CN109005662A - 芯片安装系统以及芯片安装方法 - Google Patents

芯片安装系统以及芯片安装方法 Download PDF

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CN109005662A
CN109005662A CN201810201941.XA CN201810201941A CN109005662A CN 109005662 A CN109005662 A CN 109005662A CN 201810201941 A CN201810201941 A CN 201810201941A CN 109005662 A CN109005662 A CN 109005662A
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chip
semiconductor structure
emitting
basal layer
module
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CN109005662B (zh
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廖建硕
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Maike Advanced Co ltd
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Asti Global Inc Taiwan
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Abstract

本发明公开一种芯片安装系统以及芯片安装方法。芯片安装系统包括第一承载装置、第二承载装置以及芯片获取设备。第一承载装置包括分别用于承载多个半导体结构的多个第一承载台。每一个半导体结构包括一基底层以及多个设置在基底层上的发光芯片。第二承载装置包括用于承载一电路基板的一第二承载台。芯片获取设备用于将发光芯片从基底层上移动至电路基板上。借此，让同一个排序的红色发光群组、绿色发光群组以及蓝色发光群组彼此相邻设置在电路基板上且电性连接于电路基板，以使得红色发光芯片、绿色发光芯片以及蓝色发光芯片彼此相邻设置而形成一画素。

Description

芯片安装系统以及芯片安装方法
技术领域
本发明涉及一种安装系统以及安装方法，特别是涉及一种芯片安装系统以及芯片安装方法。
背景技术
目前，发光二极管(Light-Emitting Diode，LED)因具备光质佳以及发光效率高等特性而得到广泛的应用。一般来说，为了使采用发光二极管做为发光组件的显示设备具有较佳的色彩表现能力，现有技术是利用红、绿、蓝三种颜色的发光二极管芯片的相互搭配而组成一全彩发光二极管显示设备，此全彩发光二极管显示设备可通过红、绿、蓝三种颜色的发光二极管芯片分别发出的红、绿、蓝三种的颜色光，然后再通过混光后形成一全彩色光，以进行相关信息的显示。然而，现有技术中的芯片安装系统以及芯片安装方法仍具有改限空间。
发明内容
本发明所要解决的技术问题在于，针对现有技术的不足提供一种芯片安装系统以及芯片安装方法。
为了解决上述的技术问题，本发明所采用的其中一技术方案是，提供一种芯片安装系统，其包括：一第一承载装置、一第二承载装置以及一芯片获取设备。所述第一承载装置包括分别用于承载多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个并列设置在所述基底层上的发光群组，且每一个所述发光群组包括多个设置在所述基底层上的发光芯片。所述第二承载装置包括用于承载一电路基板的一第二承载台。所述芯片获取设备用于将所述发光芯片从所述基底层上移动至所述电路基板上。
更进一步地，所述芯片获取设备包括：一位置检测模块以及一芯片分离模块。所述位置检测模块包括一发射组件以及一接收组件。所述芯片分离模块对应于所述位置检测模块。其中，所述位置检测模块通过所述发射组件与所述接收组件的相互配合，以提供位于所述基底层与所述发光芯片之间的一接触接口的一位置信息。其中，所述芯片分离模块根据所述位置信息而投射一投射光源至所述基底层与所述发光芯片之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
更进一步地，所述发射组件为一用于产生一检测信号的信号发射组件，且所述接收组件为一用于接收所述检测信号的信号接收组件，其中，所述信号发射组件所产生的所述检测信号通过所述半导体结构的反射而投向所述信号接收组件，以提供位于所述基底层与所述发光芯片两者之间的所述接触接口的所述位置信息，其中，所述基底层为一石英基底层、一玻璃基底层、一蓝宝石基底层以及一硅基底层四者其中之一，且所述发光芯片为氮化镓发光二极管芯片。
更进一步地，所述芯片分离装还进一步包括：一控制模块，所述控制模块电性连接于所述位置检测模块与所述芯片分离模块，其中，所述位置检测模块为一光学式位置传感器以及一声波式位置传感器两者其中之一，且所述位置检测模块与所述芯片分离模块设置在所述半导体结构的相同侧边或者相异侧边。
更进一步地，所述芯片获取设备包括：一发射组件以及一接收组件。所述发射组件用于产生一投射光源。所述接收组件邻近所述发射组件。其中，所述发射组件所产生的所述投射光源通过所述半导体结构的反射而投向所述接收组件，以提供位于所述基底层与所述发光芯片两者之间的一接触接口的一位置信息。其中，所述发射组件所产生的所述投射光源根据所述位置信息而投射至位于所述基底层与所述发光芯片两者之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
更进一步地，所述芯片获取设备还进一步包括：一第一棱镜、一第二棱镜以及一信号放大器。所述第一棱镜邻近所述发射组件与所述接收组件。所述第二棱镜邻近所述第一棱镜。所述信号放大器邻近所述第一棱镜。其中，所述发射组件所产生的所述投射光源依序通过所述第一棱镜与所述第二棱镜而投向所述半导体结构，所述投射光源通过所述半导体结构的反射而形成一反射光源，且所述反射光源依序通过所述第二棱镜与所述第一棱镜而投向所述接收组件。其中，所述发射组件所产生的所述投射光源依序通过所述第一棱镜与所述信号放大器而投射至位于所述基底层与所述发光芯片两者之间的所述接触接口。
更进一步地，所述芯片获取设备包括：一位置检测模块以及一芯片分离模块。所述位置检测模块接触所述半导体结构，以提供位于所述基底层与所述发光芯片之间的一接触接口的一位置信息。所述芯片分离模块对应于所述位置检测模块。其中，所述芯片分离模块根据所述位置信息而投射一投射光源至所述基底层与所述发光芯片之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
更进一步地，所述芯片获取设备还进一步包括：一控制模块，所述控制模块电性连接于所述位置检测模块与所述芯片分离模块，其中，所述位置检测模块为一接触式位置传感器，且所述位置检测模块与所述芯片分离模块设置在所述半导体结构的相同侧边或者相异侧边。
为了解决上述的技术问题，本发明所采用的另外一技术方案是，提供一种芯片安装系统，其包括：一第一承载装置、一第二承载装置以及一芯片获取设备。所述第一承载装置包括分别用于承载多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个设置在所述基底层上的发光芯片。所述第二承载装置包括用于承载一电路基板的一第二承载台。所述芯片获取设备用于将所述发光芯片从所述基底层上移动至所述电路基板上。
为了解决上述的技术问题，本发明所采用的另外再一技术方案是，提供一种芯片安装方法，其包括：提供一第一承载装置，所述第一承载装置包括分别用于承载不需预先扩晶的多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个并列设置在所述基底层上的发光群组，且每一个所述发光群组包括多个设置在所述基底层上的发光芯片；以及，利用一芯片获取设备，以将所述发光芯片从所述基底层上移动至所述电路基板上。
本发明的其中一有益效果在于，本发明所提供的一种芯片安装系统以及芯片安装方法，其能通过“所述芯片获取设备用于将所述发光芯片从所述基底层上移动至所述电路基板上”或者“利用一芯片获取设备，以将所述发光芯片从所述基底层上移动至所述电路基板上”的技术方案，让同一个排序的所述红色发光群组、所述绿色发光群组以及所述蓝色发光群组彼此相邻设置在所述电路基板上且电性连接于所述电路基板，以使得所述红色发光芯片、所述绿色发光芯片以及所述蓝色发光芯片彼此相邻设置而形成一画素。
