CN108977105A - 一种导热硅胶片的制备方法 - Google Patents
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Abstract
本发明涉及导热电子材料制备技术领域,具体涉及一种导热硅胶片的制备方法。本发明以乙烯‑醋酸乙烯酯共聚物、导热石墨片、EPS泡沫颗粒、乙烯基酯树脂作为原料制备发泡片材,将乙烯‑醋酸乙烯酯共聚物、玻璃纤维、膨胀石墨粉等混合加热得到玻纤树脂,将其涂覆于发泡片材表面热压硫化得到导热硅胶片,环氧大豆油中的极性基团与活泼性基团使丙烯酸酯基体树脂表现出优良的粘接强度、电绝缘性能和耐高温性能,EPS泡沫颗粒的苯环结构赋予基体树脂耐热性和刚性,达到高温下粘度不会降低的效果,通过偶联作用提高石墨片与乙烯‑醋酸乙烯酯共聚物的相容性,通过膨胀舒张的导热石墨片,使硅胶片的导热面积提高,具有广阔的应用前景。
Description
技术领域
本发明涉及导热电子材料制备技术领域,具体涉及一种导热硅胶片的制备方法。
背景技术
导热硅胶片是以硅胶为基材,添加金属氧化物等各种辅材,通过特殊工艺合成的一种导热介质材料。在行业内,又称为导热硅胶垫、软性导热垫等,是专门为利用缝隙传递热量的设计方案生产,能够填充缝隙,完成发热部位与散热部位间的热传递,同时还起到绝缘、减震、密封等作用,能够满足设备小型化及超薄化的设计要求,是极具工艺性和使用性,且厚度适用范围广,是一种极佳的导热填充材料。
目前市场上传统的导热硅胶片一般由硅油、导热粉体及其它一些添加些调配而成。其导热效果依靠配方中的导热粉体,该导热粉体一般是氧化铝、氮化铝之类。根据使用条件和产品形式不同,导热硅胶可分为单组分室温固化的硅胶和双组分硅胶,双组分硅胶包括加成型和缩合型两类。其中,加成型导热硅胶由于在固化过程中不产生副产物,更具有优势。
目前,现有技术中的导热硅胶片往往存在以下缺陷:(1)导热系数低,一般不超过1.5W/m·k,主要原因是受到导热填料的接触密度和导热系数的影响;(2)流动性差,由于加入了较大比例的填料,使体系粘度大幅增高,导致流动性变差;(3)耐热性低,一般不能在高于150℃下长时间工作,主要原因是硅油的耐热性不够,以及与填料的兼容性不好;(4)抗拉伸性差且耐电压性能低,在使用过程中由于抗拉伸性较差会很容易出现撕裂的情况;(5)热膨胀系数较大,会对电子元件的组成部分造成较大压力,导致元件变形、损坏;(6)固化速度慢,需要在较高的温度下较长时间加热固化,且在材料固化过程中需要添加硫化剂,容易对环境造成严重的污染,不利于环境保护和人体健康等问题。
因此,研究开发出一种能够获得较高流动性、导热率和耐热性的导热硅胶片及其制备方法具有重要意义。
发明内容
本发明主要解决的技术问题,针对目前导热硅胶片由于导热填料的接触密度和导热系数较低,导致整个导热硅胶片的导热性能较差,导热硅胶片在电路元件的长期高温工作条件下,容易老化热解导致其粘性下降的缺陷,提供了一种导热硅胶片的制备方法。
为了解决上述技术问题,本发明所采用的技术方案是:
一种导热硅胶片的制备方法,其特征在于具体制备步骤为:
(1)取30~35g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块铂金属板作为阴极,将高氯酸和冰醋酸混合,得到电解液,向烧杯中加入200~300mL电解液,启动电源,电解反应,得到膨胀石墨酸液;
(2)向膨胀石墨酸液中加入氢氧化钠溶液,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤20~25min,将抽滤得到的滤渣置于烘箱中,加热升温,干燥,得到导热石墨片;
(3)按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入50~60份蒸馏水、10~15份十二烷基磺酸钠、4~5份碳酸氢钠,启动搅拌器搅拌,水浴升温,将40~45份丙烯酸、20~30份甲基丙烯酸加入四口烧瓶后,继续反应,得到预聚乳液;
(4)按重量份数计,向上述四口烧瓶中加入20~30份环氧大豆油,再用滴液漏斗向四口烧瓶中滴加1~3份过硫酸钾,滴加完毕后,保温反应,继续加热升温,保温反应,降温,用氨水调节pH,出料,得到丙烯酸酯基体树脂;
(5)按重量份数计,称取60~70份乙烯-醋酸乙烯酯共聚物、20~25份导热石墨片、10~15份EPS泡沫颗粒、8~10份乙烯基酯树脂放入反应釜中,加热升温,混炼,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到发泡片材;
(6)按重量份数计,称取20~30份乙烯-醋酸乙烯酯共聚物、40~50份玻璃纤维、10~15份膨胀石墨粉、8~10份乙烯基酯树脂放入反应釜中,加热升温,混炼,冷却至室温后得到玻纤树脂,将丙烯酸酯基体树脂、玻纤树脂混合,预热,得到热熔物,将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温,加压,保温保压,自然冷却至室温后取出热压硫化片即得导热硅胶片。
步骤(1)所述的高氯酸质量分数为75%,冰醋酸质量分数为98%,高氯酸与冰醋酸混合体积比为4︰1,控制烧杯内电解液温度为20~22℃,电解反应的电流强度为0.3~0.5A,电解时间为40~45min。
步骤(2)所述的氢氧化钠溶液的质量分数为40%,加入氢氧化钠溶液直至膨胀石墨酸液的pH为6.8~7.0,烘箱加热升温温度为80~90℃,干燥时间为2~3h。
步骤(3)所述的搅拌转速为200~220r/min,水浴升温温度为70~80℃,继续反应时间为10~15min,得到预聚乳液。
步骤(4)所述的滴液漏斗的滴加速率为3~5mL/min,保温反应时间为30~40min,继续加热升温温度为90~100℃,保温反应时间为45~55min,降温后温度为55~60℃,氨水质量分数为20%,用氨水调节pH为6.0~7.0。
步骤(5)所述的加热升温后温度为230~250℃,混炼时间为3~5h,发泡片材厚度为0.3~0.5mm。
步骤(6)所述的加热升温温度为230~250℃,混炼时间为3~5h,丙烯酸酯基体树脂、玻纤树脂混合质量比为1︰5,预热后温度为100~120℃,热熔物涂覆量为4~5g/cm2,加热升温温度为200~220℃,加压压力为15~20MPa,保温保压时间为2~3h。
本发明的有益效果是:
(1)本发明中通过环氧大豆油与丙烯酸酯发生羟基缩合脱水反应从而形成网络互穿交联结构,生成具有粘弹性的丙烯酸酯,以乙烯-醋酸乙烯酯共聚物、导热石墨片、EPS泡沫颗粒、乙烯基酯树脂作为原料制备发泡片材,将乙烯-醋酸乙烯酯共聚物、玻璃纤维、膨胀石墨粉和乙烯基酯树脂混合加热反应得到玻纤树脂,以玻纤树脂作为基体树脂涂覆于发泡片材表面,热压硫化,得到导热硅胶片,本发明中将环氧大豆油作为改性原料放入丙烯酸酯的聚合乳液中,由于环氧大豆油中含有环氧基团、醚键、羟基等极性基团与活泼性基团,使丙烯酸酯基体树脂表现出优良的粘接强度、电绝缘性能和耐高温性能,使用的EPS泡沫颗粒不仅具有发泡效果,它的苯环结构还赋予基体树脂耐热性和刚性,环氧基和羟基使材料具有反应活性粘附力,同时在加热反应过程中多个羟基的脱水缩合使交联密度上升,在电路板工作时的高温条件下,基体树脂因高交联密度难以热解,基体树脂中有效粘附成分的浓度变化微小,保持了较强的粘附力,达到高温下粘度不会降低的效果;
(2)本发明中泡沫片材的主要成分是乙烯-醋酸乙烯酯共聚物,通过乙烯基酯树脂的偶联作用将导热石墨片与乙烯-醋酸乙烯酯共聚物的相容性提高,使导热石墨片与树脂基体能够紧密接触,在高温时导热石墨片通过树脂基体中膨胀石墨粉形成导热网络,加快硅胶片的导热效率,本发明利用EPS泡沫颗粒对共聚物进行发泡,得到疏松多孔的树脂泡棉,树脂泡绵中的导热石墨片在高温中膨胀粘附在微孔内表面,通过膨胀舒张的导热石墨片,使硅胶片的导热面积提高,使热量通过微孔快速散热,电路板中原件温度不会升至过高而烧坏,并且达到提高导热硅胶片导热性能的目的,具有广阔的应用前景。
具体实施方式
取30~35g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块铂金属板作为阴极,将质量分数为75%的高氯酸和质量分数为98%冰醋酸按体积比4︰1混合,得到电解液,向烧杯中加入200~300mL电解液,控制烧杯内电解液温度为20~22℃,启动电源,以电流强度为0.3~0.5A进行电解反应,电解40~45min后,得到膨胀石墨酸液;向膨胀石墨酸液中加入质量分数为40%的氢氧化钠溶液,直至膨胀石墨酸液的pH为6.8~7.0,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤20~25min,将抽滤得到的滤渣置于烘箱中,加热升温至80~90℃,干燥2~3h,得到导热石墨片;按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入50~60份蒸馏水、10~15份十二烷基磺酸钠、4~5份碳酸氢钠,启动搅拌器以200~220r/min的转速搅拌,水浴升温至70~80℃,将40~45份丙烯酸、20~30份甲基丙烯酸加入四口烧瓶后,继续反应10~15min,得到预聚乳液;按重量份数计,向上述四口烧瓶中加入20~30份环氧大豆油,再用滴液漏斗向四口烧瓶中以3~5mL/min的滴加速率滴加1~3份过硫酸钾,滴加完毕后,保温反应30~40min,继续加热升温至90~100℃,保温反应45~55min,降温至55~60℃,用质量分数为20%的氨水调节pH为6.0~7.0,出料,得到丙烯酸酯基体树脂;按重量份数计,称取60~70份乙烯-醋酸乙烯酯共聚物、20~25份导热石墨片、10~15份EPS泡沫颗粒、8~10份乙烯基酯树脂放入反应釜中,加热升温至230~250℃,混炼3~5h,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到厚度为0.3~0.5mm的发泡片材;按重量份数计,称取20~30份乙烯-醋酸乙烯酯共聚物、40~50份玻璃纤维、10~15份膨胀石墨粉、8~10份乙烯基酯树脂放入反应釜中,加热升温至230~250℃,混炼3~5h,冷却至室温后得到玻纤树脂,按质量比为1︰5将丙烯酸酯基体树脂、玻纤树脂混合,预热至100~120℃,得到热熔物,按涂覆量为4~5g/cm2将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温至200~220℃,加压至15~20MPa,保温保压2~3h,自然冷却至室温后取出热压硫化片即得导热硅胶片。
取30g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块钛金属板作为阴极,将质量分数为75%的高氯酸和质量分数为98%冰醋酸按体积比4︰1混合,得到电解液,向烧杯中加入200mL电解液,控制烧杯内电解液温度为20℃,启动电源,以电流强度为0.3A进行电解反应,电解40min后,得到膨胀石墨酸液;向膨胀石墨酸液中加入质量分数为40%的氢氧化钠溶液,直至膨胀石墨酸液的pH为6.8,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤20min,将抽滤得到的滤渣置于烘箱中,加热升温至80℃,干燥2h,得到导热石墨片;按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入50份蒸馏水、10份十二烷基磺酸钠、4份碳酸氢钠,启动搅拌器以200r/min的转速搅拌,水浴升温至70℃,将40份丙烯酸、20份甲基丙烯酸加入四口烧瓶后,继续反应10min,得到预聚乳液;按重量份数计,向上述四口烧瓶中加入20份环氧大豆油,再用滴液漏斗向四口烧瓶中以3mL/min的滴加速率滴加1份过硫酸钾,滴加完毕后,保温反应30min,继续加热升温至90℃,保温反应45min,降温至55℃,用质量分数为20%的氨水调节pH为6.0,出料,得到丙烯酸酯基体树脂;按重量份数计,称取60份乙烯-醋酸乙烯酯共聚物、20份导热石墨片、10份EPS泡沫颗粒、8份乙烯基酯树脂放入反应釜中,加热升温至230℃,混炼3h,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到厚度为0.3mm的发泡片材;按重量份数计,称取20份乙烯-醋酸乙烯酯共聚物、40份玻璃纤维、10份膨胀石墨粉、8份乙烯基酯树脂放入反应釜中,加热升温至230℃,混炼3h,冷却至室温后得到玻纤树脂,按质量比为1︰5将丙烯酸酯基体树脂、玻纤树脂混合,预热至100℃,得到热熔物,按涂覆量为4g/cm2将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温至200℃,加压至15MPa,保温保压2h,自然冷却至室温后取出热压硫化片即得导热硅胶片。
取33g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块钛金属板作为阴极,将质量分数为75%的高氯酸和质量分数为98%冰醋酸按体积比4︰1混合,得到电解液,向烧杯中加入250mL电解液,控制烧杯内电解液温度为21℃,启动电源,以电流强度为0.4A进行电解反应,电解43min后,得到膨胀石墨酸液;向膨胀石墨酸液中加入质量分数为40%的氢氧化钠溶液,直至膨胀石墨酸液的pH为6.9,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤23min,将抽滤得到的滤渣置于烘箱中,加热升温至85℃,干燥2h,得到导热石墨片;按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入55份蒸馏水、13份十二烷基磺酸钠、4份碳酸氢钠,启动搅拌器以210r/min的转速搅拌,水浴升温至75℃,将43份丙烯酸、25份甲基丙烯酸加入四口烧瓶后,继续反应13min,得到预聚乳液;按重量份数计,向上述四口烧瓶中加入25份环氧大豆油,再用滴液漏斗向四口烧瓶中以4mL/min的滴加速率滴加2份过硫酸钾,滴加完毕后,保温反应35min,继续加热升温至95℃,保温反应50min,降温至57℃,用质量分数为20%的氨水调节pH为6.5,出料,得到丙烯酸酯基体树脂;按重量份数计,称取65份乙烯-醋酸乙烯酯共聚物、23份导热石墨片、13份EPS泡沫颗粒、9份乙烯基酯树脂放入反应釜中,加热升温至240℃,混炼4h,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到厚度为0.4mm的发泡片材;按重量份数计,称取25份乙烯-醋酸乙烯酯共聚物、45份玻璃纤维、13份膨胀石墨粉、9份乙烯基酯树脂放入反应釜中,加热升温至240℃,混炼4h,冷却至室温后得到玻纤树脂,按质量比为1︰5将丙烯酸酯基体树脂、玻纤树脂混合,预热至110℃,得到热熔物,按涂覆量为4g/cm2将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温至210℃,加压至17MPa,保温保压2h,自然冷却至室温后取出热压硫化片即得导热硅胶片。
取35g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块钛金属板作为阴极,将质量分数为75%的高氯酸和质量分数为98%冰醋酸按体积比4︰1混合,得到电解液,向烧杯中加入300mL电解液,控制烧杯内电解液温度为20~22℃,启动电源,以电流强度为0.5A进行电解反应,电解45min后,得到膨胀石墨酸液;向膨胀石墨酸液中加入质量分数为40%的氢氧化钠溶液,直至膨胀石墨酸液的pH为7.0,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤25min,将抽滤得到的滤渣置于烘箱中,加热升温至90℃,干燥3h,得到导热石墨片;按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入60份蒸馏水、15份十二烷基磺酸钠、5份碳酸氢钠,启动搅拌器以220r/min的转速搅拌,水浴升温至80℃,将45份丙烯酸、30份甲基丙烯酸加入四口烧瓶后,继续反应15min,得到预聚乳液;按重量份数计,向上述四口烧瓶中加入30份环氧大豆油,再用滴液漏斗向四口烧瓶中以3~5mL/min的滴加速率滴加3份过硫酸钾,滴加完毕后,保温反应40min,继续加热升温至100℃,保温反应55min,降温至60℃,用质量分数为20%的氨水调节pH为7.0,出料,得到丙烯酸酯基体树脂;按重量份数计,称取70份乙烯-醋酸乙烯酯共聚物、25份导热石墨片、15份EPS泡沫颗粒、10份乙烯基酯树脂放入反应釜中,加热升温至250℃,混炼5h,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到厚度为0.5mm的发泡片材;按重量份数计,称取30份乙烯-醋酸乙烯酯共聚物、50份玻璃纤维、15份膨胀石墨粉、10份乙烯基酯树脂放入反应釜中,加热升温至230~250℃,混炼3~5h,冷却至室温后得到玻纤树脂,按质量比为1︰5将丙烯酸酯基体树脂、玻纤树脂混合,预热至120℃,得到热熔物,按涂覆量为5g/cm2将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温至220℃,加压至20MPa,保温保压3h,自然冷却至室温后取出热压硫化片即得导热硅胶片。
对比例以上海市某公司生产的导热硅胶片作为对比例 对本发明制得的导热硅胶片和对比例中的导热硅胶片进行检测,检测结果如表1所示:
