CN208336183U - A kind of one chip cleaning machine and its chuck - Google Patents
A kind of one chip cleaning machine and its chuck Download PDFInfo
- Publication number
- CN208336183U CN208336183U CN201821164328.7U CN201821164328U CN208336183U CN 208336183 U CN208336183 U CN 208336183U CN 201821164328 U CN201821164328 U CN 201821164328U CN 208336183 U CN208336183 U CN 208336183U
- Authority
- CN
- China
- Prior art keywords
- chuck
- positioning pin
- chip
- main body
- transmission device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
It includes: pedestal, chuck main body, bearing and positioning pin that the embodiment of the present application, which discloses a kind of one chip cleaning machine and its chuck, the chuck,；Wherein, the chuck main body is mounted on the pedestal, and the bearing holder (housing, cover) is mounted between the pedestal and the chuck main body, and the positioning pin is located on the chuck main body；The positioning pin includes the first positioning pin and the second positioning pin；First positioning pin is for being stuck in wafer edge；Second positioning pin is for being stuck at chip grooving.Because chip grooving is the lesser recess of opening, when the second positioning pin is fixed here, then again by the first positioning pin to the fixed function of Waffer edge, chip can be securely fixed on chuck, even if in chuck high speed rotation, because the second positioning pin is to the fixed function of chip, relative motion will not be generated between chip and chuck.
Description
Technical field
This application involves semiconductor processing equipment field more particularly to a kind of one chip cleaning machines and its chuck.
Background technique
In to chip process, it will usually be cleaned using wet clean process to chip.With semiconductor skill
The development of art, one chip cleaning (Single Wafer Clean) are increasingly becoming the mainstream technology of wet processing instantly.In monolithic
When formula is cleaned, need to realize by one chip cleaning machine (Wet Single).
In one chip cleaning machine, chuck plays a part of bearing wafer and fixed wafer.It is provided with and is used on chuck
The positioning pin at fixed wafer edge.However this chuck structure has the following problems: when the revolving speed of chuck is too fast, will cause card
The relative motion of disk and chip causes the positioning pin of chuck easily to wear, and exists simultaneously the risk of very high chip fragmentation.Separately
Outside, during wet etching, if there are relative motions between chuck and chip, the etch rate of acid solution can become larger, in this way, nothing
Method accurately controls the etch amount during entire wet etching, considerably increases wafer scrap risk.
Utility model content
In view of this, this application provides a kind of one chip cleaning machine and its chucks, to avoid chuck and its bearing wafer
Between relative motion, and then reduce the abrasion of positioning pin, and reduce chip fragmentation risk, while reaching accurate control to entire
The purpose of etch amount during wet etching.
In order to solve the above-mentioned technical problem, the application adopts the technical scheme that
A kind of chuck of one chip cleaning machine, comprising: pedestal, chuck main body, bearing and positioning pin；
Wherein, the chuck main body is mounted on the pedestal, and the bearing holder (housing, cover) is mounted in the pedestal and the chuck master
Between body, the positioning pin is located on the chuck main body；
The positioning pin includes the first positioning pin and the second positioning pin；First positioning pin is for being stuck in Waffer edge
Place；Second positioning pin is for being stuck at chip grooving.
Optionally, first positioning pin is multiple, and multiple first positioning pins are evenly distributed on the chuck main body
On.
Optionally, the positioning pin includes location key seat, the positioning pin column being connected on the location key seat and from institute
The locating piece that the top of positioning pin column is extended is stated, the locating piece deviates the center of the positioning pin column.
Optionally, each positioning pin can its respectively where position rotate.
Optionally, the chuck further include: the transmission device on the chuck main body back side, on the transmission device
Multiple gears are provided with, each gear set being capable of band by the gear in the outside of each positioning pin, the transmission device
Move each positioning pin its respectively where position rotate.
Optionally, the chuck further includes at least one spring being connected on the transmission device, the shape of the spring
Changing direction between the radial direction of the chuck, there are angles.
Optionally, the angle of the angle is 90 degree.
