CN108925035A - A kind of printed circuit board encapsulation design method and system based on 0402 encapsulation - Google Patents
A kind of printed circuit board encapsulation design method and system based on 0402 encapsulation Download PDFInfo
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- CN108925035A CN108925035A CN201810862643.5A CN201810862643A CN108925035A CN 108925035 A CN108925035 A CN 108925035A CN 201810862643 A CN201810862643 A CN 201810862643A CN 108925035 A CN108925035 A CN 108925035A
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- encapsulation
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- printed circuit
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of printed circuit boards based on 0402 encapsulation to encapsulate design method, includes the following steps：Pad design by 0402 encapsulation is octagonal shape；The center lead pin pitch for 2 pads that adaptation 0402 encapsulates；By 2 pads silk-screen circle rectangularity of 0402 encapsulation；Engineering confirmation is carried out to the layout board card using 0402 encapsulation；PCB design is carried out using the method at crawl pin center.The invention also discloses a kind of printed circuit board package design systems based on 0402 encapsulation.The method and system provided according to the present invention, the pin that the positive BGA package of PCB encapsulation and reverse side 0402 are encapsulated are completely overlapped；PCB placement-and-routing design area is extended, is all improved a lot to the functionality of entire board, reliability aspect；Substantially increase the design efficiency of PCB design.
Description
Technical field
The present invention relates to the technical fields of surface patch electronic component encapsulation, are based on more specifically, particularly relating to one kind
The printed circuit board encapsulation design method and system of 0402 encapsulation.
Background technique
In printed circuit board (Printed Circuit Board, PCB) board R & D design, the design of highly dense board
More and more involved in research and development of products, used chip integration is also higher and higher, and many small pitch packages are a large amount of
Be applied to design of electronic products in, mostly ball grid array (Ball Grid Array, BGA) encapsulate.Spacing at present
(pitch) the bga chip encapsulation that value is 1.0mm has been widely adopted, and utilization rate is very high, meanwhile, bga chip also contains very much
Configuration circuit and electrical power by-pass (bypass) are usually required that and are placed in around BGA or the back side, and 0402 encapsulation is widely used
Resistance, capacitor.This high density board is the problem that PCB layout (Layout) must capture.
The circular pad (pad) that takes the form of one by one matrix arrangement of the BGA package on PCB, pad diameter is usual
It is set as 20mil (about 0.5 millimeter (mm)), wherein mil is the length unit of PCB or chip layout, 1mil=one thousandth English
It is very little.Pitch value is that 1.0mm indicates between each adjacent circular pad that the distance of center to center is 1.0mm (39.37mil).
0402 type package takes the form of two rectangular pads on PCB, is enclosed by silk-screen to form a rectangle.0402 class
The actual size of type encapsulation is long 40mil (about 1.0mm), the rectangle ceramic paster electricity device of wide 20mil (about 0.5mm).
BGA package is to need to punch out pin (pin), while considering cost problem in PCB layout, generally all using traditional
Via Design.After via hole occupy-place, the space that the BGA package back side can be used in being laid out device is just very limited, needs designer
More time-consuming with taking energy design and layout, are also not achieved expected electricity effect.Therefore according to 1.0mmBGA encapsulation and 0402 type
The dimension data of encapsulation is analyzed, we can be designed that a kind of 0402 encapsulation for being completely adapted to the BGA that spacing is 1.0mm
PCB encapsulates (footprint).
For design efficiency in the prior art, low, wires design engineer needs to take a significant amount of time wiring, while by
It cannot reach design requirement in the placement-and-routing of placement-and-routing's limited space, many key signals and influence monolith veneer performance,
There has been no effective solution schemes at present.
Summary of the invention
In view of this, the purpose of the embodiment of the present invention is to propose that a kind of printed circuit board encapsulation based on 0402 encapsulation is set
Method and system are counted, it can be completely overlapped without to setting by the PCB positive BGA package encapsulated and the pin that encapsulates of reverse side 0402
The BGA via hole set carries out rearrangement, in the not increased situation of pcb board snap-gauge frame, extends PCB placement-and-routing design face
Product, while all 0402 encapsulated type configuration circuits of bga chip may be implemented in technique, power supply Bypass is placed nearby
At the back side BGA, all improve a lot to the functionality of entire board, reliability aspect.
