CN109037141A - Grabbing device is used in a kind of transport of semiconductor substrate - Google Patents

Grabbing device is used in a kind of transport of semiconductor substrate Download PDF

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Publication number
CN109037141A
CN109037141A CN201810942055.2A CN201810942055A CN109037141A CN 109037141 A CN109037141 A CN 109037141A CN 201810942055 A CN201810942055 A CN 201810942055A CN 109037141 A CN109037141 A CN 109037141A
Authority
CN
China
Prior art keywords
clamp jaw
semiconductor substrate
crushing block
spring
grabbing device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810942055.2A
Other languages
Chinese (zh)
Inventor
沈良霖
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zhejiang Yashi Jing Technology Co Ltd
Original Assignee
Zhejiang Yashi Jing Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zhejiang Yashi Jing Technology Co Ltd filed Critical Zhejiang Yashi Jing Technology Co Ltd
Priority to CN201810942055.2A priority Critical patent/CN109037141A/en
Publication of CN109037141A publication Critical patent/CN109037141A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67736Loading to or unloading from a conveyor

Abstract

The invention discloses a kind of semiconductor substrate transport grabbing devices, including base and movement arm, described movement arm one end clamping structure, the clamping structure includes electric telescopic rod, and the electric telescopic rod side is equipped with crushing block, and the crushing block two sides are equipped with connecting rod, the crushing block bottom is equipped with ball, the ball bottom is equipped with clamp jaw, and the clamp jaw two sides are equipped with the first spring, are equipped with gag lever post on the inside of the clamp jaw.Electric telescopic rod, crushing block, clamp jaw, second spring and the clamping plate that the present invention passes through setting clamping structure, be conducive to start electric telescopic rod, crushing block is driven to squeeze clamp jaw, so that clamp jaw bottom is close, so that clamping plate is clamped article under the action of second spring, structure is simple, and cost is relatively low, is easy to use.

Description

Grabbing device is used in a kind of transport of semiconductor substrate
Technical field
The present invention relates to semiconductor substrate production and transport field, in particular to a kind of semiconductor substrate transport crawl dress It sets.
Background technique
As manufacturing industry human cost is continuously improved, all trades and professions in society are all improving automatization level.Automation Production equipment in it is essential be exactly mechanical arm, the manufacturing cost of existing mechanical arm is higher, be easy increase business burden, Meanwhile the movable space or range of existing mechanical arm receives significant limitation, grasping dynamics is smaller, Wu Fashi It should be compared with the carrying of heavy articles.
Therefore, invent a kind of semiconductor substrate transport solved the above problems with grabbing device it is necessary.
Summary of the invention
The purpose of the present invention is to provide a kind of semiconductor substrate transport grabbing device, by setting electric telescopic rod, Crushing block and clamp jaw are conducive to starting electric telescopic rod and crushing block extruding clamp jaw are pushed to clamp article, structure letter It is single, it is higher with the manufacturing cost for solving existing mechanical arm mentioned above in the background art, it is easy to increase asking for business burden Topic.
To achieve the above object, the invention provides the following technical scheme: a kind of semiconductor substrate transport grabbing device, packet Base and movement arm are included, described movement arm one end is equipped with clamping structure, and the clamping structure includes electric telescopic rod, described electronic Telescopic rod side is equipped with crushing block, and the crushing block two sides are equipped with connecting rod, and the crushing block bottom is equipped with ball, the rolling Pearl bottom is equipped with clamp jaw, and the clamp jaw two sides are equipped with the first spring, are equipped with gag lever post, the limit on the inside of the clamp jaw Position bar bottom is equipped with second spring, and the second spring is equipped with clamping plate far from clamp jaw side, and the clamping plate side is equipped with Protective layer, the base bottom are equipped with rotational structure.
Preferably, the ball is fixedly connected with clamp jaw, and the connecting rod is fixedly connected with clamp jaw.
Preferably, the clamp jaw quantity is set as two, and the gag lever post is fixedly connected with two clamp jaws.
Preferably, the second spring is fixedly connected with clamp jaw, and the protective layer is made of rubber material.
Preferably, the rotational structure includes rotating disk, rotating electric machine, spill spin block, swivelling chute, support frame and pulley, institute Base bottom is stated equipped with rotating disk, the rotation pan bottom is equipped with rotating electric machine, and the rotating electric machine two sides are equipped with spill spin block.
Preferably, the spill spin block bottom is equipped with swivelling chute, and the rotation trench bottom is equipped with support frame, support frame as described above bottom Portion is equipped with pulley.
The invention has the benefit that
(1) by electric telescopic rod, crushing block, clamp jaw, second spring and the clamping plate of setting clamping structure, be conducive to start Electric telescopic rod drives crushing block to squeeze clamp jaw, so that clamp jaw bottom is close, so that effect of the clamping plate in second spring Under article is clamped, structure is simple, and cost is relatively low, be easy to use;
(2) by rotating disk, rotating electric machine and the pulley of setting rotational structure, be conducive to revolve under the drive of rotating electric machine Turntable rotation, band engine-bed move on the rotating pan, effectively expand the crawl range of movement arm, so that using more square Just.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention;
Fig. 2 is the portion A enlarged drawing in Fig. 1 of the invention;
In figure: 1 base, 2 movement arms, 3 clamping structures, 4 electric telescopic rods, 5 crushing blocks, 6 balls, 7 clamp jaws, 8 first springs, 9 gag lever posts, 10 second springs, 11 clamping plates, 12 protective layers, 13 rotational structures, 131 rotating disks, 132 rotating electric machines, 133 rotations Block, 134 swivelling chutes, 135 support frames, 136 pulleys.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other Embodiment shall fall within the protection scope of the present invention.
The present invention provides a kind of semiconductor substrate transport grabbing devices as shown in Figs. 1-2, including base 1 and movement Arm 2, described 2 one end of movement arm are equipped with clamping structure 3, and the clamping structure 3 includes electric telescopic rod 4, the electric telescopic rod 4 Side is equipped with crushing block 5, and 5 two sides of crushing block are equipped with connecting rod 6, and 5 bottom of crushing block is equipped with ball 6, the rolling 6 bottom of pearl is equipped with clamp jaw 7, and 7 two sides of clamp jaw are equipped with the first spring 8, are equipped with gag lever post 9 on the inside of the clamp jaw 7, 9 bottom of gag lever post is equipped with second spring 10, and the second spring 10 is equipped with clamping plate 11 far from 7 side of clamp jaw, described 11 side of clamping plate is equipped with protective layer 12, and 1 bottom of base is equipped with rotational structure 13.
Further, in the above-mentioned technical solutions, the ball 6 is fixedly connected with clamp jaw 7, the connecting rod 6 and folder Tight pawl 7 is fixedly connected;
Further, in the above-mentioned technical solutions, 7 quantity of clamp jaw is set as two, and the gag lever post 9 and two clamp Pawl 7 is fixedly connected with;
Further, in the above-mentioned technical solutions, the second spring 10 is fixedly connected with clamp jaw 7, the protective layer 12 by Rubber material is made, and is conducive to the frictional force for increasing clamp jaw 7, facilitates crawl;
Further, in the above-mentioned technical solutions, the rotational structure 13 includes rotating disk 131, rotating electric machine 132, spill spin block 133, swivelling chute 134, support frame 135 and pulley 136,1 bottom of base are equipped with rotating disk 131,131 bottom of rotating disk Equipped with rotating electric machine 132,132 two sides of rotating electric machine are equipped with spill spin block 133;
Further, in the above-mentioned technical solutions, 133 bottom of spill spin block is equipped with swivelling chute 134,134 bottom of swivelling chute Portion is equipped with support frame 135, and 135 bottom of support frame as described above is equipped with pulley 136.
This practical working principle:
Referring to Figure of description 1-2, when using grabbing device, starter, so that movement arm 2 moves on base 1, when arriving The starting of electric telescopic rod 4 squeezes crushing block 5 when up to suitable position, so that 7 bottom of clamp jaw is close, ball 6 is transported in crushing block 5 It is rolled when dynamic, reduces the frictional force between crushing block 5 and clamp jaw 7, the clamping plate 11 under the action of second spring 10 Article is clamped, protective layer 12 protects article, and after crawl, electric telescopic rod 4 drives crushing block 5 to return to Origin-location, clamp jaw 7 return to origin-location under the action of the first spring 8 and gag lever post 9, and structure is simple, easy to use;
Referring to Figure of description 1, in the process of grasping, according to the position that article is placed, starting rotating electric machine 132 makes rotating disk The spill spin block 133 of 131 bottoms rotates in swivelling chute 134, and then rotates with engine-bed 1, increases movement arm 2 and grabs article Range, so that it is more convenient to use, pulley 136 is conducive to that support frame 135 is driven to move, so to the position of grabbing device into Row is adjusted.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention, Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features, All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention Within protection scope.

