CN108966481A - A kind of printed circuit board shielding wall construction and its implementation method - Google Patents
A kind of printed circuit board shielding wall construction and its implementation method Download PDFInfo
- Publication number
- CN108966481A CN108966481A CN201810658263.XA CN201810658263A CN108966481A CN 108966481 A CN108966481 A CN 108966481A CN 201810658263 A CN201810658263 A CN 201810658263A CN 108966481 A CN108966481 A CN 108966481A
- Authority
- CN
- China
- Prior art keywords
- wall construction
- circuit board
- printed circuit
- divider wall
- shields
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0707—Shielding
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention provides a kind of printed circuit board shielding wall construction and its implementation methods, and divider wall is arranged around separate cabling circuit structure；The divider wall is the metal divider wall that continued circling is mutually connected in one week, is arranged in the dielectric substrate of wired circuit, and ground plane is connected；It on the substrate of wired circuit, is slotted to the position for needing to be arranged divider wall using laser, realizes the production of " the micro- blind slot structure of annular "；After the completion of fluting, the slot opened up is cleaned, goes to stain, is activated, heavy copper and flash Copper treatment；Then filling perforation plating is carried out；Wherein, described " the micro- blind slot structure of annular ", is continuous conductive metal using its bottom, realizes the function of divider wall internal structure and the external circuit board physical connection.Compared with prior art, existing solid matter metallization VIA, edge cladding metal foil, deficiency existing for interior metal divider wall technology are solved, good in plate of microwave, millimetre-wave circuit is realized and shields and be isolated.
Description
Technical field
The present invention relates to a kind of printed circuit board shielding wall construction and its implementation methods, are related to printed circuit board electromagnetic interference
Shielding field.
Background technique
As the working frequency of electronic equipment is higher and higher, miniaturization, densification development trend are more and more obvious, and are collected
Constantly reduce at the characteristic size of circuit, surface mount device is increasingly miniaturized, and the integrated level of PCB is continuously improved, this makes device
Interference between part is more serious, and device becomes more sensitive for electromagnetic interference.In microwave, millimetre-wave circuit design field, screen
It covers certain circuits on PCB and has become a necessary measure.Plate grade PCB is as in system encapsulation most basic, most important one
A link implements electromagnetic shielding performance at this moment, and cost can minimize, and increased weight is the smallest.
In microwave, millimetre-wave circuit design and manufacture, metallization VIA, the circuit wafer edge cladding of solid matter are generallyd use
Metal foil two ways realizes the shielding and isolation of circuit in circuit board.All there is certain limitations for both modes.
Using the metallization VIA of solid matter, between each through-hole must there are certain gaps, thus cannot completely shield microwaves, millimeter wave
Signal；It coats metal foil usually only to carry out in board edge, effective shielding can integrally be played to circuit board, and for each in plate
Shielding and interference between circuit, then be difficult to prove effective.
Using closed isolation wall construction, circuit each in circuit board is kept apart, theoretically realizes that electromagnetic shielding is best
Method.105208844 A of Chinese patent CN discloses a kind of method of shielding pcb board high speed signal interference, by pcb board
The metallic shield wall of addition perforation together, has conducting wire with high radiation energy, component to high speed signal on card to weaken
Interference.Such method can play effective shielding to the interference circuit in plate, but still Shortcomings.Firstly, the shielding of this method
Wall construction is made of " through-hole of perforation ", and the through-hole of perforation cannot be that continued circling connects, otherwise cannot achieve every
From being physically connected to for external structure within the walls.Such discontinuous shielding wall construction, theoretically can not achieve the full-shield of signal；The
Two, filling is made by the way of electrocondution slurry, since the size of through hole is usually larger, must be greater than 0.2mm, to facilitate slurry
Filling.Such size requires certain volumes and interconnection density for high microwave and millimeter wave circuit, is unacceptable.
Third is filled using electrocondution slurry, and the surface of electrocondution slurry generally can not be routed and be welded again, is limited to a certain degree
Wiring density and special welding application.4th, which is produced once completion by the way of " through hole filling perforation ", every
It is penetrated through from surface layer to bottom from wall, each layer needs the circuitous pattern being isolated needs to be arranged in " unified divider wall ", certain journey
Degree limits the freedom degree of designing wiring.
Summary of the invention
The present invention provides a kind of better printed circuit board shielding wall construction of shield effectiveness and its implementation methods, have energy
The characteristics of enough realizing the good shielding and isolation of microwave, millimetre-wave circuit in plate.
The technical solution adopted by the invention is as follows:
A kind of printed circuit board shielding wall construction, it is characterised in that: divider wall is set around separate cabling circuit structure；Institute
Stating divider wall is the metal divider wall that continued circling is mutually connected in one week, is arranged in the dielectric around wired circuit, even
Connect ground plane.
The width of the divider wall is 0.025mm ~ 0.15mm.
Wired circuit is arranged using medium substrate and/or conductive material, between medium substrate and medium substrate and medium base
Insulative separator material is provided between plate and conductive material；Wherein, intermediate core layer uses medium substrate.
The insulative separator material is pre-preg materials.
When using two layers or more medium substrate, the material of each layer medium substrate is identical material or different materials.
A kind of printed circuit board shielding wall construction implementation method is easy to implement above-mentioned printed circuit board shielding wall construction, tool
Body method includes:
It on the dielectric substrate of wired circuit, is slotted to the position for needing to be arranged divider wall using laser, realizes " ring
The production of the micro- blind slot structure of shape "；After the completion of fluting, the slot opened up is cleaned, goes to stain, is activated, heavy copper and flash copper
Processing；Then filling perforation plating is carried out；
Wherein, described " the micro- blind slot structure of annular ", is continuous conductive metal using its bottom, realizes divider wall internal structure
With the function of the external circuit board physical connection；
It is carried out in two stages using laser production " the micro- blind slot structure of annular ", the first stage, with the laser of big energy, removing is gone
Except dielectric surface conductance metal；Second stage removes the dielectric in blind slot structure with the laser of medium energy；The
Three stages were cleaned the electrically-conducting metal surface in blind slot structure and electrically-conducting metal surface are made to keep clean with the laser of small energy.
The current density of the filling perforation plating is divided into three phases progress, and the first stage is that defect makes up stage, filling perforation electricity
Plating uses current density for 0.6 ~ 1.0A/dm2, made up with the defect realized outside allowable range；Second stage is homoepitaxial
In the stage, the current density that filling perforation plating uses is 1.2 ~ 1.5A/dm2, to realize the homoepitaxial of filling perforation plating；Phase III is
Rapid growth stage, the current densities that filling perforation plating uses is 1.8 ~ 2.1A/dm2, right to realize the fast-growth of filling perforation plating
The slot opened up is filled smooth.
The method also includes, when be routed the number of plies be greater than 2 layers when, first to intermediate core layer be arranged isolation wall construction after again into
Row lamination continues setting isolation wall construction to the perisphere after lamination.
The method also includes performing etching thinned smoothing processing to the divider wall surface after filling perforation plating.
The conductive metal is copper foil.
Compared with prior art, existing solid matter metallization VIA, edge cladding metal foil, interior metal divider wall are solved
Deficiency existing for technology realizes the good shielding and isolation of microwave, millimetre-wave circuit in plate.
Detailed description of the invention
Fig. 1 is that the intermediate core layer of a wherein embodiment of the invention interconnects blind hole and divider wall structural schematic diagram.
Fig. 2 is the sectional view of the shown structure of Fig. 1.
Fig. 3 is the schematic diagram of the intermediate core layer completion graphic making in embodiment illustrated in fig. 1.
Fig. 4 is the sectional view of structure shown in Fig. 3.
Fig. 5 is that three layers of medium laminate interconnect blind hole, divider wall schematic diagram in embodiment shown in FIG. 1.
Fig. 6 is the sectional view of structure shown in Fig. 5.
Fig. 7 is that three layers of medium laminate complete schematic diagram after surfacial pattern production in embodiment illustrated in fig. 3.
Fig. 8 is the sectional view of structure shown in Fig. 7.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Any feature disclosed in this specification (including abstract and attached drawing) unless specifically stated can be equivalent by other
Or the alternative features with similar purpose are replaced.That is, unless specifically stated, each feature is a series of equivalent or class
Like an example in feature.
A kind of printed circuit board shielding wall construction, is arranged divider wall around separate cabling circuit structure；The isolation
Wall is the metal divider wall that continued circling is mutually connected in one week, is arranged in the dielectric around wired circuit, and ground plane is connected.
As shown in fig. 1 to fig. 4, there is a separate cabling circuit structure respectively, continuous loop outside separate cabling circuit structure in Fig. 1 to Fig. 4
It is metal divider wall around the isolation wall construction 1-2 for being mutually connected in one week.As shown in Fig. 5 to Fig. 8, there are three separate cabling circuits respectively
Structure, continued circling is mutually connected in one week isolation wall construction (1-2,2-2,3-2) outside separate cabling circuit structure in Fig. 5 to Fig. 8
For metal divider wall.
