CN109065560A - The packaging method and encapsulating structure of image sensing chip - Google Patents
The packaging method and encapsulating structure of image sensing chip Download PDFInfo
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- CN109065560A CN109065560A CN201810940898.9A CN201810940898A CN109065560A CN 109065560 A CN109065560 A CN 109065560A CN 201810940898 A CN201810940898 A CN 201810940898A CN 109065560 A CN109065560 A CN 109065560A
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- Prior art keywords
- image sensing
- sensing chip
- adhesive layer
- optical adhesive
- cover plate
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 83
- 238000000034 method Methods 0.000 title claims abstract description 61
- 239000012790 adhesive layer Substances 0.000 claims abstract description 99
- 230000003287 optical effect Effects 0.000 claims abstract description 99
- 238000004519 manufacturing process Methods 0.000 claims abstract description 15
- 238000001746 injection moulding Methods 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims description 9
- 238000005520 cutting process Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 4
- 239000010410 layer Substances 0.000 claims description 3
- 238000009738 saturating Methods 0.000 claims 1
- 230000008569 process Effects 0.000 abstract description 10
- 239000000243 solution Substances 0.000 abstract description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14618—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
Abstract
The invention discloses the packaging methods and encapsulating structure of a kind of image sensing chip, in technical solution of the present invention thoroughly, light cover board carries out gapless by the first optical adhesive layer with image sensing chip and is bonded fixation, without cavity between euphotic cover plate and image sensing chip, euphotic cover plate can bear biggish pressure, when being sealed protection to image sensing chip by packaging plastic, the plastic package die of injection molding can act directly on transparent cover plate, the packaging protection to the image sensing chip can be completed by a plastic package process, simple process, it reduces the production cost.
Description
Technical field
The present invention relates to chip encapsulation technology fields, more specifically, being related to a kind of packaging method of image sensing chip
And encapsulating structure.
Background technique
With the continuous development of science and technology, more and more electronic apparatus applications are to daily life and work
In the middle, huge convenience is brought for daily life and work, becomes the indispensable important tool of current people.
For the electronic equipment with image collecting function, image sensing chip is the core that it realizes image collecting function
Component.For the ease of the binding of image sensing chip and electronic equipment, and in order to protect image sensing chip, need to image
Sensing chip is packaged protection, forms encapsulating structure.
When existing packaging method is packaged protection to image sensing chip, complex process, cost of manufacture height.
Summary of the invention
To solve the above-mentioned problems, technical solution of the present invention provides the encapsulating structure and envelope of a kind of image sensing chip
Dress method, when being packaged protection to image sensing chip, simple process is reduced the production cost.
To achieve the goals above, the invention provides the following technical scheme:
A kind of packaging method of image sensing chip, the packaging method include:
An image sensing chip is provided, the image sensing chip has opposite first surface and second surface, institute
Stating first surface includes photosensitive area；
The image sensing chip is bonded fixation with a circuit board, wherein the second surface is fitted in the circuit
The surface of plate, the image sensing chip and the circuit board electrical connection, the circuit board is for connecting external circuit；
In the fixed euphotic cover plate of the first surface, the euphotic cover plate passes through the first optical adhesive layer and the image sensing
The fitting of chip gapless is fixed；
Packaging plastic is set on the surface that the circuit board is fixed with the image sensing chip, described in the packaging plastic surrounds
Image sensing chip and the euphotic cover plate, and expose the top surface of the euphotic cover plate.
Preferably, in above-mentioned packaging method, the production method of the image sensing chip includes:
A wafer is provided, the wafer includes multiple image sensing chips, has cutting between adjacent image sensing chip
Channel, the first surface of the image sensing chip include photosensitive area and the rim area for surrounding the photosensitive area；It is described photosensitive
Area is provided with microlens array；The microlens array includes the lenticule of multiple array arrangements；The rim area is provided with weldering
Pad；
The second optical adhesive layer is covered in microlens array surface gapless, the refractive index of second optical adhesive layer is small
In the refractive index of first optical adhesive layer；
Divide the wafer based on the cutting channel, forms the image sensing chip of multiple simple grains.
Preferably, in above-mentioned packaging method, top surface pattern and the microlens array of second optical adhesive layer
Top surface consistent appearance.
Preferably, in above-mentioned packaging method, the top surface of second optical adhesive layer is flat surfaces.
Preferably, in above-mentioned packaging method, second optical adhesive layer also covers the rim area, and exposes the weldering
Pad.
Preferably, in above-mentioned packaging method, all weld pads are located at the rim area of the same side of the photosensitive area.
Preferably, in above-mentioned packaging method, the refractive index of second optical adhesive layer is less than 1.4.
Preferably, in above-mentioned packaging method, the thickness range of second optical adhesive layer is 1 μm -2 μm, including endpoint
Value.
Preferably, described the image sensing chip is bonded fixation with a circuit board to include: in above-mentioned packaging method
A circuit board is provided, the circuit board has opposite front and the back side, and the front is for fixing institute
State image sensing chip；
The image sensing chip is passed through into metal wire and the circuit board electrical connection.
Preferably, described to include: in the fixed euphotic cover plate of the first surface in above-mentioned packaging method
One size and the matched euphotic cover plate of the image sensing chip are provided；
One layer of first optical adhesive layer is uniformly coated on a surface of the euphotic cover plate；
By first optical adhesive layer, the euphotic cover plate is fixed on to the first surface of the image sensing chip；
Wherein, the periphery of the euphotic cover plate is flushed with the periphery of the image sensing chip.
Preferably, in above-mentioned packaging method, the circuit board has opposite front and the back side, and the front has
For fixing the first area of the image sensing chip and surrounding the second area of the first area, the image sensing
Chip is fixed on the first area；
It is described the circuit board be fixed with the image sensing chip surface setting packaging plastic include:
By injection molding process, packaging plastic is formed on the second area, the height of the packaging plastic and described
Light cover board is flushed away from a side surface of the image sensing chip.
Preferably, in above-mentioned packaging method, the light transmittance of first optical adhesive layer is not less than 60%.
Preferably, in above-mentioned packaging method, the thickness range of first optical adhesive layer is 20 μm -60 μm.
Preferably, in above-mentioned packaging method, the thickness range of the euphotic cover plate is 100 μm -300 μm, including endpoint
Value.
The present invention also provides a kind of encapsulating structure of image sensing chip, the encapsulating structure includes:
Circuit board, the circuit board is for connecting external circuit；
Image sensing chip, the image sensing chip have opposite first surface and second surface, described first
Surface includes photosensitive area；Second surface fitting is fixed on the surface of the circuit board, the image sensing chip with it is described
Circuit board electrical connection；
Euphotic cover plate, the euphotic cover plate by the first surface of the first optical adhesive layer and the image sensing chip continuously
Gap fitting is fixed；
The surface that the circuit board is fixed with the image sensing chip, the envelope is arranged in packaging plastic, the packaging plastic
It fills glue and surrounds the image sensing chip and the euphotic cover plate.
Preferably, in above-mentioned encapsulating structure, the image sensing chip first surface includes the photosensitive area and packet
The rim area of the photosensitive area is enclosed, the photosensitive area has microlens array, and the rim area is provided with weld pad；
Microlens array surface gapless is covered with the second optical adhesive layer, and the refractive index of second optical adhesive layer is small
In the refractive index of first optical adhesive layer.
Preferably, in above-mentioned encapsulating structure, top surface pattern and the microlens array of second optical adhesive layer
Top surface consistent appearance.
Preferably, in above-mentioned encapsulating structure, the top surface of second optical adhesive layer is flat surfaces.
Preferably, in above-mentioned encapsulating structure, second optical adhesive layer also covers the rim area, and exposes the weldering
Pad.
Preferably, in above-mentioned encapsulating structure, all weld pads are located at the rim area of the same side of the photosensitive area.
Preferably, in above-mentioned encapsulating structure, the refractive index of second optical adhesive layer is less than 1.4.
Preferably, in above-mentioned encapsulating structure, the thickness range of second optical adhesive layer is 1 μm -2 μm, including endpoint
Value.
Preferably, in above-mentioned encapsulating structure, the circuit board has opposite front and the back side, and the front is used for
The fixed image sensing chip；
The image sensing chip passes through metal wire and the circuit board electrical connection.
Preferably, in above-mentioned encapsulating structure, the periphery of the euphotic cover plate and the periphery of the image sensing chip are neat
It is flat.
Preferably, in above-mentioned encapsulating structure, the circuit board has opposite front and the back side, and the front has
For fixing the first area of the image sensing chip and surrounding the second area of the first area, the image sensing
Chip is fixed on the first area；
The packaging plastic is located at the second area, and the height of the packaging plastic and the euphotic cover plate deviate from the image
One side surface of sensing chip flushes.
Preferably, in above-mentioned encapsulating structure, the light transmittance of first optical adhesive layer is not less than 60%.
Preferably, in above-mentioned encapsulating structure, the thickness range of first optical adhesive layer is 20 μm -60 μm.
Preferably, in above-mentioned encapsulating structure, the thickness range of the euphotic cover plate is 100 μm -300 μm, including endpoint
Value.
As can be seen from the above description, the packaging method and encapsulation knot for the image sensing chip that technical solution of the present invention provides
Structure has the following beneficial effects:
Euphotic cover plate is bonded with image sensing chip by the first optical adhesive layer progress gapless in technical solution of the present invention
Fixed, without cavity between euphotic cover plate and image sensing chip, euphotic cover plate can bear biggish pressure, pass through packaging plastic
When being sealed protection to image sensing chip, the plastic package die of injection molding can be acted directly on transparent cover plate, be passed through
The packaging protection to the image sensing chip can be completed in plastic package process, and simple process reduces the production cost.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1-Figure 12 is a kind of process flow chart of the packaging method of image sensing chip provided in an embodiment of the present invention；
Figure 13 is a kind of package structure diagram of image sensing chip provided in an embodiment of the present invention；
Figure 14 is the package structure diagram of another image sensing chip provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
When being packaged to image sensing chip, by image sensing chip bonding on circuit boards after, need image pass
The fixed euphotic cover plate in the top of sense chip, is fixed between euphotic cover plate and the periphery of image sensing chip by glue-line, in light transmission
Cavity structure is formed between cover board and image sensing chip.
Due to having cavity between euphotic cover plate and image sensing chip in the prior art, transparent cover plate bears pressure capability
Weaker, in order to avoid euphotic cover plate is broken, transparent cover plate can not directly carry the plastic package die of injection molding, and therefore, it is necessary to head
It first is initially formed a packaging plastic under conditions of not using plastic package die, plastic sealed mould is then carried with the packaging plastic that first time is formed
Tool, re-forms a packaging plastic, to form the encapsulation plastic structure with regular texture.As it can be seen that the prior art is needed using twice
The forming process of packaging plastic, complex manufacturing technology increase cost of manufacture.
To solve the above-mentioned problems, the embodiment of the invention provides the packaging methods and encapsulation of a kind of image sensing chip
Structure, relative to traditional cavity structure that has, in technical solution of the embodiment of the present invention, euphotic cover plate and image sensing chip are direct
It is bonded and is fixed by the first optical adhesive layer gapless, euphotic cover plate can bear biggish pressure, can use plastic package die one
Secondary property forms packaging plastic, and compared with the existing technology, manufacture craft is simple, reduces the production cost.
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, with reference to the accompanying drawing and specific real
Applying mode, the present invention is described in further detail.
With reference to Fig. 1-12, Fig. 1-Figure 12 is a kind of work of the packaging method of image sensing chip provided in an embodiment of the present invention
Skill flow chart, the packaging method include:
Step S11: as shown in figs 1 to 6, an image sensing chip 12 is provided.
Wherein, the image sensing chip 12 has opposite first surface and second surface.The first surface packet
Include photosensitive area.
The production method of the image sensing chip 12 includes:
Firstly, as depicted in figs. 1 and 2, providing a wafer 100, the wafer 100 includes multiple image sensing chips 12,
There is cutting channel 20 between adjacent image sensing chip 12, the first surface of the image sensing chip 12 include photosensitive area with
And surround the rim area of the photosensitive area；The photosensitive area is provided with microlens array；The microlens array includes multiple battle arrays
Arrange the lenticule 121 of arrangement；The rim area is provided with weld pad 122.Fig. 2 is sectional drawing of the Fig. 1 in the direction P-P '.
Then, as shown in figure 3, covering the second optical adhesive layer 13 in microlens array surface gapless.In subsequent work
In skill, as shown in Figure 10, the top of image sensing chip 12 again is needed to pass through the fixed euphotic cover plate 14 of the first optical adhesive layer 15.Institute
The refractive index for stating the second optical adhesive layer 13 is less than the refractive index of first optical adhesive layer 15.First table of image sensing chip 12
Face has photosensitive pixel, and photosensitive pixel is imaged for detecting light.Microlens array covers photosensitive pixel.It is arranged described
The refractive index of two optical adhesive layers 13 is less than the refractive index of first optical adhesive layer 15, in this way, angle of incidence of light meets total reflection
When incidence angle, it can be totally reflected in the second optical adhesive layer 13 and 15 interface of the first optical adhesive layer, so that wide-angle is oblique
Incident light is totally reflected, so that microlens array has better collimating effect, is avoided between different photosensitive pixels
Testing result generates cross-interference issue.Second optical adhesive layer 13 and the first optical adhesive layer 15 are light transmission glue-line.
Finally, dividing the wafer 100 based on the cutting channel 20 such as Fig. 4, the image for forming multiple simple grains is passed
Sense chip 12.The sectional drawing of simple grain image sensing chip after cutting as shown in figure 5, top view as shown in fig. 6, Fig. 5 is that Fig. 6 exists
The sectional drawing in the direction A-A '.
In this embodiment, the second optical adhesive layer 13 only covers photosensitive area, with rim area no overlap.Forming described the
When two optical adhesive layers 13, optical adhesive layer 13 only can be formed in the photosensitive area of each image sensing chip 12, it can also be in wafer
100 whole surface forms the second optical adhesive layer 13, and described second except photosensitive area is removed by modes such as plasma treatments
Optical adhesive layer 13.The top surface of second optical adhesive layer 13 is flat surfaces.
In this approach, all weld pads 122 are located at the rim area of the same side of the photosensitive area.In general, image
The photosensitive area of sensing chip 12 is rectangle, and all weld pads are arranged to the same side rim area of photosensitive area, can reduce in addition
The width in three side frame areas is convenient for narrow frame design, reduces the size of image sensing chip 12.
Need to illustrate when, the layout type of weld pad 122 is not limited to mode shown in Fig. 6 in image sensing chip 12, can
To set the layout of weld pad 122 according to demand, it can also be respectively provided with weld pad 122 in the circumferential side frame area of photosensitive area, can also incited somebody to action
Weld pad is divided into two groups and is separately positioned on the opposite two sides rim area of photosensitive area.
Step S12: as Figure 7-9, the image sensing chip 12 is bonded fixation with a circuit board 11.
Wherein, the second surface is fitted in the surface of the circuit board 11, the image sensing chip 12 and the electricity
Road plate 11 is electrically connected, and the circuit board 11 is for connecting external circuit.
In the step, include: in the method for 11 surface stabilized image sensing chip 12 of circuit board
Firstly, circuit board 11 has opposite front and the back side as shown in fig. 7, providing a circuit board 11.The front
For fixing the image sensing chip 12.Specifically, just towards circuit board 11 by the second surface of image sensing chip 12
Face setting.The back side of circuit board 11 has welding ends 111, and the welding ends 111 with external circuit for connecting.In circuit board 11
It is provided with interconnection circuit, interconnection circuit is connect with the welding ends 111.
Then, as shown in figure 8, the second surface of image sensing chip 12 is bonded admittedly with the first side surface of circuit board 11
It is fixed.The two can be bonded by glue-line and be fixed, or is welded and fixed by welding procedure.
Finally, as shown in figure 9, the image sensing chip 12 is electrically connected by metal wire 17 with the circuit board 11.
Wherein, the image sensing chip 12 and the electric connection mode of the circuit board 11 are not limited to logical metal wire 17 and connect.May be used also
Interconnection architecture is formed with the second surface by TSV (through silicon via) technique in image sensing chip 12, directly passes through the mutual connection
The electrical connection of circuit board 11 described in structure.Weld pad 122 is connect by metal wire 17 with interconnection circuit.Can be by routing technique, it will
The image sensing chip 12 is electrically connected by metal wire 17 with the circuit board 11.
Step S13: as shown in Figure 10 and Figure 11, in the fixed euphotic cover plate 14 of the first surface, the euphotic cover plate 14
Fixation is bonded with 12 gapless of image sensing chip by the first optical adhesive layer 15.
It is described to include: in the fixed euphotic cover plate 14 of the first surface in the step
Firstly, as shown in Figure 10, providing a size and the matched euphotic cover plate 14 of the image sensing chip 12；?
One surface of the euphotic cover plate 14 uniformly coats one layer of first optical adhesive layer 15；Then, as shown in figure 11, pass through institute
The first optical adhesive layer 15 is stated, the euphotic cover plate 14 is fixed on to the first surface of the image sensing chip 12.The present invention is real
It applies in example, euphotic cover plate 14 is identical as the size of image sensing chip 12, in this way, the periphery of the euphotic cover plate 14 and the shadow
As the periphery of sensing chip 12 flushes.
In which, since the second optical adhesive layer 13 only covers photosensitive area, therefore 15 a part of the first optical adhesive layer directly with
First optical adhesive layer 13 is fixed, and the rim area of another part and image sensing chip 12 is fixed.
Step S14: as shown in figure 12, the surface setting envelope of the image sensing chip 12 is fixed in the circuit board 11
Glue 16 is filled, the packaging plastic 16 surrounds the image sensing chip 12 and the euphotic cover plate 14, and exposes the euphotic cover
The top surface of plate 14.
The circuit board 11 has opposite front and the back side, and the front has for fixing the image sensing core
The first area of piece 12 and the second area for surrounding the first area, the image sensing chip 12 are fixed on described first
Region；
It is described that on the surface that the circuit board 11 is fixed with the image sensing chip 12, packaging plastic 6 is set in the step
It include: that packaging plastic 16, the height of the packaging plastic 16 and described are formed on the second area by injection molding process
Light cover board 14 is flushed away from a side surface of the image sensing chip 12, that is to say, that be arranged the top surface of the packaging plastic 16 with
The top surface of the euphotic cover plate 14 flushes, in this way convenient for using plastic package die progress injection molding process.Since cover board 14 is direct
It is bonded fixation with 12 gapless of image sensing chip by the first optical adhesive layer 15 of flood, therefore plastic package die can be directly used
By the encapsulation glue-line 16 for disposably forming tactical rule.
With reference to Figure 13, Figure 13 is a kind of package structure diagram of image sensing chip provided in an embodiment of the present invention, figure
13 are different only in that the second optical adhesive layer 13 is different from encapsulating structure shown in Figure 12, other processing steps and other structures are homogeneous
Together.In mode shown in Figure 13, the top surface pattern of second optical adhesive layer 13 and the top surface consistent appearance of the microlens array.
With reference to Figure 14, Figure 14 is the package structure diagram of another image sensing chip provided in an embodiment of the present invention,
Figure 14 is different only in that the formation structure of the second optical adhesive layer 13 is different from encapsulating structure shown in Figure 12, in mode shown in Figure 14,
Second optical adhesive layer 13 also covers the rim area, and exposes the weld pad 122.The image sensing shown in preparation which
When chip 12, it can be initially formed the second optical adhesive layer 13 of covering whole wafer 100, then the second of removal covering weld pad 122
Optical adhesive layer 13.Other manufacture crafts are identical, and details are not described herein.
Preferably, the refractive index of second optical adhesive layer 13 less than 1.4, second optical adhesive layers 13 refractive index as far as possible
It is small, can make it that there is with the first optical adhesive layer 15 biggish refringence in this way, can be relatively easy to be all-trans
It penetrates, improves collimation.The refractive index of second optical adhesive layer 13 is less than or equal to 1.2, i.e., better closer to 1 effect.Second light
The thickness of glue-line 13 is learned between 1 μm -2 μm.
Preferably, the light transmittance of the first optical adhesive layer 15 is more than or equal to 60%, more preferably greater than or is equal to
75%, i.e. the first optical adhesive layer 15 has high transparency.The thickness of first optical adhesive layer 15 is between 20 μm -60 μm.Optionally,
The thickness of euphotic cover plate 14 is between 100 μm -300 μm.The thickness of first optical adhesive layer 15 is greater than the thickness of the second optical adhesive layer 13
Degree, in order to which the more smooth fitting of euphotic cover plate 14 to be fixed on to the top of image sensing chip 12.
As can be seen from the above description, in packaging method described in the embodiment of the present invention, using the encapsulation that can form no cavity
Structure, plastic package die can act directly on transparent cover plate 14, can be completed by a plastic package process and pass to the image
The packaging protection of sense chip 12, simple process reduce the production cost.
Based on the above embodiment, another embodiment of the present invention additionally provides a kind of encapsulating structure of image sensing chip, institute
It states encapsulating structure to be shown in Fig.12, comprising: circuit board 11, the circuit board 11 is for connecting external circuit；Image sensing
Chip 12, the image sensing chip 12 have opposite first surface and second surface, and the first surface includes photosensitive
Area；The second surface fitting is fixed on the surface of the circuit board 11, the image sensing chip 12 and the circuit board 11
Electrical connection；Euphotic cover plate 14, the euphotic cover plate 14 pass through the first optical adhesive layer 15 and the first of the image sensing chip 12
Gapless fitting in surface is fixed；Packaging plastic 16, the packaging plastic 16, which is arranged, is fixed with the image sensing in the circuit board 11
The surface of chip 12, the packaging plastic 16 surround the image sensing chip 12 and the euphotic cover plate 14.
12 first surface of image sensing chip includes the photosensitive area and the rim area for surrounding the photosensitive area, institute
Photosensitive area is stated with microlens array, the rim area is provided with weld pad 122；Microlens array surface gapless is covered with
Second optical adhesive layer 13, the refractive index of second optical adhesive layer 13 are less than the refractive index of first optical adhesive layer 15.
In the mode shown in Figure 12, the top surface of second optical adhesive layer 13 is flat surfaces.Only cover photosensitive area.Other
, can also as shown in figure 14 in mode, second optical adhesive layer 13 also covers the rim area, and exposes the weld pad 122.
, can also as shown in figure 13 in other modes, the top surface pattern of second optical adhesive layer 13 and the top of the microlens array
Face consistent appearance has the raised structures corresponding to microlens array.
In the encapsulating structure, all weld pads 122 of the image sensing chip 12 are located at the same of the photosensitive area
The rim area of side.In this way, being convenient for the narrow frame design of chip.
In the encapsulating structure, the refractive index of second optical adhesive layer 13 is less than 1.4.Second optical adhesive layer 13
Thickness range is 1 μm -2 μm, including endpoint value.The light transmittance of first optical adhesive layer 15 is not less than 60%.First light
The thickness range for learning glue-line 15 is 20 μm -60 μm.
In the encapsulating structure, the circuit board 11 has opposite front and the back side, and the front is for fixing institute
State image sensing chip 12；The image sensing chip 11 is electrically connected by metal wire 17 with the circuit board 11.The light transmission
The periphery of cover board 14 is flushed with the periphery of the image sensing chip 12.The thickness range of the euphotic cover plate 14 is 100 μm-
300 μm, including endpoint value.The euphotic cover plate can be glass plate.
The circuit board 11 has opposite front and the back side, and the front has for fixing the image sensing core
The first area of piece 12 and the second area for surrounding the first area, the image sensing chip 12 are fixed on described first
Region；The packaging plastic 16 is located at the second area, the height of the packaging plastic 16 and the euphotic cover plate 14 away from described
One side surface of image sensing chip 12 flushes.
In encapsulating structure described in the embodiment of the present invention, using no cavity structure, it can directly pass through single injection-molded work
Skill forms packaging plastic 16, is sealed protection to image sensing chip 12, manufacture craft is simple, low manufacture cost.
Each embodiment in this specification is described in a progressive manner, the highlights of each of the examples are with other
The difference of embodiment, the same or similar parts in each embodiment may refer to each other.For device disclosed in embodiment
For, since it is corresponded to the methods disclosed in the examples, so being described relatively simple, related place is said referring to method part
It is bright.
It should also be noted that, herein, relational terms such as first and second and the like are used merely to one
Entity or operation are distinguished with another entity or operation, without necessarily requiring or implying between these entities or operation
There are any actual relationship or orders.Moreover, the terms "include", "comprise" or its any other variant are intended to contain
Lid non-exclusive inclusion, so that article or equipment including a series of elements not only include those elements, but also
It including other elements that are not explicitly listed, or further include for this article or the intrinsic element of equipment.Do not having
In the case where more limitations, the element that is limited by sentence "including a ...", it is not excluded that in the article including above-mentioned element
Or there is also other identical elements in equipment.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention.
Various modifications to these embodiments will be readily apparent to those skilled in the art, as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, of the invention
It is not intended to be limited to the embodiments shown herein, and is to fit to and the principles and novel features disclosed herein phase one
The widest scope of cause.
Claims (28)
1. a kind of packaging method of image sensing chip, which is characterized in that the packaging method includes:
One image sensing chip is provided, the image sensing chip has opposite a first surface and second surface, and described the
One surface includes photosensitive area；
The image sensing chip is bonded fixation with a circuit board, wherein the second surface is fitted in the circuit board
Surface, the image sensing chip and the circuit board electrical connection, the circuit board is for connecting external circuit；
In the fixed euphotic cover plate of the first surface, the euphotic cover plate passes through the first optical adhesive layer and the image sensing chip
Gapless fitting is fixed；
Packaging plastic is set on the surface that the circuit board is fixed with the image sensing chip, the packaging plastic surrounds the image
Sensing chip and the euphotic cover plate, and expose the top surface of the euphotic cover plate.
2. packaging method according to claim 1, which is characterized in that the production method of the image sensing chip includes:
One wafer is provided, the wafer includes multiple image sensing chips, there is cutting channel between adjacent image sensing chip,
The first surface of the image sensing chip includes photosensitive area and the rim area for surrounding the photosensitive area；The photosensitive area setting
There is microlens array；The microlens array includes the lenticule of multiple array arrangements；The rim area is provided with weld pad；
The second optical adhesive layer is covered in microlens array surface gapless, the refractive index of second optical adhesive layer is less than institute
State the refractive index of the first optical adhesive layer；
Divide the wafer based on the cutting channel, forms the image sensing chip of multiple simple grains.
3. packaging method according to claim 2, which is characterized in that the top surface pattern of second optical adhesive layer with it is described
The top surface consistent appearance of microlens array.
4. packaging method according to claim 2, which is characterized in that the top surface of second optical adhesive layer is flat table
Face.
5. packaging method according to claim 2, which is characterized in that second optical adhesive layer also covers the frame
Area, and expose the weld pad.
6. packaging method according to claim 2, which is characterized in that all weld pads are located at the same of the photosensitive area
The rim area of side.
7. packaging method according to claim 2, which is characterized in that the refractive index of second optical adhesive layer is less than 1.4.
8. packaging method according to claim 2, which is characterized in that the thickness range of second optical adhesive layer is 1 μm-
2 μm, including endpoint value.
9. packaging method according to claim 1, which is characterized in that described by the image sensing chip and a circuit board
Being bonded fixation includes:
A circuit board is provided, the circuit board has opposite front and the back side, and the front is for fixing the shadow
As sensing chip；
The image sensing chip is passed through into metal wire and the circuit board electrical connection.
10. packaging method according to claim 1, which is characterized in that described in the fixed euphotic cover plate of the first surface
Include:
One size and the matched euphotic cover plate of the image sensing chip are provided；
One layer of first optical adhesive layer is uniformly coated on a surface of the euphotic cover plate；
By first optical adhesive layer, the euphotic cover plate is fixed on to the first surface of the image sensing chip；
Wherein, the periphery of the euphotic cover plate is flushed with the periphery of the image sensing chip.
11. packaging method according to claim 1, which is characterized in that the circuit board has opposite front and back
Face, the front have the secondth area of first area and the encirclement first area for fixing the image sensing chip
Domain, the image sensing chip are fixed on the first area；
It is described the circuit board be fixed with the image sensing chip surface setting packaging plastic include:
By injection molding process, packaging plastic, the height of the packaging plastic and the euphotic cover are formed on the second area
A side surface of the backboard from the image sensing chip flushes.
12. -11 described in any item packaging methods according to claim 1, which is characterized in that the light transmission of first optical adhesive layer
Rate is not less than 60%.
13. -11 described in any item packaging methods according to claim 1, which is characterized in that the thickness of first optical adhesive layer
Range is 20 μm -60 μm.
14. -11 described in any item packaging methods according to claim 1, which is characterized in that the thickness range of the euphotic cover plate
It is 100 μm -300 μm, including endpoint value.
15. a kind of encapsulating structure of image sensing chip, which is characterized in that the encapsulating structure includes:
Circuit board, the circuit board is for connecting external circuit；
Image sensing chip, the image sensing chip have opposite first surface and second surface, the first surface
Including photosensitive area；The second surface fitting is fixed on the surface of the circuit board, the image sensing chip and the circuit
Plate electrical connection；
Euphotic cover plate, the euphotic cover plate are pasted by the first optical adhesive layer and the first surface gapless of the image sensing chip
It closes and fixes；
The surface that the circuit board is fixed with the image sensing chip, the packaging plastic is arranged in packaging plastic, the packaging plastic
Surround the image sensing chip and the euphotic cover plate.
16. encapsulating structure according to claim 15, which is characterized in that the image sensing chip first surface includes institute
It states photosensitive area and surrounds the rim area of the photosensitive area, the photosensitive area has microlens array, and the rim area is provided with
Weld pad；
Microlens array surface gapless is covered with the second optical adhesive layer, and the refractive index of second optical adhesive layer is less than institute
State the refractive index of the first optical adhesive layer.
17. encapsulating structure according to claim 16, which is characterized in that the top surface pattern of second optical adhesive layer and institute
State the top surface consistent appearance of microlens array.
18. packaging method according to claim 16, which is characterized in that the top surface of second optical adhesive layer is flat table
Face.
19. packaging method according to claim 16, which is characterized in that second optical adhesive layer also covers the frame
Area, and expose the weld pad.
20. encapsulating structure according to claim 16, which is characterized in that all weld pads are located at the same of the photosensitive area
The rim area of side.
21. encapsulating structure according to claim 16, which is characterized in that the refractive index of second optical adhesive layer is less than
1.4。
22. encapsulating structure according to claim 16, which is characterized in that the thickness range of second optical adhesive layer is 1 μ
M-2 μm, including endpoint value.
23. encapsulating structure according to claim 15, which is characterized in that the circuit board has opposite front and back
Face, the front is for fixing the image sensing chip；
The image sensing chip passes through metal wire and the circuit board electrical connection.
24. encapsulating structure according to claim 15, which is characterized in that the periphery of the euphotic cover plate and the image pass
The periphery of sense chip flushes.
25. encapsulating structure according to claim 15, which is characterized in that the circuit board has opposite front and back
Face, the front have the secondth area of first area and the encirclement first area for fixing the image sensing chip
Domain, the image sensing chip are fixed on the first area；
The packaging plastic is located at the second area, and the height of the packaging plastic and the euphotic cover plate deviate from the image sensing
One side surface of chip flushes.
26. the described in any item encapsulating structures of 5-25 according to claim 1, which is characterized in that first optical adhesive layer it is saturating
Light rate is not less than 60%.
27. the described in any item encapsulating structures of 5-25 according to claim 1, which is characterized in that the thickness of first optical adhesive layer
Spending range is 20 μm -60 μm.
28. the described in any item encapsulating structures of 5-25 according to claim 1, which is characterized in that the thickness model of the euphotic cover plate
Enclosing is 100 μm -300 μm, including endpoint value.
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| CN201810940898.9A CN109065560A (en) | 2018-08-17 | 2018-08-17 | The packaging method and encapsulating structure of image sensing chip |
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| CN201810940898.9A CN109065560A (en) | 2018-08-17 | 2018-08-17 | The packaging method and encapsulating structure of image sensing chip |
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