CN108987330B - Single-chip cleaning machine and chuck thereof - Google Patents
Single-chip cleaning machine and chuck thereof Download PDFInfo
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- CN108987330B CN108987330B CN201810804074.9A CN201810804074A CN108987330B CN 108987330 B CN108987330 B CN 108987330B CN 201810804074 A CN201810804074 A CN 201810804074A CN 108987330 B CN108987330 B CN 108987330B
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- chuck
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- positioning
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- 238000004140 cleaning Methods 0.000 title claims abstract description 28
- 230000005540 biological transmission Effects 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 3
- 230000033001 locomotion Effects 0.000 abstract description 16
- 235000012431 wafers Nutrition 0.000 description 108
- 238000000034 method Methods 0.000 description 16
- 238000005530 etching Methods 0.000 description 11
- 238000001039 wet etching Methods 0.000 description 11
- 238000012545 processing Methods 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005381 potential energy Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
Abstract
The embodiment of the application discloses monolithic cleaning machine and chuck thereof, this chuck includes: the chuck comprises a base, a chuck body, a bearing and a positioning pin; the chuck main body is arranged on the base, the bearing is sleeved between the base and the chuck main body, and the positioning pin is positioned on the chuck main body; the positioning pins comprise a first positioning pin and a second positioning pin; the first locating pin is used for being clamped at the edge of the wafer; the second locating pin is used for being clamped at the cutting groove of the wafer. Because the wafer cutting groove is a notch with a smaller opening, when the second positioning pin is fixed at the notch, the wafer can be firmly fixed on the chuck by the fixing action of the first positioning pin on the edge of the wafer, and even when the chuck rotates at a high speed, the wafer and the chuck cannot generate relative motion due to the fixing action of the second positioning pin on the wafer.
Description
Technical Field
The application relates to the field of semiconductor processing equipment, in particular to a single-chip cleaning machine and a chuck thereof.
Background
In wafer processing, the wafer is typically cleaned using a wet cleaning process. With the development of semiconductor technology, the monolithic cleaning (Single Wafer Clean) is becoming the dominant technology of the current wet process. In the case of Single-wafer cleaning, it is necessary to implement the cleaning by a Single-wafer cleaner (Wet Single).
In a single wafer cleaner, the chuck serves to carry and hold the wafer. The chuck is provided with a positioning pin for fixing the edge of the wafer. However, this chuck structure has the following problems: when the rotating speed of the chuck is too high, the chuck and the wafer can move relatively, so that the locating pins of the chuck are extremely easy to wear, and meanwhile, the risk of breaking the wafer is high. In addition, in the wet etching process, if relative motion exists between the chuck and the wafer, the etching rate of the acid solution can be increased, so that the etching amount in the whole wet etching process cannot be accurately controlled, and the wafer scrapping risk is greatly increased.
Disclosure of Invention
In view of this, the application provides a monolithic cleaning machine and chuck thereof to avoid the relative motion between chuck and its bearing wafer, and then reduce the wearing and tearing of locating pin, and reduce wafer breakage risk, reach the purpose of accurate control to the etching amount of whole wet etching in-process simultaneously.
In order to solve the technical problems, the application adopts the following technical scheme:
a chuck for a single-piece washer, comprising: the chuck comprises a base, a chuck body, a bearing and a positioning pin;
the chuck main body is arranged on the base, the bearing is sleeved between the base and the chuck main body, and the positioning pin is positioned on the chuck main body;
the positioning pins comprise a first positioning pin and a second positioning pin; the first locating pin is used for being clamped at the edge of the wafer; the second locating pin is used for being clamped at the cutting groove of the wafer.
Optionally, the plurality of first locating pins are uniformly distributed on the chuck body.
Optionally, the locating pin includes a locating pin seat, a locating pin column connected to the locating pin seat, and a locating block extending from a top end of the locating pin column, the locating block being offset from a center of the locating pin column.
Optionally, each of the locating pins is rotatable in its respective position.
Optionally, the chuck further comprises: the transmission device is positioned on the back surface of the chuck main body, a plurality of gears are arranged on the transmission device, each gear is sleeved on the outer side of each positioning pin, and the transmission device can drive each positioning pin to rotate at the position where the transmission device is positioned through the gears.
Optionally, the chuck further comprises at least one spring connected to the transmission device, and an included angle exists between the deformation direction of the spring and the radial direction of the chuck.
Optionally, the included angle is 90 degrees.
Optionally, the springs are multiple, and the distribution of the springs on the chuck is centrally symmetrical with respect to the base.
Optionally, the transmission is a metal transmission.
Optionally, the chuck further comprises: and the motor is positioned on the base and can drive the chuck main body and the transmission device to rotate through the bearing.
A single-chip washer, comprising: the machine comprises a machine table and a chuck positioned on the machine table, wherein the chuck is the chuck according to any technical scheme.
Optionally, the machine is further provided with a wafer slot alignment device, and the wafer slot alignment device is used for enabling the wafer to be placed on the chuck, so that the slots on the wafer can be accelerated to align with the second positioning pins on the chuck.
Compared with the prior art, the application has the following beneficial effects:
based on the above technical scheme, the chuck of monolithic cleaning machine that this application provided includes first locating pin and the second locating pin of setting on the chuck main part, wherein, first locating pin is used for the card in wafer edge department, the second locating pin is used for the card in wafer grooving department, because wafer grooving is the notch that an opening is less, when the second locating pin is fixed here, then when the second locating pin is fixed at this, then can firmly fix the wafer on the chuck with the help of the fixed action of first locating pin to wafer edge again, even when the chuck high-speed rotation, can not produce relative motion because of the fixed action of second locating pin to the wafer yet between wafer and the chuck. Because the relative motion between the wafer and the chuck can not occur, the abrasion of the wafer to the first positioning pin can be reduced, and the wafer breaking risk is further reduced. Moreover, because there is no relative motion between the chuck and the wafer, when the single-chip cleaner is used in the wet etching process, the possibility of high etching rate caused by the relative motion between the wafer and the chuck is avoided, so that the chuck of the single-chip cleaner can accurately control the etching amount in the whole wet etching process, and the risk of scrapping the wafer is reduced.
Drawings
In order that the detailed description of the present application may be clearly understood, a brief description of the drawings will be provided below. It is apparent that these figures are only some of the embodiments of the present application.
FIG. 1 is a schematic view of a chuck structure commonly used in the art;
FIG. 2 is a schematic view of a wafer structure with kerfs;
FIG. 3 is a schematic top view of a chuck of a single-piece washer according to an embodiment of the present disclosure;
FIG. 4 is a cross-sectional view taken along the direction A-A' in FIG. 3;
FIG. 5 is a schematic view of a locating pin according to an embodiment of the present disclosure;
fig. 6 is a schematic top view of a chuck of a single-wafer cleaning machine according to a second embodiment of the present disclosure;
fig. 7 is a schematic top view of a chuck of a single-wafer cleaning machine according to a third embodiment of the present disclosure.
Detailed Description
During wafer processing, the wafer is typically cleaned using a wet cleaning process. With the development of semiconductor technology, single-wafer cleaning is becoming the dominant technology in current wet processes. When the single chip is cleaned, the cleaning is realized by a single chip type cleaning machine.
A single-wafer cleaning machine generally includes a machine table and a chuck mounted on the machine table, the chuck serving to carry and hold a wafer. As shown in fig. 1, a conventional chuck structure is provided with a chuck 10 having a positioning pin 11 for fixing an edge of a wafer W. However, this chuck structure has the following problems: when the rotational speed of the chuck 10 is too fast, a relative movement of the chuck 10 and the wafer W is caused, i.e., there is a speed difference between the rotational speed ω1 of the chuck 10 and the rotational speed ω2 of the wafer W, for example, ω2< ω1, which results in extremely easy wear of the positioning pins 11 of the chuck 10 and also high risk of wafer chipping. In addition, in the wet etching process, if relative motion exists between the chuck and the wafer, the etching rate of the acid solution can be increased, so that the etching amount in the whole wet etching process cannot be accurately controlled, and the wafer scrapping risk is greatly increased.
In order to solve the technical problem, the application provides a chuck of a single-chip cleaning machine and a cleaning machine comprising the chuck.
It should be noted that the chuck of the single-wafer cleaning machine provided in the embodiments of the present application is suitable for fixing wafers with Notch (Notch). By way of example, the structure of the grooved wafer is shown in fig. 2. In fig. 2, 21 is a wafer main body, and 22 is a wafer kerf.
The chuck of the single-piece cleaning machine provided by the application comprises a first locating pin used for fixing the edge position of the wafer and a second locating pin used for being clamped in the notch of the wafer. When the wafer is placed on the chuck, the first positioning pin is fixed at the edge of the wafer, and the second positioning pin is clamped in the cutting groove of the wafer. Because the wafer cutting groove is a notch with a smaller opening, when the second positioning pin is fixed at the notch, the wafer can be firmly fixed on the chuck by the fixing action of the first positioning pin on the edge of the wafer, and even when the chuck rotates at a high speed, the wafer and the chuck cannot generate relative motion due to the fixing action of the second positioning pin on the wafer. Because the relative motion between the wafer and the chuck can not occur, the abrasion of the wafer to the first positioning pin can be reduced, and the wafer breaking risk is further reduced. Moreover, because there is no relative motion between the chuck and the wafer, when the single-chip cleaner is used in the wet etching process, the possibility of high etching rate caused by the relative motion between the wafer and the chuck is avoided, so that the chuck of the single-chip cleaner can accurately control the etching amount in the whole wet etching process, and the risk of scrapping the wafer is reduced.
The chuck of the single-wafer cleaning machine of the present application will be described in detail with reference to the following embodiments and the accompanying drawings.
Example 1
Referring to fig. 3 and 4, fig. 3 is a top view of a chuck of a single-chip washer according to an embodiment of the present application, and fig. 4 is a cross-sectional view along A-A' direction in fig. 3.
As shown in fig. 3 and 4, a chuck 300 of a single-chip washer according to an embodiment of the present application includes: a base 31, a chuck body 32, a bearing 33, and a dowel pin 34. Wherein the chuck body 32 is mounted on the base 31, the bearing 33 is sleeved between the base 31 and the chuck body 32, and the positioning pin 34 is positioned on the chuck body 32;
the alignment pins 34 include a first alignment pin 341 for catching at the edge of the wafer W and a second alignment pin 342 for catching at the wafer slot N.
As an optional example of the present application, in order to achieve better fixing of the wafer W, the first positioning pins 341 may be plural, and further, the plural first positioning pins 341 may be uniformly distributed on the chuck body 31 and be centrally symmetrical with respect to the center of the chuck, so that stress of the wafer W may be uniform, and the risk of breaking the wafer W may be reduced. Moreover, this structural design is favorable to reducing the wearing and tearing of first locating pin 341, improves first locating pin 341's life.
In order to more conveniently fix the wafer W by the first and second alignment pins 341 and 342, as an example, the first and second alignment pins 341 and 342 may be rotated at positions where they are respectively located.
In addition, in order to conveniently fix the wafer W using the first alignment pin 341 and/or the second alignment pin 342, as another example, the specific structure of the first alignment pin 341 and/or the second alignment pin 342 may include an alignment pin seat 51, an alignment pin 52 connected to the alignment pin seat 51, and an alignment block 53 extending from a top end of the alignment pin 52, wherein the alignment pin 52 extends upward from a center of the alignment pin seat, and the alignment block 53 is offset from a center of the alignment pin 52, as shown in fig. 5.
In the embodiment of the present application, the first positioning pin 51 and the second positioning pin 52 may have the structure shown in fig. 5, or one of them may have the structure shown in fig. 5.
In this way, before the wafer W is placed on the chuck 300, the positioning pins 34 are rotated in advance to a position where the positioning blocks 53 are away from the center of the chuck, and thereafter, the positioning pins 34 are controlled to stop rotating, so that there is a large space between the positioning pins 34 to accommodate the wafer W, thereby making it easier to place the wafer W on the chuck 300. After the wafer W is placed on the chuck 300, the positioning pins 34 are controlled to rotate so that the positioning blocks 53 on the first positioning pins 341 rotate to a position contacting the edge of the wafer W and the positioning blocks 53 on the second positioning pins 342 rotate to a position contacting the notch of the wafer W. Thus, the wafer W can be firmly fixed to the chuck 300 by the first and second positioning pins 341 and 342. Even when the chuck 300 rotates at a high speed, the second positioning pins 342 fix the wafer W, so that no relative movement occurs between the wafer W and the chuck. Since the wafer W and the chuck 300 do not move relatively, the abrasion of the wafer W to the first positioning pins 341 is reduced, and the wafer W breaking risk is reduced. Moreover, because there is no relative motion between the chuck 300 and the wafer W, when the single-chip cleaner is used in the wet etching process, the possibility of high etching rate caused by the relative motion between the wafer W and the chuck 300 does not occur, so that the chuck using the single-chip cleaner can accurately control the etching amount in the whole wet etching process, and the risk of wafer scrapping is reduced.
The foregoing is a specific implementation manner of the chuck of the single-chip washer provided in the first embodiment of the present application. In order to control the rotation of the positioning pin 34 more conveniently, the application also provides another implementation of the chuck of the single-chip washer, and the second embodiment is specifically referred to.
Example two
The chuck 600 of the single-chip washer according to the second embodiment is modified based on the chuck 300 of the single-chip washer according to the first embodiment. Thus, there are many similarities between the second embodiment and the first embodiment, and for the sake of brevity, only the differences will be described in detail herein, and reference is made to the description of the first embodiment.
Referring to fig. 6, in addition to the respective structures of the chuck 300 of the first embodiment, the chuck 600 of the single-chip cleaning machine according to the second embodiment of the present application may further include:
the transmission device 61 is positioned on the back surface 31 of the chuck body, a plurality of gears 611 are arranged on the transmission device 61, each gear 611 is sleeved on the outer side of each positioning pin 34, and the transmission device 61 can drive each positioning pin 34 to rotate at the position of each positioning pin through each gear 611.
As an alternative example of the present application, the transmission 61 may be a metal transmission for conveniently driving the positioning pin 34 to rotate.
In addition, as another alternative example of the present application, in order to conveniently drive the transmission 61 to rotate, the chuck 600 may further include a motor (not shown) disposed on the base 31, so that the motor can drive the chuck body 31 and the transmission 61 to rotate through the bearing 33. The chuck body 31 and the transmission 61 are rotated in a time-sharing manner, that is, they cannot be rotated at the same time. More specifically, the actuator 61 is rotated before the wafer is placed, and the chuck body 31 is rotated during the process of processing the wafer after the wafer is placed on the chuck.
The above is a specific implementation manner of the chuck of the single-chip washer according to the second embodiment of the present application, in which, in addition to the beneficial effects described in the first embodiment, the second embodiment can further control the rotation of the positioning pin 34 by means of the transmission 61 and the gears 611 thereof. In this way, before the wafer is placed on the chuck 600, the transmission device 61 and each gear 611 thereon are driven in advance to rotate, and the rotation of each gear 611 can drive each positioning pin 34 in contact with the transmission device, so that the positioning block on each positioning pin 34 is rotated to a position far from the center of the chuck 600, and thus, a larger space is provided between the positioning pins 34 to accommodate the wafer W, so that the wafer W is placed on the chuck 600 more easily. After the wafer W is placed on the chuck 600, the positioning pins 34 are controlled to rotate so that the positioning blocks 53 on the first positioning pins 341 rotate to a position contacting the edge of the wafer W and the positioning blocks 53 on the second positioning pins 342 rotate to a position contacting the notch of the wafer W. Thus, the wafer W may be firmly fixed to the chuck 600 by the first and second positioning pins 341 and 342.
In addition, to facilitate control of the reversal of the alignment pins 34 to a position where they contact the wafer edge and wafer kerf after the wafer is placed on the chuck, embodiments of the present application provide yet another specific implementation of a chuck for a single wafer cleaning machine. See in particular example three.
Example III
The chuck of the single-chip washer according to the third embodiment is improved on the basis of the chuck of the single-chip washer according to the second embodiment. Therefore, there are many similarities between the third embodiment and the second embodiment, and for the sake of brevity, only the differences will be described in detail herein, and reference is made to the description of the second embodiment.
Referring to fig. 7, in addition to the respective structures of the chuck 600 described in the second embodiment, the chuck 700 of the single-chip cleaning machine according to the third embodiment of the present application may further include:
at least one spring 71 connected to the actuator 61, the direction of deformation of the spring 71 being at an angle to the radial direction of the chuck 300.
Thus, rotation of the actuator 61 causes a certain elastic deformation of the springs 71 thereon, which have a certain elastic potential, before the wafer is placed on the chuck 700. After the wafer is placed on the chuck 700, the elastic potential energy generated by the spring 71 drives the transmission device 61 to rotate reversely, so as to further drive the positioning pins 34 to turn over, and further enable the positioning blocks 343 on the positioning pins 34 to rotate to a position contacting with the edge of the wafer or the cutting groove of the wafer, thereby realizing the fixing effect of the positioning pins 34 on the wafer.
As an alternative embodiment of the present application, the number of springs 71 connected to the driving device 61 may be plural in order to increase the energy for driving the driving device 61 to reverse, and the plurality of springs 71 may be uniformly distributed on the chuck 700 in order to make the rotational speed of the respective positioning pins 34 equivalent, and further, the plurality of springs 71 may be centrally and symmetrically distributed with respect to the base 33 of the chuck 71.
Furthermore, as an alternative embodiment of the present application, the angle between the deformation direction of the spring and the radial direction of the chuck may be 90 degrees in order to enable the kinetic energy during rotation of the transmission 61 to be converted to elastic potential energy of the spring 71 with maximum efficiency.
The above is three embodiments of the chuck of the single-chip washer provided in the embodiments of the present application, in which the implementations may be combined with each other, and the combined solutions are also within the scope of protection of the present application.
Based on the chuck of the single-chip washer provided by the embodiment, the embodiment of the application also provides a specific implementation mode of the single-chip washer.
The single-chip cleaning machine comprises a machine table and a chuck positioned on the machine table, wherein the chuck can be provided by any specific implementation mode.
As an example, in order to enable the wafer kerf of the wafer placed on the chuck to be aligned with the second positioning pin relatively quickly, the machine platform of the single-wafer cleaning machine provided by the embodiment of the application may be further provided with an alignment device for wafer kerf, where the alignment device for wafer kerf is used to enable the kerf of the wafer to be aligned with the second positioning pin on the chuck when the wafer is placed on the chuck.
The foregoing is merely exemplary of the present application and is not intended to limit the present application. Various modifications and variations may occur to those skilled in the art and it is intended to be included within the scope of the appended claims, along with the full scope of equivalents to which such modifications and variations are entitled.
Claims (6)
1. A chuck for a single-piece washer, comprising: the chuck comprises a base, a chuck body, a bearing and a positioning pin;
the chuck main body is arranged on the base, the bearing is sleeved between the base and the chuck main body, and the positioning pin is positioned on the chuck main body;
the positioning pins comprise a first positioning pin and a second positioning pin; the first locating pin is used for being clamped at the edge of the wafer; the second locating pin is used for being clamped at the cutting groove of the wafer;
the positioning pin comprises a positioning pin seat, a positioning pin column connected to the positioning pin seat and a positioning block extending from the top end of the positioning pin column, and the positioning block deviates from the center of the positioning pin column; each positioning pin can rotate at the position of the positioning pin;
the chuck further comprises: the transmission device is positioned on the back surface of the chuck main body, a plurality of gears are arranged on the transmission device, each gear is sleeved on the outer side of each positioning pin, and the transmission device can drive each positioning pin to rotate at the position of each positioning pin through the gears;
the chuck further comprises at least one spring connected to the transmission device, wherein an included angle exists between the deformation direction of the spring and the radial direction of the chuck; the included angle is 90 degrees; the springs are distributed on the chuck in a central symmetry mode with respect to the base.
2. The chuck as in claim 1, wherein the first plurality of alignment pins is uniformly distributed on the chuck body.
3. The chuck as in claim 1, wherein the actuator is a metal actuator.
4. The chuck as in claim 1, further comprising: and the motor is positioned on the base and can drive the chuck main body and the transmission device to rotate through the bearing.
5. A single-chip washer, comprising: a machine and a chuck on the machine, the chuck being as claimed in any one of claims 1 to 4.
6. The single-wafer cleaning machine of claim 5, wherein the machine further comprises a wafer slot alignment device, wherein the wafer slot alignment device is configured to facilitate alignment of a slot on a wafer with a second alignment pin on the chuck when the wafer is placed on the chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810804074.9A CN108987330B (en) | 2018-07-20 | 2018-07-20 | Single-chip cleaning machine and chuck thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810804074.9A CN108987330B (en) | 2018-07-20 | 2018-07-20 | Single-chip cleaning machine and chuck thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108987330A CN108987330A (en) | 2018-12-11 |
| CN108987330B true CN108987330B (en) | 2024-03-12 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810804074.9A Active CN108987330B (en) | 2018-07-20 | 2018-07-20 | Single-chip cleaning machine and chuck thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108987330B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111834246B (en) * | 2019-04-23 | 2023-12-08 | 上海新微技术研发中心有限公司 | Wafer bonding device |
| CN115346905B (en) * | 2022-10-18 | 2023-03-24 | 智程半导体设备科技(昆山)有限公司 | Thin semiconductor substrate rotary positioning device |
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| US5421056A (en) * | 1993-04-19 | 1995-06-06 | Tokyo Electron Limited | Spin chuck and treatment apparatus using same |
| JPH09219437A (en) * | 1996-02-13 | 1997-08-19 | Nikon Corp | Positioning apparatus |
| US5851102A (en) * | 1996-09-17 | 1998-12-22 | Hitachi Electronics Engineering Co., Ltd. | Device and method for positioning a notched wafer |
| KR20040100547A (en) * | 2003-05-23 | 2004-12-02 | 삼성전자주식회사 | Wafer Spin Chuck |
| KR100966721B1 (en) * | 2009-12-24 | 2010-06-29 | 이인오 | Chuck for fixing wafer |
| KR20120072530A (en) * | 2010-12-24 | 2012-07-04 | 이인오 | Chuck for fixing wafer |
| CN102884616A (en) * | 2010-05-07 | 2013-01-16 | 朗姆研究公司 | Device for holding wafer shaped articles |
| CN204303791U (en) * | 2015-01-08 | 2015-04-29 | 北京七星华创电子股份有限公司 | The clamping device of semiconductor wafer |
| CN107093569A (en) * | 2016-02-18 | 2017-08-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of wafer locating device and reaction chamber |
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2018
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Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5421056A (en) * | 1993-04-19 | 1995-06-06 | Tokyo Electron Limited | Spin chuck and treatment apparatus using same |
| JPH09219437A (en) * | 1996-02-13 | 1997-08-19 | Nikon Corp | Positioning apparatus |
| US5851102A (en) * | 1996-09-17 | 1998-12-22 | Hitachi Electronics Engineering Co., Ltd. | Device and method for positioning a notched wafer |
| KR20040100547A (en) * | 2003-05-23 | 2004-12-02 | 삼성전자주식회사 | Wafer Spin Chuck |
| KR100966721B1 (en) * | 2009-12-24 | 2010-06-29 | 이인오 | Chuck for fixing wafer |
| CN102884616A (en) * | 2010-05-07 | 2013-01-16 | 朗姆研究公司 | Device for holding wafer shaped articles |
| KR20120072530A (en) * | 2010-12-24 | 2012-07-04 | 이인오 | Chuck for fixing wafer |
| CN204303791U (en) * | 2015-01-08 | 2015-04-29 | 北京七星华创电子股份有限公司 | The clamping device of semiconductor wafer |
| CN107093569A (en) * | 2016-02-18 | 2017-08-25 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of wafer locating device and reaction chamber |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108987330A (en) | 2018-12-11 |
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