Based on above-mentioned purpose, the one side of the embodiment of the present invention provides a kind of printed circuit board envelope based on 0402 encapsulation
Design method is filled, is included the following steps：
Pad design by 0402 encapsulation is octagonal shape；
The center lead pin pitch for 2 pads that adaptation 0402 encapsulates；
By 2 pads silk-screen circle rectangularity of 0402 encapsulation；
Engineering confirmation will be carried out using the layout board card of 0402 encapsulation；
PCB design is carried out using the method at crawl pin center.
In some embodiments, the pad design by 0402 encapsulation includes for octagonal shape：Utilize printed circuit board
The square pads of 0402 encapsulation are changed to the polygon-octagonal shape that inscribed circle diameter is 24mil by encapsulation design software.
In some embodiments, the center lead pin pitch of 2 pads of the encapsulation of adaptation 0402 includes：It is adapted to
The center lead pin pitch for 2 pads that described 0402 encapsulates is set spacing by the distance between the pin of 2 neighbouring BGA pads
Value is 1.0mm.
In some embodiments, 2 pads silk-screen circle rectangularity by 0402 encapsulation includes：By 0402 envelope
The silk-screen that it is 3mil to the distance of the pad in 0402 encapsulation that dress, which is drawn,.
In some embodiments, 2 pads silk-screen circle rectangularity by 0402 encapsulation further comprises：Root
According to the different function and purposes of electronic device, different identifiers is drawn with silk-screen.
In some embodiments, will carry out engineering confirmation using the layout board card of 0402 encapsulation includes：0402 will be used
The design board confirmation encapsulation of encapsulation meets technique production requirement.
In some embodiments, carrying out PCB design using the method at crawl pin center includes：Carry out PCB
When design, for being adapted to 0402 type package for the BGA that spacing is 1.0mm, a pin center with 0402 encapsulation is to grab
It takes and is a little placed on 0402 packaging on the pin center of the suitable pin for the BGA package that spacing is 1.0mm.
In some embodiments, the front of printed circuit board is BGA package, and the back side encapsulates for 0402, and BGA package
It is completely overlapped with the respective pin of 0402 encapsulation.
In some embodiments, BGA package and 0402 encapsulation have been grouped together into a positive back side and have realized difference
Signal connection new via hole device.
The another aspect of the embodiment of the present invention additionally provides a kind of printed circuit board encapsulation design department based on 0402 encapsulation
System, including：
Processor；
Memory, the memory are stored with the executable instruction of the processor, and the processor is executing the finger
Above-mentioned method is realized when enabling.
The present invention has following advantageous effects：Printed circuit board provided in an embodiment of the present invention based on 0402 encapsulation
Design method and system are encapsulated, the pin that the positive BGA package of PCB encapsulation and reverse side 0402 are encapsulated is completely overlapped without right
The BGA via hole set carries out rearrangement；In the not increased situation of pcb board snap-gauge frame, the design of PCB placement-and-routing is extended
Area keeps entire board device layout more neat, beautiful, generous；Realize all 0402 encapsulated types configuration of bga chip
Circuit, power supply Bypass are placed on the back side BGA nearby, all improve a lot to the functionality of entire board, reliability aspect；
PCB design personnel, without deleting via hole by every means, saving via hole, substantially increase the design of PCB design in placement-and-routing
Efficiency.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is that the process for the embodiment that the printed circuit board provided by the invention based on 0402 encapsulation encapsulates design method is shown
It is intended to；
Fig. 2 is that BGA package in prior art PCB encapsulation and 0402 encapsulation are merged one embodiment in the same face
Schematic diagram；
Fig. 3 is the schematic diagram of one embodiment of the polygon-octagonal pad of 0402 encapsulation provided by the invention；
Fig. 4 is the schematic diagram of the encapsulation of the back side 0402 of PCB provided by the invention encapsulation and one embodiment of via hole；
Fig. 5 is the schematic diagram of the positive BGA package of PCB provided by the invention encapsulation and one embodiment of via hole；
Fig. 6 is one of positive BGA package provided by the invention and the encapsulation of the back side 0402 and via hole merging in the same face
The schematic diagram of a embodiment.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
The embodiment of the present invention is further described in attached drawing.