Optionally, the spring is multiple, and distribution of the spring on the chuck is centrosymmetric about pedestal
Distribution.
Optionally, the transmission device is metal transmission device.
Optionally, the chuck further include: the motor on the pedestal, the motor can be driven by the bearing
Move the chuck main body and transmission device rotation.
A kind of one chip cleaning machine characterized by comprising board and the chuck on the board, the chuck
For chuck described in any of the above-described technical solution.
Optionally, the alignment device of chip grooving is additionally provided on the board, the alignment device of the chip grooving is used
In make chip when being placed on chuck, can the grooving in faster wafer be directed at the second positioning pin on the chuck.
Compared to the prior art, the application has the advantages that
Based on above technical scheme it is found that the chuck of one chip cleaning machine provided by the present application includes being arranged in chuck main body
On the first positioning pin and the second positioning pin, wherein the first positioning pin is for being stuck in wafer edge, and the second positioning pin is for blocking
At chip grooving, because chip grooving is then the lesser recess of opening is borrowed again when the second positioning pin is fixed here
It helps the first positioning pin to the fixed function of Waffer edge, chip can be securely fixed on chuck, even if in chuck high speed
When rotation, because the second positioning pin is to the fixed function of chip, relative motion will not be generated between chip and chuck.Because chip with
Relative motion will not occur between chuck, therefore, chip can also reduce the abrasion of the first positioning pin, and it is broken to thereby reduce chip
Piece risk.Moreover, because between chuck and chip without relative motion, when the one chip cleaning machine is used wet-etching technology process
It is not in the possibility for causing etch rate to get higher because of the relative motion between chip and chuck when middle, thus, utilize this Shen
The chuck for the one chip cleaning machine that please be provided can accurately control the etch amount during entire wet etching, reduce chip report
Useless risk.
Detailed description of the invention
In order to which the specific embodiment of the application is expressly understood, used when the application specific embodiment is described below
Attached drawing do a brief description.It should be evident that these attached drawings are only the section Examples of the application.
Fig. 1 is chuck structure schematic diagram commonly used in the art；
Fig. 2 is the chip architecture schematic diagram with grooving；
Fig. 3 is the chuck overlooking structure diagram for the one chip cleaning machine that the embodiment of the present application one provides；
Fig. 4 is the cross-sectional view in the direction A-A ' in Fig. 3；
Fig. 5 is locating pin structure schematic diagram provided by the embodiments of the present application；
Fig. 6 is the chuck overlooking structure diagram for the one chip cleaning machine that the embodiment of the present application two provides；
Fig. 7 is the chuck overlooking structure diagram for the one chip cleaning machine that the embodiment of the present application three provides.
Specific embodiment
In chip process, it will usually be cleaned using wet clean process to chip.With semiconductor technology
Development, one chip, which cleans, is increasingly becoming the mainstream technology of wet processing instantly.In monolithic cleaning, need clear by one chip
Washing machine is realized.
The chuck that one chip cleaning machine generally includes board and is mounted on board, chuck play bearing wafer and fixed crystalline substance
The effect of piece.Common chuck structure on chuck 10 as shown in Figure 1, be provided with the positioning pin 11 for the edge fixed wafer W.
However, the chuck structure has the following problems: when the revolving speed of chuck 10 is too fast, will cause the opposite fortune of chuck 10 and wafer W
Dynamic, i.e. there are speed differences between the slewing rate ω 1 of chuck 10 and the slewing rate ω 2 of wafer W, for example, 2 < ω of ω 1, causes
The positioning pin 11 of chuck 10 is easily worn, and exists simultaneously very high chip fragmentation risk.In addition, during wet etching, if
There are relative motion between chuck and chip, the etch rate of acid solution can become larger, in this way, during can not be to entire wet etching
Etch amount accurately controlled, considerably increase wafer scrap risk.
In order to solve the above-mentioned technical problem, this application provides a kind of chuck of one chip cleaning machine and include the chuck
Cleaning machine.