拉伸强度和断裂伸长率测定
按照ASTMD882中规定的方法进行测试。
导热性能测定根据标准ASTMD5470,使用导热测试仪对本发明制得的导热硅胶片和对比例中的导热硅胶片的导热系数进行测试。
硬度测定使用硬度计对本发明制得的导热硅胶片和对比例中的导热硅胶片进行硬度测定。
击穿电压测定按照ASTMD149中规定的方法,分别对本发明制得的导热硅胶片和对比例中的导热硅胶片的击穿电压进行测定。
表1性能测定结果
根据表1中数据可知,本发明制得的导热硅胶片,具有良好的机械性能,硬度适中,耐热性能好,且在高温工作环境下,流动性较好,具有广阔的使用前景。
Claims (7)
1.一种导热硅胶片的制备方法,其特征在于具体制备步骤为:
(1)取30~35g天然鳞片石墨,放入网袋中,在网袋内放置一块钛金属板作为阳极,将网袋置于烧杯中,烧杯内放入一块铂金属板作为阴极,将高氯酸和冰醋酸混合,得到电解液,向烧杯中加入200~300mL电解液,启动电源,电解反应,得到膨胀石墨酸液;
(2)向膨胀石墨酸液中加入氢氧化钠溶液,得到中和的膨胀石墨悬浮液,将膨胀石墨悬浮液放入布氏漏斗中,水洗,减压抽滤20~25min,将抽滤得到的滤渣置于烘箱中,加热升温,干燥,得到导热石墨片;
(3)按重量份数计,向带有搅拌器、回流冷凝管、温度计、滴液漏斗的四口烧瓶中加入50~60份蒸馏水、10~15份十二烷基磺酸钠、4~5份碳酸氢钠,启动搅拌器搅拌,水浴升温,将40~45份丙烯酸、20~30份甲基丙烯酸加入四口烧瓶后,继续反应,得到预聚乳液;
(4)按重量份数计,向上述四口烧瓶中加入20~30份环氧大豆油,再用滴液漏斗向四口烧瓶中滴加1~3份过硫酸钾,滴加完毕后,保温反应,继续加热升温,保温反应,降温,用氨水调节pH,出料,得到丙烯酸酯基体树脂;
(5)按重量份数计,称取60~70份乙烯-醋酸乙烯酯共聚物、20~25份导热石墨片、10~15份EPS泡沫颗粒、8~10份乙烯基酯树脂放入反应釜中,加热升温,混炼,得到泡沫材料,将泡沫材料置于片材成型机中压制切割成片,得到发泡片材;
(6)按重量份数计,称取20~30份乙烯-醋酸乙烯酯共聚物、40~50份玻璃纤维、10~15份膨胀石墨粉、8~10份乙烯基酯树脂放入反应釜中,加热升温,混炼,冷却至室温后得到玻纤树脂,将丙烯酸酯基体树脂、玻纤树脂混合,预热,得到热熔物,将热熔物涂覆于发泡片材表面,置于热压硫化机中,加热升温,加压,保温保压,自然冷却至室温后取出热压硫化片即得导热硅胶片。
2.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(1)所述的高氯酸质量分数为75%,冰醋酸质量分数为98%,高氯酸与冰醋酸混合体积比为4︰1,控制烧杯内电解液温度为20~22℃,电解反应的电流强度为0.3~0.5A,电解时间为40~45min。
3.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(2)所述的氢氧化钠溶液的质量分数为40%,加入氢氧化钠溶液直至膨胀石墨酸液的pH为6.8~7.0,烘箱加热升温温度为80~90℃,干燥时间为2~3h。
4.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(3)所述的搅拌转速为200~220r/min,水浴升温温度为70~80℃,继续反应时间为10~15min,得到预聚乳液。
5.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(4)所述的滴液漏斗的滴加速率为3~5mL/min,保温反应时间为30~40min,继续加热升温温度为90~100℃,保温反应时间为45~55min,降温后温度为55~60℃,氨水质量分数为20%,用氨水调节pH为6.0~7.0。
6.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(5)所述的加热升温后温度为230~250℃,混炼时间为3~5h,发泡片材厚度为0.3~0.5mm。
7.根据权利要求1所述的一种导热硅胶片的制备方法,其特征在于:步骤(6)所述的加热升温温度为230~250℃,混炼时间为3~5h,丙烯酸酯基体树脂、玻纤树脂混合质量比为1︰5,预热后温度为100~120℃,热熔物涂覆量为4~5g/cm2,加热升温温度为200~220℃,加压压力为15~20MPa,保温保压时间为2~3h。
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111117576A (zh) * | 2019-12-30 | 2020-05-08 | 江智秦 | 一种硅胶垫的制备方法 |
CN111690333A (zh) * | 2020-06-11 | 2020-09-22 | 东莞市兆科电子材料科技有限公司 | 一种导热垫片及其制备方法和应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006137860A (ja) * | 2004-11-12 | 2006-06-01 | Hitachi Chem Co Ltd | 熱伝導シート |
CN102994010A (zh) * | 2012-12-07 | 2013-03-27 | 天威新能源控股有限公司 | 一种eva热熔胶封装材料及其制备方法 |
CN103509219A (zh) * | 2012-06-15 | 2014-01-15 | 辽宁辽杰科技有限公司 | 一种导热热塑性树脂复合材料及其制备方法 |
CN104017369A (zh) * | 2014-06-18 | 2014-09-03 | 中国科学院宁波材料技术与工程研究所 | 一种具有高拉伸强度的硅橡胶泡沫材料的制备方法 |
CN104842618A (zh) * | 2015-04-28 | 2015-08-19 | 杭州祥和实业有限公司 | 一种用于旅行的保温隔层材料及其制备方法 |
CN107603505A (zh) * | 2017-10-17 | 2018-01-19 | 陈合华 | 一种耐高温导热泡棉胶的制备方法 |
-
2018
- 2018-07-11 CN CN201810758203.5A patent/CN108977105A/zh not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006137860A (ja) * | 2004-11-12 | 2006-06-01 | Hitachi Chem Co Ltd | 熱伝導シート |
CN103509219A (zh) * | 2012-06-15 | 2014-01-15 | 辽宁辽杰科技有限公司 | 一种导热热塑性树脂复合材料及其制备方法 |
CN102994010A (zh) * | 2012-12-07 | 2013-03-27 | 天威新能源控股有限公司 | 一种eva热熔胶封装材料及其制备方法 |
CN104017369A (zh) * | 2014-06-18 | 2014-09-03 | 中国科学院宁波材料技术与工程研究所 | 一种具有高拉伸强度的硅橡胶泡沫材料的制备方法 |
CN104842618A (zh) * | 2015-04-28 | 2015-08-19 | 杭州祥和实业有限公司 | 一种用于旅行的保温隔层材料及其制备方法 |
CN107603505A (zh) * | 2017-10-17 | 2018-01-19 | 陈合华 | 一种耐高温导热泡棉胶的制备方法 |
Non-Patent Citations (4)
Title |
---|
房海明: "《LED照明设计与案例精选》", 30 April 2012, 北京航空航天大学出版社 * |
王顺亭,杨学忠等: "《树脂基复合材料 材料选择 模具制作 工艺设计》", 30 June 1997, 北京:中国建材工业出版社 * |
赵庆芳等: "热固化反应型热熔胶的应用研究", 《中国胶粘剂》 * |
郑水林: "《非金属矿加工技术与应用手册》", 31 May 2005, 冶金工业出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111117576A (zh) * | 2019-12-30 | 2020-05-08 | 江智秦 | 一种硅胶垫的制备方法 |
CN111690333A (zh) * | 2020-06-11 | 2020-09-22 | 东莞市兆科电子材料科技有限公司 | 一种导热垫片及其制备方法和应用 |
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