CN108924720A - Mems麦克风 - Google Patents
Mems麦克风 Download PDFInfo
- Publication number
- CN108924720A CN108924720A CN201810663424.4A CN201810663424A CN108924720A CN 108924720 A CN108924720 A CN 108924720A CN 201810663424 A CN201810663424 A CN 201810663424A CN 108924720 A CN108924720 A CN 108924720A
- Authority
- CN
- China
- Prior art keywords
- vibrating diaphragm
- substrate
- vacuum chamber
- mems microphone
- magnetoresistive sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R23/00—Transducers other than those covered by groups H04R9/00 - H04R21/00
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
- H04R19/04—Microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R1/00—Details of transducers, loudspeakers or microphones
- H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
- H04R1/04—Structural association of microphone with electric circuitry therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
- H04R2201/003—Mems transducers or their use
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R2410/00—Microphones
- H04R2410/03—Reduction of intrinsic noise in microphones
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
- H04R7/04—Plane diaphragms
- H04R7/06—Plane diaphragms comprising a plurality of sections or layers
- H04R7/10—Plane diaphragms comprising a plurality of sections or layers comprising superposed layers in contact
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R7/00—Diaphragms for electromechanical transducers; Cones
- H04R7/16—Mounting or tensioning of diaphragms or cones
- H04R7/18—Mounting or tensioning of diaphragms or cones at the periphery
Abstract
Description
Claims (9)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810663424.4A CN108924720B (zh) | 2018-06-25 | 2018-06-25 | Mems麦克风 |
PCT/CN2018/104442 WO2020000651A1 (zh) | 2018-06-25 | 2018-09-06 | Mems麦克风 |
US16/640,022 US11102586B2 (en) | 2018-06-25 | 2018-09-06 | MEMS microphone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810663424.4A CN108924720B (zh) | 2018-06-25 | 2018-06-25 | Mems麦克风 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108924720A true CN108924720A (zh) | 2018-11-30 |
CN108924720B CN108924720B (zh) | 2020-07-24 |
Family
ID=64422446
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810663424.4A Active CN108924720B (zh) | 2018-06-25 | 2018-06-25 | Mems麦克风 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11102586B2 (zh) |
CN (1) | CN108924720B (zh) |
WO (1) | WO2020000651A1 (zh) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109819390A (zh) * | 2019-01-29 | 2019-05-28 | 歌尔股份有限公司 | 一种gmr/tmr麦克风的制造方法 |
CN111757225A (zh) * | 2020-06-19 | 2020-10-09 | 歌尔微电子有限公司 | Mems芯片及其制作方法、mems麦克风 |
CN111885472A (zh) * | 2020-06-24 | 2020-11-03 | 歌尔微电子有限公司 | 微机电系统麦克风、麦克风单体及电子设备 |
CN112087695A (zh) * | 2020-06-16 | 2020-12-15 | 歌尔微电子有限公司 | 绝对压力感测微机电系统麦克风、麦克风单体及电子设备 |
WO2023015485A1 (zh) * | 2021-08-11 | 2023-02-16 | 深圳市韶音科技有限公司 | 一种传声器 |
EP4024015A4 (en) * | 2019-08-28 | 2023-08-23 | MultiDimension Technology Co., Ltd. | HIGH SENSITIVITY ACOUSTIC WAVE MAGNETORESISTIVE SENSOR AND GRID DEVICE |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109005490B (zh) * | 2018-06-25 | 2020-01-21 | 歌尔股份有限公司 | Mems电容式麦克风 |
CN112179478B (zh) * | 2020-10-09 | 2022-09-30 | 重庆理工大学 | 一种基于磁电阻效应的悬臂式振动传感器 |
CN114339507B (zh) * | 2022-03-10 | 2022-06-17 | 绍兴中芯集成电路制造股份有限公司 | Mems麦克风及其制造方法 |
WO2023216687A1 (zh) * | 2022-05-10 | 2023-11-16 | 迈感微电子(上海)有限公司 | 麦克风结构和语音通讯设备 |
CN114598977B (zh) * | 2022-05-10 | 2022-09-09 | 迈感微电子(上海)有限公司 | 一种mems麦克风和语音通讯设备 |
Citations (6)
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US20020178831A1 (en) * | 2001-05-29 | 2002-12-05 | Akio Takada | Force sensing device |
CN2704174Y (zh) * | 2004-04-26 | 2005-06-08 | 清华大学 | 基于磁电阻效应的微声学器件 |
JP2010045430A (ja) * | 2008-08-08 | 2010-02-25 | Panasonic Electric Works Co Ltd | 静電型トランスデューサ |
CN103017795A (zh) * | 2011-09-27 | 2013-04-03 | 株式会社东芝 | 应变和压力检测器件、话筒、制造应变和压力检测器件的方法以及制造话筒的方法 |
CN104117477A (zh) * | 2013-04-25 | 2014-10-29 | 佳能株式会社 | 电容变换器及其制造方法、探测器以及对象信息获取装置 |
CN104661164A (zh) * | 2013-11-25 | 2015-05-27 | 英飞凌科技股份有限公司 | 半导体器件以及形成半导体器件的方法 |
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US5450372A (en) * | 1994-03-30 | 1995-09-12 | At&T Corp. | Magnetoresistive microphone and acoustic sensing devices |
