CN111816712A - Packaging structure and method for prefabricated filter cover plate and photoelectric device - Google Patents
Packaging structure and method for prefabricated filter cover plate and photoelectric device Download PDFInfo
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- CN111816712A CN111816712A CN202010879103.5A CN202010879103A CN111816712A CN 111816712 A CN111816712 A CN 111816712A CN 202010879103 A CN202010879103 A CN 202010879103A CN 111816712 A CN111816712 A CN 111816712A
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 61
- 238000000034 method Methods 0.000 title claims abstract description 25
- 230000003287 optical effect Effects 0.000 claims abstract description 27
- 230000008569 process Effects 0.000 claims abstract description 7
- 239000004033 plastic Substances 0.000 claims description 28
- 238000005520 cutting process Methods 0.000 claims description 8
- 230000005693 optoelectronics Effects 0.000 claims description 7
- 238000001746 injection moulding Methods 0.000 claims description 6
- 239000000565 sealant Substances 0.000 claims description 5
- 239000005022 packaging material Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000009417 prefabrication Methods 0.000 claims description 2
- 230000037237 body shape Effects 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000005538 encapsulation Methods 0.000 abstract description 34
- 230000000977 initiatory effect Effects 0.000 abstract description 3
- 239000003292 glue Substances 0.000 description 6
- 238000004026 adhesive bonding Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000010073 coating (rubber) Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0232—Optical elements or arrangements associated with the device
- H01L31/02325—Optical elements or arrangements associated with the device the optical elements not being integrated nor being directly associated with the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model provides a prefabricated filter apron, photoelectric device's packaging structure and method, a prefabricated printing opacity piece apron, including printing opacity piece main part, at least one first stationary blade and at least one second stationary blade, first stationary blade and second stationary blade fixed connection are at the edge of printing opacity piece main part, and first stationary blade and second stationary blade one-to-one just set up relatively and form the stationary blade pair. The cover plate for encapsulating the optical filter is prepared in advance, so that the chip encapsulation efficiency and the accuracy of the position of the optical filter patch are greatly improved, the cover plate can be integrated in the traditional IC encapsulation types, QFN (quad Flat No-lead), DFN (distributed feed network), SIP (Session initiation protocol) and other encapsulation types, the cover plate can be applied to the encapsulation of a chip tube shell, the encapsulation operation process of a photoelectric device can be effectively shortened, and the encapsulation operation efficiency and the encapsulation operation consistency are improved.
Description
Technical Field
The disclosure relates to the related technical field of photoelectric devices, in particular to a prefabricated filter cover plate, a packaging structure of a photoelectric device and a packaging method of the photoelectric device.
Background
The statements in this section merely provide background information related to the present disclosure and may not necessarily constitute prior art.
The photoelectric device is a device manufactured according to a photoelectric effect, and generally comprises a photosensitive sensor chip, and the sensitive part of the sensor can be contacted with light to realize the sensing and detecting functions of the sensor. The existing packaging structure does not generally adopt the packaging form of the traditional IC, but adopts the cavity type packaging with the exposed functional part of the sensor chip or the whole chip, and the packaging has the advantages that the sensor chip can be directly exposed in a cavity made by a special mold, and the sensing chip in a device is semi-wrapped by plastic packaging material or directly exposed in the air, so that the best performance of the sensor chip can be exerted.
The inventor finds that in the conventional package of the package, the filter is usually attached to the upper portion of the package as the chip photosensitive channel, and in the packaging operation, the plastic cover plate needs to be attached to the top surface of the package first, and then the filter needs to be attached to the plastic cover plate. Such an operation is complicated and inefficient. Meanwhile, the positions of the optical filter patches cannot be kept consistent, and the sealant is easily adhered to the optical filter in the adhering process, so that the actual light transmission areas of the optical filter are inconsistent. Therefore, the traditional plastic package structure cannot meet the requirements of rapid operation and operation consistency in a tube shell packaging form with the optical filter.
Disclosure of Invention
In order to solve the problems, the disclosure provides a prefabricated filter cover plate, a packaging structure of a photoelectric device and a method.
In order to achieve the purpose, the following technical scheme is adopted in the disclosure:
one or more embodiments provide a prefabricated light-transmitting sheet cover plate, including the light-transmitting sheet main part, at least one first stationary blade and at least one second stationary blade, first stationary blade and second stationary blade fixed connection are at the edge of light-transmitting sheet main part, and first stationary blade and second stationary blade one-to-one and relative setting form the stationary blade pair.