It should be noted that all statements for using " first " and " second " are for differentiation two in the embodiment of the present invention
The non-equal entity of a same names or non-equal parameter, it is seen that " first " " second " only for the convenience of statement, does not answer
It is interpreted as the restriction to the embodiment of the present invention, subsequent embodiment no longer illustrates this one by one.
Based on above-mentioned purpose, the first aspect of the embodiment of the present invention proposes a kind of printing electricity based on 0402 encapsulation
The embodiment of road plate encapsulation design method.Shown in fig. 1 is the printed circuit board encapsulation provided by the invention based on 0402 encapsulation
The flow diagram of the embodiment of design method.
The printed circuit board encapsulation design method based on 0402 encapsulation optionally includes the following steps：
Step S101, the pad design by 0402 encapsulation are octagonal shape；
Step S102, the center lead pin pitch for 2 pads that adaptation 0402 encapsulates；
Step S103, by 2 pads silk-screen circle rectangularity of 0402 encapsulation；
Step S104 carries out engineering confirmation to the layout board card using 0402 encapsulation；
Step S105 carries out PCB design using the method at crawl pin center.
According to some embodiments, PCB layout design and production can be used such as CADENCE ALLEGRO wiring and set
It counts software and Pad designer PCB encapsulates design software.
Fig. 2 shows be that BGA package and 0402 encapsulation in prior art PCB encapsulation design are merged into reality in the same face
Apply the schematic diagram of example.
As shown in Fig. 2, filled circles are the BGA pads that spacing is 1.0MM, small square is the pad of 0402 encapsulation, is contained
The circle of dot is the via hole that BGA outlet needs.It is known that via hole is routinely kept to the distance between pad (via to pin)
8mil, minimum will also accomplish 5mil.Thus for figure as can be seen that since BGA needs via hole outlet, the back side BGA can put the sky of device
Between it is very limited, even if being put into 0402 packaging, also because between square pads and via hole distance cannot reach PCB technology
Manufacture demand and via hole must be deleted.But the via hole that can be deleted be also it is considerably less, BGA pin must punch could be full
Circuit connection is completed in outlet under the demand of sufficient manufacturing process.
Fig. 3 shows the schematic diagram of one embodiment of the polygon-octagonal pad of 0402 encapsulation provided by the invention.
In a preferred embodiment, the pad design by 0402 encapsulation includes for octagonal shape：Utilize printed circuit
Plate encapsulates design software and the square pads of 0402 encapsulation is changed to the polygon-octagonal shape that inscribed circle diameter is d3=24mil.It repairs
Pad after changing increases the distance of pad edge and signal via edge, ensure that the distance between via hole and pad are greater than
5mil.The number for 0402 types of devices that theoretically back side BGA can place is the half of BGA pin, greatly expands PCB
Placement-and-routing space.
In a preferred embodiment, the center lead pin pitch of 2 pads of the encapsulation of adaptation 0402 includes：It adapts to
Distance values are set by the center lead pin pitch of 2 pads of 0402 encapsulation in the distance between pin of 2 neighbouring BGA pads
For d2=1.0mm (39.37mil).The center lead pin pitch of 2 pads of 0402 encapsulation adapts to the BGA pad that spacing is 1.0mm
Pin between distance values.
In a preferred embodiment, 2 pad silk-screen circle rectangularities by 0402 encapsulation include：By 0402 encapsulation
Draw the silk-screen for being 3mil to the distance of the pad in 0402 encapsulation.The PCB product that this distance can guarantee that actual production goes out is seen
Clear pad, also see clearly silk-screen.
In a preferred embodiment, 2 pads silk-screen circle rectangularity by 0402 encapsulation further comprises：
According to the different function and purposes of electronic device, different identifiers is drawn with silk-screen.Electricity can be more easily identified in this way
Sub- device.