The width of the divider wall is 0.025mm ~ 0.15mm.
Wired circuit is arranged using medium substrate and/or conductive material, between medium substrate and medium substrate and medium base
Insulative separator material is provided between plate and conductive material；Wherein, intermediate core layer uses medium substrate.
The insulative separator material is pre-preg materials.
When using two layers or more medium substrate, the material of each layer medium substrate is identical material or different materials.
A kind of printed circuit board shielding wall construction implementation method is easy to implement above-mentioned printed circuit board shielding wall construction, tool
Body method includes:
It on the dielectric substrate of wired circuit, is slotted to the position for needing to be arranged divider wall using laser, realizes " ring
The production of the micro- blind slot structure of shape "；After the completion of fluting, the slot opened up is cleaned, goes to stain, is activated, heavy copper and flash copper
Processing；Then filling perforation plating is carried out；
Wherein, described " the micro- blind slot structure of annular ", is continuous conductive metal using its bottom, realizes divider wall internal structure
With the function of the external circuit board physical connection；
It is carried out in two stages using laser production " the micro- blind slot structure of annular ", the first stage, with the laser of big energy, removing is gone
Except dielectric surface conductance metal；Second stage removes the dielectric in blind slot structure with the laser of medium energy；The
Three stages were cleaned the electrically-conducting metal surface in blind slot structure and electrically-conducting metal surface are made to keep clean with the laser of small energy.
The current density of the filling perforation plating is divided into three phases progress, and the first stage is that defect makes up stage, filling perforation electricity
Plating uses current density for 0.6 ~ 1.0A/dm2, made up with the defect realized outside allowable range；Second stage is homoepitaxial
In the stage, the current density that filling perforation plating uses is 1.2 ~ 1.5A/dm2, to realize the homoepitaxial of filling perforation plating；Phase III is
Rapid growth stage, the current densities that filling perforation plating uses is 1.8 ~ 2.1A/dm2, right to realize the fast-growth of filling perforation plating
The slot opened up is filled smooth.
The method also includes being first arranged after isolation wall construction again intermediate core layer when conductor wiring layer is greater than 2 layers
It is laminated, setting isolation wall construction is continued to the perisphere after lamination.
The method also includes performing etching thinned smoothing processing to the divider wall surface after filling perforation plating.
In the prior art, the pore structure that internal Isolated Shield structure is substantially all made of perforation is made, can not
Realize that head and the tail continuously connect, close continuous metal isolation wall construction, to theoretically cannot achieve real complete shield effectiveness.
The present invention carries out the production of " the micro- blind slot structure of annular " using laser, will using micro- continuous copper foil in blind slot bottom
Divider wall internal structure and the external circuit board realize physical connection, then carry out filling perforation plating, continued circling may be implemented and connect
It is one week, completely encloses metal and wall construction is isolated, to realize the complete shielding of signal.
As one embodiment of the present invention, as shown in Fig. 1 to Fig. 8, in existing HDI(high density interconnection substrate) technology
On the basis of, the new structure of " the micro- blind slot structure of annular " is introduced, it, also will " annular while interconnection blind hole is filled in solid plating
Micro- blind slot structure " filling, to realize the production of metal divider wall.
" the shielding divider wall " of this method production, by the way of filling perforation be electroplated, with the solid production that blind hole is electroplated,
Gradually lamination completes, and typical isolation wall width≤0.15mm, every layer of isolation wall construction can be identical or different, divider wall table
Face can be still routed, and while realizing high-frequency signal full-shield, very big routing freedom is also left to designer.Specifically
Method includes:
Firstly, core layer, pre-preg materials needed for providing production HDI substrate；The core layer dielectric layer material, semi-solid preparation
Sheet material can be liquid crystal polymer (LCP), polytetrafluoroethylene (PTFE) (PTFE), modified epoxy, olefin polymer, hydrocarbon
The high frequencies high-speed transfer materials such as compound, cyanate ester (CE), polyphenylene oxide (PPO), and it is not limited to above-mentioned material.The core layer allusion quotation
Type thickness≤0.1mm(does not include surface copper thickness).Prepreg typical thickness≤the 0.1mm.