为使能更进一步了解本发明的特征及技术内容，请参阅以下有关本发明的详细说明与附图，然而所提供的附图仅用于提供参考与说明，并非用来对本发明加以限制。
附图说明
图1为本发明的芯片安装系统的功能方块图。
图2为本发明的第一承载装置的多个第一承载台分别用于承载多个半导体结构的俯视示意图。
图3为本发明的第一半导体结构的第1、4、7个红色发光群组通过芯片获取设备以从基底层移走的俯视示意图。
图4为本发明的第一半导体结构的第1、4、7个红色发光群组通过芯片获取设备以移至电路基板上的俯视示意图。
图5为本发明的第二半导体结构的第2、5、8个绿色发光群组通过芯片获取设备以从基底层移走的俯视示意图。
图6为本发明的第二半导体结构的第2、5、8个绿色发光群组通过芯片获取设备以移至电路基板上的俯视示意图。
图7为本发明的第三半导体结构的第3、6、9个蓝色发光群组通过芯片获取设备以从基底层移走的俯视示意图。
图8为本发明的第三半导体结构的第3、6、9个蓝色发光群组通过芯片获取设备以移至电路基板上的俯视示意图。
图9为本发明的芯片安装方法的流程图。
图10为本发明第一实施例的芯片获取设备进行位置检测步骤时的示意图。
图11为本发明第一实施例的芯片获取设备进行位置检测步骤与芯片分离步骤时的示意图。
图12为本发明第一实施例的芯片获取设备的功能方块图。
图13为本发明第二实施例的芯片获取设备进行位置检测步骤与芯片分离步骤时的示意图。
图14为本发明第三实施例的芯片获取设备进行位置检测步骤与芯片分离步骤时的示意图。
图15为本发明第四实施例的芯片获取设备进行位置检测步骤与芯片分离步骤时的示意图。
具体实施方式
以下是通过特定的具体实施例来说明本发明所公开有关“芯片安装系统以及芯片安装方法”的实施方式，本领域技术人员可由本说明书所公开的内容了解本发明的优点与效果。本发明可通过其他不同的具体实施例加以施行或应用，本说明书中的各项细节也可基于不同观点与应用，在不悖离本发明的精神下进行各种修饰与变更。另外，本发明的附图仅为简单示意说明，并非依实际尺寸的描绘，事先声明。以下的实施方式将进一步详细说明本发明的相关技术内容，但所公开的内容并非用以限制本发明的保护范围。
请参阅图1至图8所示，本发明提供一种芯片安装系统，其包括：一第一承载装置D1、一第二承载装置D2以及一芯片获取设备D3，并且第一承载装置D1、一第二承载装置D2以及芯片获取设备D3设置在同一生产在线。
首先，配合图1与图2所示，第一承载装置D1包括分别用于承载多个半导体结构S的多个第一承载台D10。更进一步来说，配合图2与图10所示，每一个半导体结构S包括一基底层S10以及多个并列设置在基底层S10上的发光群组，并且每一个发光群组包括多个设置在基底层S10上的发光芯片S11。另外，多个半导体结构S可以被区分成一第一半导体结构S1、一第二半导体结构S2以及一第三半导体结构S3。
举例来说，如图2所示，第一半导体结构S1的每一个发光群组可为一红色发光群组R1，并且第一半导体结构S1的每一个发光芯片可为一红色发光芯片R10。另外，第一半导体结构S1的多个红色发光群组R1的排序(排列顺序)可以是按照公差为1的等差级数依序被定义为第1、2、3、…、n个。也就是说，多个红色发光群组R1从图2的左到右的方向进行排列，以使得多个红色发光群组R1分别被定义为第1个红色发光群组R1、第2个红色发光群组R1、第3个红色发光群组R1、…、第n个红色发光群组R1。
举例来说，如图2所示，第二半导体结构S2的每一个发光群组可为一绿色发光群组G1，并且第二半导体结构S2的每一个发光芯片可为一绿色发光芯片G10。另外，第二半导体结构S2的多个绿色发光群组G1的排序可以是按照公差为1的等差级数依序被定义为第1、2、3、…、n个。也就是说，多个绿色发光群组G1从图2的左到右的方向进行排列，以使得多个绿色发光群组G1分别被定义为第1个绿色发光群组G1、第2个绿色发光群组G1、第3个绿色发光群组G1、…、第n个绿色发光群组G1。
举例来说，如图2所示，第三半导体结构S3的每一个发光群组可为一蓝色发光群组B1，并且第三半导体结构S3的每一个发光芯片可为一蓝色发光芯片B10。另外，第三半导体结构S3的多个蓝色发光群组B1的排序可以是按照公差为1的等差级数依序被定义为第1、2、3、…、n个。也就是说，多个蓝色发光群组B1从图2的左到右的方向进行排列，以使得多个蓝色发光群组B1分别被定义为第1个蓝色发光群组B1、第2个蓝色发光群组B1、第3个蓝色发光群组B1、…、第n个蓝色发光群组B1。
再者，配合图1、图4以及图10所示，第二承载装置D2包括用于承载一电路基板C的一第二承载台D20，并且芯片获取设备D3用于将发光芯片S11从基底层S10上移动至电路基板C上。举例来说，芯片获取设备D3可以包括一种芯片撷取模块，其可为任何的吸取装置(例如真空吸嘴)或者任何的夹持装置，然而本发明不以此举例为限。
举例来说，配合图3、图4以及图10所示，第一半导体结构S1的红色发光芯片R10能通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。另外，配合图5、图6以及图10所示，第二半导体结构S2的绿色发光芯片G10能通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。此外，配合图7、图8以及图10所示，第三半导体结构S3的蓝色发光芯片B10能通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。
承上所言，更进一步来说，配合图3与图4，第一半导体结构S1的第1、4、7个红色发光群组R1能同时通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。另外，配合图5与图6，第二半导体结构S2的第2、5、8个绿色发光群组G1能同时通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。此外，配合图7与图8，第三半导体结构S3的第3、6、9个蓝色发光群组B1能同时通过芯片获取设备D3的运送，而从基底层S10上移动至电路基板C上。
借此，如图8所示，同一个排序的红色发光群组R1、绿色发光群组G1以及蓝色发光群组B1可以彼此相邻设置在电路基板C上且电性连接于电路基板C，以使得红色发光芯片R10、绿色发光芯片G10以及蓝色发光芯片B10彼此相邻设置而形成一画素W(或者像素(pixel))。也就是说，第1个红色发光群组R1、第1个绿色发光群组G1以及第1个蓝色发光群组B1可以彼此相邻设置在电路基板C上且电性连接于电路基板C，以使得红色发光芯片R10、绿色发光芯片G10以及蓝色发光芯片B10彼此相邻设置而形成一画素W。
综上所言，本发明所提供的一种芯片安装系统能够通过“芯片获取设备D3用于将发光芯片S11从基底层S10上移动至电路基板C上”的技术方案，而不需预先对多个半导体结构S进行扩晶，即可让同一个排序的红色发光群组R1、绿色发光群组G1以及蓝色发光群组B1可以彼此相邻设置在电路基板C上且电性连接于电路基板C，以使得红色发光芯片R10、绿色发光芯片G10以及蓝色发光芯片B10彼此相邻设置而形成一画素W。
值得一提的是，配合图1至图10所示，本发明还进一步提供一种芯片安装方法，其至少包括下列步骤：首先，提供一第一承载装置D1，第一承载装置D1包括分别用于承载多个不需预先扩晶的半导体结构S的多个第一承载台D10，其中，每一个半导体结构S包括一基底层S10以及多个并列设置在基底层S10上的发光群组，并且每一个发光群组包括多个设置在基底层S10上的发光芯片S11(步骤S100)；以及，利用一芯片获取设备D3，以将发光芯片S11从基底层S10上移动至电路基板C上(步骤S102)。
综上所言，本发明所提供的一种芯片安装方法能够通过“利用一芯片获取设备D3，以将发光芯片S11从基底层S10上移动至电路基板C上”的技术方案，而不需预先对多个半导体结构S进行扩晶，即可让同一个排序的红色发光群组R1、绿色发光群组G1以及蓝色发光群组B1可以彼此相邻设置在电路基板C上且电性连接于电路基板C，以使得红色发光芯片R10、绿色发光芯片G10以及蓝色发光芯片B10彼此相邻设置而形成一画素W(步骤S104)。
第一实施例
请参阅图10至图12所示，本发明第一实施例提供一种芯片获取设备D3，并且芯片获取设备D3包括一位置检测模块1以及一芯片分离模块2。另外，芯片获取设备D3能应用于加工一半导体结构S，并且半导体结构S包括一基底层S10以及多个设置在基底层S10上的发光芯片S11。举例来说，基底层S10可为一石英基底层、一玻璃基底层、一蓝宝石(sapphire)基底层、一硅(silicon)基底层或者任何材料的基底层。另外，多个发光芯片S11可以是处于切割前的状态而呈现彼此相连的外观，或是多个发光芯片S11可以是处于切割后的状态而呈现彼此分离的外观(如同本发明目前所使用的例子)。发光芯片S11可为氮化镓(GaN)发光二极管芯片或者是任何种类的半导体发光芯片，并且每一个发光芯片S11的上表面具有至少两个焊垫(未标号)。然而，本发明不以上述所举的例子为限。
首先，配合图10与图11所示，位置检测模块1包括一发射组件11以及一接收组件12，并且芯片分离模块2邻近或者对应于位置检测模块1。更进一步来说，位置检测模块1能通过发射组件11与接收组件12的相互配合，以提供位于基底层S10与发光芯片S11之间的一接触接口S100(或者一接触表面)的一位置信息(也就是说，使用位置检测模块1来进行“位置检测”步骤)。借此，配合图10与图11所示，芯片分离模块2就能根据位置信息而投射一投射光源P至基底层S10与发光芯片S11之间的接触接口S100，以使得发光芯片S11能通过投射光源P的照射而易于脱离基底层S10(也就是说，以降低损坏的发光单元与电路基板之间的结合力，并使用芯片分离模块2来进行“芯片分离”步骤)。也就是说，半导体结构S能通过投射光源P的照射，而使得发光芯片S11能够更容易脱离基底层S10。
举例来说，配合图10与图11所示，位置检测模块1可为一光学式位置传感器以及一声波式位置传感器两者其中之一。更具体来说，发射组件11可为一用于产生一检测信号L(例如光波信号或者声波信号)的信号发射组件110(例如信号发射器)，并且接收组件12可为一用于接收检测信号L的信号接收组件120(例如信号接收器)。另外，信号发射组件110所产生的检测信号L能通过半导体结构S的反射而投向信号接收组件120，借此以提供位于基底层S10与发光芯片S11两者之间的接触接口S100的位置信息。因此，配合图10与图11所示，芯片分离模块2就能根据信号接收组件120所得到的位置信息而投射一投射光源P至基底层S10与发光芯片S11之间的接触接口S100，以使得发光芯片S11能通过投射光源P对接触接口S100的照射而易于脱离基底层S10。
综上所言，本发明所提供的芯片获取设备D3可以预先通过发射组件11与接收组件12的相互配合，以提供位于基底层S10与发光芯片S11之间的一接触接口S100的一位置信息，然后再利用接收组件12所得到的位置信息，以让芯片分离模块2所提供的投射光源P能准确地投射至基底层S10与发光芯片S11之间的接触接口S100上。借此，发光芯片S11能通过投射光源P对接触接口S100的精准照射而易于脱离基底层S10。
值得一提的是，配合图10与图11所示，本发明的还进一步包括一控制模块3以及一芯片撷取模块7。控制模块3电性连接于位置检测模块1与芯片分离模块2，并且芯片撷取模块7用于将发光芯片S11从基底层S10上取下。另外，配合图10与图11所示，位置检测模块1与芯片分离模块2可以被设置在半导体结构S的相同侧边。
第二实施例
请参阅图13所示，本发明第二实施例提供一种芯片获取设备D3，并且芯片获取设备D3包括一位置检测模块1以及一芯片分离模块2。由图13与图11的比较可知，本发明第二实施例与第一实施例最大的不同在于：在第二实施例中，位置检测模块1与芯片分离模块2设置在半导体结构S的相异侧边。举例来说，位置检测模块1可设置在半导体结构S的上方处，而芯片分离模块2则可设置在半导体结构S的下方处。
值得一提的是，发光芯片S11也可以在同一个位置上分别进行“位置检测”与“芯片分离”步骤。也就是说，芯片分离模块2可以设置在与位置检测模块1相对应的另外一端(如图13的假想线所呈现的芯片分离模块2所示)，以使得发光芯片S11也可以在同一个位置上分别进行“位置检测”与“芯片分离”步骤。
第三实施例
请参阅图14所示，本发明第三实施例提供一种芯片获取设备D3。由图14与图11的比较可知，本发明第三实施例与第一实施例最大的不同在于：第三实施例的芯片获取设备D3包括：一用于产生一投射光源P的发射组件11、一邻近发射组件11的接收组件12以及一电性连接于发射组件11与接收组件12的控制模块3。
更进一步来说，发射组件11所产生的投射光源P能通过半导体结构S的反射而投向接收组件12，以提供位于基底层S10与发光芯片S11两者之间的一接触接口S100的一位置信息。借此，发射组件11所产生的投射光源P就能根据位置信息而准确投射至位于基底层S10与发光芯片S11两者之间的接触接口S100，以使得发光芯片S11能通过投射光源P的照射而易于脱离基底层S10。
更进一步来说，芯片获取设备D3还进一步包括：一第一棱镜4、一第二棱镜5以及一信号放大器6。第一棱镜4邻近发射组件11与接收组件12，第二棱镜5邻近第一棱镜4，并且信号放大器6邻近第一棱镜4。另外，发射组件11所产生的投射光源P能依序通过第一棱镜4与第二棱镜5而投向半导体结构S。投射光源P能通过半导体结构S的反射而形成一反射光源R，并且反射光源R能依序通过第二棱镜5与第一棱镜4而投向接收组件12。也就是说，发射组件11所产生的投射光源P能通过半导体结构S的反射而投向接收组件12。借此，根据位置信息，发射组件11所产生的投射光源P就能依序通过第一棱镜4以及信号放大器6而准确投射至位于基底层S10与发光芯片S11两者之间的接触接口S100，以使得发光芯片S11能通过投射光源P的照射而易于脱离基底层S10。
第四实施例
请参阅图15所示，本发明第四实施例提供一种芯片获取设备D3，并且芯片获取设备D3包括一位置检测模块1以及一芯片分离模块2。由图15与图11的比较可知，本发明第四实施例与第一实施例最大的不同在于：第四实施例的芯片获取设备D3包括一位置检测模块1、一芯片分离模块2以及一控制模块3，并且位置检测模块1可为一接触式位置传感器。
更进一步来说，位置检测模块1接触半导体结构S，以提供位于基底层S10与发光芯片S11之间的一接触接口S100的一位置信息。举例来说，当基底层S10有翘曲(warpage)时，可以通过位置检测模块1与半导体结构S的基底层S10的接触，以得知位于具有固定厚度的基底层S10与具有固定厚度的发光芯片S11之间的接触接口S100的位置。另外，芯片分离模块2对应且邻近于位置检测模块1，并且控制模块3电性连接于位置检测模块1与芯片分离模块2。
借此，芯片分离模块2能根据位置信息而投射一投射光源P至基底层S10与发光芯片S11之间的接触接口S100，以使得发光芯片S11通过投射光源P的照射而易于脱离基底层S10。
值得一提的是，位置检测模块1与芯片分离模块2不限于设置在半导体结构S的相同侧边(如图15所示)，而是也能够设置在半导体结构S的相异侧边。
实施例的有益效果
本发明的其中一有益效果在于，本发明所提供的一种芯片安装系统以及芯片安装方法，其能通过“芯片获取设备D3用于将发光芯片S11从基底层S10上移动至电路基板C上”或者“利用一芯片获取设备D3，以将发光芯片S11从基底层S10上移动至电路基板C上”的技术方案，让同一个排序的红色发光群组R1、绿色发光群组G1以及蓝色发光群组B1彼此相邻设置在电路基板C上且电性连接于电路基板C，以使得红色发光芯片R10、绿色发光芯片G10以及蓝色发光芯片B10彼此相邻设置而形成一画素W。
以上所公开的内容仅为本发明的优选可行实施例，并非因此局限本发明的权利要求书的保护范围，所以凡是运用本发明说明书及附图内容所做的等效技术变化，均包含于本发明的权利要求书的保护范围内。

Claims (10)

1.一种芯片安装系统，其特征在于，所述芯片安装系统包括：
一第一承载装置，所述第一承载装置包括分别用于承载多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个并列设置在所述基底层上的发光群组，且每一个所述发光群组包括多个设置在所述基底层上的发光芯片；
一第二承载装置，所述第二承载装置包括用于承载一电路基板的一第二承载台；以及
一芯片获取设备，所述芯片获取设备用于将所述发光芯片从所述基底层上移动至所述电路基板上；
其中，所述第一承载装置、所述一第二承载装置以及所述芯片获取设备设置在同一生产在线，且多个所述半导体结构被区分成一第一半导体结构、一第二半导体结构以及一第三半导体结构；
其中，所述第一半导体结构的每一个所述发光群组为一红色发光群组，所述第一半导体结构的每一个所述发光芯片为一红色发光芯片，且所述第一半导体结构的多个所述红色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第二半导体结构的每一个所述发光群组为一绿色发光群组，所述第二半导体结构的每一个所述发光芯片为一绿色发光芯片，且所述第二半导体结构的多个所述绿色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第三半导体结构的每一个所述发光群组为一蓝色发光群组，所述第三半导体结构的每一个所述发光芯片为一蓝色发光芯片，且所述第三半导体结构的多个所述蓝色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第一半导体结构的所述红色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，所述第二半导体结构的所述绿色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，且所述第三半导体结构的所述蓝色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上；
其中，同一个排序的所述红色发光群组、所述绿色发光群组以及所述蓝色发光群组彼此相邻设置在所述电路基板上且电性连接于所述电路基板，以使得所述红色发光芯片、所述绿色发光芯片以及所述蓝色发光芯片彼此相邻设置而形成一画素。
2.根据权利要求1所述的芯片安装系统，其特征在于，所述芯片获取设备包括：
一位置检测模块，所述位置检测模块包括一发射组件以及一接收组件；以及
一芯片分离模块，所述芯片分离模块对应于所述位置检测模块；
其中，所述位置检测模块通过所述发射组件与所述接收组件的相互配合，以提供位于所述基底层与所述发光芯片之间的一接触接口的一位置信息；
其中，所述芯片分离模块根据所述位置信息而投射一投射光源至所述基底层与所述发光芯片之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
3.根据权利要求2所述的芯片安装系统，其特征在于，所述发射组件为一用于产生一检测信号的信号发射组件，且所述接收组件为一用于接收所述检测信号的信号接收组件，其中，所述信号发射组件所产生的所述检测信号通过所述半导体结构的反射而投向所述信号接收组件，以提供位于所述基底层与所述发光芯片两者之间的所述接触接口的所述位置信息，其中，所述基底层为一石英基底层、一玻璃基底层、一蓝宝石基底层以及一硅基底层四者其中之一，且所述发光芯片为氮化镓发光二极管芯片。
4.根据权利要求3所述的芯片安装系统，其特征在于，所述芯片分离装还进一步包括：一控制模块，所述控制模块电性连接于所述位置检测模块与所述芯片分离模块，其中，所述位置检测模块为一光学式位置传感器以及一声波式位置传感器两者其中之一，且所述位置检测模块与所述芯片分离模块设置在所述半导体结构的相同侧边或者相异侧边。
5.根据权利要求1所述的芯片安装系统，其特征在于，所述芯片获取设备包括：
一发射组件，所述发射组件用于产生一投射光源；以及
一接收组件，所述接收组件邻近所述发射组件；
其中，所述发射组件所产生的所述投射光源通过所述半导体结构的反射而投向所述接收组件，以提供位于所述基底层与所述发光芯片两者之间的一接触接口的一位置信息；
其中，所述发射组件所产生的所述投射光源根据所述位置信息而投射至位于所述基底层与所述发光芯片两者之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
6.根据权利要求5所述的芯片安装系统，其特征在于，所述芯片获取设备还进一步包括：
一第一棱镜，所述第一棱镜邻近所述发射组件与所述接收组件；
一第二棱镜，所述第二棱镜邻近所述第一棱镜；以及
一信号放大器，所述信号放大器邻近所述第一棱镜；
其中，所述发射组件所产生的所述投射光源依序通过所述第一棱镜与所述第二棱镜而投向所述半导体结构，所述投射光源通过所述半导体结构的反射而形成一反射光源，且所述反射光源依序通过所述第二棱镜与所述第一棱镜而投向所述接收组件；
其中，所述发射组件所产生的所述投射光源依序通过所述第一棱镜与所述信号放大器而投射至位于所述基底层与所述发光芯片两者之间的所述接触接口。
7.根据权利要求1所述的芯片安装系统，其特征在于，所述芯片获取设备包括：
一位置检测模块，所述位置检测模块接触所述半导体结构，以提供位于所述基底层与所述发光芯片之间的一接触接口的一位置信息；以及
一芯片分离模块，所述芯片分离模块对应于所述位置检测模块；
其中，所述芯片分离模块根据所述位置信息而投射一投射光源至所述基底层与所述发光芯片之间的所述接触接口，以使得所述发光芯片通过所述投射光源的照射而易于脱离所述基底层。
8.根据权利要求7所述的芯片安装系统，其特征在于，所述芯片获取设备还进一步包括：一控制模块，所述控制模块电性连接于所述位置检测模块与所述芯片分离模块，其中，所述位置检测模块为一接触式位置传感器，且所述位置检测模块与所述芯片分离模块设置在所述半导体结构的相同侧边或者相异侧边。
9.一种芯片安装系统，其特征在于，所述芯片安装系统包括：
一第一承载装置，所述第一承载装置包括分别用于承载多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个设置在所述基底层上的发光芯片；
一第二承载装置，所述第二承载装置包括用于承载一电路基板的一第二承载台；以及
一芯片获取设备，所述芯片获取设备用于将所述发光芯片从所述基底层上移动至所述电路基板上；
其中，所述第一承载装置、所述一第二承载装置以及所述芯片获取设备设置在同一生产在线；
其中，所述第一半导体结构的每一个所述发光芯片为一红色发光芯片，所述第二半导体结构的每一个所述发光芯片为一绿色发光芯片，且所述第三半导体结构的每一个所述发光芯片为一蓝色发光芯片；
其中，所述第一半导体结构的所述红色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，所述第二半导体结构的所述绿色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，且所述第三半导体结构的所述蓝色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上；
其中，所述红色发光芯片、所述绿色发光芯片以及所述蓝色发光芯片彼此相邻设置而形成一画素。
10.一种芯片安装方法，其特征在于，所述芯片安装方法包括：
提供一第一承载装置，所述第一承载装置包括分别用于承载不需预先扩晶的多个半导体结构的多个第一承载台，其中，每一个所述半导体结构包括一基底层以及多个并列设置在所述基底层上的发光群组，且每一个所述发光群组包括多个设置在所述基底层上的发光芯片；以及
利用一芯片获取设备，以将所述发光芯片从所述基底层上移动至所述电路基板上；
其中，所述第一承载装置、所述一第二承载装置以及所述芯片获取设备设置在同一生产在线，且多个所述半导体结构被区分成一第一半导体结构、一第二半导体结构以及一第三半导体结构；
其中，所述第一半导体结构的每一个所述发光群组为一红色发光群组，所述第一半导体结构的每一个所述发光芯片为一红色发光芯片，且所述第一半导体结构的多个所述红色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第二半导体结构的每一个所述发光群组为一绿色发光群组，所述第二半导体结构的每一个所述发光芯片为一绿色发光芯片，且所述第二半导体结构的多个所述绿色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第三半导体结构的每一个所述发光群组为一蓝色发光群组，所述第三半导体结构的每一个所述发光芯片为一蓝色发光芯片，且所述第三半导体结构的多个所述蓝色发光群组的排序是按照公差为1的等差级数依序被定义为第1、2、3、…、n个；
其中，所述第一半导体结构的所述红色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，所述第二半导体结构的所述绿色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上，且所述第三半导体结构的所述蓝色发光芯片通过所述芯片获取设备的运送而从所述基底层上移动至所述电路基板上；
其中，同一个排序的所述红色发光群组、所述绿色发光群组以及所述蓝色发光群组彼此相邻设置在所述电路基板上且电性连接于所述电路基板，以使得所述红色发光芯片、所述绿色发光芯片以及所述蓝色发光芯片彼此相邻设置而形成一画素。
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