In a preferred embodiment, carrying out engineering confirmation to the layout board card using 0402 encapsulation includes：To use
The design board confirmation encapsulation of 0402 encapsulation meets technique production requirement.In some embodiments, new 0402 will can be used
The design board of encapsulation is transmitted to company's manufacturability design (DFM) engineer and pcb board factory and printed circuit-board assembly table
Engineering confirmation is done by face mounting technology (PCBA SMT) patch factory, and confirmation encapsulation meets technique production requirement.
Fig. 4 is the schematic diagram of the encapsulation of the back side 0402 of PCB provided by the invention encapsulation and one embodiment of via hole.Fig. 5
For the schematic diagram of one embodiment of the positive BGA package and via hole of PCB provided by the invention encapsulation.Fig. 6 provides for the present invention
Positive BGA package and the encapsulation of the back side 0402 and via hole merge the schematic diagram of one embodiment in the same face.
As shown in figure 4,401 indicate 0402 encapsulation, the Rectangular boxes that 401 are similar in figure are 0402 encapsulation；402 tables
Show via hole, the white point that 402 are similar in figure is via hole；403 indicate 0402 encapsulation octagonal pad, are similar to 403 in figure
It is 0402 encapsulation welding tray.As shown in figure 5,501 indicate via hole, the white point that 501 are similar in figure is via hole；502 indicate BGA
Pad, the ash point in figure similar to 502 is BGA pad.As shown in fig. 6,601 indicate 0402 encapsulation, 601 are similar in figure
Rectangular boxes are 0402 encapsulation；602 indicate via hole, and the white point that 602 are similar in figure is via hole；603 indicate 0402 envelope
Welding equipment disk similar to 603 is 0402 encapsulation welding tray in figure；604 indicate BGA pad, and 604 grey dot is similar in figure
Regardless of whether being overlapped with 603 is BGA pad.
In a preferred embodiment, carrying out PCB design using the method at crawl pin center includes：It carries out
When PCB design, for being adapted to 0402 type package for the BGA that spacing is 1.0mm, a pin center with 0402 encapsulation is
Point is grabbed, 0402 packaging is placed on the pin center of the suitable pin for the BGA package that spacing is 1.0mm.It grasps in this way
The benefit of work is that once just device is put well, does not need to move again.This laying method and packing forms have met PCB work
Skill demand, does not delete via hole not and will cause that technique is bad, and the via hole left wears layer use for the cabling of more PCB.
In a preferred embodiment, the front of printed circuit board is BGA package, and the back side is 0402 encapsulation, and BGA is sealed
Dress and the respective pin of 0402 encapsulation are completely overlapped.It can make PCB encapsulation more neat, beautiful, generous in this way, and save
The working time of wires design engineer.
In a preferred embodiment, BGA package and 0402 encapsulation have been grouped together into a positive back side and have realized not
The new via hole device of same signal connection.
Pcb board is divided to two kinds of single side pendulum device and two-sided pendulum device.PCB with BGA package can make two-sided pendulum device.Often
Advising way is：PCB puts in front BGA, and PCB puts at the back side it and configures capacitance-resistance.Just as one page recto writes, the back side can also write
Equally, do not interfere.Via hole has interference to the device that two sides is put.
Core technology of the present invention is to keep the positive back side pin of 1.0mmBGA pin and 0402 type package after layout completely heavy
It is folded, without carrying out rearrangement to the BGA via hole set.As seen from Figure 6, the encapsulation of BGA and 0402 combination
A new via devices are formd together, but different signals but may be implemented in the positive back side of this new via devices
Connection, realizes the partial function of HDI plate, and PCB design and manufacturing process cost not will increase really.
From above-described embodiment as can be seen that a kind of printed circuit board envelope based on 0402 encapsulation provided in an embodiment of the present invention
Design method is filled, the positive back side pin of 1.0mmBGA pin and 0402 type package after making layout are completely overlapped, without
Rearrangement is carried out to the BGA via hole set.Technique extends PCB in the not increased situation of pcb board snap-gauge frame
Placement-and-routing's design area, while keeping entire board device layout more neat, beautiful, generous.BGA may be implemented in technique
All 0402 encapsulated type configuration circuits of chip, power supply Bypass is placed on the back side BGA nearby, to the function of entire board
Property, all improve a lot in terms of reliability.PCB design personnel are in placement-and-routing, it is no longer necessary to painstakingly little by little move
Dynamic device, racks one's brains and thinks a through-hole how can be saved, time saving and energy saving, while also substantially increasing the design of PCB design
Efficiency.