As depicted in figs. 1 and 2, the isolation wall construction 1-2 of the first blind hole 1-1 and first is processed in intermediate core layer, at this
Described that wall construction is isolated using laser processing mode processing blind hole in specific embodiment, the width range that wall construction is isolated exists
0.025mm~0.15mm.After processing is completed, the isolation of the first blind hole 1-1 and first wall construction 1-2 is cleaned, desmearing, work
Change, heavy copper and flash Copper treatment, then carry out filling perforation plating, then to after filling perforation plating blind hole and divider wall surface perform etching
Smoothing processing is thinned.
As shown in Figure 3 and Figure 4, on the basis of Fig. 1 and Fig. 2, core layer graphic making, including line pattern 1-3 are completed,
Then brownification or Darkening process are carried out to the surface of line pattern.
As shown in Figure 5 and Figure 6, on the basis of Fig. 3 and Fig. 4 completes brownification or Darkening process, first time lamination is carried out,
The upper and lower surface of intermediate core layer is laminating over the basal layer of one layer of wired circuit, the basal layer for the two layers of wiring circuit being laminated
It can be same material, or different materials can may be conductive material for medium substrate, and three layers of formation
Between plate, it is bonded with insulative separator material, in this embodiment, the insulative separator material is pre-preg materials.When
It can be different medium substrate materials when the three ply board includes two layers or more of medium substrate, or same to be situated between
Matter baseplate material.
As it can be seen in figures 5 and 6, since the wired circuit basal layer in lamination includes other two independent wired circuit, it is right
The second blind hole 2-1 and third blind hole 3-1, the second isolation of processing wall construction 2- are processed respectively in other two independent wired circuit
2 and third isolation wall construction 3-2；In this embodiment, blind via bottom pad diameter is 0.1mm or more bigger than blind hole diameter,
The ground plane that wall construction connection is isolated is 0.1mm or more bigger than divider wall width.First isolation wall construction, second isolation wall construction and
The shape and structure that wall construction is isolated in third can not be identical.
On the basis of Fig. 5 and Fig. 6, carry out that the cleaning of wall construction, desmearing, activation, heavy copper, flash for blind hole is isolated
Copper, filling perforation plating, the production of thinned and surfacial pattern, multi-layer substrate structure after the completion are as shown in Figure 7 and Figure 8.
Wherein, the blind hole in Fig. 1 and Fig. 2 and isolation wall construction are the blind hole and isolation wall construction for completing filling plating；Fig. 3
It is to complete the interconnection blind hole and isolation wall construction that filling is electroplated, and complete figure system with isolation wall construction with the blind hole in Fig. 4
Make；2-3 in 1-3 and Fig. 7 and Fig. 8 and 3-3 in Fig. 3 and Fig. 4 are line pattern.
Claims (10)
1. a kind of printed circuit board shields wall construction, it is characterised in that: divider wall is arranged around separate cabling circuit structure；
The divider wall is the metal divider wall that continued circling is mutually connected in one week, is arranged in the dielectric around wired circuit, even
Connect ground plane.
2. printed circuit board according to claim 1 shields wall construction, it is characterised in that: the width of the divider wall is
0.025mm~0.15mm。
3. printed circuit board according to claim 1 shields wall construction, it is characterised in that: wired circuit uses medium substrate
And/or conductive material setting, be provided between medium substrate and medium substrate and between medium substrate and conductive material insulation every
From material；Wherein, intermediate core layer uses medium substrate.
4. printed circuit board according to claim 3 shields wall construction, it is characterised in that: the insulative separator material is half
Cured sheets material.
5. printed circuit board according to claim 3 shields wall construction, it is characterised in that: use two layers or more medium substrate
When, the material of each layer medium substrate is identical material or different materials.
6. a kind of printed circuit board shields wall construction implementation method, it is easy to implement printed circuit described in one of claims 1 to 5
Plate shields wall construction, and specific method includes:
It on the dielectric substrate of wired circuit, is slotted to the position for needing to be arranged divider wall using laser, realizes " ring
The production of the micro- blind slot structure of shape "；After the completion of fluting, the slot opened up is cleaned, goes to stain, is activated, heavy copper and flash copper
Processing；Then filling perforation plating is carried out；
Wherein, described " the micro- blind slot structure of annular ", is continuous conductive metal using its bottom, realizes divider wall internal structure
With the function of the external circuit board physical connection；
It is carried out in two stages using laser production " the micro- blind slot structure of annular ", the first stage, with the laser of big energy, removing is gone
Except dielectric surface conductance metal；Second stage removes the dielectric in blind slot structure with the laser of medium energy；The
Three stages were cleaned the electrically-conducting metal surface in blind slot structure and electrically-conducting metal surface are made to keep clean with the laser of small energy.
