CN108922980A - Touch control display panel - Google Patents
Touch control display panel Download PDFInfo
- Publication number
- CN108922980A CN108922980A CN201810755764.XA CN201810755764A CN108922980A CN 108922980 A CN108922980 A CN 108922980A CN 201810755764 A CN201810755764 A CN 201810755764A CN 108922980 A CN108922980 A CN 108922980A
- Authority
- CN
- China
- Prior art keywords
- substrate
- touch
- layer
- display panel
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 120
- 238000007789 sealing Methods 0.000 claims abstract description 50
- 230000002093 peripheral effect Effects 0.000 claims abstract description 38
- 239000010410 layer Substances 0.000 claims description 101
- 239000000463 material Substances 0.000 claims description 37
- 239000011241 protective layer Substances 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 238000002955 isolation Methods 0.000 claims description 11
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 3
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical group N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 229910052797 bismuth Inorganic materials 0.000 claims description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- 239000007769 metal material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 9
- MWUXSHHQAYIFBG-UHFFFAOYSA-N nitrogen oxide Inorganic materials O=[N] MWUXSHHQAYIFBG-UHFFFAOYSA-N 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- -1 Indium zinc oxygen Compound Chemical class 0.000 description 4
- 239000004020 conductor Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- 239000004372 Polyvinyl alcohol Substances 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920002451 polyvinyl alcohol Polymers 0.000 description 3
- 229910003978 SiClx Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- JYMITAMFTJDTAE-UHFFFAOYSA-N aluminum zinc oxygen(2-) Chemical compound [O-2].[Al+3].[Zn+2] JYMITAMFTJDTAE-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- RQIPKMUHKBASFK-UHFFFAOYSA-N [O-2].[Zn+2].[Ge+2].[In+3] Chemical compound [O-2].[Zn+2].[Ge+2].[In+3] RQIPKMUHKBASFK-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000013081 microcrystal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 239000002362 mulch Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
A touch display panel comprises a first substrate, a plurality of pixel structures, a protrusion, a first conductive element, a second substrate, a touch electrode, an insulating layer, a second conductive element and a sealing element. The first substrate has a display area, a peripheral area and a sealing area. The protrusions are arranged on the peripheral area of the first substrate. The first conductive element covers the bump. The insulating layer covers the touch electrode arranged on the second substrate and is provided with a groove. The second conductive element is arranged on the insulating layer and electrically connected with the touch electrode. The first conductive element covering the protrusion and the second conductive element on the second substrate are abutted to each other and electrically contacted. The sealing element is arranged between the sealing area of the first substrate and the groove of the insulating layer so as to connect the first substrate and the second substrate. The sealing member is in contact with a surface of the groove of the insulating layer.
Description
Technical field
The present invention relates to a kind of display panels, and in particular to a kind of touch-control display panel.
Background technique
In recent years, the display panel with touch function is widely used in mobile device, public information billboard and intelligent family
The ranges such as electricity.Display panel (i.e. touch-control display panel) with touch function can be divided into embedded (in-cell), externally embedded type
(on-cell) and the types such as external hanging type (out-cell), wherein In-cell touch display panel is directly integrated by touch control electrode
Into the structure of display panel, and there is relatively thin thickness, therefore be increasingly becoming the mainstream in market.
For the structure for simplifying In-cell touch display panel, In-cell touch display panel is available to be set to peripheral region
Protrusion enables the touch control electrode signal of upper plate to integrate and (in other words, be connected) into the display signal circuit of lower plate.However, convex
The design of object is played so that the upper and lower plate of touch-control display panel is easy to happen separation after group is vertical, it is abnormal in turn result in touching signals
Or the problem of reliability.Therefore, it how while simplifying In-cell touch display panel structure using protrusion, is promoted and is trusted
Property is the important project that each panel factory is faced.
Summary of the invention
The present invention provides a kind of touch-control display panel, and reliability is good.
Touch-control display panel of the invention, including first substrate, multiple dot structures, protrusion, the first conducting element,
Two substrates, touch control electrode, insulating layer, the second conducting element and sealing element.First substrate has from the inside of first substrate to the
Viewing area, peripheral region and the seal area of the edge arranged in sequence of one substrate.Multiple dot structures are set to the display of first substrate
Area.Protrusion is set to the peripheral region of first substrate.First conducting element covers protrusion.The second substrate is set to first substrate
Opposite direction.Touch control electrode is set in the second substrate, and Chong Die with an at least dot structure.Insulating layer is set in the second substrate
And covering touch control electrode, wherein insulating layer has groove.Second conducting element be set on insulating layer and with touch control electrode electrical property
Connection, wherein covering protrusion the first conducting element be located at the second substrate on the second conducting element support mutually and electrically
Contact.Sealing element is set between the seal area of first substrate and the groove of insulating layer, to connect first substrate and the second substrate,
Wherein sealing element is contacted with the surface of the groove of insulating layer.
Based on above-mentioned, the touch-control display panel of the embodiment of the present invention, by the way that sealing element is set to the exhausted of touch base plate
The groove of edge layer can be such that the contact surface area of sealing element and touch base plate increases, and then lift-off seal part and touch base plate is attached
Put forth effort, to improve the reliability (Reliability) of touch-control display panel.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and cooperate Detailed description of the invention
Book attached drawing is described in detail below.
Detailed description of the invention
Fig. 1 is the diagrammatic cross-section of the touch-control display panel of one embodiment of the invention.
Fig. 2 is the top view of the touch-control display panel of one embodiment of the invention.