It is important to note that each embodiment of the above-mentioned printed circuit board encapsulation design method based on 0402 encapsulation
In each step can intersect, replace, increase, delete, therefore, these reasonable permutation and combination transformation in being based on
The printed circuit board encapsulation design method of 0402 encapsulation should also be as belonging to the scope of protection of the present invention, and should not will be of the invention
Protection scope is confined on the embodiment.
It is exemplary embodiment disclosed by the invention above, the disclosed sequence of the embodiments of the present invention is just to retouching
It states, does not represent the advantages or disadvantages of the embodiments.It should be noted that the discussion of any of the above embodiment is exemplary only, it is not intended that
Imply that range disclosed by the embodiments of the present invention (including claim) is limited to these examples, what is limited without departing substantially from claim
Under the premise of range, it may be many modifications and modify.According to the claim to a method of open embodiment described herein
Function, step and/or movement are not required to the execution of any particular order.In addition, although element disclosed by the embodiments of the present invention can be with
It is described or is required in the form of individual, but be unless explicitly limited odd number, it is understood that be multiple.
Based on above-mentioned purpose, the second aspect of the embodiment of the present invention proposes a kind of printing electricity based on 0402 encapsulation
Road plate package design system, the printed circuit board package design system based on 0402 encapsulation includes processor and storage
Device, memory are stored with the executable instruction of processor, and processor realizes base described in the present invention when executing described instruction
Design method is encapsulated in the printed circuit board of 0402 encapsulation.
A kind of printed circuit board package design system based on 0402 encapsulation provided in an embodiment of the present invention, after making layout
1.0mmBGA pin and the positive back side the pin of 0402 type package are completely overlapped, without to the BGA via hole set into
Row rearrangement.Technique extends PCB placement-and-routing design area, simultaneously in the not increased situation of pcb board snap-gauge frame
Keep entire board device layout more neat, beautiful, generous.All 0402 encapsulation classes of bga chip may be implemented in technique
Type configuration circuit, power supply Bypass are placed on the back side BGA nearby, have very to the functionality of entire board, reliability aspect
It is big to improve.PCB design personnel are in placement-and-routing, it is no longer necessary to painstakingly little by little move device, rack one's brains think why
A through-hole can be saved, it is time saving and energy saving, while also substantially increasing the design efficiency of PCB design.
It is important to note that the embodiment of the above-mentioned printed circuit board package design system based on 0402 encapsulation uses
The embodiment of the printed circuit board encapsulation design method of 0402 encapsulation illustrates the course of work of each module, ability
Field technique personnel can be it is readily conceivable that encapsulate design method for the printed circuit board of these module applications to 0402 encapsulation
Other embodiments in.Certainly, due to each step in the printed circuit board encapsulation design method embodiment of 0402 encapsulation
Suddenly can intersect, replace, increase, deleting, therefore, these reasonable permutation and combination transformation in it is described 0402 encapsulation
Printed circuit board package design system should also be as belonging to the scope of protection of the present invention, and should not be by protection scope of the present invention office
Limit is on the embodiment.
Those of ordinary skills in the art should understand that：The discussion of any of the above embodiment is exemplary only, not
It is intended to imply that range disclosed by the embodiments of the present invention (including claim) is limited to these examples；In the think of of the embodiment of the present invention
Under road, it can also be combined between the technical characteristic in above embodiments or different embodiments, and exist as described above
Many other variations of the different aspect of the embodiment of the present invention, for simplicity, they are not provided in details.Therefore, all at this
Within the spirit and principle of inventive embodiments, any omission, modification, equivalent replacement, improvement for being made etc. should be included in this hair
Within the protection scope of bright embodiment.
Claims (10)
1. a kind of printed circuit board based on 0402 encapsulation encapsulates design method, which is characterized in that include the following steps：
The pad design that described 0402 is encapsulated is octagonal shape；
The center lead pin pitch of 2 pads of 0402 encapsulation described in adaptation；
2 pads silk-screen circle rectangularity that described 0402 is encapsulated；
Engineering confirmation is carried out to the layout board card using 0402 encapsulation；
PCB design is carried out using the method at crawl pin center.
2. the method according to claim 1, wherein the pad design that described 0402 is encapsulated is octagonal shape
Including：It is 24mil that the square pads that described 0402 encapsulates, which are changed to inscribed circle diameter, using printed circuit board encapsulation design software
Polygon-octagonal shape.
3. the method according to claim 1, wherein in 2 pads of 0402 encapsulation described in adaptation
Heart lead pin pitch includes：It is adapted to 2 pads that the distance between the pins of 2 neighbouring BGA pads is encapsulated described 0402
It is 1.0mm that center lead pin pitch, which is set as distance values,.
4. the method according to claim 1, wherein 2 pads silk-screen circle that described 0402 is encapsulated
Rectangularity includes：0402 encapsulation is drawn to the silk-screen for being 3mil to the distance of the pad in 0402 encapsulation.
5. according to the method described in claim 4, it is characterized in that, 2 pads silk-screen circle that described 0402 is encapsulated
Rectangularity further comprises：According to the different function and purposes of electronic device, different identifiers is drawn with silk-screen.
6. the method according to claim 1, wherein carrying out engineering to the layout board card using 0402 encapsulation
Confirmation includes：Technique production requirement will be met using the design board confirmation encapsulation of 0402 encapsulation.
7. the method according to claim 1, wherein carrying out printed circuit board using the method at crawl pin center
Design includes：When carrying out PCB design, for being adapted to 0402 type package for the BGA that spacing is 1.0mm, with described
One pin center of 0402 encapsulation is crawl point, and 0402 packaging is placed on the suitable of the BGA package that spacing is 1.0mm
On the pin center of pin.
8. the method according to the description of claim 7 is characterized in that the front of the printed circuit board is the BGA package, back
Face is 0402 encapsulation, and the BGA package and the respective pin of 0402 encapsulation are completely overlapped.
9. method according to claim 7 or 8, which is characterized in that the BGA package and the 0402 encapsulation combination are one
It rises and forms the new via hole device that different signal connections is realized at a positive back side.
10. a kind of printed circuit board package design system based on 0402 encapsulation, which is characterized in that including：
Processor；
Memory, the memory are stored with the executable instruction of the processor, and the processor is when executing described instruction
Realize method described in any one of claim 1-9.
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| CN201810862643.5A CN108925035A (en) | 2018-08-01 | 2018-08-01 | A kind of printed circuit board encapsulation design method and system based on 0402 encapsulation |
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| JP2007207868A (en) * | 2006-01-31 | 2007-08-16 | Toshiba Corp | Wiring board |
| CN101068453A (en) * | 2007-06-26 | 2007-11-07 | 福建星网锐捷网络有限公司 | Welding pad design method, pad structure, printing circuit board and equipment |
| CN103379737A (en) * | 2012-04-19 | 2013-10-30 | 佳能株式会社 | Printed circuit board |
| CN206480616U (en) * | 2017-01-04 | 2017-09-08 | 大唐移动通信设备有限公司 | One kind is used for chip package pad and chip |
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2018
- 2018-08-01 CN CN201810862643.5A patent/CN108925035A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007207868A (en) * | 2006-01-31 | 2007-08-16 | Toshiba Corp | Wiring board |
| CN101068453A (en) * | 2007-06-26 | 2007-11-07 | 福建星网锐捷网络有限公司 | Welding pad design method, pad structure, printing circuit board and equipment |
| CN103379737A (en) * | 2012-04-19 | 2013-10-30 | 佳能株式会社 | Printed circuit board |
| CN206480616U (en) * | 2017-01-04 | 2017-09-08 | 大唐移动通信设备有限公司 | One kind is used for chip package pad and chip |
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Application publication date: 20181130 |