, 43b are parallel to each other, wherein the two groups of conductors 41, 43 respectively extend in opposite directions, at least one group of conductors 42 and the other two groups of conductors 41, 43 are perpendicular. Preferably, the wire detection marker 4 has four sets of wires 41, 42, 43, 44, and each set of wires 41, 42, 43, 44 has two wires 41a, 41b; 42a, 42b; 43a, 43b; 44a, 44b ; The two wires 41a, 41b of each group of wires 41, 42, 43, 44; 42a, 42b; 43a, 43b; 42 and 44 are perpendicular to the other two groups of wires 41 and 43 . Thereby, the wire detection mark 4 can be used to determine the detection positions in four directions.

Referring to FIG. 1 again, the detection marks of the marking portions M can be detected by an automatic image measuring system. In this embodiment, there may be a first distance D1 between the two drilling detection marks 3 located on the same long side of the at least one use area 11 in a rectangular shape; There may be a second distance D2 between the two drilling detection marks 3 . The automatic image measuring system can measure the first distance D1 and the second distance D2, thereby determining whether the change of the length dimension of the at least one usage area 11 conforms to the process specification.

Referring to FIG. 2 again, when detecting the isolation layer detection mark 2 , the automatic image measurement system detects each of the gaps S. Specifically, there is a third distance D3 between the edge of the isolation layer 22 located in each of the gaps S and the outer edge of the conductive layer 21 ; the edge of the isolation layer 22 located in each of the gaps S and the inside of each of the gaps S There is a fourth distance D4 between the edges. The automatic image measuring system can measure the third distance D3 and the fourth distance D4 located at each of the gaps S. Thus, by calculating the errors of each of the third distances D3 and the fourth distance D4, it is possible to determine the number of line units Whether the exposure position and range of the isolation layer of U conform to the process specification.

Referring to FIG. 3 again, there is a fifth distance D5 between the hole edge of the first hole 33 of the hole detection mark 3 and the edge of the hole planned area 32 . When detecting the drilling detection mark 3, the automatic image measuring system can measure several of the fifth distances D5 between the hole edge of the first drilling hole 33 and the edge of the drilling predetermined area 32 respectively. By calculating the error of each of the fifth distances D5, it can be determined whether the positions and sizes of the laser drill holes of the plurality of circuit units U meet the process specification.

Please continue to refer to FIG. 3, the user can also cut the double-sided panel 1 along a cutting line B across the second hole 34, thereby revealing the longitudinal section of the second hole 34, the user can The filling state of the conductive material in the second drill hole 34 is inspected from the longitudinal section, and then it can be determined whether the conductive material in the drill holes of the plurality of circuit units U is completely filled to meet the process specification.

Referring to FIG. 4 again, each of the wires 41a, 41b, 42a, 42b, 43a, 43b, 44a, and 44b of the wire detection mark 4 has a length L and a width W, respectively. The automatic image measuring system can The length L and the width W of each of the wires 41a, 41b, 42a, 42b, 43a, 43b, 44a, and 44b are measured. In this way, by calculating the errors of the lengths L and the widths W, it can be determined whether the line lengths and line widths of the plurality of line units U meet the process specification. In addition, there is a distance D6 between the two wires 41a, 41b; 42a, 42b; 43a, 43b; 44a, 44b of each group of wires 41, 42, 43, 44, and the automatic image measuring system can measure the distance D6 distance. In this way, by calculating the error of each of the distances D6, it can be determined whether the circuit distances of the plurality of circuit units U meet the process specification.

To sum up, in the circuit board with inspection marks of the present invention, the waste areas on each side of the double-sided board have the four mark parts, and each of the mark parts is located at the most difficult part of the process to meet the specifications. The detection results of the plurality of detection marks can be used to determine the range, area, and size of the at least one use area, the exposure position and range of the isolation layers of the plurality of circuit units, the position and size of the laser drilling hole, and the hole diameter in the drilling hole. Whether the conductive material is completely filled, and the line length and line length of the several line units Whether the width of the circuit conforms to the process specification has the effect of convenient and rapid detection of the circuit board.

Although the present invention has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the patent application attached hereto.

