CN108987381A - A kind of stacked chip package structure based on special-shaped resin gasket - Google Patents
A kind of stacked chip package structure based on special-shaped resin gasket Download PDFInfo
- Publication number
- CN108987381A CN108987381A CN201810924717.3A CN201810924717A CN108987381A CN 108987381 A CN108987381 A CN 108987381A CN 201810924717 A CN201810924717 A CN 201810924717A CN 108987381 A CN108987381 A CN 108987381A
- Authority
- CN
- China
- Prior art keywords
- chip
- special
- resin gasket
- shaped resin
- gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 102
- 239000011347 resin Substances 0.000 title claims abstract description 102
- 239000012790 adhesive layer Substances 0.000 claims abstract description 33
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000003822 epoxy resin Substances 0.000 claims description 44
- 229920000647 polyepoxide Polymers 0.000 claims description 44
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 31
- 239000004744 fabric Substances 0.000 claims description 29
- 239000003365 glass fiber Substances 0.000 claims description 19
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims description 15
- 239000000292 calcium oxide Substances 0.000 claims description 15
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 15
- 239000003795 chemical substances by application Substances 0.000 claims description 15
- -1 phenol aldehyde Chemical class 0.000 claims description 15
- 235000013312 flour Nutrition 0.000 claims description 12
- 239000000377 silicon dioxide Substances 0.000 claims description 12
- 239000010410 layer Substances 0.000 claims description 11
- 239000000049 pigment Substances 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 208000002925 dental caries Diseases 0.000 claims description 8
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 8
- 239000000843 powder Substances 0.000 claims description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 238000005192 partition Methods 0.000 claims description 6
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 claims description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims description 4
- 239000004952 Polyamide Substances 0.000 claims description 4
- 150000001412 amines Chemical class 0.000 claims description 4
- 150000004982 aromatic amines Chemical class 0.000 claims description 4
- 235000010290 biphenyl Nutrition 0.000 claims description 4
- 239000004305 biphenyl Substances 0.000 claims description 4
- 239000006229 carbon black Substances 0.000 claims description 4
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-methyl phenol Natural products CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 4
- 229920002647 polyamide Polymers 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 3
- 239000003990 capacitor Substances 0.000 claims description 2
- 235000009508 confectionery Nutrition 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 description 12
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical group CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 9
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 9
- 229910052710 silicon Inorganic materials 0.000 description 9
- 239000010703 silicon Substances 0.000 description 9
- 239000003292 glue Substances 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 6
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 6
- 238000005470 impregnation Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 3
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 3
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 3
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229940113088 dimethylacetamide Drugs 0.000 description 3
- 235000019441 ethanol Nutrition 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 238000002386 leaching Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 210000000577 adipose tissue Anatomy 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910001651 emery Inorganic materials 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 238000004321 preservation Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention relates to a kind of stacked chip package structures based on special-shaped resin gasket, including the circuit board, the first adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip being cascading, on circuit boards by the first adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip package, first chip is electrically connected encapsulating material by bonding wire and circuit board；There is at least one cavity among the abnormity resin gasket, at least one second chip is provided in the cavity, second chip is electrically connected through bonding wire and circuit board.Stacked chip package structure of the invention can reduce the size of chip-packaging structure, save encapsulating material, improve the density of chip in unit area.
Description
Technical field
The present invention relates to a kind of stacked chip package structures based on special-shaped resin gasket, belong to chip encapsulation technology neck
Domain.
Background technique
With the development of modern integrated circuits, microelectronic industry chip encapsulation technology is from two dimension to three-dimensional stacked encapsulation shape
Formula rapidly develops, to adapt to lighter chip-packaging structure, thinner, smaller, high-performance, low-power consumption, the market demands of low cost.Three
Stacked package technology is tieed up under conditions of not increasing package dimension, packaging density is not only increased, reduces costs, accelerate envelope
Speed is filled, multifunctional unit degree also greatly reinforces.