One or more embodiments provide a prefabricated light-transmitting sheet cover plate, including a light-transmitting sheet main body and an annular fixing sheet, an inner ring shape of the annular fixing sheet matches with an outer peripheral shape of the light-transmitting sheet main body, and an inner ring of the annular fixing sheet is fixedly connected to an edge of the light-transmitting sheet main body.
One or more embodiments provide a method of prefabricating a light transmissive sheet cover panel, comprising the steps of:
manufacturing a plastic package mold, wherein the plastic package mold comprises a filter placing area and an injection molding area, the filter placing area is matched with the thickness and the shape of the optical filter, and the injection molding area is matched with the shape of the fixing piece;
placing the optical filter in plastic packaging equipment with a plastic packaging mold to carry out plastic packaging operation of a cover plate, so that the plastic packaging material can wrap the periphery of the optical filter to realize fixation of the optical filter;
and after plastic packaging is finished, performing single cutting operation on the cover plate according to the cutting path marks to cut the cover plate into single cover plates with single optical filters.
One or more embodiments provide a packaging structure of a photoelectric device, which includes a chip and a chip packaging shell, and the prefabricated light-transmitting sheet cover plate; the chip is fixedly arranged in the packaging tube shell and is connected with a lead frame of the tube shell through a lead, the light-transmitting sheet cover plate covers the packaging tube shell to form a cavity, and the light-transmitting area of the light-transmitting sheet cover plate is arranged above the light-sensing part of the chip.
One or more embodiments provide a method of packaging an optoelectronic device, including the steps of:
preparing a prefabricated light-transmitting sheet cover plate by adopting the prefabricating method;
the chip is pasted in the packaging tube shell, and the substrate or the lead frame is connected with the chip welding spot through routing;
and (3) adopting sealant to paste the prefabricated light-transmitting sheet cover plate on the opening surface of the packaging tube shell provided with the chip.
Compared with the prior art, the beneficial effect of this disclosure is:
(1) in this disclosure, set up two stationary blades or cyclic annular stationary blade at least and fix the printing opacity piece main part and form prefabricated filter apron in the centre, when carrying out photoelectric device's encapsulation, can be through the last surface contact of stationary blade with the tube, with this prefabricated filter apron setting on the tube, the printing opacity area of non-contact printing opacity piece has increased the area of can snatching of encapsulation in-process simultaneously, has improved the convenience of operation, avoids being sealed to cover of printing opacity piece and leads to the encapsulation failure.
The annular fixing piece can fix the periphery of the light-transmitting piece, so that the cover plate is more stable in structure, and the service life of the cover plate is prolonged.
(2) The packaging structure of the photoelectric device is formed on the packaging tube shell by covering the prefabricated light-transmitting sheet cover plate in the disclosure, the light-transmitting sheet is prevented from being directly operated and damaged, the positions of the packaging structures are inconsistent, and the light-transmitting sheet is coated, so that the consistency of the packaging structures can be improved.
(3) The cover plate for encapsulating the optical filter is prepared in advance, so that the chip encapsulation efficiency and the accuracy of the position of the optical filter patch are greatly improved, the cover plate can be integrated in the traditional IC encapsulation types, QFN (quad Flat No-lead), DFN (distributed feed network), SIP (Session initiation protocol) and other encapsulation types, the cover plate can be applied to the encapsulation of a chip tube shell, the encapsulation operation process of a photoelectric device can be effectively shortened, and the encapsulation operation efficiency and the encapsulation operation consistency are improved.
Drawings
The accompanying drawings, which are included to provide a further understanding of the disclosure, illustrate embodiments of the disclosure and together with the description serve to explain the disclosure and not to limit the disclosure.
Fig. 1 is a schematic structural view of a prefabricated light transmissive sheet cover of example 1 of the present disclosure;
FIG. 2 is a schematic view of another embodiment of a preformed cover sheet of example 1 of the present disclosure;
fig. 3 is a schematic view of a package structure of an optoelectronic device according to embodiment 4 of the present disclosure;
fig. 4 is a schematic view of a package structure of another optoelectronic device according to embodiment 4 of the present disclosure;
FIG. 5 is a flow chart of a method of prefabricating a cover plate for a light transmitting sheet of example 3 of the present disclosure;
fig. 6 is a flowchart of a packaging method of an optoelectronic device of embodiment 5 of the present disclosure.
Wherein: 1. printing opacity piece main part, 2, first stationary blade, 3, second stationary blade, 4, first location platform, 5, second location platform, 6, encapsulation tube shell, 7, chip.
The specific implementation mode is as follows:
the present disclosure is further described with reference to the following drawings and examples.
It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments in the present disclosure may be combined with each other. The embodiments will be described in detail below with reference to the accompanying drawings.