Fig. 3 A to Fig. 3 E is the manufacturing process diagrammatic cross-section of the touch base plate of the touch-control display panel of Fig. 1.
Fig. 4 A to Fig. 4 C is that the group of the touch-control display panel of one embodiment of the invention founds process profile diagram.
Symbol description
1：Image element array substrates
2：Touch base plate
10：Touch-control display panel
100：First substrate
100a：Edge
110：First insulating layer
120：First flatness layer
120a, 140a~140d, 140f, 150a~150d, 170b, 220a, 220b, 240a, 240b, TH1~TH4：It connects
Touch window
130：First switching pattern
131：Conducting element
135,136：Connecting line
140：Protective layer
140e,241a：Surface
141,241：Groove
150：Second flatness layer
150e,241b：Perforation
151,152,153,154：Protrusion
151t,185t：Top surface
160,163,164：First conducting element
161：First electrode
162：Second switching pattern
165：Connection pad
170：Pixel defining layer
170a：Opening
180：Luminous pattern
185：Isolation structure
190：Second electrode
200：The second substrate
210：Touch control electrode
211：Peripheral electrode
220：First insulating sublayer layer
230：Bucking electrode
230A：Shielding part
230B：Interconnecting piece
231,232：Third switching pattern
240：Second insulating sublayer layer
250,253,254：Second conducting element
300：Sealing element
300a：Neck
AA：Viewing area
BA：Bonding land
CH：Semiconductor pattern
D：Drain electrode
D1：First direction
D2：Second direction
D3：Third direction
G：Grid
H1,H2,L：Distance
LR：Laser
P1：First projection
P2：Second projection
PA：Peripheral region
PX：Dot structure
S：Source electrode
SA：Seal area
T：Active member
W1,W2：Line width
A-A',B-B',C-C'：Hatching line
Specific embodiment
With detailed reference to exemplary embodiment of the invention, the example of exemplary embodiment is illustrated in attached drawing.Only
It is possible that similar elements symbol is used to indicate same or similar part in the accompanying drawings and the description.
Fig. 1 is the diagrammatic cross-section of the touch-control display panel 10 of one embodiment of the invention.Fig. 2 is one embodiment of the invention
The top view of touch-control display panel 10.In particular, hatching line A-A ', B-B ' and the C-C ' of Fig. 1 corresponding diagram 2.In addition, clearly to show
Out, Fig. 2 omits the dot structure PX of Fig. 1, the first insulating layer 110, first switching pattern 130, conducting element 131, connecting line
135, connecting line 136, the first conducting element 160, second switching pattern 162, third switching pattern 231, third switching pattern 232
And isolation structure 185 is shown.
Fig. 1 and Fig. 2 is please referred to, in the present embodiment, touch-control display panel 10 may include image element array substrates 1, be set to
The opposite touch base plate 2 and sealing element 300 of image element array substrates 1, wherein sealing element 300 be set to image element array substrates 1 with
Between touch base plate 2, so that image element array substrates 1 are connected with touch base plate 2.Image element array substrates 1 may include first substrate
100, multiple dot structure PX and protrusion 151.Referring to figure 2., first substrate 100 have from the inside of first substrate 100 to
Viewing area AA, peripheral region PA and the seal area SA of the edge 100a arranged in sequence of first substrate 100.Multiple dot structure PX settings
In the viewing area AA of first substrate 100.The peripheral region PA of first substrate 100 is arranged in protrusion 151.The setting of sealing element 300 exists
The seal area SA of first substrate 100.For example, in this example it is shown that area AA is border circular areas, peripheral region PA is circular
The annular region of viewing area AA, and seal area SA is the external annular region of surrounding periphery area PA and viewing area AA.However, this hair
Bright to be not limited, in other embodiments, visual actual demand designs viewing area AA, peripheral region PA and/or seal area SA
For other suitable shapes.
Fig. 1 and Fig. 2 is please referred to, in the present embodiment, image element array substrates 1 may also include data line (not shown) and scanning
Line (not shown), wherein data line extends in the first direction dl and is arranged on first substrate 100 along second direction D2, sweeps
Retouch that line extends in a second direction d 2 and D1 is arranged on first substrate 100 along a first direction.For example, in the present embodiment
In, first direction D1 and second direction D2 are substantially orthogonal, but invention is not limited thereto.In the present embodiment, multiple
Dot structure PX can array be arranged in the viewing area AA of first substrate 100, wherein each dot structure PX may include being set to
Active member T on first substrate 100, and each dot structure PX passes through active member T and corresponding data line and right
The scan line answered is electrically connected, but invention is not limited thereto.
Fig. 1 and Fig. 2 is please referred to, in the present embodiment, active member T may include thin film transistor (TFT), and thin film transistor (TFT) is for example
With grid G, semiconductor pattern CH, source S and drain D.For example, in the present embodiment, grid G is arranged in the first base
On plate 100, and it is electrically connected with a corresponding scan line (not shown).Source S be arranged on first substrate 100, and with it is right
The data line (not shown) answered is electrically connected.Different twoth areas electrically connect source S with semiconductor pattern CH's respectively from drain D
It connects.For example, in the present embodiment, the structure of semiconductor pattern CH can be single-layer or multi-layer；The material of semiconductor pattern CH
May include amorphous silicon, polysilicon, microcrystal silicon, monocrystalline silicon, organic semiconducting materials, oxide semiconductor material (such as：Indium zinc oxygen
Compound, indium gallium zinc oxide or other suitable materials or combinations of the above) or other suitable materials or containing mixing
Sundries (dopant) is in above-mentioned material or combinations of the above.