7. printed circuit board according to claim 6 shields wall construction implementation method, the current density of the filling perforation plating
It is divided into three phases progress, the first stage is that defect makes up the stage, and filling perforation plating uses current density for 0.6 ~ 1.0A/dm2, with
Realize that the defect outside allowable range makes up；Second stage is the homoepitaxial stage, and the filling perforation current density that uses of plating is 1.2
~1.5A/dm2, to realize the homoepitaxial of filling perforation plating；Phase III is rapid growth stage, the circuit that filling perforation plating uses
Density is 1.8 ~ 2.1A/dm2, to realize the fast-growth of filling perforation plating, the slot opened up is filled smooth.
8. printed circuit board according to claim 6 or 7 shields wall construction implementation method, the method also includes working as cloth
When the line number of plies is greater than 2 layers, it is laminated again after isolation wall construction first is set to intermediate core layer, the perisphere after lamination is continued
Setting isolation wall construction.
9. printed circuit board according to claim 6 or 7 shields wall construction implementation method, the method also includes to filling out
Divider wall surface after the plating of hole performs etching thinned smoothing processing.
10. printed circuit board according to claim 6 shields wall construction implementation method, the conductive metal is copper foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658263.XA CN108966481A (en) | 2018-06-25 | 2018-06-25 | A kind of printed circuit board shielding wall construction and its implementation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810658263.XA CN108966481A (en) | 2018-06-25 | 2018-06-25 | A kind of printed circuit board shielding wall construction and its implementation method |
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| Publication Number | Publication Date |
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| CN108966481A true CN108966481A (en) | 2018-12-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810658263.XA Pending CN108966481A (en) | 2018-06-25 | 2018-06-25 | A kind of printed circuit board shielding wall construction and its implementation method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110913609A (en) * | 2019-10-10 | 2020-03-24 | 宜兴硅谷电子科技有限公司 | Preparation process of high-frequency photoelectric plate with blind buried hole structure |
| CN111491442A (en) * | 2020-04-30 | 2020-08-04 | 武汉铱科赛科技有限公司 | Circuit board with electromagnetic shielding structure and manufacturing method thereof |
| CN112153812A (en) * | 2019-06-28 | 2020-12-29 | 深圳迈瑞生物医疗电子股份有限公司 | Circuit board and AED equipment |
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| US5357138A (en) * | 1991-02-22 | 1994-10-18 | Nec Corporation | Coaxial wiring pattern structure in a multilayered wiring board |
| CN1213997A (en) * | 1996-05-17 | 1999-04-14 | 电科学工业公司 | Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |
| CN1402608A (en) * | 2001-08-08 | 2003-03-12 | 株式会社丰田自动织机 | Method for plating via hole with copper |
| US20100052993A1 (en) * | 2008-09-04 | 2010-03-04 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof |
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2018
- 2018-06-25 CN CN201810658263.XA patent/CN108966481A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5357138A (en) * | 1991-02-22 | 1994-10-18 | Nec Corporation | Coaxial wiring pattern structure in a multilayered wiring board |
| CN1213997A (en) * | 1996-05-17 | 1999-04-14 | 电科学工业公司 | Method employing UV laser pulses of varied energy density to form blind vias in multilayered targets |
| CN1402608A (en) * | 2001-08-08 | 2003-03-12 | 株式会社丰田自动织机 | Method for plating via hole with copper |
| US20100052993A1 (en) * | 2008-09-04 | 2010-03-04 | Samsung Electro-Mechanics Co., Ltd. | Printed circuit board having micro strip line, printed circuit board having strip line and method of manufacturing thereof |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112153812A (en) * | 2019-06-28 | 2020-12-29 | 深圳迈瑞生物医疗电子股份有限公司 | Circuit board and AED equipment |
| CN112153812B (en) * | 2019-06-28 | 2022-09-13 | 深圳迈瑞生物医疗电子股份有限公司 | Circuit board and AED equipment |
| CN110913609A (en) * | 2019-10-10 | 2020-03-24 | 宜兴硅谷电子科技有限公司 | Preparation process of high-frequency photoelectric plate with blind buried hole structure |
| CN111491442A (en) * | 2020-04-30 | 2020-08-04 | 武汉铱科赛科技有限公司 | Circuit board with electromagnetic shielding structure and manufacturing method thereof |
| CN111491442B (en) * | 2020-04-30 | 2023-12-26 | 武汉铱科赛科技有限公司 | Circuit board with electromagnetic shielding structure and manufacturing method thereof |
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Application publication date: 20181207 |
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