Currently, gasket used in three-dimensional stacked chip packaging structure is all silicon-based wafer gasket, the shortcomings that such gasket, is
Processes, the processing technologys such as processing technology includes pad pasting, be thinned, cutting extremely occupy normal machines production capacity, and by silicon-based wafer
The size limitation (12 cun maximum) of gasket, causes the rate of output low, and processing technology is long, and consumption auxiliary material (cut by adhesive film, emery wheel
Cutter tool) it is more, and since silicon-based wafer gasket is easy to crack in the process of processing and using, the yield rate of product is affected, is mentioned
High production cost.Especially, the thinner silicon-based wafer gasket the more frangible, and spacer thickness is caused to be restricted, cannot be because of encapsulation
Size is thin and thinned, and cannot according to chip design and special shape be made, make the body size of stacked chip package structure by
Limitation.
Summary of the invention
The technical problem to be solved by the present invention is big to solve the package dimension of existing chip stack package structure and existing
There is the technical issues of long frangible chip package silicon-based wafer gasket, high production cost, processing technology, consumption auxiliary material, mentions
For a kind of stacked chip package structure based on special-shaped resin gasket.
The present invention is that technical solution used by solving its technical problem is:
A kind of stacked chip package structure based on special-shaped resin gasket, including be cascading circuit board, first
Adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip, encapsulating material is by the first adhesive layer, special-shaped resin gasket, the
On circuit boards, first chip is electrically connected by bonding wire and circuit board for two adhesive layers, the first chip package；
There is at least one cavity among the abnormity resin gasket, be provided at least one second core in the cavity
Piece, second chip are electrically connected through bonding wire and circuit board.
Preferably, the centre of the special-shaped resin gasket has partition laterally and/or longitudinally, and the cavity is divided into
Several cavitys.
Preferably, the cavity is top opening or bottom opening.
Preferably, using fibrous glass cloth as substrate, the weight accounting of the fibrous glass cloth is the special-shaped resin gasket
10-60wt% is attached with following components thereon, to account for the percentages of special-shaped resin gasket total weight: epoxy resin 8-
40wt%, silica flour 10-30wt%, aluminium oxide 2-10wt%, calcium oxide 1-8wt%, curing agent 1-8wt%.
Preferably, for the special-shaped resin gasket using fibrous glass cloth as substrate, the weight accounting of fibrous glass cloth is 40-
60wt% is attached with following components thereon, to account for the percentages of special-shaped resin gasket total weight: epoxy resin 30-40wt%,
Silica flour 10-20wt%, aluminium oxide 5-10wt%, calcium oxide 2-8wt%, curing agent 4-8wt%.
It preferably, further include pigment for the special-shaped resin gasket of chip stack package, the weight accounting of the pigment is
1-3wt%, the pigment are preferably at least one of white carbon black, pearl powder.
Preferably, the mesh number of the glass fabric is 100-200 mesh, and the mesh number of the silica flour is 200-400 mesh, institute
The mesh number for stating aluminium oxide is 400-600 mesh, and the mesh number of the calcium oxide is 200-400 mesh.
Preferably, the epoxy resin is phosphatized epoxy resin, biphenyl type epoxy resin, bisphenol-type epoxy resin, phenolic aldehyde
Type epoxy resin, glycerol epoxy resin, o-cresol aldehyde type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy
At least one of resin, the curing agent are fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, dicyandiamide, imidazoles chemical combination
At least one of object.
Preferably, the top of first chip is with one layer of staircase stack or multilayer fourth chip, the first chip with
It is electrically connected by bonding wire between adjacent fourth chip and adjacent fourth chip, adjacent bonding wire is by being set to first
Weld pad on chip and fourth chip is connected in series.
Preferably, the upper surface of the circuit board be equipped with several passive blocks, the passive block be resistance, capacitor or
Inductance.