In the present embodiment, the material of scan line (not shown) and grid G is optionally identical；That is, scanning
Line and grid G may be selectively formed at same film layer.In addition, in the present embodiment, data line (not shown), source S and leakage
The material of pole D is optionally identical；That is, data line, source S and drain D may be selectively formed at same film layer.
For example, in the present embodiment, considering based on electric conductivity, the material of data line, scan line, grid G, source S and drain D
Usually use metal material.However, invention is not limited thereto, according to other embodiments, data line, scan line, grid
G, other conductive materials can also be used in source S and drain D, such as：The oxidation of alloy, the nitride of metal material, metal material
The stack layer of object, the nitrogen oxides of metal material or other suitable materials or metal material and other conductive materials.
Fig. 1 is please referred to, in the present embodiment, image element array substrates 1 may also include the first insulating layer 110, the first insulating layer
110 are set between grid G and semiconductor pattern CH.In addition, in the present embodiment, setting to the semiconductor pattern CH property of can choose
It sets above grid G, and then forms bottom grid film transistor (Bottom-gate TFT).However, the present invention is not with this
It is limited, according to other embodiments, active member T can also be top gate-type thin film transistor (top-gate TFT) or other
The thin film transistor (TFT) of appropriate form.
In the present embodiment, image element array substrates 1 may also include the first flatness layer 120, first switching pattern 130, conduction
Element 131, connecting line 135 and connecting line 136.First flatness layer 120 can cover active member T, multiple data lines (not shown)
And the first partial insulating layer 110.First flatness layer 120 has the contact hole 120a positioned at viewing area AA.In the present embodiment,
Contact hole 120a runs through the first flatness layer 120, and is overlapped in the part of the surface of drain D.First switching pattern 130 and conducting element
131 are set on the first flatness layer 120.First switching pattern 130 insert the first flatness layer 120 contact hole 120a with and actively
The drain D of element T is electrically connected.Connecting line 135 and connecting line 136 are set on first substrate 100.For example, in this reality
It applies in example, connecting line 135 and connecting line 136 are arranged on the first flatness layer 120, and wherein first substrate 100 can also have engagement
Area BA, viewing area AA, peripheral region PA, seal area SA and bonding land BA are from the inside of first substrate 100 to the side of first substrate 100
Edge arranged in sequence, bonding land BA are located at outside sealing element 300.In particular, in the present embodiment, at least one connecting line 135 is by week
Border area PA extends to bonding land BA and crosses over seal area SA.
In the present embodiment, image element array substrates 1 may also include protective layer 140 and the second flatness layer 150.Protective layer 140
It is set to viewing area AA, peripheral region PA, seal area SA and the bonding land BA of first substrate 100, and covers connecting line 135, connection
Line 136, the part of the surface of the first flatness layer 120, the first switching pattern 130 and conducting element 131.The setting of second flatness layer 150
In the viewing area AA and peripheral region PA of first substrate 100, and protective mulch 140.In the present embodiment, protective layer 140 has
Surface 140e towards the second substrate 200, the second flatness layer 150 have the perforation 150e for being overlapped in surface 140e, protective layer 140
Surface 140e and the side wall of perforation 150e of the second flatness layer 150 define groove 141.Sealing element 300 is set to groove 141,
And it can directly be contacted with the side wall of the surface 140e of protective layer 140 and the perforation 150e of the second flatness layer 150.By by sealing element
300 are set to groove 141, the contact surface area of sealing element 300 and image element array substrates 1 can be made to increase, and then lift-off seal part
300 with the adhesive force of image element array substrates 1, to improve the reliability of touch-control display panel 10.For example, in the present embodiment
In, the material of protective layer 140 and the second flatness layer 150 can be selected from silicon nitride, silica or combinations thereof, but the present invention not as
Limit.In the present embodiment, sealing element 300 can be glass material (Frit, frit), and the material of sealing element 300 can be selected from oxygen
SiClx, boron, bismuth or combinations thereof, but invention is not limited thereto.
In the present embodiment, protrusion 151 is arranged on the second flatness layer 150 of peripheral region PA.For example, exist
In the present embodiment, the material of protrusion 151 is with the material property of can choose of the second flatness layer 150 identical, and material includes nothing
Machine material (such as：The stacking of silica, silicon nitride, silicon oxynitride, other suitable materials or above-mentioned at least two material
Layer), organic material or other suitable materials or combinations of the above, but invention is not limited thereto.
Image element array substrates 1 further include the first conducting element 160.In the present embodiment, the first conducting element 160 covers convex
Object 151 is played, more specifically, the first conducting element 163 conformally covers protrusion 153, and the first conducting element 164 conformally covers
Lid protrusion 154.In addition, protective layer 140 have the contact hole 140c that is respectively arranged on connecting line 135 and connecting line 136 and
Contact hole 140d, the second flatness layer 150 have be respectively arranged at connecting line 135 and the top of connecting line 136 contact hole 150c,
150d, wherein the first conducting element 163 of covering protrusion 153 passes through the contact hole 140c and the second flatness layer of protective layer 140
150 contact hole 150c and connecting line 135 is electrically connected, and the first conducting element 164 of covering protrusion 154 passes through protective layer
The contact hole 150d of 140 contact hole 140d and the second flatness layer 150 and connecting line 136 are electrically connected.For example, in this reality
It applies in example, contact hole 140c is trimmed with contact hole 150c, and contact hole 140d is trimmed with contact hole 150d, that is to say, that protective layer
The contact hole 150c of 140 contact hole 140c and the second flatness layer 150 can be formed using same be masked in same etch process,
The contact hole 150d of the contact hole 140d of protective layer 140 and the second flatness layer 150 can be masked in same etch process using same
Middle formation, but invention is not limited thereto.