It is to be appreciated that the chuck of one chip cleaning machine provided by the embodiments of the present application, which is suitable for fixing, has grooving
(Notch) chip.As an example, the structure for the chip that should have grooving is as shown in Figure 2.In Fig. 2 21 be wafer bulk, 22
For chip grooving.
One chip cleaning machine provided by the present application chuck in addition to including for first at fixed wafer marginal position
It further include the second positioning pin gone out for being stuck in chip grooving other than positioning pin.After chip is placed on chuck, the first positioning
Pin is fixed on wafer edge, and the second positioning pin is stuck in the grooving of chip.Because chip grooving is the lesser recess of opening,
It, can be by chip then again by the first positioning pin to the fixed function of Waffer edge when the second positioning pin is fixed here
It is securely fixed on chuck, even if in chuck high speed rotation, because the second positioning pin is to the fixed function of chip, chip and card
Relative motion will not be generated between disk.Because relative motion will not occur between chip and chuck, therefore, chip is positioned to first
The abrasion of pin can also be reduced, and thereby reduce chip fragmentation risk.Moreover, because between chuck and chip without relative motion, when will
It is not in be led because of the relative motion between chip and chuck when the one chip cleaning machine is used during wet-etching technology
The possibility for causing etch rate to get higher, thus, it can accurately be controlled entirely using the chuck of one chip cleaning machine provided by the present application
Etch amount during wet etching reduces the risk of wafer scrap.
Combined with specific embodiments below and attached drawing, it describes in detail to the chuck of the application one chip cleaning machine.
Embodiment one
Refer to Fig. 3 and Fig. 4, wherein Fig. 3 is the vertical view of the chuck for the one chip cleaning machine that the embodiment of the present application one provides
Figure, Fig. 4 are the cross-sectional view in the direction A-A ' in Fig. 3.
As shown in Figure 3 and Figure 4, the embodiment of the present application one provide one chip cleaning machine chuck 300 include: pedestal 31,
Chuck main body 32, bearing 33 and positioning pin 34.Wherein chuck main body 32 is mounted on pedestal 31, and bearing 33 is sleeved on 31 He of pedestal
Between chuck main body 32, positioning pin 34 is located on chuck main body 32；
Positioning pin 34 includes the first positioning pin 341 for being stuck at wafer W edge and for being stuck at chip grooving N
Second positioning pin 342.
As the optional example of the application, preferably fixed to wafer W in order to realize, the first positioning pin 341 can be
Multiple, further, multiple first positioning pin 341 can be evenly distributed on chuck main body 31, and be in about chuck hub
Central symmetry reduces the risk of wafer W fragmentation in this way, can make the uniform force of wafer W.Moreover, this structure design,
The abrasion for being conducive to reduce the first positioning pin 341, improves the service life of the first positioning pin 341.
In order to make 342 more convenient ground fixed wafer W of the first positioning pin 341 and the second positioning pin more conveniently, make
For an example, the first positioning pin 341 and the second positioning pin 342 can its respectively where position rotate.
In addition, in order to be consolidated using the first positioning pin 341 and/or the realization of the second positioning pin 342 to wafer W more conveniently
Be set for using, as another example, the specific structure of the first positioning pin 341 and/or the second positioning pin 342 can with as shown in figure 5, its
Determine including location key seat 51, the positioning pin column being connected on location key seat 51 52 and from what the top of positioning pin column 52 was extended
Position block 53, wherein positioning pin column 52 is upwardly extended from the center of location key seat, and locating piece 53 deviates the center of positioning pin column 52.
It is to be appreciated that in the embodiment of the present application, the first positioning pin 51 and the second positioning pin 52 can be using shown in Fig. 5
Structure, can also one of them use structure shown in fig. 5.