1: Double panel

11: Use area

12: Waste area

13: Diagonal

14: Imaginary line

2: Isolation layer detection mark

3: Drilling detection mark

4: Wire detection mark

D1: first distance

D2: Second distance

M: Marker

U: line unit

Claims (15)

A circuit board with detection marks, comprising: a double-sided board, two sides of the double-sided board respectively have at least one use area and a waste area, the at least one use area has the same number of circuit units, and the waste area is located in the At least one outer periphery of the use area, the at least one use area is rectangular, the at least one use area has two imaginary lines, and the two imaginary lines pass through two diagonal corners of the at least one use area respectively in a straight line; and the two surfaces of the double-sided panel There are four marking parts respectively located in the waste area, each of the imaginary lines has two marking parts respectively, and the two marking parts on each of the virtual lines are respectively located on two opposite sides of the at least one use area, and the four marking parts respectively have several types Detection marks, the detection marks include an isolation layer detection mark, the isolation layer detection mark has a conductive layer, the conductive layer has a number of notches extending from the edge to the center, and the plurality of notches are along the circumference of the conductive layer The average interval is formed, the conductive layer has an isolation layer, the area of the isolation layer is smaller than the area of the conductive layer, and the isolation layer covers a part of the plurality of notches. The circuit board with inspection marks according to claim 1, wherein the isolation layer is solder resist paint. The circuit board with detection marks of claim 1, wherein there is a third distance between the edge of the isolation layer located in each of the gaps and the outer edge of the conductive layer, and the edge of the isolation layer located in each of the gaps and each of the There is a fourth distance between the inner edges of the notches. The circuit board with inspection marks as claimed in claim 1, wherein the plurality of inspection marks include a drilling detection mark, the drilling detection mark has a conductive layer, the conductive layer has a drilling predetermined area, and the drilling detection mark The marker also has a first drill hole, the first drill hole penetrates the double panel, the first drill hole is located in the drill hole predetermined area, and the area of the drill hole predetermined area is larger than that of the first drill hole. The circuit board with detection marks of claim 1 or 4, wherein the conductive layer Conductive materials such as copper and aluminum. The circuit board with detection marks of claim 4, wherein the drilling predetermined area is connected to at least a flow channel, and the at least flow channel extends toward the outer edge of the conductive layer. The circuit board with detection marks of claim 6, wherein the at least flow channel communicates the drilling predetermined area and the outer edge of the conductive layer. The circuit board with detection mark of claim 4, wherein the hole detection mark has a second hole, the second hole penetrates the double-sided board, the conductive layer has a hole filling predetermined area, and the hole filling is predetermined The region covers the second drill hole, and the conductive material forming the conductive layer fills the second drill hole. The circuit board with detection marks of claim 4, wherein there is a first distance between the two drilling detection marks located on the same long side of the at least one use area in the rectangular shape, and the at least one use area in the rectangular shape is the same There is a second distance between the two drilling detection marks on the short side. The circuit board with the detection mark according to claim 4, wherein a fifth distance exists between the hole edge of the first hole of the hole detection mark and the edge of the hole predetermined area. A circuit board with detection marks, comprising: a double-sided board, two sides of the double-sided board respectively have at least one use area and a waste area, the at least one use area has the same number of circuit units, and the waste area is located in the At least one outer periphery of the use area, the at least one use area is rectangular, the at least one use area has two imaginary lines, and the two imaginary lines pass through two diagonal corners of the at least one use area respectively in a straight line; and the two surfaces of the double-sided panel There are four marking parts respectively located in the waste area, each of the imaginary lines has two marking parts respectively, and the two marking parts on each of the virtual lines are respectively located on two opposite sides of the at least one use area, and the four marking parts respectively have several types Detection marks, the plurality of detection marks include a wire detection mark, the wire detection mark has at least three groups of wires, each group of wires has two wires, the two wires of each group of wires are parallel to each other, and the two groups of wires are respectively in opposite directions Extending, at least one set of wires is perpendicular to the other two sets of wires. The circuit board with detection marks of claim 11, wherein the wire detection marks have four groups of wires. The circuit board with detection marks of claim 11, wherein the wire detection marks are copper or aluminum conductive materials. The circuit board with detection marks of claim 11, wherein each of the wires has a length and a width, respectively. The circuit board with detection marks as claimed in claim 11, wherein there is a distance between the two wires of each group of wires.

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