In the present embodiment, image element array substrates 1 further include the connection pad 165 for being set to bonding land BA, wherein covering protrusion
First conducting element 163 of object 153 is electrically connected to connection pad 165 by connecting line 135.For example, in the present embodiment, it connects
Pad 165 may be disposed on protective layer 140, and be electrically connected to connecting line 135, but this by the contact hole 140f of protective layer 140
Invention is not limited.Considering based on electric conductivity, connection pad 165, the switching pattern 130 of connecting line 135,136, first and conductive element
The material of part 131 is usually to use metal material.However, invention is not limited thereto, according to other embodiments, connection pad 165,
Other suitable conductive materials, example can also be used in connecting line 135, the switching pattern 130 of connecting line 136, first and conducting element 131
Such as：Alloy, the nitride of metal material, the oxide of metal material, metal material nitrogen oxides or other suitable materials
The stack layer of material or metal material and other conductive materials.
In the present embodiment, each dot structure PX further includes first electrode 161, and first electrode 161 and active member T
It is electrically connected.For example, in the present embodiment, contact hole 150a and protection of the first electrode 161 by the second flatness layer 150
The switching pattern 130 of the contact hole 140a of layer 140 and first is electrically connected；That is, first electrode 161 passes through the first switching figure
Case 130 and the drain D of active member T are electrically connected.However, invention is not limited thereto, according to other embodiments, first electrode
161 can also be used the drain D that other appropriate ways are electrically connected to active member T, and for example, first electrode 161 can also pass through
Wear the second flatness layer 150, protective layer 140 and the first flatness layer 120 and directly in electrical contact with the drain D of active member T.
In the present embodiment, the second switching pattern 162 passes through the contact hole 150b and protective layer 140 of the second flatness layer 150
Contact hole 140b be electrically connected to conducting element 131.For example, in the present embodiment, contact hole 140a and contact hole
150a is trimmed, and contact hole 140b is trimmed with contact hole 150b, that is to say, that the contact hole 140a of protective layer 140 and second is flat
The contact hole 150a of layer 150 can be formed in same etch process using same mask, the contact hole 140b of protective layer 140 and the
The contact hole 150b of two flatness layers 150 can be formed in same etch process using same mask, but invention is not limited thereto.
In the present embodiment, each dot structure PX further includes pixel defining layer 170, luminous pattern 180 and second electrode
190.Pixel defining layer 170 is set in first electrode 161 and has the opening 170a Chong Die with first electrode 161.Illuminated diagram
Case 180 is set to the opening 170a of pixel defining layer 170.For example, in the present embodiment, the material of pixel defining layer 170
It is the property of can choose organic insulating material.Organic insulating material is, for example, polyimide, polyester, benzocyclobutene
(benzocyclobutene, BCB), polymethyl methacrylate (polymethylmethacrylate, PMMA), polystyrene
Phenol (poly (4-vinylphenol), PVP), polyvinyl alcohol (polyvinyl alcohol, PVA), polytetrafluoroethylene (PTFE)
(polytetrafluoroethene, PTFE), hexamethyldisiloxane (hexamethyldisiloxane, HMDSO) or its
Its suitable organic insulating material.For example, in the present embodiment, the material of luminous pattern 180 includes the organic electric shock of phosphorescence
The combination of luminescent material, fluorescence organic electric-excitation luminescent material, inorganic electroluminescence material or above-mentioned at least two material, but this hair
It is bright to be not limited.
In the present embodiment, image element array substrates 10 further include isolation structure 185, and wherein isolation structure 185 is set to picture
On plain definition layer 170 and the luminous pattern 180 of the adjacent two dot structure PX of isolation.Second electrode 190 is set to illuminated diagram
In case 180.For example, in the present embodiment, second electrode 190 conformally cover luminous pattern 180, isolation structure 185 and
The part of the surface of pixel defining layer 170.Second electrode 190 is electrically connected to by the contact hole 170b of pixel defining layer 170
Two switching patterns 162.Second electrode 190 can be electrically connected to conducting element 131 by the second switching pattern 162, to have ginseng
Current potential is examined, wherein the reference potential can be earthing potential, fixed current potential, floating (floating) current potential or other appropriate shapes
The current potential of formula.
In the present embodiment, first electrode 161, the first conducting element 160 and the second switching pattern 162 can belong to same film
Layer；That is, first electrode 161, the first conducting element 160 and the second switching pattern 162 can be using same masks in same
It is formed in technique, but invention is not limited thereto.For example, in the present embodiment, first electrode 161 can be reflective electricity
Pole, second electrode 190 can be penetration electrode, and wherein the material of reflective electrode includes metal material with high reflectivity,
And the material of penetration electrode includes metal oxide, e.g. indium tin oxide, indium-zinc oxide, aluminium tin-oxide, aluminium zinc
Oxide or other suitable oxides or be above-mentioned stack layer both at least.However, invention is not limited thereto, root
According to other embodiments, first electrode 161 and second electrode 190 can also be all penetration electrode.
Fig. 3 A to Fig. 3 E is the manufacturing process diagrammatic cross-section of the touch base plate 2 of the touch-control display panel 10 of Fig. 1.Match below
Close manufacturing process and its structure that Fig. 3 A to Fig. 3 E illustrates touch base plate 2.
