CN103983498A - Microetch liquid used for analyzing metallographic slice and application method thereof - Google Patents
Microetch liquid used for analyzing metallographic slice and application method thereof Download PDFInfo
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- CN103983498A CN103983498A CN201410168655.XA CN201410168655A CN103983498A CN 103983498 A CN103983498 A CN 103983498A CN 201410168655 A CN201410168655 A CN 201410168655A CN 103983498 A CN103983498 A CN 103983498A
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Abstract
The invention discloses a microetch liquid used for analyzing metallographic slice and an application method thereof. The microetch liquid comprises pure water, ammoniacal liquor and hydrogen peroxide, wherein the volume ratio of pure water to ammoniacal liquor to hydrogen peroxide is 1: 1: 0.1. The application method of the microetch liquid comprises the following steps: 1)sampling; 2)sealing a compound; 3)grinding; 4)polishing; 5)performing microetch treatment; and 6)performing metallographic analysis and measurement. Compared with the prior art, the circuit board metallographic slice is preformed with the microetch treatment, the copper powder left in a gap is reacted with the microetch liquid instantly due to a fluffy structure of the copper powder, a clear interface is formed at the copper edge for conveniently measuring and analyzing the information relative to the thickness of each layer of copper, the measure result is more accurate, and the image distortion can be minimized.
Description
Technical field
The present invention relates to a kind of micro-corrosion liquid, particularly a kind of micro-corrosion liquid and using method thereof of analyzing for wiring board microsection.
Background technology
Printed circuit board is the indispensable parts of electronic devices and components, is widely used in electron trade, and whether its reliable in quality must be judged by certain detection technique.Printed board manufacturing process is complicated, if wherein quality problems appear in a certain link, will cause printed board to be scrapped.Check so printed board in minute process, to check and product inspection.The useful magnifier visual inspection of our conventional measuring means, check backlight etc.As the microsection technology of one of measuring means, because of its investment little, applied range, and printed plate manufacturer adopts.Microsection is a kind of destructive testing, can test the multinomial performance of printed board.For example: resin smear, crack of plating, hole wall layering, solder coat situation, layer thickness, thickness of coating, through-hole plating thickness, lateral erosion, internal layer ring width, layer to layer registration, quality of coating, Hole Wall Roughness etc.
The making flow process of industry microsection is at present: sampling, and------grinding---polishing---metallographic examination measures in sealing.Its shortcoming is: 1. the liquid glue that sealing is used can shrink in solidification process, can between section sample and glue, produce tiny gap like this, but in speed lapping process, the copper powder being worn away in section can remain in gap, when metallographic examination, can cause distortion, measurement data can be bigger than normal than actual result.2. the copper layer of wiring board is generally divided into base copper layer and copper plate, and the section of normal polishing cannot be distinguished the boundary line between two-layer copper, thickness that cannot each copper layer of Measurement accuracy.
Summary of the invention
For above the deficiencies in the prior art, the object of this invention is to provide a kind of minimizing image fault, be convenient to the relevant informations such as thickness of the every layer of copper of Measurement and analysis, make the measurement result method for making that microsection is analyzed more accurately.
The object of the invention is by realizing by the following technical solutions:
The micro-corrosion liquid of analyzing for wiring board microsection, comprises pure water, ammoniacal liquor, hydrogen peroxide, described pure water: ammoniacal liquor: the volume ratio of hydrogen peroxide is 1:1:0.1.
The micro-corrosion liquid using method of analyzing for wiring board microsection, comprises the following steps:
Step 1: sampling, model to be sampled is positioned in template, the position that drift samples over against need, firmly rotates handwheel and cuts sample, from the section of taking of sample chute mouth;
Step 2: sealing, with liquid glue, the section of step 1 gained is carried out to sealing;
Step 3: grind, the sample of step 2 gained is fixed, 1. corase grind: adopt silicon carbide paper, polishing and burnishing machine revolution 400r/s～800r/s, milling time 30～50 seconds; 2. fine grinding: after corase grind, sample is through washing, the sand paper of not jack per line number from coarse to fine is placed in respectively on mechanical sample grinding machine and is ground successively, polishing and burnishing machine revolution 150r/s～300r/s, milling time 10-15 second/time, while often changing a sand paper, sample dextrorotation turn 90 degrees, and angle becomes vertical direction with polishing scratch, to a direction, be milled to polishing scratch and disappear completely, during new polishing scratch uniformity till;
Step 4: polishing, the sample after polishing is carried out to mechanical buffing with buffing machine, until surface-brightening;
Step 5: microetch is processed, and step 4 gained sample is processed with above-mentioned micro-corrosion liquid;
Step 6: metallographic examination is measured, and gained sample in step 5 is carried out to metallographic examination measurement with optical microscope.
As the preferred technical solution of the present invention, liquid glue is novolaks or epoxy resin described in step 2.
As the preferred technical solution of the present invention, the processing time is 3-5 second described in step 2.
The invention has the beneficial effects as follows: with respect to prior art, wiring board microsection former copper powder remaining in gap after microetch is processed is fluffy because of its structure, can react with micro-corrosion liquid moment, at copper bound edge, forms interface clearly, is convenient to measure, and reduces image fault.Equally between the multiple layer of copper after microetch is processed because the crystal structure in its manufacturing process is different, different from the speed in micro-corrosion liquid course of reaction, after microetch, have obvious separatrix, be convenient to the relevant informations such as thickness of the every layer of copper of Measurement and analysis, make measurement result more accurate.
Embodiment
The embodiment of the present invention is now described as follows:
The micro-corrosion liquid of analyzing for wiring board microsection, comprises pure water, ammoniacal liquor, hydrogen peroxide, described pure water: ammoniacal liquor: the volume ratio of hydrogen peroxide is 1:1:0.1.
The micro-corrosion liquid using method of analyzing for wiring board microsection, comprises the following steps:
Step 1: sampling, model to be sampled is positioned in template, the position that drift samples over against need, firmly rotates handwheel and cuts sample, from the section of taking of sample chute mouth;
Step 2: sealing, with liquid glue, the section of step 1 gained is carried out to sealing;
Step 3: grind, the sample of step 2 gained is fixed, 1. corase grind: adopt silicon carbide paper, polishing and burnishing machine revolution 400r/s～800r/s, milling time 30～50 seconds; 2. fine grinding: after corase grind, sample is through washing, the sand paper of not jack per line number from coarse to fine is placed in respectively on mechanical sample grinding machine and is ground successively, polishing and burnishing machine revolution 150r/s～300r/s, milling time 10-15 second/time, while often changing a sand paper, sample dextrorotation turn 90 degrees, and angle becomes vertical direction with polishing scratch, to a direction, be milled to polishing scratch and disappear completely, during new polishing scratch uniformity till;
Step 4: polishing, the sample after polishing is carried out to mechanical buffing with buffing machine, until surface-brightening;
Step 5: microetch is processed, and step 4 gained sample is processed with above-mentioned micro-corrosion liquid;
Step 6: metallographic examination is measured, and gained sample in step 5 is carried out to metallographic examination measurement with optical microscope.
In the present embodiment, liquid glue is novolaks or epoxy resin described in step 2, and the processing time is 3-5 second described in step 2.
Claims (4)
1. a micro-corrosion liquid of analyzing for wiring board microsection, is characterized in that: described micro-corrosion liquid comprises pure water, ammoniacal liquor, hydrogen peroxide described pure water: ammoniacal liquor: the volume ratio of hydrogen peroxide is 1:1:0.1.
2. the micro-corrosion liquid using method of analyzing for wiring board microsection according to claim 1, is characterized in that comprising the following steps:
Step 1: sampling, model to be sampled is positioned in template, the position that drift samples over against need, firmly rotates handwheel and cuts sample, from the section of taking of sample chute mouth;
Step 2: sealing, with liquid glue, the section of step 1 gained is carried out to sealing;
Step 3: grind, the sample of step 2 gained is fixed, 1. corase grind: adopt silicon carbide paper, polishing and burnishing machine revolution 400r/s～800r/s, milling time 30～50 seconds; 2. fine grinding: after corase grind, sample is through washing, the sand paper of not jack per line number from coarse to fine is placed in respectively on mechanical sample grinding machine and is ground successively, polishing and burnishing machine revolution 150r/s～300r/s, milling time 10-15 second/time, while often changing a sand paper, sample dextrorotation turn 90 degrees, and angle becomes vertical direction with polishing scratch, to a direction, be milled to polishing scratch and disappear completely, during new polishing scratch uniformity till;
Step 4: polishing, the sample after polishing is carried out to mechanical buffing with buffing machine, until surface-brightening;
Step 5: microetch is processed, and step 4 gained sample is processed with micro-corrosion liquid described in claim 1;
Step 6: metallographic examination is measured, and gained sample in step 5 is carried out to metallographic examination measurement with optical microscope.
3. the method for making that microsection according to claim 2 is analyzed, is characterized in that: described in step 2, liquid glue is novolaks or epoxy resin.
4. the method for making that microsection according to claim 2 is analyzed, is characterized in that: described in step 2, the processing time is 3-5 second.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410168655.XA CN103983498A (en) | 2014-04-24 | 2014-04-24 | Microetch liquid used for analyzing metallographic slice and application method thereof |
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| CN201410168655.XA CN103983498A (en) | 2014-04-24 | 2014-04-24 | Microetch liquid used for analyzing metallographic slice and application method thereof |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105928462A (en) * | 2016-07-08 | 2016-09-07 | 晶科能源有限公司 | Method for measuring thickness of photovoltaic solar energy material |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
| CN107328999A (en) * | 2017-07-31 | 2017-11-07 | 深圳崇达多层线路板有限公司 | A kind of method of parameter value needed for acquisition calculates sheet material dielectric constant |
| CN109084718A (en) * | 2018-07-10 | 2018-12-25 | 郑州云海信息技术有限公司 | The method and apparatus of medium and copper foil structure data in a kind of measurement printed circuit board |
| CN110724943A (en) * | 2019-11-29 | 2020-01-24 | 四川英创力电子科技股份有限公司 | Palladium-free activating solution before chemical nickel plating on copper surface, preparation method and nickel plating method |
| CN111537312A (en) * | 2020-06-18 | 2020-08-14 | 西安微电子技术研究所 | Metallographic test sample and manufacturing method thereof |
| CN113235092A (en) * | 2021-05-08 | 2021-08-10 | 九江德福科技股份有限公司 | Micro-etching solution for copper foil slice observation, preparation method thereof and micro-etching method |
| CN114016033A (en) * | 2021-10-29 | 2022-02-08 | 广州添利电子科技有限公司 | Micro-etching solution for observing copper deposition layer section of circuit board and micro-etching observation method |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105928462A (en) * | 2016-07-08 | 2016-09-07 | 晶科能源有限公司 | Method for measuring thickness of photovoltaic solar energy material |
| CN106338413A (en) * | 2016-08-29 | 2017-01-18 | 广东工业大学 | Making method of PCB half-hole section |
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| CN110724943A (en) * | 2019-11-29 | 2020-01-24 | 四川英创力电子科技股份有限公司 | Palladium-free activating solution before chemical nickel plating on copper surface, preparation method and nickel plating method |
| CN111537312A (en) * | 2020-06-18 | 2020-08-14 | 西安微电子技术研究所 | Metallographic test sample and manufacturing method thereof |
| CN113235092A (en) * | 2021-05-08 | 2021-08-10 | 九江德福科技股份有限公司 | Micro-etching solution for copper foil slice observation, preparation method thereof and micro-etching method |
| CN114016033A (en) * | 2021-10-29 | 2022-02-08 | 广州添利电子科技有限公司 | Micro-etching solution for observing copper deposition layer section of circuit board and micro-etching observation method |
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Application publication date: 20140813 |