In this way, positioning pin 34 is turned to locating piece 53 far from card in advance before wafer W is placed on chuck 300
The position of disk center, hereafter, control positioning pin 34 stop operating, in this way, just having biggish space between positioning pin 34
Wafer W is accommodated, so that wafer W is relatively easily placed on chuck 300.After wafer W is placed on chuck 300, control
Positioning pin 34 processed rotates, and the locating piece 53 on the first positioning pin 341 is made to turn to the position at contact wafer W edge, and second is fixed
Locating piece 53 on the pin 342 of position turns at the position of contact wafer W grooving.In this way, fixed by the first positioning pin 341 and second
Wafer W can be securely fixed on chuck 300 by position pin 342.Even if in 300 high speed rotation of chuck, because of the second positioning
Pin 342 will not generate relative motion to the fixed function of wafer W between wafer W and chuck.Because between wafer W and chuck 300
Relative motion will not occur, therefore, wafer W can also reduce the abrasion of the first positioning pin 341, thereby reduce wafer W fragmentation
Risk.Moreover, because between chuck 300 and wafer W without relative motion, when the one chip cleaning machine is used wet-etching technology mistake
It is not in the possibility for causing etch rate to get higher because of the relative motion between wafer W and chuck 300 when in journey, thus, benefit
Etch amount during entire wet etching can accurately be controlled with the chuck of one chip cleaning machine provided by the present application, reduces
The risk of wafer scrap.
The above are the specific implementations of the chuck of the one chip cleaning machine of the offer of the embodiment of the present application one.In order to more square
Just the rotation for controlling positioning pin 34, present invention also provides another implementations of the chuck of one chip cleaning machine, specifically
Referring to embodiment two.
Embodiment two
It is to be appreciated that the chuck 600 for the one chip cleaning machine that embodiment two provides is the one chip provided in embodiment one
It is improved on the basis of the chuck 300 of cleaning machine.Therefore, have between embodiment two and embodiment one it is many it is similar it
Place, for the sake of brevity, is only described in detail its difference, similarity refers to the description of above-described embodiment one herein.
Fig. 6 is referred to, the chuck 600 for the one chip cleaning machine that the embodiment of the present application two provides is in addition to including above-described embodiment
Other than each structure of one chuck 300, can also include:
31 transmission device 61 on the chuck main body back side is provided with multiple gears 611 on the transmission device 61, often
A gear 611 is sleeved on the outside of each positioning pin 34, and transmission device 61 is able to drive each positioning pin by each gear 611
34 its respectively where position rotate.
As the optional example of the application, in order to drive positioning pin 34 to rotate more conveniently, which can
Think metal transmission device.
In addition, another optional example as the application, for the rotation of more convenient ground driving transmission device 61, the chuck
It can also include the motor (not shown) on pedestal 31 on 600, in this way, motor can drive chuck by bearing 33
Main body 31 and transmission device 61 rotate.It is to be appreciated that chuck main body 31 and transmission device 61 are timesharing rotation, that is to say, that two
Person cannot rotate simultaneously.More specifically, transmission device 61 rotates before placing chip, and chuck main body 31 is placed in chip
After on to chuck, chip is rotated in the process of processing.
The above are the specific implementations of the chuck of the one chip cleaning machine of the offer of the embodiment of the present application two, in the specific reality
In existing mode, other than with beneficial effect described in embodiment one, the embodiment two can also by transmission device 61 and its
Each gear 611 facilitate control positioning pin 34 rotation.In this way, driving passes in advance before chip is placed on chuck 600
Dynamic device 61 and each gear 611 thereon rotate, and the rotation of each gear 611 is able to drive each positioning pin being in contact with it
34 rotation, so that the locating piece on each positioning pin 34 is turned to the position far from 600 center of chuck, in this way, positioning
Biggish space is had between pin 34 just to accommodate wafer W, so that wafer W is relatively easily placed on chuck 600.To
After wafer W is placed on chuck 600, control positioning pin 34 is rotated, and the locating piece 53 on the first positioning pin 341 is made to turn to contact
Position at wafer W edge, the locating piece 53 on the second positioning pin 342 turn at the position of contact wafer W grooving.In this way,
Wafer W can be securely fixed on chuck 600 by the first positioning pin 341 and the second positioning pin 342.
In addition, control positioning pin 34 is inverted to and chip in order to control after chip is placed on chuck more conveniently
The position at edge and the contact of chip grooving, another the embodiment of the present application also provides the chuck of one chip cleaning machine are specific real
Existing mode.Referring specifically to embodiment three.