A referring to figure 3., firstly, providing the second substrate 200.The second substrate 200 also has the inside by the second substrate 200
To the viewing area AA, peripheral region PA and seal area SA of the edge arranged in sequence of the second substrate 200.Then, in the second substrate 200
Form touch control electrode 210 and peripheral electrode 211.Touch control electrode 210 is arranged in the second substrate 200 and is located on the AA of viewing area.
Peripheral electrode 211 is arranged in the second substrate 200 and is located on the PA of peripheral region.Referring to figure 2. and Fig. 3 A, in the present embodiment,
Upright projection of the peripheral electrode 211 on first substrate 100 can be annular in shape configuration, and the upright projection position of peripheral electrode 211
Between the upright projection of protrusion 151 and the upright projection of sealing element 300.For example, in the present embodiment, peripheral electrode
211 can have reference potential, wherein the reference potential can be earthing potential (Ground), fix current potential, be floating
(floating) current potential of current potential or other appropriate forms.In the present embodiment, considering based on electric conductivity, optionally makes
Touch control electrode 210 and peripheral electrode 211 are made with metal material.It the use of the touch control electrode 210 that metal material makes is, for example, gold
Belong to netted (metal mesh) electrode, but invention is not limited thereto.
B referring to figure 3. then forms the first insulating sublayer layer 220, to cover touch control electrode 210, peripheral electrode 211 and the
The part of the surface of two substrates 200.In the present embodiment, the first insulating sublayer layer 220 has the contact hole being located on the AA of viewing area
220a and the contact hole 220b on the PA of peripheral region, contact hole 220a and contact hole 220b expose touch control electrode 210 respectively
Part of the surface and peripheral electrode 211 part of the surface.In the present embodiment, the material of the first insulating sublayer layer 220 is, for example, oxygen
SiClx, but invention is not limited thereto.
C and Fig. 2 referring to figure 3. then forms bucking electrode 230 and third switching pattern on the first insulating sublayer layer 220
231,232.Bucking electrode 230 includes the masking shielding part 230A of touch control electrode 210 and outwardly extending by shielding part 230A
Interconnecting piece 230B (is illustrated in Fig. 2).The interconnecting piece 230B of bucking electrode 230 passes through multiple contact hole TH1 positioned at peripheral region PA
~TH4 and peripheral electrode 211 are electrically connected.Third switching pattern 231 is set on the AA of viewing area, and inserts the first insulating sublayer layer
220 contact hole 220a and touch control electrode 210 is electrically connected.Third switching pattern 232 is set on the PA of peripheral region, and inserts the
The contact hole 220b and peripheral electrode 211 of one insulating sublayer layer 220 are electrically connected.In the present embodiment, bucking electrode 230, third
Switching pattern 231 and third switching pattern 232 are, for example, to belong to the first transparency conducting layer comprising metal oxide, e.g.
Indium tin oxide, indium-zinc oxide, aluminium tin-oxide, aluminium zinc oxide, indium germanium zinc oxide or other suitable oxides,
The stack layer of either above-mentioned at least the two, but invention is not limited thereto.
D referring to figure 3. then forms the second insulating sublayer layer 240, on the first insulating sublayer layer 220 to cover bucking electrode
230 and first insulating sublayer layer 220 part of the surface.In the present embodiment, the second insulating sublayer layer 240, which has, is located on the PA of peripheral region
Contact hole 240b, the perforation 241b on seal area SA and the contact hole 240a positioned at viewing area AA.Contact hole 240a
And contact hole 240b exposes the part of the surface of third switching pattern 231 and the part of the surface of third switching pattern 232 respectively.It passes through
Hole 241b exposes the part of the surface 241a of the first insulating sublayer layer 220.In the present embodiment, the perforation of the second insulating sublayer layer 240
The side wall of 241b and the first insulating sublayer layer 220 define groove 241 towards the surface 241a of first substrate 100.It is worth mentioning
It is that groove 241 and contact hole 240a and contact hole 240b can be formed in etch process in along with, therefore the design of groove 241
Additional technique and production cost are not will increase.In the present embodiment, the material of the second insulating sublayer layer 240 is, for example, silica, but
Invention is not limited thereto.
E referring to figure 3. then forms the second conducting element 250 on the second insulating sublayer layer 240.In detail, in this reality
It applies in example, the second conducting element 253 is transferred by the contact hole 240a and third of the second insulating sublayer layer 240, and pattern 231 is electrical to be connected
It is connected to touch control electrode 210, contact hole 240b and third the switching pattern that the second conducting element 254 passes through the second insulating sublayer layer 240
232 are electrically connected to peripheral electrode 211.In this, the touch base plate 2 of the present embodiment is just completed.
Fig. 4 A to Fig. 4 C is that the group of the touch-control display panel 10 of one embodiment of the invention founds process profile diagram.Utilize figure
Process shown in 4A to Fig. 4 C can organize the touch base plate 2 of vertical image element array substrates 1 and Fig. 3 E, and it is aobvious to form touch-control shown in FIG. 1
Show panel 10, cooperates Fig. 4 A to Fig. 4 C to illustrate below.
A referring to figure 4., firstly, providing touch base plate 2.Then, sealing element is coated in the groove 241 of touch base plate 2
300, contact sealing element 300 and the side wall of the surface 241a of the groove 241 of the second insulating sublayer layer 240 and perforation 241b.It please join
According to Fig. 4 B, then, image element array substrates 1 are set to the opposite direction of touch base plate 2, so that sealing element 300 is set to pixel array
Between the groove 141 of substrate 1 and the groove 241 of the second insulating sublayer layer 240, make the touch control electrode 210 and shielding electricity of touch base plate 2
Pole 230 and the dot structure PX of image element array substrates 1 are be overlapped on third direction D3, and make the second conductive element of touch base plate 2
Part 250 is Chong Die with the protrusion 151 of image element array substrates 1, and wherein third direction D3 is perpendicular to second direction D2.Bucking electrode
230 between touch control electrode 210 and dot structure PX.
C referring to figure 4. then organizes vertical image element array substrates 1 and touch base plate 2, so as to be located at the groove of touch base plate 2
241 sealing element 300 contacts the surface of the groove 141 of image element array substrates 1 (also that is, the side of surface 140e and perforation 150e
Wall).In particular, in the present embodiment, the first conducting element 160 of covering protrusion 151 be located in the second substrate 200 the
Two conducting elements 250 are supported mutually and in electrical contact.In detail, it covers the first conducting element 163 of protrusion 153 and is located at the
The second conducting element 253 on two substrates 200 is supported mutually and in electrical contact, and therefore, the touch control electrode 210 of touch base plate 2 can
Pixel is electrically connected to by third switching pattern 231, the second conducting element 253, the first conducting element 163 and connecting line 135
The connection pad 165 of array substrate 1, and the touching signals in touch control electrode 210 is enable to be transferred to connection pad 165；Similarly, covering protrusion
First conducting element 164 of object 154 is supported mutually and in electrical contact with the second conducting element 254 being located in the second substrate 200,
Therefore, the peripheral electrode 211 of touch base plate 2 can pass through third switching pattern 232, the second conducting element 254 and the first conductive element
Part 164 is electrically connected to connecting line 136, so that the peripheral electrode 211 of touch base plate 2 is by connecting line 136 with above-mentioned
Reference potential.
Then, it recycles laser LR to irradiate sealing element 300, therefore, sealing element 300 can be made to be sintered (Sintering) solidification,
Affixed touch base plate 2 and image element array substrates 1 in turn.In this, the touch-control display panel 10 of the present embodiment is just completed, wherein Fig. 4 C
Touch-control display panel 10 be Fig. 1 touch-control display panel 10.In the present embodiment, due to the seal area SA's of touch base plate 2
Shading route is less, it is preferred, therefore, that laser LR by the second substrate 200 seal area SA outer lateral touch-control display panel
10 inside transmitting are to irradiate sealing element 300, but invention is not limited thereto.
Please refer to Fig. 1, it is notable that by the way that sealing element 300 to be arranged to the groove 241 of touch base plate 2, can make to seal
The contact surface area of part 300 and touch base plate 2 increases, and then the adhesive force of lift-off seal part 300 and touch base plate 2, to increase
The reliability of touch-control display panel 10.In particular, in the present embodiment, sealing element 300 and 241 surface of groove are (also that is, surface
The side wall of 241a and perforation 241b) it contacts, and define the surface 241a and perforation 241b of the first insulating sublayer layer 220 of groove 241
Side wall property it is close with the property of the material of sealing element 300, therefore, sealing element 300 and 241 surface of groove are (also that is, surface
The side wall of 241a and perforation 241b) adhesive force it is stronger, be more than sealing element 300 and the second substrate 200 (such as：Glass) surface
Adhesive force, facilitate improve touch-control display panel 10 reliability.
In the present embodiment, protrusion 151 has the top surface 151t far from first substrate 100, and top surface 151t is first
Projected area on substrate 100 is A, and 1 μm2≤A≤10000μm2, can so take into account the top surface 151t for being set to protrusion 151
On the first conducting element 160 and touch base plate 2 the second conducting element 250 between contact impedance and make protrusion 151
Size is not excessive and struts image element array substrates 1 and touch base plate 2.In addition, the top surface 151t and the first base of protrusion 151
The distance of plate 100 is H1, and the top surface 185t of isolation structure 185 is H2 at a distance from first substrate 100, and H2≤H1.Citing and
Speech, in the present embodiment, the top surface 151t and 100 distance H1 of first substrate of protrusion 151 are greater than the top surface of isolation structure 185
185t and 100 distance H2 of first substrate.That is, there is the isolation structure 185 compared with low height compared to protrusion 151
It can avoid the first conducting element 160 that the second conducting element 250 in the second substrate 200 is detached from protrusion 151, can so mention
Rise the contact success rate of the first conducting element 160 and the second conducting element 250.
Fig. 1 and Fig. 2 is please referred to, in the present embodiment, on the projection plane of parallel first substrate 100, sealing element 300 has
There is neck 300a, the line width W1 of neck 300a is small compared with the line width W2 at other positions of sealing element 300.Neck 300a is encapsulation laser
Sintering path Origin And Destination；That is, the neck 300a of sealing element 300 is sintered at least twice, thus have compared with
Narrow line width W1.On the projection plane of parallel first substrate 100, neck 300a has the first projection P 1, and protrusion 152 has
Second projection P 2, and the shortest distance of the first projection P 1 and the second projection P 2 on the projection plane for being parallel to first substrate 100
For L, and L >=1mm.Since the neck 300a of sealing element 300 is sintered at least twice, the adhesive force of neck 300a is than sealing
The poor adhesive force at other positions of part 300 is avoided that pixel by the way that neck 300a and protrusion 152 are maintained appropriately distance L
Array substrate 1 is with touch base plate 2 because sealing element 300 is strutted due to the adhesive force of neck 300a declines by protrusion 152.