The present invention also provides a kind of processing technology of stacked chip package structure based on special-shaped resin gasket, including it is as follows
Step:
Special-shaped resin gasket, circuit board, the first chip, the second chip are provided, had extremely among the abnormity resin gasket
A few cavity, the cavity have opening；
In placing the second chip in the cavity of special-shaped resin gasket, by bonding wire by the second chip and circuit board electrical property phase
Even；
Circuit board, the first adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip are stacked gradually and be connected to one
It rises, makes the cavities open of special-shaped resin gasket upward or downward, and be electrically connected the first chip and circuit board using bonding wire；
Special-shaped resin gasket, the first chip, the second chip, bonding wire, the first adhesive layer, second are bonded using encapsulating material
Layer sealing is on circuit boards.
Preferably, the processing technology of the stacked chip package structure based on special-shaped resin gasket further includes special-shaped tree
The preparation of fat pad piece, steps are as follows:
S1: impregnation: by the oxidation of the epoxy resin of 8-40 parts by weight, the silica flour of 10-30 parts by weight, 2-10 parts by weight
Aluminium, 1-8 parts by weight calcium oxide be added solvent in, stirring and dissolving, be added 1-8 parts by weight curing agent, be uniformly dispersed, obtain resin
Glue；
S2: impregnation: the fibrous glass cloth of 10-60 parts by weight is immersed in the resin adhesive liquid prepared, obtains impregnated fabric, control leaching
Glue amount is 50-70g/m2；
S3: semi-solid preparation: impregnated fabric is dried, and procuring degree is controlled in 30-50%, and prepreg is made；
S4: folded structure, pressing: then muti-piece prepreg layer stackup pressure is heated, while being pressed, heat preservation one
Stop heating after the section time, it is cooling, it is processed into special-shaped resin gasket.
Preferably, the drying temperature of the S3 step is 70-120 DEG C.
Preferably, the heating temperature of the S4 step is 150-180 DEG C, soaking time 8-12h, pressing pressure 3-
10MPa。
Preferably, the solvent is acetone, butanone, ethyl acetate, butyl acetate, ethyl alcohol, glycol monoethyl ether, ethylene glycol
At least one of dimethyl ether, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, N-Methyl pyrrolidone.
The beneficial effects of the present invention are:
(1) the present invention provides a kind of stacked chip package structures based on special-shaped resin gasket, using one kind by specific
The resin gasket of the specific shape of material composition replaces conventional silicon substrate gasket, compared to can only do squarely or rectangular silicon
The plasticity of base wad piece, resin gasket brings bigger freedom degree to the design of stacked chip package structure, can reduce chip
The size of encapsulating structure saves encapsulating material, improves the density of chip in unit area.
(2) the special-shaped resin gasket flexibility for chip stack package of the invention is good, is not easily broken, is anti-aging, is easy
It saves, resin gasket can be pre-machined, and size, thickness are without limitation, and resin gasket electrical insulating property is excellent, and resin gasket is hit
The breakdown voltage that voltage is far longer than silicon substrate gasket is worn, in addition, resin gasket hydrophilic effect of the invention is good, uses common glue
Can be by itself and chip adhesive, ether, phenyl ring and fat hydroxyl in curing system are not corroded vulnerable to soda acid, it can substitute mesh
Before be widely used in the silicon substrate gasket of chip stack package.
Detailed description of the invention
Present invention will be further explained below with reference to the attached drawings and examples.
Fig. 1 is the cross-sectional view of the stacked chip package structure based on special-shaped resin gasket of the embodiment of the present invention 1；
Fig. 2 is the cross-sectional view of the stacked chip package structure based on special-shaped resin gasket of the embodiment of the present invention 2；
Appended drawing reference in figure are as follows: 1- encapsulating material, 2- circuit board, 3- abnormity resin gasket, the first chip of 4-, 5-
Two chips, the second adhesive layer of 6-, the first adhesive layer of 7-, 8- passive block, 9- bonding wire, 10- fourth chip.
Specific embodiment
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates basic structure of the invention, therefore it only shows the composition relevant to the invention.
Embodiment 1
The present embodiment provides a kind of stacked chip package structures based on special-shaped resin gasket, as shown in Figure 1, include according to
The secondary circuit board 2 being stacked, the first adhesive layer 7, special-shaped resin gasket 3, the second adhesive layer 6, the first chip 4, encapsulating material 1
On the circuit board 2 by the first adhesive layer 7, special-shaped resin gasket 3, the second adhesive layer 6, the encapsulation of the first chip 4, first chip
4 are electrically connected by bonding wire 9 and circuit board 2；
The abnormity resin gasket 3 has two cavitys being divided by partition, and the cavity is top opening, Mei Gekong
Intracavitary to be provided with second chip 5, second chip 5 is electrically connected through bonding wire and circuit board 2.
Preferably, using fibrous glass cloth as substrate, the weight accounting of the fibrous glass cloth is the special-shaped resin gasket 3
10-60wt% is attached with following components thereon, to account for the percentages of special-shaped 3 total weight of resin gasket: epoxy resin 8-
40wt%, silica flour 10-30wt%, aluminium oxide 2-10wt%, calcium oxide 1-8wt%, curing agent 1-8wt%.
Further, for the special-shaped resin gasket 3 using fibrous glass cloth as substrate, the weight accounting of fibrous glass cloth is 40-
60wt% is attached with following components thereon, to account for the percentages of special-shaped 3 total weight of resin gasket: epoxy resin 30-
40wt%, silica flour 10-20wt%, aluminium oxide 5-10wt%, calcium oxide 2-8wt%, curing agent 4-8wt%.
It preferably, further include pigment for the special-shaped resin gasket 3 of chip stack package, the weight accounting of the pigment is
1-3wt%, the pigment are preferably at least one of white carbon black, pearl powder.
Preferably, the epoxy resin is phosphatized epoxy resin, biphenyl type epoxy resin, bisphenol-type epoxy resin, phenolic aldehyde
Type epoxy resin, glycerol epoxy resin, o-cresol aldehyde type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy
At least one of resin.
Preferably, the mesh number of the glass fabric is 100-200 mesh (such as 100 mesh, 150 mesh, 200 mesh), the quartz
The mesh number of powder is 200-400 mesh (such as 200 mesh, 300 mesh, 400 mesh), and the mesh number of the aluminium oxide is 400-600 mesh (such as 400
Mesh, 500 mesh, 600 mesh), the mesh number of the calcium oxide is 200-400 mesh (such as 200 mesh, 300 mesh, 400 mesh).
Preferably, the curing agent is fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, dicyandiamide, glyoxaline compound
At least one of.
Preferably, the top of first chip 4 can be with one layer of staircase stack or multilayer fourth chip 10, ladder
Formula stacks the routing operation that will not interfere the first chip 4 and the weld pad in fourth chip 10, the first chip 4 and the 4th adjacent core
It is electrically connected by bonding wire between piece 10 and adjacent fourth chip 10, and is linked together by adhesive layer, it is adjacent
Bonding wire is connected in series by the weld pad being set on the first chip 4 and fourth chip 10.
Preferably, the upper surface of the circuit board 2 is equipped with several passive blocks 8, and the passive block 8 can be electricity
It hinders, inductively or capacitively.
The present embodiment also provides a kind of processing technology of stacked chip package structure based on special-shaped resin gasket, including such as
Lower step:
Special-shaped resin gasket, circuit board, the first chip, the second chip are provided, the abnormity resin gasket has by partition
Two cavitys being divided into, the cavity have opening；
In placing second chip respectively in two cavitys of special-shaped resin gasket, the second chip is distinguished by bonding wire
It is electrical connected with circuit board；
Circuit board, the first adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip are stacked gradually and be connected to one
It rises, keeps two cavities opens of special-shaped resin gasket upward, and be electrically connected the first chip and circuit board using bonding wire；
Special-shaped resin gasket, the first chip, the second chip, bonding wire, the first adhesive layer, second are bonded using encapsulating material
Layer sealing is on circuit boards.
The preparation method of the abnormity resin gasket, includes the following steps:
S1: impregnation: by the oxidation of the epoxy resin of 8-40 parts by weight, the silica flour of 10-30 parts by weight, 2-10 parts by weight
Aluminium, 1-8 parts by weight calcium oxide be added solvent in, stirring and dissolving, be added 1-8 parts by weight curing agent, be uniformly dispersed, obtain resin
Glue；
S2: impregnation: the fibrous glass cloth of 10-60 parts by weight is immersed in the resin adhesive liquid prepared, obtains impregnated fabric, control leaching
Glue amount is 50-70g/m2(such as 50g/m2、60g/m2、70g/m2)；
S3: semi-solid preparation: impregnated fabric is dried at a temperature of 70-120 DEG C (such as 70 DEG C, 100 DEG C, 120 DEG C), pre- solid
Change degree is controlled at 30-50% (such as 30%, 40%, 50%), and prepreg is made；
S4: folded structure, pressing: by muti-piece prepreg layer stackup pressure, then 150-180 DEG C (such as 150 DEG C, 160 DEG C,
180 DEG C) at a temperature of heated, while being pressed, kept the temperature 8-12h (such as 8h, 10h, 12h) under the pressure of 3-10MPa
Stop heating afterwards, it is cooling, it is processed into the special-shaped resin gasket of above-mentioned shape.
Preferably, the solvent is acetone, butanone, ethyl acetate, butyl acetate, ethyl alcohol, glycol monoethyl ether, ethylene glycol
At least one of dimethyl ether, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, N-Methyl pyrrolidone.
Embodiment 2
The present embodiment provides a kind of stacked chip package structures based on special-shaped resin gasket, as shown in Fig. 2, include according to
The secondary circuit board 2 being stacked, the first adhesive layer 7, special-shaped resin gasket 3, the second adhesive layer 6, the first chip 4, encapsulating material 1
On the circuit board 2 by the first adhesive layer 7, special-shaped resin gasket 3, the second adhesive layer 6, the encapsulation of the first chip 4, first chip
4 are electrically connected by bonding wire 9 and circuit board 2；
The abnormity resin gasket 3 has two cavitys being divided by partition, and the cavity is bottom opening, Mei Gekong
Intracavitary to be provided with second chip 5, second chip 5 is electrically connected through bonding wire and circuit board 2.
For the abnormity resin gasket 3 using fibrous glass cloth as substrate, the weight accounting of the fibrous glass cloth is 10-
60wt% is attached with following components thereon, to account for the percentages of special-shaped 3 total weight of resin gasket: epoxy resin 8-40wt%,
Silica flour 10-30wt%, aluminium oxide 2-10wt%, calcium oxide 1-8wt%, curing agent 1-8wt%.
Preferably, for the special-shaped resin gasket 3 using fibrous glass cloth as substrate, the weight accounting of fibrous glass cloth is 40-
60wt% is attached with following components thereon, to account for the percentages of special-shaped 3 total weight of resin gasket: epoxy resin 30-
40wt%, silica flour 10-20wt%, aluminium oxide 5-10wt%, calcium oxide 2-8wt%, curing agent 4-8wt%.
It preferably, further include pigment for the special-shaped resin gasket 3 of chip stack package, the weight accounting of the pigment is
1-3wt%, the pigment are preferably at least one of white carbon black, pearl powder.
Preferably, the epoxy resin is phosphatized epoxy resin, biphenyl type epoxy resin, bisphenol-type epoxy resin, phenolic aldehyde
Type epoxy resin, glycerol epoxy resin, o-cresol aldehyde type epoxy resin, naphthol type epoxy resin, dicyclopentadiene type epoxy
At least one of resin.
Preferably, the mesh number of the glass fabric is 100-200 mesh (such as 100 mesh, 150 mesh, 200 mesh), the quartz
The mesh number of powder is 200-400 mesh (such as 200 mesh, 300 mesh, 400 mesh), and the mesh number of the aluminium oxide is 400-600 mesh (such as 400
Mesh, 500 mesh, 600 mesh), the mesh number of the calcium oxide is 200-400 mesh (such as 200 mesh, 300 mesh, 400 mesh).
Preferably, the curing agent is fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, dicyandiamide, glyoxaline compound
At least one of.
Preferably, the top of first chip 4 is with 10 (the present embodiment of one layer of staircase stack or multilayer fourth chip
In the top of the first chip 4 with one layer of fourth chip 10 of staircase stack), staircase stack will not interfere the first chip 4 and
The routing operation of weld pad in fourth chip 10, the first chip 4 and adjacent fourth chip 10 and adjacent fourth chip 10
Between be electrically connected by bonding wire, and linked together by adhesive layer, adjacent bonding wire is by being set to the first chip 4 and the
Weld pad on four chips 10 is connected in series.
Preferably, the upper surface of the circuit board 2 is equipped with several passive blocks 8, and the passive block 8 can be electricity
It hinders, inductively or capacitively.
The present embodiment also provides a kind of processing technology of stacked chip package structure based on special-shaped resin gasket, including such as
Lower step:
Special-shaped resin gasket, circuit board, the first chip, the second chip are provided, the abnormity resin gasket has by partition
Two cavitys being divided into, the cavity have opening；
In placing second chip respectively in two cavitys of special-shaped resin gasket, the second chip is distinguished by bonding wire
It is electrical connected with circuit board；
Circuit board, the first adhesive layer, special-shaped resin gasket, the second adhesive layer, the first chip are stacked gradually and be connected to one
It rises, keeps two cavities opens of special-shaped resin gasket downward, and be electrically connected the first chip and circuit board using bonding wire；
Special-shaped resin gasket, the first chip, the second chip, bonding wire, the first adhesive layer, second are bonded using encapsulating material
Layer sealing is on circuit boards.
The preparation method of the abnormity resin gasket, includes the following steps:
S1: impregnation: by the oxidation of the epoxy resin of 8-40 parts by weight, the silica flour of 10-30 parts by weight, 2-10 parts by weight
Aluminium, 1-8 parts by weight calcium oxide be added solvent in, stirring and dissolving, be added 1-8 parts by weight curing agent, be uniformly dispersed, obtain resin
Glue；
S2: impregnation: the fibrous glass cloth of 10-60 parts by weight is immersed in the resin adhesive liquid prepared, obtains impregnated fabric, control leaching
Glue amount is 50-70g/m2(such as 50g/m2、60g/m2、70g/m2)；
S3: semi-solid preparation: impregnated fabric is dried at a temperature of 70-120 DEG C (such as 70 DEG C, 100 DEG C, 120 DEG C), pre- solid
Change degree is controlled at 30-50% (such as 30%, 40%, 50%), and prepreg is made；
S4: folded structure, pressing: by muti-piece prepreg layer stackup pressure, then 150-180 DEG C (such as 150 DEG C, 160 DEG C,
180 DEG C) at a temperature of heated, while being pressed, kept the temperature 8-12h (such as 8h, 10h, 12h) under the pressure of 3-10MPa
Stop heating afterwards, it is cooling, it is processed into the special-shaped resin gasket of above-mentioned shape.
Preferably, the solvent is acetone, butanone, ethyl acetate, butyl acetate, ethyl alcohol, glycol monoethyl ether, ethylene glycol
At least one of dimethyl ether, N,N-dimethylformamide, DMAC N,N' dimethyl acetamide, N-Methyl pyrrolidone.
Taking the above-mentioned ideal embodiment according to the present invention as inspiration, through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention' entirely.The technology of this invention
Property range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (10)
1. a kind of stacked chip package structure based on special-shaped resin gasket, which is characterized in that including the electricity being cascading
Road plate (2), the first adhesive layer (7), special-shaped resin gasket (3), the second adhesive layer (6), the first chip (4), encapsulating material (1) will
First adhesive layer (7), special-shaped resin gasket (3), the second adhesive layer (6), the first chip (4) are encapsulated on circuit board (2), described
First chip (4) is electrically connected by bonding wire (9) and circuit board (2)；
There is at least one cavity, the cavity has opening, is provided at least in cavity among the abnormity resin gasket (3)
One the second chip (5), second chip (5) are electrically connected through bonding wire and circuit board (2).
2. the stacked chip package structure according to claim 1 based on special-shaped resin gasket, which is characterized in that described different
The centre of shape resin gasket (3) has partition laterally and/or longitudinally, and the cavity is divided into several cavitys.
3. the stacked chip package structure according to claim 2 based on special-shaped resin gasket, which is characterized in that the sky
Chamber is top opening or bottom opening.
4. the stacked chip package structure according to claim 1-3 based on special-shaped resin gasket, feature exist
In, for the abnormity resin gasket (3) using fibrous glass cloth as substrate, the weight accounting of the fibrous glass cloth is 10-60wt%,
It is attached with following components, thereon to account for the percentages of special-shaped resin gasket (3) total weight: epoxy resin 8-40wt%, quartz
Powder 10-30wt%, aluminium oxide 2-10wt%, calcium oxide 1-8wt%, curing agent 1-8wt%.
5. the stacked chip package structure according to claim 1-4 based on special-shaped resin gasket, feature exist
In the abnormity resin gasket (3) is using fibrous glass cloth as substrate, and the weight accounting of fibrous glass cloth is 40-60wt%, thereon
It is attached with following components, to account for the percentages of special-shaped resin gasket (3) total weight: epoxy resin 30-40wt%, silica flour
10-20wt%, aluminium oxide 5-10wt%, calcium oxide 2-8wt%, curing agent 4-8wt%.
6. the stacked chip package structure according to claim 4 or 5 based on special-shaped resin gasket, which is characterized in that use
It further include pigment in the special-shaped resin gasket (3) of chip stack package, the weight accounting of the pigment is 1-3wt%, the face
Material is preferably at least one of white carbon black, pearl powder.
7. according to the described in any item stacked chip package structures based on special-shaped resin gasket of claim 4-6, feature exists
In the mesh number of the glass fabric is 100-200 mesh, and the mesh number of the silica flour is 200-400 mesh, the mesh of the aluminium oxide
Number is 400-600 mesh, and the mesh number of the calcium oxide is 200-400 mesh.
8. according to the described in any item stacked chip package structures based on special-shaped resin gasket of claim 4-7, feature exists
In, the epoxy resin be phosphatized epoxy resin, it is biphenyl type epoxy resin, bisphenol-type epoxy resin, phenol aldehyde type epoxy resin, sweet
Oil epoxy resin, o-cresol aldehyde type epoxy resin, naphthol type epoxy resin, at least one in dicyclopentadiene type epoxy resin
Kind, the curing agent is at least one of fatty amine, aliphatic cyclic amine, aromatic amine, polyamide, dicyandiamide, glyoxaline compound.
9. the stacked chip package structure according to claim 1-8 based on special-shaped resin gasket, feature exist
In the top of, first chip (4) with one layer of staircase stack or multilayer fourth chip (10), the first chip (4) and phase
It is electrically connected by bonding wire between adjacent fourth chip (10) and adjacent fourth chip (10), adjacent bonding wire is by setting
It is connected in series in the weld pad on the first chip (4) and fourth chip (10).
10. the stacked chip package structure according to claim 1-5 based on special-shaped resin gasket, feature exist
In the upper surface of the circuit board (2) is equipped with several passive blocks (8), and the passive block (8) is resistance, capacitor or electricity
Sense.
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Cited By (1)
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| CN109904128A (en) * | 2019-03-13 | 2019-06-18 | 中国科学院微电子研究所 | Three-dimensionally integrated T/R assembly encapsulation structure and packaging method based on silicon substrate support plate |
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