Claims (6)

1. a kind of semiconductor substrate transport grabbing device, including base (1) and movement arm (2), it is characterised in that: the movement Arm (2) one end clamping structure (3), the clamping structure (3) include electric telescopic rod (4), and electric telescopic rod (4) side is set Have crushing block (5), crushing block (5) two sides are equipped with connecting rod (6), and crushing block (5) bottom is equipped with ball (6), institute Ball (6) bottom is stated equipped with clamp jaw (7), clamp jaw (7) two sides are equipped with the first spring (8), in the clamp jaw (7) Side is equipped with gag lever post (9), and gag lever post (9) bottom is equipped with second spring (10), and the second spring (10) is far from clamp jaw (7) side is equipped with clamping plate (11), and clamping plate (11) side is equipped with protective layer (12), and base (1) bottom is equipped with rotation Rotation structure (13).
2. a kind of semiconductor substrate transport grabbing device according to claim 1, it is characterised in that: the ball (6) It is fixedly connected with clamp jaw (7), the connecting rod (6) is fixedly connected with clamp jaw (7).
3. a kind of semiconductor substrate transport grabbing device according to claim 1, it is characterised in that: the clamp jaw (7) quantity is set as two, and the gag lever post (9) is fixedly connected with two clamp jaws (7).
4. a kind of semiconductor substrate transport grabbing device according to claim 1, it is characterised in that: the second spring (10) it is fixedly connected with clamp jaw (7), the protective layer (12) is made of rubber material.
5. a kind of semiconductor substrate transport grabbing device according to claim 1, it is characterised in that: the rotational structure It (13) include rotating disk (131), rotating electric machine (132), spill spin block (133), swivelling chute (134), support frame (135) and pulley (136), base (1) bottom is equipped with rotating disk (131), and rotating disk (131) bottom is equipped with rotating electric machine (132), institute It states rotating electric machine (132) two sides and is equipped with spill spin block (133).
6. a kind of semiconductor substrate transport grabbing device according to claim 1, it is characterised in that: the spill spin block (133) bottom is equipped with swivelling chute (134), and swivelling chute (134) bottom is equipped with support frame (135), support frame as described above (135) bottom Portion is equipped with pulley (136).
CN201810942055.2A 2018-08-17 2018-08-17 Grabbing device is used in a kind of transport of semiconductor substrate Pending CN109037141A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810942055.2A CN109037141A (en) 2018-08-17 2018-08-17 Grabbing device is used in a kind of transport of semiconductor substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810942055.2A CN109037141A (en) 2018-08-17 2018-08-17 Grabbing device is used in a kind of transport of semiconductor substrate

Publications (1)

Publication Number Publication Date
CN109037141A true CN109037141A (en) 2018-12-18

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109610924A (en) * 2019-01-30 2019-04-12 厦门宇龙机械有限公司 It is a kind of to grab linkage and the upright bar landfill equipment applied to electric pole snatch rotation
CN111128823A (en) * 2019-12-24 2020-05-08 苏州晋宇达实业股份有限公司 Transfer method of semiconductor wafer

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206123626U (en) * 2016-07-04 2017-04-26 安徽理工大学 Multi -functional shipment machine people of 6 -degree of freedom
CN206335568U (en) * 2017-01-05 2017-07-18 成都工业职业技术学院 A kind of robot device
CN206465103U (en) * 2016-12-22 2017-09-05 天津市仁好工贸有限公司 It is a kind of to protect the manipulator of part
CN206703050U (en) * 2017-03-22 2017-12-05 金顺利塑胶(重庆)有限公司 It is a kind of to capture firm manipulator
CN207273219U (en) * 2017-09-22 2018-04-27 姜巍凯 A kind of portable material folding mechanical arm

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN206123626U (en) * 2016-07-04 2017-04-26 安徽理工大学 Multi -functional shipment machine people of 6 -degree of freedom
CN206465103U (en) * 2016-12-22 2017-09-05 天津市仁好工贸有限公司 It is a kind of to protect the manipulator of part
CN206335568U (en) * 2017-01-05 2017-07-18 成都工业职业技术学院 A kind of robot device
CN206703050U (en) * 2017-03-22 2017-12-05 金顺利塑胶(重庆)有限公司 It is a kind of to capture firm manipulator
CN207273219U (en) * 2017-09-22 2018-04-27 姜巍凯 A kind of portable material folding mechanical arm

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109610924A (en) * 2019-01-30 2019-04-12 厦门宇龙机械有限公司 It is a kind of to grab linkage and the upright bar landfill equipment applied to electric pole snatch rotation
CN111128823A (en) * 2019-12-24 2020-05-08 苏州晋宇达实业股份有限公司 Transfer method of semiconductor wafer

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Application publication date: 20181218

RJ01 Rejection of invention patent application after publication