In conclusion the touch-control display panel of the embodiment of the present invention, by the way that sealing element is set to the exhausted of touch base plate
The groove of edge layer can be such that the contact surface area of sealing element and touch base plate increases, and then lift-off seal part and touch base plate is attached
Put forth effort, to improve the reliability of touch-control display panel.In particular, in an embodiment, the groove of sealing element and touch base plate
Surface contact, and the material of the property and sealing element of the side wall on the surface and perforation of the first insulating sublayer layer of the definition groove
Property is close, and therefore, sealing element and the adhesive force of the groove surfaces are stronger, be more than sealing element and the second substrate (such as：Glass
Glass) surface adhesive force, facilitate further improve touch-control display panel reliability.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle technical staff, without departing from the spirit and scope of the invention, when can make a little variation and retouching, therefore protection of the invention
Range is subject to view as defined in claim.
Claims (10)
1. a kind of touch-control display panel, including：
One first substrate, have edge arranged in sequence from from the inside of the first substrate to the first substrate a viewing area, one
Peripheral region and a seal area；
Multiple dot structures are set to the viewing area of the first substrate；
One protrusion is set to the peripheral region of the first substrate；
One first conducting element, covers the protrusion；
One the second substrate is set to the opposite direction of the first substrate；
One touch control electrode is set in the second substrate, and Chong Die at least one dot structure；
One insulating layer is set in the second substrate and covers the touch control electrode, and wherein the insulating layer has a groove；
One second conducting element is set on the insulating layer and is electrically connected with the touch control electrode, wherein covering the protrusion
First conducting element is supported mutually and in electrical contact with second conducting element being located in the second substrate；And
One sealing element is set between the seal area of the first substrate and the groove of the insulating layer, to connect first base
Plate and the second substrate, wherein the sealing element is contacted with a surface of the groove of the insulating layer.
2. touch-control display panel as described in claim 1, further includes：
One bucking electrode is set in the second substrate, and between the touch control electrode and at least one dot structure, wherein
The insulating layer includes：
One first insulating sublayer layer, covers the touch control electrode, and wherein the bucking electrode is set on the first insulating sublayer layer；And
One second insulating sublayer layer, covers the bucking electrode, wherein the groove of the insulating layer by the first insulating sublayer layer towards
The side wall of one perforation of one surface of the first substrate and the second insulating sublayer layer is defined.
3. touch-control display panel as claimed in claim 2, wherein the second insulating sublayer layer also has a contact hole, and this second
Conducting element is electrically connected by the contact hole and the touch control electrode.
4. touch-control display panel as described in claim 1, wherein the material of the insulating layer is selected from silica.
5. touch-control display panel as described in claim 1, wherein the material of the sealing element is selected from silica, boron, bismuth or its group
It closes.
6. touch-control display panel as described in claim 1, wherein the first substrate also has a bonding land, which is somebody's turn to do
The edge arranged in sequence of peripheral region, the seal area and the bonding land from the inside of the first substrate to the first substrate, and be somebody's turn to do
Touch-control display panel further includes：
One connecting line is set on the first substrate, and is extended to the bonding land by the peripheral region and crossed over the seal area；
One protective layer is set on the connecting line and has a contact hole, wherein covering first conducting element of the protrusion
It is electrically connected by the contact hole of the protective layer and the connecting line, and the sealing element is contacted with the protective layer；And
One connection pad is set to the bonding land, wherein first conducting element for covering the protrusion is electrically connected by the connecting line
It is connected to the connection pad.
7. touch-control display panel as claimed in claim 6, wherein the material of the protective layer is selected from silicon nitride, silica or its group
It closes.
8. touch-control display panel as described in claim 1, wherein respectively the dot structure includes：
One active member is set on the first substrate；
One first electrode is electrically connected with the active member；
One pixel defining layer is set in the first electrode and has an opening Chong Die with the first electrode；
One luminous pattern is set to the opening of the pixel defining layer；And
One second electrode is set on the luminous pattern, and wherein the touch-control display panel further includes：
One isolation structure is set in the pixel defining layer and is isolated the luminous pattern of two neighboring dot structure；
Wherein, a top surface of the protrusion is H1, a top surface of the isolation structure and first base at a distance from the first substrate
The distance of plate is H2, and H2≤H1.