DE102005008511B4 (de) * | 2005-02-24 | 2019-09-12 | Tdk Corporation | MEMS-Mikrofon |
US20070209437A1 (en) * | 2005-10-18 | 2007-09-13 | Seagate Technology Llc | Magnetic MEMS device |
WO2007117198A1 (en) | 2006-04-07 | 2007-10-18 | Niklaus Consulting | Microelectromechanical pressure sensor with integrated circuit and method of manufacturing such |
JP2011069690A (ja) * | 2009-09-25 | 2011-04-07 | Audio Technica Corp | 振動板の張力測定方法 |
DE102012215897A1 (de) * | 2012-09-07 | 2014-03-13 | Robert Bosch Gmbh | Schallwandlervorrichtung und Verfahren zum Herstellen derselben, Sensorvorrichtung und Verfahren zum Bestimmen eines akustischen Signals |
US20140254835A1 (en) * | 2013-03-05 | 2014-09-11 | Analog Devices, Inc. | Packaged Microphone System with a Permanent Magnet |
US9181080B2 (en) * | 2013-06-28 | 2015-11-10 | Infineon Technologies Ag | MEMS microphone with low pressure region between diaphragm and counter electrode |
US9828237B2 (en) * | 2016-03-10 | 2017-11-28 | Infineon Technologies Ag | MEMS device and MEMS vacuum microphone |
CN109661367A (zh) * | 2016-07-08 | 2019-04-19 | 罗伯特·博世有限公司 | 用于微机电系统mems传感器器件封装的混合电流连接系统 |
WO2018091644A1 (en) * | 2016-11-18 | 2018-05-24 | Robert Bosch Gmbh | System of non-acoustic sensor combined with mems microphone |
WO2018096130A1 (en) * | 2016-11-28 | 2018-05-31 | Robert Bosch Gmbh | Mems transducer system for pressure and acoustic sensing |
CN110679159B (zh) * | 2017-06-05 | 2021-07-20 | 罗伯特·博世有限公司 | 具有封装的移动电极的麦克风 |
CN107548001B (zh) * | 2017-09-18 | 2020-04-24 | 联想(北京)有限公司 | 传感器组及电子设备 |
US10349188B2 (en) * | 2017-10-18 | 2019-07-09 | Akustica, Inc. | MEMS microphone system and method |
-
2018
- 2018-06-25 CN CN201810663424.4A patent/CN108924720B/zh active Active
- 2018-09-06 WO PCT/CN2018/104442 patent/WO2020000651A1/zh active Application Filing
- 2018-09-06 US US16/640,022 patent/US11102586B2/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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US20020178831A1 (en) * | 2001-05-29 | 2002-12-05 | Akio Takada | Force sensing device |
CN2704174Y (zh) * | 2004-04-26 | 2005-06-08 | 清华大学 | 基于磁电阻效应的微声学器件 |
JP2010045430A (ja) * | 2008-08-08 | 2010-02-25 | Panasonic Electric Works Co Ltd | 静電型トランスデューサ |
CN103017795A (zh) * | 2011-09-27 | 2013-04-03 | 株式会社东芝 | 应变和压力检测器件、话筒、制造应变和压力检测器件的方法以及制造话筒的方法 |
CN104117477A (zh) * | 2013-04-25 | 2014-10-29 | 佳能株式会社 | 电容变换器及其制造方法、探测器以及对象信息获取装置 |
CN104661164A (zh) * | 2013-11-25 | 2015-05-27 | 英飞凌科技股份有限公司 | 半导体器件以及形成半导体器件的方法 |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109819390A (zh) * | 2019-01-29 | 2019-05-28 | 歌尔股份有限公司 | 一种gmr/tmr麦克风的制造方法 |
CN109819390B (zh) * | 2019-01-29 | 2020-05-29 | 歌尔股份有限公司 | 一种gmr/tmr麦克风的制造方法 |
WO2020155654A1 (zh) * | 2019-01-29 | 2020-08-06 | 歌尔股份有限公司 | 一种gmr/tmr麦克风的制造方法 |
EP4024015A4 (en) * | 2019-08-28 | 2023-08-23 | MultiDimension Technology Co., Ltd. | HIGH SENSITIVITY ACOUSTIC WAVE MAGNETORESISTIVE SENSOR AND GRID DEVICE |
CN112087695A (zh) * | 2020-06-16 | 2020-12-15 | 歌尔微电子有限公司 | 绝对压力感测微机电系统麦克风、麦克风单体及电子设备 |
WO2021253501A1 (zh) * | 2020-06-16 | 2021-12-23 | 歌尔微电子有限公司 | 绝对压力感测微机电系统麦克风、麦克风单体及电子设备 |
CN111757225A (zh) * | 2020-06-19 | 2020-10-09 | 歌尔微电子有限公司 | Mems芯片及其制作方法、mems麦克风 |
CN111885472A (zh) * | 2020-06-24 | 2020-11-03 | 歌尔微电子有限公司 | 微机电系统麦克风、麦克风单体及电子设备 |
WO2023015485A1 (zh) * | 2021-08-11 | 2023-02-16 | 深圳市韶音科技有限公司 | 一种传声器 |
Also Published As
Publication number | Publication date |
---|---|
US20200267480A1 (en) | 2020-08-20 |
US11102586B2 (en) | 2021-08-24 |
WO2020000651A1 (zh) | 2020-01-02 |
CN108924720B (zh) | 2020-07-24 |
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Effective date of registration: 20200814 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Co-patentee after: Qingdao Research Institute of Beijing University of Aeronautics and Astronautics Patentee after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Development Zone, Shandong, China, No. 268 Co-patentee before: Qingdao Research Institute of Beijing University of Aeronautics and Astronautics Patentee before: GOERTEK Inc. |
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TR01 | Transfer of patent right |