Embodiment three
It is to be appreciated that the chuck for the one chip cleaning machine that embodiment three provides is the one chip cleaning provided in embodiment two
It is improved on the basis of the chuck of machine.Therefore, there are many similarities between embodiment three and embodiment two, in order to
For the sake of briefly, its difference is only described in detail herein, similarity refers to the description of above-described embodiment two.
Fig. 7 is referred to, the chuck 700 for the one chip cleaning machine that the embodiment of the present application three provides is in addition to including two institute of embodiment
Outside each structure for the chuck 600 stated, can also include:
At least one spring 71 being connected on transmission device 61, the deformation direction of spring 71 and the radial direction side of chuck 300
There are angles between.
In this way, the rotation of transmission device 61 will lead to the generation of spring 71 thereon before chip is placed on chuck 700
Certain elastic deformation, spring have certain elastic potential energy.After chip is placed on chuck 700, what spring 71 generated
Elastic potential energy will drive the reversion of transmission device 61, to be further driven to the overturning of positioning pin 34, and then make on positioning pin 34
Locating piece 343 turns to the position contacted with Waffer edge or chip grooving, to realize that positioning pin 34 makees the fixed of chip
With.
Transmission is connected to as the alternative embodiment of the application in order to improve the energy for driving transmission device 61 to invert
Spring 71 on device 61 can be multiple, and in order to enable the velocity of rotation of each positioning pin 34 is suitable, multiple spring
71 are evenly distributed on chuck 700, and further the, and multiple spring 71 can be in center pair about the pedestal 33 of chuck 71
Claim distribution.
In addition, another alternative embodiment as the application, in order to make the kinetic energy in 61 rotation process of transmission device
It can be converted to the elastic potential energy of spring 71 in maximum efficiency, between the deformation direction of the spring and the radial direction of the chuck
Angle can be 90 degree.
The above are three embodiments of the chuck of one chip cleaning machine provided by the embodiments of the present application, in three embodiments
In, it can be combined with each other between each implementation, and the scheme after combination is also in the column of the protection scope of the application.
The chuck of the one chip cleaning machine provided based on the above embodiment, the embodiment of the present application also provides one chip cleanings
The specific implementation of machine.
The one chip cleaning machine includes board and the chuck on board, which can be any of the above-described specific implementation
The chuck that mode provides.
As an example, in order to enable the chip grooving for the chip being placed on chuck can be relatively rapid fixed with second
Position pin is aligned, and the alignment dress of chip grooving is also provided on the board of one chip cleaning machine provided by the embodiments of the present application
It sets, the alignment device of the chip grooving is used for so that chip is when being placed on chuck, being capable of grooving alignment in faster wafer
The second positioning pin on chuck.
The above is only embodiments herein, are not intended to limit this application.It will be understood by those skilled in the art that this
Application can have various modifications and variations, and all any modifications made within the spirit and principles of the present application, change equivalent replacement
Into etc., it should be included within the scope of the claims of this application.
Claims (12)
1. a kind of chuck of one chip cleaning machine characterized by comprising pedestal, chuck main body, bearing and positioning pin；
Wherein, the chuck main body is mounted on the pedestal, the bearing holder (housing, cover) mounted in the pedestal and the chuck main body it
Between, the positioning pin is located on the chuck main body；
The positioning pin includes the first positioning pin and the second positioning pin；First positioning pin is for being stuck in wafer edge；Institute
The second positioning pin is stated for being stuck at chip grooving.
2. chuck according to claim 1, which is characterized in that first positioning pin be it is multiple, multiple described first is fixed
Position pin is evenly distributed on the chuck main body.
3. chuck according to claim 1, which is characterized in that the positioning pin include location key seat, be connected to it is described fixed
Positioning pin column on the key seat of position and the locating piece that extends from the top of the positioning pin column, it is described fixed that the locating piece deviates
The center of position pin.
4. chuck according to claim 3, which is characterized in that each positioning pin can its respectively where position
Rotation.
5. chuck according to claim 1-4, which is characterized in that the chuck further include: be located at the chuck
Transmission device on the main body back side is provided with multiple gears on the transmission device, and each gear set is in each positioning pin
Outside, the transmission device by the gear be able to drive each positioning pin its respectively where position rotate.
6. chuck according to claim 5, which is characterized in that the chuck further includes being connected on the transmission device
At least one spring, there are angles between the deformation direction of the spring and the radial direction of the chuck.
7. chuck according to claim 6, which is characterized in that the angle of the angle is 90 degree.
8. chuck according to claim 6, which is characterized in that the spring is multiple, and the spring is in the chuck
On distribution be centrosymmetric distribution about pedestal.
9. chuck according to claim 5, which is characterized in that the transmission device is metal transmission device.
10. chuck according to claim 5, which is characterized in that the chuck further include: the horse on the pedestal
It reaches, the motor can drive the chuck main body and the transmission device to rotate by the bearing.
11. a kind of one chip cleaning machine characterized by comprising board and the chuck on the board, the chuck are
The described in any item chucks of claim 1-10.
12. one chip cleaning machine according to claim 11, which is characterized in that be additionally provided with chip grooving on the board
Alignment device, the alignment device of the chip grooving is used for so that chip is when being placed on chuck, can be in faster wafer
Grooving be directed at the second positioning pin on the chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821164328.7U CN208336183U (en) | 2018-07-20 | 2018-07-20 | A kind of one chip cleaning machine and its chuck |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821164328.7U CN208336183U (en) | 2018-07-20 | 2018-07-20 | A kind of one chip cleaning machine and its chuck |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208336183U true CN208336183U (en) | 2019-01-04 |
Family
ID=64784340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821164328.7U Active CN208336183U (en) | 2018-07-20 | 2018-07-20 | A kind of one chip cleaning machine and its chuck |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208336183U (en) |
-
2018
- 2018-07-20 CN CN201821164328.7U patent/CN208336183U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6378437B2 (en) | Cylindrical parts polishing equipment, workpiece propulsion apparatus, and polishing method | |
| JP6352541B2 (en) | Double disc linear groove cylindrical part surface polishing disc | |
| CN101356017A (en) | Dust remover | |
| CN208575979U (en) | A kind of whole bamboo ring removal device of bamboo and wood processing | |
| CN108987330A (en) | A kind of one chip cleaning machine and its chuck | |
| CN110682199B (en) | Polishing mechanism capable of realizing reducing through plane thread expansion shaft | |
| CN103537981B (en) | A kind of superfine processing method of high accuracy circular cylindrical parts cylindrical | |
| CN106002587B (en) | Workpiece surface treatment equipment based on translation circular-rotation | |
| CN104108027A (en) | Cradle type turntable and five-axis linkage numerical-control machine tool with same | |
| CN107756168A (en) | A kind of vehicle GPS housing mounting holes burring mechanism | |
| CN106670938A (en) | Silicon wafer edge polishing device | |
| CN208336183U (en) | A kind of one chip cleaning machine and its chuck | |
| CN104786160A (en) | Gas-liquid-solid three-phase-flow based multi-process automatic polishing equipment | |
| CN207642907U (en) | A kind of disc-grinding mechanism being used for sanding and polishing and mirror finish lathe | |
| US6514127B2 (en) | Conditioner set for chemical-mechanical polishing station | |
| CN202150447U (en) | Wafer turning device | |
| CN208005349U (en) | A kind of rotating device of Domestic glass edge polisher | |
| JP6545311B1 (en) | Polishing machine | |
| CN216262401U (en) | Arranged megasonic cleaning device for cleaning wafers | |
| CN208019988U (en) | Self-cleaning semiconductor crystal wafer milling apparatus | |
| CN106002560A (en) | Efficient grinding machining device for rolling bodies used for bearings | |
| CN206998613U (en) | A kind of pivoted arm revolving structure of polishing machine | |
| CN205765519U (en) | A kind of translational surface processing device | |
| CN105458866B (en) | Multistation turn automatic clutch transmission device | |
| JP2015100865A (en) | Grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |