TWM641423U - Circuit board having protective structure with alignment capability - Google Patents

Abstract

A circuit board with a protection structure of an alignment structure is used to solve the problem that the alignment structure of the conventional circuit board is prone to contamination of the alignment structure when an additional layer is provided. It includes: a substrate with a surface; a circuit layer with multiple sections of circuits disposed on the surface of the substrate; an alignment structure disposed on the substrate, the alignment structure having a predetermined shape; and a protection structure, A protection protrusion protrudes from the surface of the substrate, and the protection structure surrounds the alignment structure or is non-surroundingly arranged on the outer periphery of the alignment structure.

Description

Circuit board with protective structure of alignment structure

The invention relates to a circuit board, especially a circuit board with a protection structure of an alignment structure.

In recent years, due to the miniaturization of electronic products due to the demand for portability, the circuits of electronic products have evolved into a more subtle evolution trend, which has led to an increase in the importance of alignment in the production process of circuit boards.

However, the alignment marks of the above-mentioned known circuit boards are still prone to anti-overflow due to the lack of anti-overflow means between other subsequent additional coatings or structural layers, such as even if solder resist is set by printing or coating. The problem of solder paint overflowing to the alignment mark makes it difficult for the recognition element/photosensitive element (such as using a photosensitive coupling device (CCD)) to identify the contaminated alignment mark, and it is impossible to perform accurate alignment, which reduces the production of the circuit board yield.

In view of this, it is indeed necessary to improve the conventional alignment mark related technology of circuit boards.

In order to solve the above problems, the purpose of this creation is to provide a circuit board with a protective structure of the alignment structure, so that the alignment marks are not easily polluted when the additional layer overflows.

The directionality mentioned throughout this work or similar terms, such as "front", "back", "left", "right", "upper (top)", "lower (bottom)", "inner", "outer" ,"side" etc., are mainly referring to the directions of the attached drawings, and each direction or similar terms are only used to assist in explaining and understanding the various embodiments of this creation, not to limit this creation.

The use of the quantifiers "one" or "one" in the elements and components described throughout this creation is only for convenience and to provide the usual meaning of the scope of this creation; it should be interpreted in this creation as including one or at least one, and a single The notion of also includes the plural unless it is obvious that it means otherwise.

The circuit board with the protection structure of the alignment structure includes: a substrate with a surface; a circuit layer with multiple sections of lines arranged on the surface of the substrate; an alignment structure arranged on the substrate, the The alignment structure has a predetermined shape; and a protection structure, a protection protrusion protruding from the surface of the substrate, the protection structure surrounds the alignment structure or is not surrounded by the outer periphery of the alignment structure.

Accordingly, the circuit board with the protection structure of the alignment structure in the present invention can prevent the alignment structure from additional overflow when the additional layer is overflowed by the protection structure arranged on the periphery of the alignment structure. Layer material contamination can achieve the effect of ensuring that the optical resolution of the alignment structure is not affected, thereby improving production yield.

Wherein, the alignment structure and the protection structure are directly connected or disposed on the substrate. In this way, the alignment structure and the protection structure have the functions of simple structure and convenient manufacture.

Wherein, the alignment structure and the protection structure are directly formed by the substrate. In this way, the alignment structure and the protection structure have the functions of simple structure and convenient manufacture.

Wherein, the alignment structure, the protection structure and the surface of the substrate are formed through a one-time coating and etching molding method. In this way, the whole substrate (including the alignment structure, the protection structure and the surface) has the effect of simple structure and convenient manufacture.

Wherein, the circuit board with the protection structure of the alignment structure further includes an additional layer applied on the surface of the substrate, the additional layer surrounds or does not surround the protection structure, and the protection The structure is disposed between the additional layer and the alignment structure. In this way, through the arrangement among the additional layer, the protection structure and the alignment structure, the effect of preventing the alignment structure from being polluted can be achieved.

Wherein, when the protection structure is disposed around the periphery of the alignment structure, the additional layer is disposed around or not around the periphery of the protection structure. In this way, through the arrangement among the additional layer, the protection structure and the alignment structure, the effect of preventing the alignment structure from being polluted can be achieved.

Wherein, when the protection structure is not disposed around the periphery of the alignment structure, the additional layer is not disposed around the periphery of the protection structure. Through the arrangement among the additional layer, the protection structure and the alignment structure, the effect of preventing the alignment structure from being polluted can be achieved.

Wherein, the alignment structure is a protrusion protruding from the surface of the substrate; the distance between the protection structure and the alignment structure is not less than a first distance, and the first distance is greater than zero. In this way, through the alignment structure protruding from the surface of the substrate, the effect of making the alignment structure have an optical recognition that is easy to identify can be achieved. In addition, through the first distance between the protection structure and the alignment structure, the effect of preventing the additional layer material from overflowing to the alignment structure can be improved, and it is helpful to distinguish the alignment structure and the protection structure, and also The effect of making the alignment structure have an optical recognition degree that is easy to identify can be achieved.

Wherein, the protection structure surrounds a local area of the surface, and makes the local area form the alignment structure having the predetermined shape, and the protection structure is adjacent to the alignment structure. In this way, by forming the protection structure on the substrate, the corresponding alignment structure is also formed, so that the alignment structure and the protection structure can be regarded as an integral structure, and the effect of simple structure and easy manufacture can be achieved .

Wherein, the protection structure surrounds a local area of the surface, and a groove of the predetermined shape is formed in the local area to form the alignment structure; there is a second distance between the protection structure and the alignment structure, and the second Spacing is not less than zero. In this way, through the corresponding grooves formed by the alignment structure, the optical recognition of the level difference between the surface of the substrate and the protective structure can be achieved. The alignment structure has the effect of optical recognition that is easy to identify.

Wherein, the protection structure surrounds a local area of the surface, and a perforation of the predetermined shape is formed in the local area to form the alignment structure; there is a second distance between the protection structure and the alignment structure, and the second distance not less than zero. In this way, through the formation of the corresponding through-holes in the alignment structure, the optical recognition with a difference in level between the surface of the substrate and the protective structure can be achieved, so that the alignment structure can have an optical recognition that is easy to identify.

Wherein, the outer periphery of the alignment structure has more than two protection structures, and there is a distance between each protection structure, and the distance is greater than zero. In this way, by having more than two protective structures on the periphery of the alignment structure, the effect of improving the protection of the alignment structure can be achieved.

1: Substrate

10: surface

2: Line layer

21: line

3: Parallel structure

3A: Protrusion

3B: plane part

3C: groove

3D: perforation

4: Protective structure

5: Additional layers

D: Depth

G1: the first gap

G2: Second Gap

H3, H4: Height

[Fig. 1] The top view of the first embodiment of the alignment structure and protection structure of this creation.

[Fig. 2] Partial enlarged top view of area A shown in Fig. 1.

[Fig. 3] A sectional view along the line B-B in Fig. 2.

[Fig. 4] Schematic diagram of the situation where an additional layer is applied as shown in Fig. 3.

[Fig. 5] Partial top view of the second embodiment of the alignment structure and protective structure of this creation.

[Fig. 6] A cross-sectional view along the line C-C in Fig. 5, showing an example of the alignment structure as a plane.

[Fig. 7] A cross-sectional view along line C-C in Fig. 5, showing an example where the alignment structure is a groove.

[Fig. 8] A sectional view along line C-C in Fig. 5, showing an example of the alignment structure as a perforation.

[FIG. 9] An example of an additional layer disposed around the outer periphery of the protective structure.

[FIG. 10] An example of an additional layer non-circumferentially disposed on the periphery of the alignment structure.

In order to make the above and other purposes, features and advantages of this creation more obvious and easy to understand, the preferred embodiments of this creation are specially cited below, and explained in detail with the accompanying drawings; in addition, the same symbols are marked in different drawings are considered the same, and their descriptions will be omitted.

Please refer to Figures 1, 2, and 3, which respectively show the top view, partial top view, and partial cross-sectional view of the first embodiment of the circuit board with the protection structure of the alignment structure, and include a substrate 1 , a circuit layer 2 , a bit structure 3 and a protection structure 4 . The circuit layer 2 , the alignment structure 3 and the protection structure 4 are disposed on the substrate 1 .

The substrate 1 has a surface 10 . The material of the substrate 1 can be selected according to actual needs; for example, if the substrate 1 is used as the base material of a flexible circuit board, the substrate 1 can be made of a corresponding material, for example, polyimide (Polyimide) can be used. , PI).

The circuit layer 2 has a plurality of segments of circuits 21 disposed on the surface 10 of the substrate 1 . In an example of a circuit configuration, the main circuit in the multi-section circuit 21 can be arranged in the center of the surface 10, and the soldering in the multi-section circuit 21 can be located on the outer edge of the surface 10; however, the present invention does not As limited to this type of circuit configuration, each functional part of the multi-section circuit 21 (such as the above-mentioned main circuit or a welder) can be arranged at any position on the substrate 1 as required.

The alignment structure 3 has a predetermined shape to form an identifiable pattern, and can correspond to an identification element with identifiable optical resolution as an alignment mark, and is arranged at a predetermined position on the substrate 1, so as to As the purpose of positioning correction, it can achieve the effect of precise alignment in the corresponding processing operations, dimension measurement operations, and calibration operations. It should be noted that the number of alignment structures 3 and the shape/figure formed can be determined by the performance of the corresponding alignment instrument (such as the resolution of the identification element (such as a camera) used for optical inspection) and the planning of the detection area The configuration is not limited to the position and shape shown in this creation.

Specifically, as shown in FIG. 3 , the alignment structure 3 protrudes outward from the surface 10 of the substrate 1 to form a protruding portion 3A having the predetermined shape.

As shown in Figures 1 to 3, the protection structure 4 is a protection protrusion protruding from the surface 10 of the substrate 1, and the protection structure 4 surrounds the alignment structure 3 and is aligned with the alignment structure. The distance between the three is not less than a first distance G1, and the first distance G1 is greater than zero. In this way, as shown in FIG. 4, when an additional layer 5 is set/coated on a predetermined area on the circuit board (for example, by printing or coating, the solder resist is covered on the area to be protected of the multi-section circuit 21 ), and when the additional layer 5 (coating material) overflows, the protective structure 4 can form an outer retaining wall around the alignment structure 3 to produce a stop effect, so that the overflowing additional layer 5 will first The protection structure 4 is blocked by touching the protection structure 4 , so that the overflowing additional layer 5 will not cover/contaminate the alignment structure 3 , so as to ensure the recognizability/optical resolution of the alignment structure 3 . It should be noted that the shape/figure formed by the protective structure 4 can be produced according to actual needs, and is not limited to the shape shown in this invention.

In detail, in the case where the alignment structure 3 shown in FIG. 3 is a protrusion 3A protruding from the surface 10 , there is a distance between the protection structure 4 and the alignment structure 3 . In particular, the alignment structure 3 and the protection structure 4 (and optionally further including the circuit layer 2/the multi-segment circuit 21) can be protruding structures formed by coating and etching in the same process and have the same material. , or protruding structures that can be formed separately through multiple stages of the same or different processes. Optionally, the height H3 of the alignment structure 3 may be the same as the height H4 of the protection structure 4 . Optionally (not shown), the height H3 of the alignment structure 3 is different (higher or lower) than the height H4 of the protective structure 4 . In addition, the protective structure 4 can have a width (the width corresponds to the size of the area on the surface 10), and by widening the width, the protection of the protective structure 4 to the alignment structure 3 can be improved. Effect.

Please refer to FIG. 5 , which is a partial top view of the second embodiment of the circuit board with the protective structure of the alignment structure. Wherein, the alignment structure 3 is not formed to protrude outward from the surface 10 of the substrate 1, and may be formed by a local area of the surface 10 to form a planar portion 3B (as shown in FIG. 6 plane), a groove 3C (as shown in Figure 7) or a perforation 3D (as shown in Figure 8).

Specifically, in the case where the alignment structure 3 shown in FIG. 6 is a planar portion 3B formed by a local area of the surface 10, the protective structure 4 surrounds the local area of the surface 10, and makes The local area forms the alignment structure 3/the planar portion 3B having the predetermined shape, and the protection structure 4 is adjacent to the alignment structure 3 (it can be considered that the inner edge of the protection structure 4 is directly connected to the planar portion 3B). The planar portion 3B (corresponding to the local area) utilizes the optical properties (such as light transmittance, reflectivity, etc.) of the substrate surface, especially the optical properties between the planar portion 3B and the protective structure 4 The difference of , improves the recognizability/optical resolution of the parastructure 3.

Specifically, in the case where the alignment structure 3 shown in FIG. 7 is a groove 3C formed by a local area of the surface 10, the protective structure 4 surrounds the local area of the surface 10, and the There is a groove of the predetermined shape in a local area, and the groove has a depth D to form the alignment structure 3/the groove 3C. There is a second distance G2 between the protection structure 4 and the alignment structure 3 , and the second distance G2 is not less than zero. In other words, the second distance G2 is an adjustable distance, and can be zero (at this time, the inner edge of the protection structure 4 is directly connected with the groove 3C), or not zero (at this time, the inner edge of the protection structure 4 The inner edge is directly connected to the surface 10 of the substrate 1). It should be noted that the groove 3C described in this invention can also be formed as a ring structure (not shown).

Specifically, in the case where the alignment structure 3 shown in FIG. 8 is a through hole 3D formed by a local area of the surface 10, the protective structure 4 surrounds the local area of the surface 10, and the local A perforation of the predetermined shape is formed in the region to form the alignment structure 3/the perforation 3D. There may be a second distance G2 between the protection structure 4 and the alignment structure 3, and the second distance G2 is not less than zero; in other words, the second distance G2 is an adjustable distance and may be zero (at this time, the The inner edge of the protective structure 4 is directly connected to the through hole 3D), or not zero (in this case, the inner edge of the protective structure 4 is directly connected to the surface 10 of the substrate 1 ).

According to the first embodiment (as shown in Fig. 1 ~ 3) and the 2nd embodiment of above this creation Embodiment (as shown in Figures 5-8), it can be understood that the alignment structure 3 is arranged on the substrate 1, has a predetermined shape, and optionally has the following different implementation aspects, such as the alignment structure 3 is a protruding portion 3A protruding from the surface 10 of the substrate 1, or, for example, a planar portion 3B (plane) and a groove 3C (groove) formed by the alignment structure 3 in a local area of the substrate. ) and a perforation 3D (perforation). Optionally, when there are multiple alignment structures 3, each alignment structure 3 can be any one of the above-mentioned protruding portion 3A, planar portion 3B, a groove 3C, and a through hole 3D, and can be identical to each other or different. In addition, the protection structure 4 is a protection protrusion protruding from the surface 10 of the substrate 1 and surrounds the alignment structure 3 . Preferably, the alignment structure 3 can have more than two protection structures 4, and the two or more protection structures 4 are dedicated to protecting the same alignment structure 3; A distance, and the distance is greater than zero, so as to improve the protection force of the alignment structure 3 .

In particular, for the formation of the alignment structure 3 and the protection structure 4, the alignment structure 3 (such as any one of the above-mentioned protruding portion 3A, planar portion 3B, a groove 3C, and a through hole 3D) and The protective structure 4 is directly connected or disposed on the substrate 1 . In one embodiment, the alignment structure 3 (such as any one of the above-mentioned protrusion 3A, planar portion 3B, a groove 3C, and a through hole 3D) and the protection structure 4 are directly formed by the substrate 1. Structural features formed by the ontology. In this way, the alignment structure 3 and the protection structure 4 have the functions of simple structure and convenient manufacture.

In a preferred embodiment, when the alignment structure 3 is the above-mentioned protruding portion 3A or planar portion 3B, the alignment structure 3, the protection structure 4 and the surface 10 of the substrate 1 are permeable and disposable Formed by coating etch molding method. In the coating-etching forming method, when the alignment structure 3 is the above-mentioned protrusion 3A, both the alignment structure 3 and the protection structure 4 are regions on the substrate 1 that have corrosion resistance through coating, Next, the substrate 1 is etched to form the protruding portion 3A and the protective structure 4 in the area of the substrate 1 that has corrosion resistance, and the surface 10 is formed by etching other areas of the substrate 1 that do not have corrosion resistance. ; When the alignment structure 3 is the above-mentioned planar portion 3B, the protective structure 4 It is the area on the substrate 1 that has corrosion resistance through coating, and then the substrate 1 is etched to form the protective structure 4 in the area of the substrate 1 that has corrosion resistance, and the substrate 1 does not have corrosion resistance. Other regions of nature are etched to form the surface 10 and the planar portion 3B. In this way, through the arrangement of the alignment structure 3 (the protruding portion 3A or the planar portion 3B), the protection structure 4 and the surface 10 of the substrate 1, the alignment structure 3, the protection structure 4 and the substrate 1 The surface 10 can be formed by one-time coating-etching molding method, and has the advantages of simple structure and convenient manufacture.

In particular, with regard to the configuration of the alignment structure 3 and the protection structure 4, although the above content and the corresponding drawings in this creation show that the protection structure 4 is around the periphery of the alignment structure 3; however, based on the protection structure 4 is In order to prevent the alignment structure 3 from being polluted by other materials, in other feasible embodiments (not shown), the protection structure 4 is non-circumferential/partially arranged on the side of the alignment structure 3 that is susceptible to contamination outside. In other words, the protection structure 4 can surround the alignment structure 3 or be non-surroundingly disposed on the periphery of the alignment structure 3 .

Based on the aforementioned protection structure 4 being disposed around or not surrounding the alignment structure 3 , the additional layer 5 is correspondingly surrounding or not surrounding the protection structure 4 or the alignment structure 3 . In one embodiment, as shown in FIG. 9 , corresponding to the case where the protection structure 4 is disposed around the periphery of the alignment structure 3 , the additional layer 5 is applied around the periphery of the protection structure 4 . In another embodiment, as shown in FIG. 10, corresponding to the protection structure 4 being non-circumferentially disposed/partially disposed on the periphery of the alignment structure 3, the additional layer 5 is non-circumferentially applied to the periphery of the protection structure 4; It should be noted that, at this time, there is a considerable height difference between the alignment structure 3 and the surface 10 of the substrate 1 , such as the protrusion 3A, the groove 3C or the through hole 3D.

In other words, it can be understood from Figures 9 and 10 that there is a corresponding protective structure 4 between the additional layer 5 and the alignment structure 3, and the protective structure 4 is determined corresponding to the area where the additional layer 5 is applied; When the additional layer 5 surrounds the alignment structure 3, the protective structure 4 also surrounds the alignment structure 3 (as shown in Figure 9); when the additional layer 5 does not surround the alignment structure 3, the protection The structure 4 may surround the alignment structure 3 (not shown) or may be partially disposed (non-surrounding arrangement) between the alignment structure 3 and the additional layer 5 . Wherein, it should be noted that since the application area of the additional layer 5 and the alignment structure 3 are usually pre-planned, it can be planned/designed according to the above-mentioned pre-planned features (additional layer 5 and alignment structure 3) The area where the protective structure 4 is disposed (for example, it should be disposed between the alignment structure 3 and the additional layer 5 ) and the manner (for example, it is disposed around or not surrounding the alignment structure 3 ).

To sum up, the circuit board with the protection structure of the alignment structure in this invention can protect the alignment mark when the additional coating overflows by surrounding the protection structure of the alignment structure. The structure is protected from contamination by spilled additional coating material, so that the optical resolution of the alignment structure is not affected.

Although this creation has been disclosed by using the above-mentioned preferred embodiments, it is not intended to limit this creation. Anyone who is familiar with this technology can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of this creation. Therefore, the scope of protection of this creation shall include all changes within the meaning and equivalent scope recorded in the appended scope of patent application. In addition, when the above-mentioned several embodiments can be combined, the invention includes any combination of implementations.

1: Substrate

2: Line layer

21: line

3: Parallel structure

4: Protective structure

Claims (12)

A circuit board with a protection structure of an alignment structure, comprising: a substrate having a surface; a circuit layer having a multi-segment circuit arranged on the surface of the substrate; an alignment structure arranged on the substrate, the alignment The structure has a predetermined shape; and a protection structure, a protection protrusion protruding from the surface of the substrate, the protection structure surrounds the alignment structure or is not surrounded by the outer periphery of the alignment structure. The circuit board with the protection structure of the alignment structure as claimed in claim 1, wherein the alignment structure and the protection structure are directly connected or arranged on the substrate. The circuit board with the protection structure of the alignment structure as claimed in claim 1, wherein the alignment structure and the protection structure are directly formed by the substrate. The circuit board with the protection structure of the alignment structure as described in claim 3, wherein the alignment structure, the protection structure and the surface of the substrate are formed by a one-time coating and etching molding method. As described in any one of claims 1 to 4, the circuit board with the protection structure of the alignment structure further comprises an additional layer applied on the surface of the substrate, and the additional layer surrounds or does not surround the protection structure, And the protection structure is disposed between the additional layer and the alignment structure. The circuit board with the protection structure of the alignment structure as described in claim 5, wherein, when the protection structure is arranged around the periphery of the alignment structure, the additional layer is arranged around or not around the periphery of the protection structure . The circuit board with the protection structure of the alignment structure as claimed in claim 5, wherein, when the protection structure is not disposed around the periphery of the alignment structure, the additional layer is not disposed around the periphery of the protection structure. The protective structure with para-structure as described in any one of claims 1 to 4 The circuit board of the present invention, wherein the alignment structure is a protrusion protruding from the surface of the substrate; the distance between the protection structure and the alignment structure is not less than a first distance, and the first distance is greater than zero. The circuit board with the protection structure of the alignment structure as described in any one of claims 1 to 4, wherein the protection structure surrounds a local area of the surface, and makes the local area form the predetermined shape. a para-position structure, and the protection structure is adjacent to the para-position structure. The circuit board with the protection structure of the alignment structure as described in any one of claims 1 to 3, wherein the protection structure surrounds a local area of the surface, and the local area has a groove of the predetermined shape to form the alignment structure; there is a second distance between the protection structure and the alignment structure, and the second distance is not less than zero. The circuit board with the protection structure of the alignment structure as described in any one of claims 1 to 3, wherein the protection structure surrounds a local area of the surface, and the local area has a perforation of the predetermined shape to The alignment structure is formed; there is a second distance between the protection structure and the alignment structure, and the second distance is not less than zero. The circuit board with the protection structure of the alignment structure as described in any one of claims 1 to 4, wherein the outer periphery of the alignment structure has more than two protection structures, and there is a distance between each protection structure , and the distance is greater than zero.

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