Example 1
In one or more embodiments, as shown in fig. 1, a prefabricated light-transmitting sheet cover plate includes a light-transmitting sheet main body 1, at least one first fixing sheet 2 and at least one second fixing sheet 3, wherein the first fixing sheet 2 and the second fixing sheet 3 are fixedly connected to an edge of the light-transmitting sheet main body 1, and the first fixing sheet 2 and the second fixing sheet 3 are in one-to-one correspondence and are oppositely arranged to form a fixing sheet pair.
In this embodiment, set up two stationary blades at least and fix printing opacity piece main part 1 in the centre, can be when carrying out photoelectric device's encapsulation, through the last surface contact of stationary blade and tube, with this apron setting on the tube, the printing opacity area of contactless printing opacity piece has increased the area that can snatch of encapsulation in-process, has improved the convenience of operation, avoids printing opacity piece to be sealed to cover and leads to the encapsulation failure.
Optionally, the light-transmitting sheet main body 1 may employ an optical filter, and the first fixing sheet and the second fixing sheet may employ plastic fixing sheets.
As a further improvement, as shown in fig. 1, the light-transmitting sheet main body 1 is arranged between the first fixing sheet 2 and the second fixing sheet 3 to form a straight-line-like shape, the side surface of the light-transmitting sheet main body 1 is fixedly connected with the first fixing sheet 2 and the second fixing sheet 3, and the light-transmitting surface of the light-transmitting sheet main body 1 is flush with the surfaces of the first fixing sheet 2 and the second fixing sheet 3 respectively.
As another structure, as shown in fig. 2, a first positioning stage 4 is disposed on a side surface of the first fixing sheet 2 connected to the light-transmitting sheet main body 1, a second positioning stage 5 is disposed on a side surface of the second fixing sheet 3 connected to the light-transmitting sheet main body 1, and the first positioning stage 4 and the second positioning stage 5 are fixedly connected to a bottom surface or a top surface of the light-transmitting sheet main body 1.
In some embodiments, the first fixing sheet 2 and the second fixing sheet 3 are respectively provided with a fixing area, and the fixing area is a groove or a concave surface, and optionally, the inner surface of the concave surface or the groove is provided with a frosting surface.
Alternatively, the first fixing plate 2 and the second fixing plate 3 may have a rectangular shape or a circular arc shape.
In this embodiment, through setting up recess or concave surface as fixed area, when can be fixed the apron and the tube of this embodiment, will seal glue and scribble this position, directly with the apron lid realize the encapsulation on the tube, perhaps in the encapsulation process after the rubber coating on the tube, extrude unnecessary sealed glue to this fixed area, avoid the inaccurate printing glue volume of gluing control to lead to the light transmission piece to be scribbled.
Example 2
The present embodiment provides a prefabricated light-transmitting sheet cover plate different from the structure of embodiment 1 in that the fixing sheet of the present embodiment is different from the first fixing sheet or the second fixing sheet of embodiment 1 in structure, and includes a light-transmitting sheet main body 1 and an annular fixing sheet, the inner ring shape of the annular fixing sheet matches with the peripheral shape of the light-transmitting sheet main body, and the inner ring of the annular fixing sheet is fixedly connected to the edge of the light-transmitting sheet main body 1.
The cyclic annular stationary blade that this embodiment set up can be fixed printing opacity piece border for the structure of apron is more stable, improves apron life.
In a typical structure, the light-transmitting surface of the light-transmitting sheet main body 1 is flush with the surface of the ring-shaped fixing sheet.
In another structure, a third positioning table is arranged on the surface of the inner ring of the annular fixing sheet and is fixedly connected with the bottom surface or the top surface of the light-transmitting sheet main body 1.
Optionally, the light-transmitting sheet main body 1 may adopt an optical filter, and the annular fixing sheet may adopt a plastic fixing sheet.
In some embodiments, the annular fixing plate is provided with a fixing region, the fixing region is a groove or a concave surface, and optionally, the inner surface of the concave surface or the groove is provided with a frosting surface.
In this embodiment, through setting up recess or concave surface as fixed area, when can be fixed the apron and the tube of this embodiment, will seal glue and scribble this position, directly with the apron lid realize the encapsulation on the tube, perhaps in the encapsulation process after the rubber coating on the tube, extrude unnecessary sealed glue to this fixed area, avoid the inaccurate printing glue volume of gluing control to lead to the light transmission piece to be scribbled.
Example 3
This example provides a method of prefabricating a cover plate for a light transmitting sheet as described in example 1, comprising the steps of:
step 1: manufacturing a plastic package mold, wherein the plastic package mold comprises a filter placing area and an injection molding area, the filter placing area is matched with the thickness and the shape of the optical filter, and the injection molding area is matched with the shape of the fixing piece; the fixing pieces are a first fixing piece 2 and a second fixing piece 3, or are annular fixing pieces.
Step 2: placing the optical filter in plastic packaging equipment with a plastic packaging mold to carry out plastic packaging operation of a cover plate, so that the plastic packaging material can wrap the periphery of the optical filter to realize fixation of the optical filter;
and 3, after plastic package is completed, performing sheet cutting operation on the cover plate according to the cutting path marks to cut the cover plate into single cover plates with single optical filters.
Example 4
This embodiment provides a package structure of an optoelectronic device, as shown in fig. 3 and 4, including a prefabricated light-transmissive sheet cover plate, a chip 7 and a chip package 6 described in embodiment 1 or embodiment 2; the chip is fixedly arranged in the packaging tube shell 6 and is connected with a lead frame of the tube shell 6 through a lead, the light-transmitting sheet cover plate covers the packaging tube shell 6 to form a cavity, and the light-transmitting area of the light-transmitting sheet cover plate is arranged above the light-sensing part of the chip.
The packaging structure of the photoelectric device is formed by covering the prefabricated light-transmitting sheet cover plate on the packaging tube shell in the embodiment, the light-transmitting sheet is prevented from being directly operated and damaged, the packaging structure is inconsistent in position and the light-transmitting sheet is coated, the consistency of the packaging structure can be improved, and the packaging quality and efficiency of the photoelectric device are improved.
As shown in fig. 3 or fig. 4, the package can 6 includes a base and a riser disposed on the base, and the riser and the base form a box shape with an open upper end.
In some embodiments, encapsulation can be achieved theoretically as long as the upper opening of the encapsulation tube is opposite to the position of the light-transmitting sheet of the prefabricated light-transmitting sheet cover plate. In order to improve the integrity of the packaging structure, the shape of the fixing sheet of the prefabricated light-transmitting sheet cover plate 6 is matched with that of the upper end face of the packaging tube shell 6, and the fixing sheet is fixedly connected with the upper end face of the packaging tube shell 6.
Specifically, the fixing sheet and the upper end face of the package tube shell 6 may be connected by gluing, and a sealant may be used to coat the surface in contact with the fixing sheet and to bond and seal the contact surface.
Optionally, the chip 7 may be a photo-transistor, a photomultiplier, a photo-resistor, a photodiode, a photo-transistor, a photocell, or a photocoupler.
The package structure of the embodiment can be integrated and applied to package types such as a traditional IC package, a QFN package, a DFN package, an SIP package and the like.
Example 5
The present embodiment provides a method for packaging an optoelectronic device, as shown in fig. 6, which may include the following steps:
and 3, adhering the prefabricated light-transmitting sheet cover plate to the opening surface of the packaging tube shell provided with the chip 7 by adopting sealant.
In the embodiment, the cover plate for encapsulating the optical filter is prepared in advance, so that the chip encapsulation efficiency and the accuracy of the position of the optical filter patch are greatly improved, the cover plate can be integrated in the traditional IC encapsulation types, QFN (quad Flat No-lead), DFN (distributed feed network), SIP (Session initiation protocol) and other encapsulation types, and can be applied to the encapsulation of the chip tube shell, the encapsulation operation process of the photoelectric device can be effectively shortened, and the encapsulation operation efficiency and the encapsulation operation consistency are improved.
Optionally, the method can be used for packaging a single packaged tube shell product, and can also be used for cutting and molding the whole Block tube shell product after being pasted with a group of cover plates.
Specifically, during the packaging operation, a group (block) of tube shells can be plastically packaged at a time, and the group of tube shells can be cut into single tube shells, and then the next operation is performed. Instead of cutting the sheet into individual pieces, the group may be subjected to bonding and wire bonding. And then a group of cover plates are integrally attached and cut into single pieces. The efficiency of the packaging can be further improved by adopting the whole set of operation.
The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure.
Although the present disclosure has been described with reference to specific embodiments, it should be understood that the scope of the present disclosure is not limited thereto, and those skilled in the art will appreciate that various modifications and changes can be made without departing from the spirit and scope of the present disclosure.
Claims (10)
1. The utility model provides a prefabricated printing opacity piece apron which characterized by: including printing opacity piece main part, at least one first stationary blade and at least one second stationary blade, first stationary blade and second stationary blade fixed connection are at the edge of printing opacity piece main part, and first stationary blade and second stationary blade one-to-one and relative setting form the stationary blade to right.
2. A preformed optically transparent cover sheet as claimed in claim 1, wherein: the side surface of the light-transmitting sheet main body is fixedly connected with the first fixing sheet and the second fixing sheet, and the light-transmitting surface of the light-transmitting sheet main body is flush with the surfaces of the first fixing sheet and the second fixing sheet respectively;
or, the side that first stationary blade and printing opacity piece main part are connected sets up first location platform, and the side that the second stationary blade and printing opacity piece main part are connected sets up the second location platform, first location platform and second location platform and the bottom surface or the top surface fixed connection of printing opacity piece main part.
3. A preformed optically transparent cover sheet as claimed in claim 1, wherein: the first fixing piece and the second fixing piece are respectively provided with a fixing area, and the fixing areas are grooves or concave surfaces;
or the light-transmitting sheet main body adopts a light filter, and the first fixing sheet and the second fixing sheet adopt plastic fixing sheets.
4. A preformed optically transparent cover sheet as claimed in claim 3, wherein: the inner surface of the concave surface or the groove is a frosted surface;
or the first fixing plate and the second fixing plate are rectangular or arc-shaped.
5. The utility model provides a prefabricated printing opacity piece apron which characterized by: the light-transmitting piece comprises a light-transmitting piece main body and an annular fixing piece, wherein the inner ring shape of the annular fixing piece is matched with the peripheral shape of the light-transmitting piece main body, and the inner ring of the annular fixing piece is fixedly connected to the edge of the light-transmitting piece main body.
6. A preformed optically transparent cover sheet as claimed in claim 5, wherein: the light-transmitting surface of the light-transmitting sheet main body is flush with the surface of the annular fixing sheet;
or the inner ring surface of the annular fixing sheet is provided with a third positioning table which is fixedly connected with the bottom surface or the top surface of the light-transmitting sheet main body;
or, the annular fixing sheets are respectively provided with fixing areas, and the fixing areas are grooves or concave surfaces;
alternatively, the inner surface of the concave surface or the groove is provided with a frosted surface.
7. A prefabrication method for prefabricating a light-transmitting sheet cover plate is characterized by comprising the following steps:
manufacturing a plastic package mold, wherein the plastic package mold comprises a filter placing area and an injection molding area, the filter placing area is matched with the thickness and the shape of the optical filter, and the injection molding area is matched with the shape of the fixing piece;
placing the optical filter in plastic packaging equipment with a plastic packaging mold to carry out plastic packaging operation of a cover plate, so that the plastic packaging material can wrap the periphery of the optical filter to realize fixation of the optical filter;
and after plastic packaging is finished, performing single cutting operation on the cover plate according to the cutting path marks to cut the cover plate into single cover plates with single optical filters.
8. The utility model provides a packaging structure of photoelectric device which characterized by: comprising a chip and a chip package case, and a pre-fabricated light-transmitting sheet cover plate of any one of claims 1 to 6; the chip is fixedly arranged in the packaging tube shell and is connected with a lead frame of the tube shell through a lead, the light-transmitting sheet cover plate covers the packaging tube shell to form a cavity, and the light-transmitting area of the light-transmitting sheet cover plate is arranged above the light-sensing part of the chip.
9. The package structure of an optoelectronic device as claimed in claim 8, wherein: the shape of a fixing piece of the prefabricated light-transmitting piece cover plate is matched with the shape of the upper end face of the packaging tube shell, and the fixing piece is fixedly connected with the upper end face of the packaging tube shell;
or the chip is a photoelectric tube, a photomultiplier, a photoresistor, a photosensitive diode, a photosensitive triode, a photoelectric cell or a photoelectric coupling device;
or, the packaging structure of the photoelectric device is integrally applied to a traditional IC package, a QFN package, a DFN package or/and an SIP package;
or the packaging tube shell comprises a base plate and a vertical plate arranged on the base plate, and the vertical plate and the base plate form a box body shape with an opening at the upper end.
10. A packaging method of photoelectric devices is characterized by comprising the following steps:
preparing a preformed cover sheet for a light transmitting sheet using the preforming process of claim 7;
the chip is pasted in the packaging tube shell, and the substrate or the lead frame is connected with the chip welding spot through routing;
and (3) adopting sealant to paste the prefabricated light-transmitting sheet cover plate on the opening surface of the packaging tube shell provided with the chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010879103.5A CN111816712A (en) | 2020-08-27 | 2020-08-27 | Packaging structure and method for prefabricated filter cover plate and photoelectric device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010879103.5A CN111816712A (en) | 2020-08-27 | 2020-08-27 | Packaging structure and method for prefabricated filter cover plate and photoelectric device |
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Effective date of abandoning: 20221111 |