CN108983558A - A kind of interference exposure Simple Vertical chip bench - Google Patents
A kind of interference exposure Simple Vertical chip bench Download PDFInfo
- Publication number
- CN108983558A CN108983558A CN201810876389.4A CN201810876389A CN108983558A CN 108983558 A CN108983558 A CN 108983558A CN 201810876389 A CN201810876389 A CN 201810876389A CN 108983558 A CN108983558 A CN 108983558A
- Authority
- CN
- China
- Prior art keywords
- vacuum chuck
- degree
- mobile station
- pivot angle
- interference
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70408—Interferometric lithography; Holographic lithography; Self-imaging lithography, e.g. utilizing the Talbot effect
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Abstract
The invention belongs to multi-beam interference photoetching exposure technique fields, and in particular to a kind of interference exposure Simple Vertical chip bench.Its price is low, small in size, light-weight, combination free, can good fixation and adjustment control substrate completes to expose in multi-beam interference photoetching system.Technical solution of the present invention includes pedestal, and six degree of freedom combination mobile station is provided on the pedestal, is provided with vacuum chuck component in six degree of freedom combination mobile station.
Description
Technical field
The invention belongs to multi-beam interference photoetching exposure technique fields, and in particular to a kind of interference exposure Simple Vertical substrate
Platform.
Background technique
In multi-beam interference photoetching exposure experiments research process, need continually to adjust substrate to be exposed relative to multiple
The inclination angle and position of incident beam.In lithographic equipment currently on the market, there are many Special precision work stages, meet photoetching base
The precision of piece is mobile and positions, multiple functional, but its system construction is complicated, expensive, bulky.For multiple-beam interference
The technical characterstic of photoetching is not required to mask imaging, it is only necessary to be irradiated to multiple coherent beams simultaneously with certain incident orientation angle
On substrate surface to be exposed, using Energy distribution corresponding to interference figure, the photoresist of substrate surface is exposed.With biography
The photoetching technique of system is compared, and interference lithography system has longitudinal placement position spirit that exposure field range is big, substrate is in interference field
Advantage living.Therefore, unlike conventional lithography system, in multiple-beam interference exposure system, substrate surface with it is multiple enter
Angle between irradiating light beam is adjustable, and substrate surface can repeatedly be combined around itself normal big angle rotary with meeting multiple beam
The needs of exposure.In addition, be mostly that the horizontal mode put is different from substrate to be exposed in conventional lithography equipment, interference lithography system
In, it being laid out in the horizontal direction on platform for convenience of optical path, substrate to be exposed generally requires to erect placement, so that substrate surface
Normal and optical axis coincidence in the horizontal direction, facilitate light beam to project substrate surface in the horizontal direction.
Summary of the invention
In view of this, the present invention provides a kind of interference exposure Simple Vertical chip bench, price is low, it is small in size, light-weight,
Combination free, the good fixation of energy and adjustment control substrate complete exposure in multi-beam interference photoetching system.
In order to solve the problems existing in the prior art, the technical scheme is that a kind of interference exposes Simple Vertical substrate
Platform, it is characterised in that: including pedestal, six degree of freedom combination mobile station, six degree of freedom combination movement are provided on the pedestal
Vacuum chuck component is provided on platform.
The vacuum chuck component includes vacuum chuck and vacuum chuck connector；It opens on the surface of the vacuum chuck
There is groove, groove is penetrated through with the venthole for being located at sucker center；It is provided with venthole on vacuum chuck connector, and is inhaled with vacuum
Venthole on disk communicates, and the venthole on sucker connector is connected with vacuum pump；
The six degree of freedom combination mobile station is by lifting platform, two-dimension translational platform, pivot angle device one, pivot angle device two and turntable group
At the lifting platform, two-dimension translational platform, pivot angle device one, pivot angle device two and turntable are sequentially connected from top to bottom；The suction
Disk connector is set on lifting platform.
Compared with prior art, advantages of the present invention is as follows:
The configuration of the present invention is simple can replace previous complicated and expensive high-precision photo-etching machine work-piece platform, have the basic of work stage
Function meets interference lithography experiment needs, research cost and space is greatly saved；
Six degree of freedom combination mobile station in the present invention is built using existing market, standardized component, is had good
Interchangeability, build process is simple and fast, time saving and energy saving.
Detailed description of the invention
Fig. 1 is schematic structural view of the invention.
In figure: 1-vacuum chuck component, 2-six degree of freedoms combination mobile station, 3-vacuum chucks, 4-sucker connectors,
5-lifting platforms, 6-two-dimension translational platforms, 7-pivot angle devices one, 8-pivot angle devices two, 9-turntables, 10-pedestals.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
The principle of the present invention is: by two-dimension translational platform, turntable, the combination between pivot angle device forms six spatially
Freedom degree control assembly, the fixed substrate to be exposed in the way of vacuum suction, then vacuum is driven by six degree of freedom control assembly
Suction cup assembly controls the adjustment of position and angle of the substrate to be exposed in exposure field, substrate is enable accurately to adjust surface method
Line direction is directed at the irradiation that optical axis receives multiple beam, to form the exposure of interference image to substrate surface.
The present embodiment provides a kind of interference to expose Simple Vertical chip bench (referring to Fig. 1), including pedestal 10, the pedestal
It is provided with six degree of freedom combination mobile station 2 on 10, is provided with vacuum chuck component 1 in six degree of freedom combination mobile station 2；
The vacuum chuck component 1 includes vacuum chuck 3 and vacuum chuck connector 4；It opens on the surface of the vacuum chuck 3
There is groove, groove is penetrated through with the venthole for being located at sucker center；It is provided with venthole on 3 connector 4 of vacuum chuck, is inhaled with vacuum
Venthole on disk 3 communicates, and vacuum chuck 3 and vacuum chuck connector 4 are connected through a screw thread, and is provided on sucker connector 4
Gas nozzle, gas nozzle are connected by hose with vacuum pump, when chip bench works, the negative pressure formed using vacuum pump, by base to be exposed
Piece is absorbed and fixed at 3 surface of sucker.
The six degree of freedom combination mobile station 2 is by lifting platform 5, two-dimension translational platform 6, pivot angle device 1,28 and of pivot angle device
Turntable 9 form, the lifting platform 5, two-dimension translational platform 6, pivot angle device 1, pivot angle device 28 and turntable 9 from top to bottom according to
Secondary connection.
Sucker connector 4 is connected through a screw thread on the lifting platform 5 for being fixed on six degree of freedom combination mobile station 2, certainly by six
It drives vacuum chuck 3 to realize lifting, the two-dimension translational of horizontal direction by spending combination mobile station 2, tilt, along x-axis and y-axis around z-axis
Rotation function.
The same of existing market can be selected in lifting platform 5, two-dimension translational platform 6, pivot angle device 1, pivot angle device 28 and turntable 9
The ray machine part or functional unit of type, a combination thereof sequence or form can also be not limited to the present embodiment the mode provided, as long as can
It realizes lifting, the two-dimension translational of horizontal direction, tilt, along x-axis and y-axis around z-axis rotation function.
The foregoing is only a preferred embodiment of the present invention, is not intended to limit the scope of the present invention.
Claims (2)
1. a kind of interference exposes Simple Vertical chip bench, it is characterised in that: including pedestal (10), the pedestal is arranged on (10)
There is six degree of freedom to combine mobile station (2), is provided with vacuum chuck component (1) in six degree of freedom combination mobile station (2).
2. interference according to claim 1 exposes Simple Vertical chip bench, it is characterised in that:
The vacuum chuck component (1) includes vacuum chuck (3) and vacuum chuck connector (4)；The vacuum chuck (3)
Surface be provided with groove, groove is penetrated through with the venthole for being located at sucker center；Vacuum chuck connector is provided with ventilation on (4)
Hole, and communicated with the venthole on vacuum chuck, the venthole on sucker connector (4) is connected with vacuum pump；
Six degree of freedom combination mobile station (2) is by lifting platform (5), two-dimension translational platform (6), pivot angle device one (7), pivot angle device two
(8) it is formed with turntable (9), the lifting platform (5), two-dimension translational platform (6), pivot angle device one (7), pivot angle device two (8) and rotation
Turntable (9) is sequentially connected from top to bottom；The sucker connector (4) is set on lifting platform (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876389.4A CN108983558A (en) | 2018-08-03 | 2018-08-03 | A kind of interference exposure Simple Vertical chip bench |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810876389.4A CN108983558A (en) | 2018-08-03 | 2018-08-03 | A kind of interference exposure Simple Vertical chip bench |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108983558A true CN108983558A (en) | 2018-12-11 |
Family
ID=64554626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810876389.4A Pending CN108983558A (en) | 2018-08-03 | 2018-08-03 | A kind of interference exposure Simple Vertical chip bench |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108983558A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113666112A (en) * | 2021-08-19 | 2021-11-19 | 单原子微纳米科技(淮安)有限责任公司 | Automatic change two-dimensional material transfer device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020109823A1 (en) * | 2001-02-09 | 2002-08-15 | Nikon Corporation. | Wafer stage assembly |
| CN102681366A (en) * | 2012-05-28 | 2012-09-19 | 上海理工大学 | Exposure light path system in production of concave holographic grating and method for adjusting gyration center |
| CN104991426A (en) * | 2015-08-12 | 2015-10-21 | 西安工业大学 | Multi-beam interference photoetching auxiliary exposure device |
| CN107643656A (en) * | 2017-10-25 | 2018-01-30 | 中国科学院光电技术研究所 | A kind of double laser beams interference lithography system |
| CN207541290U (en) * | 2018-02-05 | 2018-06-26 | 湖北光安伦科技有限公司 | A kind of preparing grating device |
-
2018
- 2018-08-03 CN CN201810876389.4A patent/CN108983558A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020109823A1 (en) * | 2001-02-09 | 2002-08-15 | Nikon Corporation. | Wafer stage assembly |
| CN102681366A (en) * | 2012-05-28 | 2012-09-19 | 上海理工大学 | Exposure light path system in production of concave holographic grating and method for adjusting gyration center |
| CN104991426A (en) * | 2015-08-12 | 2015-10-21 | 西安工业大学 | Multi-beam interference photoetching auxiliary exposure device |
| CN107643656A (en) * | 2017-10-25 | 2018-01-30 | 中国科学院光电技术研究所 | A kind of double laser beams interference lithography system |
| CN207541290U (en) * | 2018-02-05 | 2018-06-26 | 湖北光安伦科技有限公司 | A kind of preparing grating device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113666112A (en) * | 2021-08-19 | 2021-11-19 | 单原子微纳米科技(淮安)有限责任公司 | Automatic change two-dimensional material transfer device |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20181211 |