CN107685284B - Method for uniformly polishing optical device - Google Patents
Method for uniformly polishing optical device Download PDFInfo
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- CN107685284B CN107685284B CN201710923679.5A CN201710923679A CN107685284B CN 107685284 B CN107685284 B CN 107685284B CN 201710923679 A CN201710923679 A CN 201710923679A CN 107685284 B CN107685284 B CN 107685284B
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- polishing
- optical device
- processing cavity
- wheel
- planetary wheel
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention relates to a method for uniformly polishing an optical device, which comprises the following steps: s1, placing the wandering star wheel into a polishing machine; s2, placing the optical device into a processing cavity, wherein the processing cavity is arranged in the polishing hole of the planetary wheel and can freely rotate relative to the polishing hole; s3, starting polishing, enabling the planetary wheel to rotate along with the driving wheel of the polishing machine and have a rotation speed w1, enabling the processing cavity to rotate along with the planetary wheel and the optical device and have a rotation speed w2, and enabling w1 to be not equal to w 2. The technical scheme of the invention ensures that the grinding paths passed by all parts of the optical device in the grinding process are basically the same.
Description
Technical Field
The invention relates to a polishing process, in particular to a method for uniformly polishing an optical device.
Background
In the polishing process of the optical device, the polishing uniformity and the polishing evenness of the optical device are parameters which are crucial to the quality of a finished product, when the existing wandering star wheel is polished in a polishing machine, the optical device rotates along with the wandering star wheel, so that the angle of the optical device at the periphery can pass through a longer grinding path, the condition that the flatness of the same optical device is different after grinding, namely edge collapse, can occur, and the uniformity of the product cannot be guaranteed under the condition.
Disclosure of Invention
The invention aims to solve the technical problem of providing a method for uniformly polishing an optical device, so that the polishing paths of all parts of the optical device are basically the same in the polishing process.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the utility model provides an evenly polish wandering star wheel, inside the round hole of polishing of having seted up of wandering star wheel, the hole of polishing is at the in-process of polishing and is rotatory around wandering star wheel center, be provided with the process chamber in the hole of polishing, process chamber rotatable coupling wandering star wheel, the coefficient of friction between process chamber and wandering star wheel is less than the coefficient of friction between process chamber and the machined part of treating.
Furthermore, a circular ring-shaped roller path is arranged in the planetary wheel, a ball is arranged in the roller path, and the processing cavity is connected with the ball and is not in contact with the planetary wheel.
Furthermore, the processing cavity is connected with the ball through an elastic piece.
Still further, the distance between the processing cavity and the ball is equal to the natural length of the elastic element.
Preferably, the number of the balls is three or four and the balls are arranged at equal intervals.
Preferably, the wandering star wheel is in contact connection with the processing cavity, and a lubricating layer is arranged between the wandering star wheel and the processing cavity.
The method for solving the technical problems comprises the following steps:
a method for uniformly polishing an optical device comprises the following steps:
s1, placing the wandering star wheel into a polishing machine;
s2, placing the optical device into a processing cavity, wherein the processing cavity is arranged in the polishing hole of the planetary wheel and can freely rotate relative to the polishing hole;
s3, starting polishing, enabling the planetary wheel to rotate along with the driving wheel of the polishing machine and have a rotation speed w1, enabling the processing cavity to rotate along with the planetary wheel and the optical device and have a rotation speed w2, and enabling w1 to be not equal to w 2.
Further, the w1< w 2.
Preferably, in the step S2, the planetary wheel is provided with a circular race, the race is provided with balls, the processing cavity is connected with the balls and does not contact with the planetary wheel, and the processing cavity is connected with the balls through an elastic member; in step S3, the processing chamber is shifted from the center of the planetary wheel.
Compared with the prior art, the invention has the following advantages and effects: because the rotatable processing cavity is arranged in the wandering star wheel, the rotation speed of the optical device relative to the wandering star wheel is changed, so that the advancing path of the optical device relative to the grinding disc is changed all the time, and the phenomenon of edge collapse is eliminated. The connection design through the ball has reduced the cooperation requirement of process chamber with the wandering star wheel, and the addition of elastic component further reduces the cooperation degree of difficulty to make the process chamber can design into the non-circular processing that does benefit to the process chamber, also can make the center of the relative wandering star wheel of process chamber take place the skew because the atress inequality at the in-process of polishing, thereby further change optical device's grinding route. Meanwhile, by selecting proper elastic pieces and the number of the balls, a smaller friction coefficient between the balls and the planetary gears is guaranteed, and stability is good during processing, so that the friction force between the balls and the planetary gears is not increased due to the fact that a certain elastic piece is stressed too much. In addition, the matching difficulty of the processing cavity and the planetary wheel can be reduced by arranging a lubricating layer.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of the present invention.
FIG. 2 is an enlarged view of a part of a processing chamber in example 1.
FIG. 3 is an enlarged view of a part of a processing chamber in example 2.
Description of the reference symbols
Machining cavity 2 for polishing hole 11 of wandering star wheel 1
Detailed Description
The present invention will be described in further detail with reference to examples, which are illustrative of the present invention and are not to be construed as being limited thereto.
Example 1:
as shown in fig. 1, the present embodiment is composed of a wandering star wheel 1 and a processing cavity 2, wherein a polishing hole 11 is formed on the wandering star wheel 1, and the polishing hole 11 rotates around the center of the wandering star wheel 1 in the polishing process. Fig. 2 is a schematic diagram of the cooperation between the planetary gear 1 and the processing chamber 2, wherein a circular raceway matched with the ball 3 is provided on the planetary gear 1, the other end of the ball 3 is disposed in a notch provided in the processing chamber 2 (the other end of the ball can also be disposed as the circular raceway), and the planetary gear 1 is not in contact with the processing chamber 2, a rectangular station 4 is provided in the processing chamber 2, when a workpiece is placed in the station for polishing, the planetary gear 1 rotates along with a driving gear of the polishing machine, because a friction force preventing the workpiece from rotating to the rotational direction of the planetary gear 1 exists between the workpiece and the polishing disc, and the friction force between the processing chamber 2 and the planetary gear 1 is smaller than the friction force, and further, the rotational speed of the workpiece is slower than that of the planetary gear 1, so that the grinding path of each part.
The specific processing steps are as follows:
s1, placing the wandering star wheel into a polishing machine;
s2, placing the optical device into a processing cavity, wherein the processing cavity is arranged in the polishing hole of the planetary wheel and can freely rotate relative to the polishing hole;
and S3, starting to polish, wherein the planetary wheel rotates along with the driving wheel of the polishing machine and has a rotation speed w1, the processing cavity rotates along with the planetary wheel and the optical device and has a rotation speed w2, and because of the friction force acting in the opposite direction between the grinding tool and the workpiece, w1 is less than w 2.
Example 2:
as shown in fig. 3, this embodiment is substantially the same as embodiment 1, except that the processing chamber 2 is connected with the ball 3 through the elastic member 31, wherein the natural length of the elastic member 31 is equal to the space between the processing chamber 2 and the ball 3, thereby reducing the requirement for the fit between the processing chamber 2 and the ball 3. When grinding is started, the processing cavity is deviated relative to the center of the planetary wheel due to uneven stress, so that the substitute processed piece is deviated in the positions of different parts and is ground on different paths.
Example 3:
as shown in fig. 1, the free-wheel 1 is in direct contact with the processing cavity 2, and a lubricating layer is arranged between the free-wheel and the processing cavity, wherein the lubricating layer can be alkyd resin, epoxy resin or acrylic resin, and a little metal oxide with the content of less than 5% can be added into the materials to increase the wear resistance.
In addition, it should be noted that the specific embodiments described in the present specification may differ in the shape of the components, the names of the components, and the like. All equivalent or simple changes of the structure, the characteristics and the principle of the invention which are described in the patent conception of the invention are included in the protection scope of the patent of the invention. Various modifications, additions and substitutions for the specific embodiments described may be made by those skilled in the art without departing from the scope of the invention as defined in the accompanying claims.
Claims (1)
1. A method for uniformly polishing an optical device comprises the following steps:
s1, placing the wandering star wheel into a polishing machine;
s2, placing the optical device into a processing cavity, wherein the processing cavity is arranged in the polishing hole of the planetary wheel and can freely rotate relative to the polishing hole;
s3, starting polishing, wherein the planetary wheel rotates along with a driving wheel of the polishing machine and has a rotation speed w1, the processing cavity rotates along with the planetary wheel and the optical device and has a rotation speed w2, and w1 is more than w 2;
in the step S2, the planetary wheel is provided with a circular raceway, balls are arranged in the raceway, the processing cavity is connected with the balls and is not contacted with the planetary wheel, and the processing cavity is connected with the balls through springs; in step S3, the processing chamber is shifted from the center of the planetary wheel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923679.5A CN107685284B (en) | 2017-09-30 | 2017-09-30 | Method for uniformly polishing optical device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710923679.5A CN107685284B (en) | 2017-09-30 | 2017-09-30 | Method for uniformly polishing optical device |
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| Publication Number | Publication Date |
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| CN107685284A CN107685284A (en) | 2018-02-13 |
| CN107685284B true CN107685284B (en) | 2020-05-01 |
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| CN201710923679.5A Active CN107685284B (en) | 2017-09-30 | 2017-09-30 | Method for uniformly polishing optical device |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107553315A (en) * | 2017-09-30 | 2018-01-09 | 德清晶生光电科技有限公司 | A kind of method of optics uniform grinding |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1037262A2 (en) * | 1999-03-15 | 2000-09-20 | Mitsubishi Materials Corporation | Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer |
| CN2584349Y (en) * | 2002-11-21 | 2003-11-05 | 洛阳轴研科技股份有限公司 | Electromagnetic coreless holder for high-precision rolling bearing grinding |
| CN102975114A (en) * | 2012-12-06 | 2013-03-20 | 江苏吉星新材料有限公司 | Wandering star wheel |
| CN205021414U (en) * | 2015-10-13 | 2016-02-10 | 中恒日上(江苏)新能源股份有限公司 | Car parts production is with high stability wandering star wheel |
| CN205415202U (en) * | 2016-03-17 | 2016-08-03 | 苏州久晶光电科技有限公司 | Ultra -thin lens processing tool |
| CN107553315A (en) * | 2017-09-30 | 2018-01-09 | 德清晶生光电科技有限公司 | A kind of method of optics uniform grinding |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010040604A (en) * | 2008-07-31 | 2010-02-18 | Tokyo Seimitsu Co Ltd | Wafer rotation stabilization mechanism in wafer polishing device |
| CN205147994U (en) * | 2014-12-30 | 2016-04-13 | 东莞市兰光光学科技有限公司 | Be used for flexible mirror lens precision grinding device |
| CN105014517A (en) * | 2015-07-24 | 2015-11-04 | 常州博美新材料科技有限公司 | Centrifugal polishing machine |
| JP2017144531A (en) * | 2016-02-19 | 2017-08-24 | 株式会社島津製作所 | Carrier plate and single-side polishing device using the same |
-
2017
- 2017-09-30 CN CN201710923679.5A patent/CN107685284B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1037262A2 (en) * | 1999-03-15 | 2000-09-20 | Mitsubishi Materials Corporation | Wafer transfer apparatus and wafer polishing apparatus, and method for manufacturing wafer |
| CN2584349Y (en) * | 2002-11-21 | 2003-11-05 | 洛阳轴研科技股份有限公司 | Electromagnetic coreless holder for high-precision rolling bearing grinding |
| CN102975114A (en) * | 2012-12-06 | 2013-03-20 | 江苏吉星新材料有限公司 | Wandering star wheel |
| CN205021414U (en) * | 2015-10-13 | 2016-02-10 | 中恒日上(江苏)新能源股份有限公司 | Car parts production is with high stability wandering star wheel |
| CN205415202U (en) * | 2016-03-17 | 2016-08-03 | 苏州久晶光电科技有限公司 | Ultra -thin lens processing tool |
| CN107553315A (en) * | 2017-09-30 | 2018-01-09 | 德清晶生光电科技有限公司 | A kind of method of optics uniform grinding |
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| CN107685284A (en) | 2018-02-13 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20210210 Address after: 317000 Funan West Road, Dunan Avenue, Duqiao Town, Linhai City, Taizhou City, Zhejiang Province Patentee after: Taizhou Zhengda optics Co.,Ltd. Address before: 313200 No.6, Yidong Road, Qianyuan Town, Deqing County, Huzhou City, Zhejiang Province Patentee before: CRYSTAL OPTOELECTRONIC TECHNOLOGY Co.,Ltd. |
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| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Method for Uniform Grinding of Optical Devices Effective date of registration: 20230414 Granted publication date: 20200501 Pledgee: Industrial and Commercial Bank of China Limited Linhai Branch Pledgor: Taizhou Zhengda optics Co.,Ltd. Registration number: Y2023330000767 |
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