It, should 9. touch-control display panel as described in claim 1, wherein the protrusion has the top surface far from the first substrate
Projected area of the top surface on the first substrate is A, and 1 μm2≤A≤10000μm2。
10. touch-control display panel as described in claim 1, wherein this is close on a projection plane of the parallel first substrate
Sealing have a neck, the neck have one first projection, the protrusion have one second projection, this first projection with this second
The shortest distance being projected on the projection plane for being parallel to the first substrate is L, and L >=1mm.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107114475A TWI657361B (en) | 2018-04-27 | 2018-04-27 | Touch display panel |
| TW107114475 | 2018-04-27 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108922980A true CN108922980A (en) | 2018-11-30 |
| CN108922980B CN108922980B (en) | 2020-06-02 |
Family
ID=64412542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810755764.XA Active CN108922980B (en) | 2018-04-27 | 2018-07-11 | Touch control display panel |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108922980B (en) |
| TW (1) | TWI657361B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854128A (en) * | 2019-03-15 | 2020-02-28 | 友达光电股份有限公司 | Array substrate |
| US11048352B2 (en) | 2019-09-04 | 2021-06-29 | Samsung Display Co., Ltd. | Display device |
| WO2021238519A1 (en) * | 2020-05-28 | 2021-12-02 | 华为技术有限公司 | Display screen, method for manufacturing display screen, and electronic device |
| CN114256658A (en) * | 2020-09-23 | 2022-03-29 | 群创光电股份有限公司 | Electronic device |
| CN114385020A (en) * | 2020-10-21 | 2022-04-22 | 宸美（厦门）光电有限公司 | Touch panel and touch device |
| WO2023224232A1 (en) * | 2022-05-20 | 2023-11-23 | 삼성디스플레이 주식회사 | Display device and manufacturing method therefor |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202166809U (en) * | 2011-08-05 | 2012-03-14 | 北京京东方光电科技有限公司 | Film transistor liquid crystal display screen and display device |
| CN202453616U (en) * | 2012-03-15 | 2012-09-26 | 京东方科技集团股份有限公司 | Display panel and liquid crystal display (LCD) device |
| CN104216159A (en) * | 2014-09-03 | 2014-12-17 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN104733502A (en) * | 2015-03-13 | 2015-06-24 | 上海和辉光电有限公司 | Amoled panel and manufacturing method thereof |
| TW201706796A (en) * | 2015-08-07 | 2017-02-16 | 群創光電股份有限公司 | Touch display device |
| CN107340921A (en) * | 2017-06-08 | 2017-11-10 | 友达光电股份有限公司 | Touch panel |
| CN207096959U (en) * | 2017-08-01 | 2018-03-13 | 惠科股份有限公司 | A kind of touch display panel and display device |
-
2018
- 2018-04-27 TW TW107114475A patent/TWI657361B/en active
- 2018-07-11 CN CN201810755764.XA patent/CN108922980B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202166809U (en) * | 2011-08-05 | 2012-03-14 | 北京京东方光电科技有限公司 | Film transistor liquid crystal display screen and display device |
| CN202453616U (en) * | 2012-03-15 | 2012-09-26 | 京东方科技集团股份有限公司 | Display panel and liquid crystal display (LCD) device |
| CN104216159A (en) * | 2014-09-03 | 2014-12-17 | 上海天马有机发光显示技术有限公司 | Display panel, manufacturing method thereof and display device |
| CN104733502A (en) * | 2015-03-13 | 2015-06-24 | 上海和辉光电有限公司 | Amoled panel and manufacturing method thereof |
| TW201706796A (en) * | 2015-08-07 | 2017-02-16 | 群創光電股份有限公司 | Touch display device |
| CN107340921A (en) * | 2017-06-08 | 2017-11-10 | 友达光电股份有限公司 | Touch panel |
| CN207096959U (en) * | 2017-08-01 | 2018-03-13 | 惠科股份有限公司 | A kind of touch display panel and display device |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110854128A (en) * | 2019-03-15 | 2020-02-28 | 友达光电股份有限公司 | Array substrate |
| CN110854128B (en) * | 2019-03-15 | 2022-04-19 | 友达光电股份有限公司 | Array substrate |
| US11048352B2 (en) | 2019-09-04 | 2021-06-29 | Samsung Display Co., Ltd. | Display device |
| WO2021238519A1 (en) * | 2020-05-28 | 2021-12-02 | 华为技术有限公司 | Display screen, method for manufacturing display screen, and electronic device |
| CN114256658A (en) * | 2020-09-23 | 2022-03-29 | 群创光电股份有限公司 | Electronic device |
| CN114385020A (en) * | 2020-10-21 | 2022-04-22 | 宸美（厦门）光电有限公司 | Touch panel and touch device |
| CN114385020B (en) * | 2020-10-21 | 2024-04-19 | 宸美（厦门）光电有限公司 | Touch panel and touch device |
| WO2023224232A1 (en) * | 2022-05-20 | 2023-11-23 | 삼성디스플레이 주식회사 | Display device and manufacturing method therefor |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201945903A (en) | 2019-12-01 |
| TWI657361B (en) | 2019-04-21 |
| CN108922980B (en) | 2020-06-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108922980A (en) | Touch control display panel | |
| CN105304679B (en) | A kind of bottom light emitting-type OLED display panel | |
| CN108183117A (en) | Micro-led display panel and preparation method thereof | |
| WO2018036179A1 (en) | Touch-control structure, array substrate and display device | |
| CN103943787B (en) | A kind of OLED display and preparation method thereof | |
| CN106326845A (en) | Fingerprint recognition unit, manufacturing method, array substrate, display device, and fingerprint recognition method | |
| JP2017174811A (en) | Display device | |
| JP2017021797A (en) | Touch sensor and touch panel | |
| CN102593126B (en) | Panel and manufacturing method thereof | |
| CN103247692B (en) | Thin film transistor (TFT), display unit and electronic equipment | |
| CN109326609A (en) | A kind of array substrate and preparation method thereof | |
| CN107340928A (en) | Touch-control display panel and its manufacture method, touch control display apparatus | |
| CN109148489A (en) | A kind of array substrate and production method, display device | |
| CN110265470A (en) | Display device, display panel and its manufacturing method | |
| CN103824862B (en) | Thin film transistor base plate and display | |
| CN108493215A (en) | Optical device | |
| CN105655378A (en) | Array substrate, OLED display panel, manufacturing method and display device | |
| CN109858443A (en) | The production method of display panel, display device and display panel | |
| CN103456738A (en) | Thin film transistor substrate and displayer | |
| CN109585367A (en) | Display device, display panel, array substrate and its manufacturing method | |
| CN110391283A (en) | Organic light emitting display panel and organic light-emitting display device | |
| CN110828476B (en) | Array substrate, preparation method thereof and display device | |
| CN109449164A (en) | A kind of TFT substrate, display panel and display device | |
| CN107946315A (en) | A kind of array base palte, display panel and electronic equipment | |
| CN101515590B (en) | Film transistor array substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |