CN108922980B

CN108922980B - Touch control display panel

Info

Publication number: CN108922980B
Application number: CN201810755764.XA
Authority: CN
Inventors: 郭汉浤; 赵骏铭; 郭柏佑; 李文仁; 黄彦士; 陈加明; 来汉中
Original assignee: AU Optronics Corp
Current assignee: AU Optronics Corp
Priority date: 2018-04-27
Filing date: 2018-07-11
Publication date: 2020-06-02
Anticipated expiration: 2038-07-11
Also published as: CN108922980A; TW201945903A; TWI657361B

Abstract

A touch display panel comprises a first substrate, a plurality of pixel structures, a protrusion, a first conductive element, a second substrate, a touch electrode, an insulating layer, a second conductive element and a sealing element. The first substrate has a display area, a peripheral area and a sealing area. The protrusions are arranged on the peripheral area of the first substrate. The first conductive element covers the bump. The insulating layer covers the touch electrode arranged on the second substrate and is provided with a groove. The second conductive element is arranged on the insulating layer and electrically connected with the touch electrode. The first conductive element covering the protrusion and the second conductive element on the second substrate are abutted to each other and electrically contacted. The sealing element is arranged between the sealing area of the first substrate and the groove of the insulating layer so as to connect the first substrate and the second substrate. The sealing member is in contact with a surface of the groove of the insulating layer.

Description

Touch control display panel

Technical Field

The present disclosure relates to display panels, and particularly to a touch display panel.

Background

In recent years, display panels having a touch function are widely used in a range of mobile devices, public information boards, intelligent home appliances, and the like. Display panels with touch control function (i.e., touch display panels) can be classified into an in-cell (in-cell), an on-cell (on-cell), and an out-cell (out-cell), wherein the in-cell touch display panel is directly integrated into the structure of the display panel through a touch electrode and has a relatively thin thickness, and thus has become the mainstream of the market.

In order to simplify the structure of the in-cell touch display panel, the in-cell touch display panel can integrate (or conduct) the touch electrode signal of the upper panel to the display signal loop of the lower panel by using the protrusions disposed on the peripheral region. However, due to the design of the protrusion, the upper and lower plates of the touch display panel are easily separated after being assembled, thereby causing the problem of abnormal or reliable touch signals. Therefore, how to simplify the structure of the in-cell touch display panel by using the protrusions and improve the reliability is an important issue for each panel factory.

Disclosure of Invention

The invention provides a touch display panel with good reliability.

The invention discloses a touch display panel, which comprises a first substrate, a plurality of pixel structures, a bulge, a first conductive element, a second substrate, a touch electrode, an insulating layer, a second conductive element and a sealing element. The first substrate has a display region, a peripheral region and a sealing region arranged in sequence from the inside of the first substrate to the edge of the first substrate. The plurality of pixel structures are arranged in the display area of the first substrate. The protrusions are arranged on the peripheral area of the first substrate. The first conductive element covers the bump. The second substrate is arranged opposite to the first substrate. The touch electrode is arranged on the second substrate and is overlapped with the at least one pixel structure. The insulating layer is arranged on the second substrate and covers the touch electrode, wherein the insulating layer is provided with a groove. The second conductive element is arranged on the insulating layer and electrically connected with the touch electrode, wherein the first conductive element covering the protrusion and the second conductive element positioned on the second substrate are mutually abutted and electrically contacted. The sealing element is arranged between the sealing area of the first substrate and the groove of the insulating layer so as to connect the first substrate and the second substrate, wherein the sealing element is in contact with the surface of the groove of the insulating layer.

Based on the above, in the touch display panel of the embodiment of the invention, the sealing element is disposed in the groove of the insulating layer of the touch substrate, so that the contact surface area between the sealing element and the touch substrate is increased, and the adhesion between the sealing element and the touch substrate is further improved, thereby improving the Reliability (Reliability) of the touch display panel.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

Fig. 1 is a schematic cross-sectional view of a touch display panel according to an embodiment of the invention.

Fig. 2 is a top view of a touch display panel according to an embodiment of the invention.

Fig. 3A to 3E are schematic cross-sectional views illustrating a manufacturing process of a touch substrate of the touch display panel of fig. 1.

Fig. 4A to 4C are schematic sectional views illustrating an assembly process of a touch display panel according to an embodiment of the invention.

Description of the symbols

1: pixel array substrate

2: touch substrate

10: touch control display panel

100: first substrate

100 a: edge of a container

110: a first insulating layer

120: a first flat layer

120a, 140a to 140d, 140f, 150a to 150d, 170b, 220a, 220b, 240a, 240b, TH1 to TH 4: contact window

130: first transfer pattern

131: conductive element

135. 136: connecting wire

140: protective layer

140e, 241 a: surface of

141. 241: groove

150: a second flat layer

150e, 241 b: through hole

151: projection

152: first protrusion

153: second protrusion

154: third projection

151t, 185 t: the top surface

160: first conductive element

163: first sub-portion first conductive element

164: second sub-portion first conductive element

161: a first electrode

162: second transfer pattern

165: connecting pad

170: pixel definition layer

170 a: opening of the container

180: light-emitting pattern

185: isolation structure

190: second electrode

200: second substrate

210: touch electrode

211: peripheral electrode

220: first sub-insulating layer

230: shielding electrode

230A: shielding part

230B: connecting part

231: third transfer pattern

232: sub-part of the third transfer pattern

240: second sub-insulating layer

250: second conductive element

253: first sub-portion second conductive element

254: second sub-portion second conductive element

300: sealing element

300 a: neck part

AA: display area

BA: bonding region

CH: semiconductor pattern

D: drain electrode

D1: a first direction

D2: second direction

D3: third direction

G: grid electrode

H1, H2, L: distance between two adjacent plates

LR: laser

P1: first projection

P2: second projection

PA: peripheral zone

PX: pixel structure

S: source electrode

And SA: sealing area

T: active component

W1, W2: line width

3A 3- 3A 3 ' 3, 3B 3- 3B 3 ' 3, 3C 3- 3C 3 ' 3: 3 Cutting line

Detailed Description

Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.

Fig. 1 is a schematic cross-sectional view of a touch display panel 10 according to an embodiment of the invention. Fig. 2 is a top view of the touch display panel 10 according to an embodiment of the invention. 3 in 3 particular 3, 3 FIG. 31 3 corresponds 3 to 3 the 3 cross 3- 3 sectional 3 lines 3A 3- 3A 3 ' 3, 3B 3- 3B 3 ' 3 and 3C 3- 3C 3 ' 3 of 3 FIG. 32 3. 3 In addition, for clarity of illustration, fig. 2 omits the illustration of the pixel structure PX, the first insulating layer 110, the first transfer pattern 130, the conductive element 131, the connection line 135, the connection line 136, the first conductive element 160, the second transfer pattern 162, the third transfer pattern 231, the sub-portion third transfer pattern 232, and the isolation structure 185 of fig. 1.

Referring to fig. 1 and 2, in the present embodiment, the touch display panel 10 may include a pixel array substrate 1, a touch substrate 2 disposed opposite to the pixel array substrate 1, and a sealing member 300, wherein the sealing member 300 is disposed between the pixel array substrate 1 and the touch substrate 2, so as to connect the pixel array substrate 1 and the touch substrate 2. The pixel array substrate 1 may include a first substrate 100, a plurality of pixel structures PX, and a protrusion 151. Referring to fig. 2, the first substrate 100 has a display area AA, a peripheral area PA and a sealing area SA sequentially arranged from the inside of the first substrate 100 to the edge 100a of the first substrate 100. A plurality of pixel structures PX are disposed in the display area AA of the first substrate 100. The protrusions 151 are disposed in the peripheral region PA of the first substrate 100. The sealing member 300 is disposed at the sealing area SA of the first substrate 100. For example, in the embodiment, the display area AA is a circular area, the peripheral area PA is an inner annular area surrounding the display area AA, and the sealing area SA is an outer annular area surrounding the peripheral area PA and the display area AA. However, the present invention is not limited thereto, and in other embodiments, the display area AA, the peripheral area PA and/or the sealing area SA may be designed to have other suitable shapes according to actual requirements.

Referring to fig. 1 and 2, in the present embodiment, the pixel array substrate 1 may further include data lines (not shown) and scan lines (not shown), wherein the data lines extend in the first direction D1 and are arranged on the first substrate 100 along the second direction D2, and the scan lines extend in the second direction D2 and are arranged on the first substrate 100 along the first direction D1. For example, in the embodiment, the first direction D1 and the second direction D2 are substantially perpendicular to each other, but the invention is not limited thereto. In this embodiment, a plurality of pixel structures PX may be arranged in the display area AA of the first substrate 100 in an array, wherein each pixel structure PX may include an active device T disposed on the first substrate 100, and each pixel structure PX is electrically connected to a corresponding data line and a corresponding scan line through the active device T, but the invention is not limited thereto.

Referring to fig. 1 and 2, in the present embodiment, the active device T may include a thin film transistor having, for example, a gate G, a semiconductor pattern CH, a source S, and a drain D. For example, in the present embodiment, the gate G is disposed on the first substrate 100 and electrically connected to a corresponding scan line (not shown). The source S is disposed on the first substrate 100 and electrically connected to a corresponding data line (not shown). The source S and the drain D are electrically connected to two different regions of the semiconductor pattern CH, respectively. For example, in the present embodiment, the structure of the semiconductor pattern CH may be a single layer or a multi-layer; the material of the semiconductor pattern CH may include amorphous silicon, polysilicon, microcrystalline silicon, single crystal silicon, organic semiconductor material, oxide semiconductor material (such as indium zinc oxide, indium gallium zinc oxide, or other suitable materials, or combinations thereof), or other suitable materials, or include dopants (dopants) therein, or combinations thereof.

In the present embodiment, the material of the scan line (not shown) and the gate G can be selectively the same; that is, the scan line and the gate G can be selectively formed in the same layer. In addition, in the present embodiment, the materials of the data line (not shown), the source S and the drain D may be selectively the same; that is, the data line, the source S and the drain D may be selectively formed in the same film. For example, in the present embodiment, the materials of the data line, the scan line, the gate G, the source S and the drain D are generally metal materials in consideration of conductivity. However, the invention is not limited thereto, and according to other embodiments, the data lines, the scan lines, the gate G, the source S and the drain D may also use other conductive materials, such as: an alloy, a nitride of a metal material, an oxide of a metal material, an oxynitride of a metal material, or other suitable material, or a stacked layer of a metal material and other conductive materials.

Referring to fig. 1, in the present embodiment, the pixel array substrate 1 may further include a first insulating layer 110, and the first insulating layer 110 is disposed between the gate G and the semiconductor pattern CH. In addition, in the present embodiment, the semiconductor pattern CH may be selectively disposed over the gate electrode G, thereby forming a Bottom-gate type thin film transistor (Bottom-gate TFT). However, the invention is not limited thereto, and according to other embodiments, the active device T may also be a top-gate thin film transistor (top-gate TFT) or other suitable type of thin film transistor.

In this embodiment, the pixel array substrate 1 may further include a first planarization layer 120, a first transfer pattern 130, a conductive element 131, a connection line 135 and a connection line 136. The first planarization layer 120 may cover the active device T, the plurality of data lines (not shown), and a portion of the first insulating layer 110. The first planarization layer 120 has a contact window 120a in the display area AA. In the present embodiment, the contact window 120a penetrates through the first planarization layer 120 and overlaps a portion of the surface of the drain D. The first via pattern 130 and the conductive element 131 are disposed on the first planarization layer 120. The first via pattern 130 fills the contact hole 120a of the first planarization layer 120 to electrically connect to the drain D of the active device T. The connection lines 135 and 136 are disposed on the first substrate 100. For example, in the present embodiment, the

connection lines

135 and 136 are disposed on the first planarization layer 120, wherein the first substrate 100 may further have a bonding area BA, the display area AA, the peripheral area PA, the sealing area SA and the bonding area BA are sequentially arranged from the inside of the first substrate 100 to the edge of the first substrate 100, and the bonding area BA is located outside the sealing member 300. In particular, in the present embodiment, the at least one connection line 135 extends from the peripheral region PA to the bonding region BA across the sealing region SA.

In this embodiment, the pixel array substrate 1 may further include a protection layer 140 and a second planarization layer 150. The passivation layer 140 is disposed in the display area AA, the peripheral area PA, the sealing area SA, and the bonding area BA of the first substrate 100, and covers the connection lines 135, the connection lines 136, a portion of the surface of the first planarization layer 120, the first transfer pattern 130, and the conductive elements 131. The second planarization layer 150 is disposed in the display area AA and the peripheral area PA of the first substrate 100, and covers the protection layer 140. In the embodiment, the passivation layer 140 has a surface 140e facing the second substrate 200, the second planarization layer 150 has a through hole 150e overlapping the surface 140e, and the surface 140e of the passivation layer 140 and the sidewall of the through hole 150e of the second planarization layer 150 define the recess 141. The sealing member 300 is disposed in the recess 141 and can directly contact the surface 140e of the passivation layer 140 and the sidewall of the through hole 150e of the second planarization layer 150. By disposing the sealing member 300 in the groove 141, the contact surface area between the sealing member 300 and the pixel array substrate 1 can be increased, and the adhesion between the sealing member 300 and the pixel array substrate 1 can be further improved, so as to improve the reliability of the touch display panel 10. For example, in the embodiment, the material of the protection layer 140 and the second planarization layer 150 may be selected from silicon nitride, silicon oxide, or a combination thereof, but the invention is not limited thereto. In this embodiment, the sealing member 300 may be made of glass (Frit), and the material of the sealing member 300 may be selected from silicon oxide, boron, bismuth, or a combination thereof, but the invention is not limited thereto.

In the present embodiment, the protrusions 151 are provided on the second flat layer 150 located in the peripheral area PA. For example, in the present embodiment, the material of the protrusion 151 and the material of the second flat layer 150 may be selectively the same, and the material of the protrusion includes an inorganic material (e.g., silicon oxide, silicon nitride, silicon oxynitride, other suitable materials, or a stacked layer of at least two of the above materials), an organic material, or other suitable materials, or a combination thereof, but the invention is not limited thereto.

The pixel array substrate 1 further includes a first conductive element 160. In the present embodiment, the first conductive element 160 covers the protrusion 151, and more specifically, the first sub-portion first conductive element 163 conformally covers the second protrusion 153, and the second sub-portion first conductive element 164 conformally covers the third protrusion 154. In addition, the passivation layer 140 has

contact windows

140c and 140d respectively disposed on the

connection lines

135 and 136, the second planarization layer 150 has

contact windows

150c and 150d respectively disposed above the

connection lines

135 and 136, wherein the first sub-portion of the first conductive element 163 covering the second protrusion 153 is electrically connected to the connection lines 135 through the

contact windows

140c and 150c of the second planarization layer 150 of the passivation layer 140, and the second sub-portion of the first conductive element 164 covering the third protrusion 154 is electrically connected to the connection lines 136 through the

contact windows

140d and 150d of the

passivation layer

140 and 150d of the second planarization layer 150. For example, in the present embodiment, the contact 140c is cut to be aligned with the contact 150c, and the contact 140d is cut to be aligned with the contact 150d, that is, the contact 140c of the protection layer 140 and the contact 150c of the second planarization layer 150 can be formed in the same etching process by using the same mask, and the contact 140d of the protection layer 140 and the contact 150d of the second planarization layer 150 can be formed in the same etching process by using the same mask, but the invention is not limited thereto.

In this embodiment, the pixel array substrate 1 further includes a pad 165 disposed in the bonding area BA, wherein the first conductive element 163 covering the first sub-portion of the second protrusion 153 is electrically connected to the pad 165 through the connection line 135. For example, in the embodiment, the pad 165 may be disposed on the protection layer 140 and electrically connected to the connection line 135 through the contact window 140f of the protection layer 140, but the invention is not limited thereto. For electrical conductivity, the materials of the pad 165, the connecting

lines

135, 136, the first via pattern 130 and the conductive element 131 are generally metal materials. However, the invention is not limited thereto, and according to other embodiments, the pads 165, the connecting lines 135, the connecting lines 136, the first via patterns 130 and the conductive elements 131 may also use other suitable conductive materials, such as: an alloy, a nitride of a metal material, an oxide of a metal material, an oxynitride of a metal material, or other suitable material, or a stacked layer of a metal material and other conductive materials.

In this embodiment, each pixel structure PX further includes a first electrode 161, and the first electrode 161 is electrically connected to the active device T. For example, in the present embodiment, the first electrode 161 is electrically connected to the first transfer pattern 130 through the contact window 150a of the second planarization layer 150 and the contact window 140a of the protection layer 140; that is, the first electrode 161 is electrically connected to the drain D of the active device T through the first via pattern 130. However, the invention is not limited thereto, and according to other embodiments, the first electrode 161 may be electrically connected to the drain D of the active device T by other suitable methods, for example, the first electrode 161 may also penetrate through the second planarization layer 150, the protection layer 140 and the first planarization layer 120 to directly electrically contact the drain D of the active device T.

In the present embodiment, the second via pattern 162 is electrically connected to the conductive element 131 through the contact window 150b of the second planarization layer 150 and the contact window 140b of the passivation layer 140. For example, in the present embodiment, the contact 140a and the contact 150a are cut to be equal, and the contact 140b and the contact 150b are cut to be equal, that is, the contact 140a of the protection layer 140 and the contact 150a of the second planarization layer 150 can be formed in the same etching process by using the same mask, and the contact 140b of the protection layer 140 and the contact 150b of the second planarization layer 150 can be formed in the same etching process by using the same mask, but the invention is not limited thereto.

In the present embodiment, each pixel structure PX further includes a pixel defining layer 170, a light emitting pattern 180, and a second electrode 190. The pixel defining layer 170 is disposed on the first electrode 161 and has an opening 170a overlapping the first electrode 161. The light emitting pattern 180 is disposed in the opening 170a of the pixel defining layer 170. For example, in the present embodiment, the material of the pixel defining layer 170 may be selectively an organic insulating material. Examples of organic insulating materials are polyimide, polyester, benzocyclobutene (BCB), polymethyl methacrylate (PMMA), polyvinyl phenol (poly (4-vinylphenol), PVP), polyvinyl alcohol (PVA), Polytetrafluoroethylene (PTFE), Hexamethyldisiloxane (HMDSO), or other suitable organic insulating materials. For example, in the present embodiment, the material of the light emitting pattern 180 includes a phosphorescent organic electroluminescent material, a fluorescent organic electroluminescent material, an inorganic electroluminescent material, or a combination of at least two of the above materials, but the invention is not limited thereto.

In the present embodiment, the pixel array substrate 10 further includes an isolation structure 185, wherein the isolation structure 185 is disposed on the pixel defining layer 170 and isolates the light emitting patterns 180 of two adjacent pixel structures PX. The second electrode 190 is disposed on the light emitting pattern 180. For example, in the present embodiment, the second electrode 190 conformally covers the light emitting pattern 180, the isolation structure 185 and a portion of the surface of the pixel defining layer 170. The second electrode 190 is electrically connected to the second via pattern 162 through the contact window 170b of the pixel defining layer 170. The second electrode 190 may be electrically connected to the conductive element 131 through the second via pattern 162 to have a reference potential, wherein the reference potential may be a ground potential, a fixed potential, a floating (floating) potential, or other suitable type of potential.

In the embodiment, the first electrode 161, the first conductive element 160 and the second via pattern 162 may belong to the same film layer; that is, the first electrode 161, the first conductive element 160 and the second via pattern 162 may be formed in the same process by using the same mask, but the invention is not limited thereto. For example, in the present embodiment, the first electrode 161 may be a reflective electrode, and the second electrode 190 may be a transmissive electrode, wherein the material of the reflective electrode includes a metal material with high reflectivity, and the material of the transmissive electrode includes a metal oxide, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, or other suitable oxide, or a stacked layer of at least two of the foregoing. However, the invention is not limited thereto, and according to other embodiments, the first electrode 161 and the second electrode 190 may be both transmissive electrodes.

Fig. 3A to 3E are schematic cross-sectional views illustrating a manufacturing process of the touch substrate 2 of the touch display panel 10 of fig. 1. The following describes a manufacturing process of the touch substrate 2 and the structure thereof with reference to fig. 3A to 3E.

Referring to fig. 3A, first, a second substrate 200 is provided. The second substrate 200 also has a display area AA, a peripheral area PA, and a sealing area SA sequentially arranged from the inside of the second substrate 200 toward the edge of the second substrate 200. Next, a touch electrode 210 and a peripheral electrode 211 are formed on the second substrate 200. The touch electrode 210 is disposed on the second substrate 200 and located on the display area AA. The peripheral electrode 211 is disposed on the second substrate 200 and on the peripheral region PA. Referring to fig. 2 and fig. 3A, in the present embodiment, a vertical projection of the peripheral electrode 211 on the first substrate 100 may be in a ring shape, and the vertical projection of the peripheral electrode 211 is located between the vertical projection of the protrusion 151 and the vertical projection of the sealing member 300. For example, in the present embodiment, the peripheral electrode 211 may have a reference potential, wherein the reference potential may be a Ground potential (Ground), a fixed potential, a floating potential (floating) or other suitable type of potential. In the present embodiment, the touch electrode 210 and the peripheral electrode 211 may be selectively made of metal materials based on the consideration of conductivity. The touch electrode 210 made of a metal material is, for example, a metal mesh (metal mesh) electrode, but the invention is not limited thereto.

Referring to fig. 3B, a first sub-insulating layer 220 is formed to cover the touch electrode 210, the peripheral electrode 211 and a portion of the surface of the second substrate 200. In the present embodiment, the first sub-insulating layer 220 has a contact window 220a located on the display area AA and a contact window 220b located on the peripheral area PA, and the contact window 220a and the contact window 220b respectively expose a portion of the surface of the touch electrode 210 and a portion of the surface of the peripheral electrode 211. In the present embodiment, the material of the first sub-insulating layer 220 is, for example, silicon oxide, but the invention is not limited thereto.

Referring to fig. 3C and fig. 2, next, a shielding electrode 230, a third via pattern 231, and a sub-portion of the third via pattern 232 are formed on the first sub-insulating layer 220. The shielding electrode 230 includes a shielding portion 230A shielding the touch electrode 210 and a connecting portion 230B (shown in fig. 2) extending outward from the shielding portion 230A. The connection portion 230B of the shielding electrode 230 is electrically connected to the peripheral electrode 211 through a plurality of contact holes TH1 to TH4 located in the peripheral region PA. The third via pattern 231 is disposed on the display area AA, and is filled in the contact window 220a of the first sub-insulating layer 220 to be electrically connected to the touch electrode 210. A sub-portion of the third via pattern 232 is disposed on the peripheral region PA, and the contact windows 220b filled in the first sub-insulating layer 220 are electrically connected to the peripheral electrode 211. In the present embodiment, the shielding electrode 230, the third via pattern 231 and the sub-portion of the third via pattern 232 belong to a first transparent conductive layer, for example, and include a metal oxide, such as indium tin oxide, indium zinc oxide, aluminum tin oxide, aluminum zinc oxide, indium germanium zinc oxide, or other suitable oxide, or a stacked layer of at least two of the foregoing, but the invention is not limited thereto.

Referring to fig. 3D, a second sub-insulating layer 240 is formed on the first sub-insulating layer 220 to cover the shielding electrode 230 and a portion of the surface of the first sub-insulating layer 220. In the present embodiment, the second sub-insulating layer 240 has a contact window 240b located on the peripheral region PA, a through hole 241b located on the sealing region SA, and a contact window 240a located in the display region AA. The contact holes 240a and 240b expose a portion of the surface of the third via pattern 231 and a portion of the surface of the sub-portion of the third via pattern 232, respectively. The via hole 241b exposes a portion of the surface 241a of the first sub-insulating layer 220. In the present embodiment, the sidewall of the through hole 241b of the second sub-insulating layer 240 and the surface 241a of the first sub-insulating layer 220 facing the first substrate 100 define a recess 241. It should be noted that the recess 241, the contact 240a and the contact 240b can be formed in the same etching process, so that the design of the recess 241 does not increase the additional process and production cost. In the present embodiment, the material of the second sub-insulating layer 240 is, for example, silicon oxide, but the invention is not limited thereto.

Referring to fig. 3E, a second conductive element 250 is formed on the second sub-insulating layer 240. In detail, in the present embodiment, the first sub-portion second conductive element 253 is electrically connected to the touch electrode 210 through the contact window 240a of the second sub-insulating layer 240 and the third via pattern 231, and the second sub-portion second conductive element 254 is electrically connected to the peripheral electrode 211 through the contact window 240b of the second sub-insulating layer 240 and the sub-portion third via pattern 232. In this way, the touch substrate 2 of the present embodiment is completed.

Fig. 4A to 4C are schematic sectional views illustrating an assembly process of the touch display panel 10 according to an embodiment of the invention. The pixel array substrate 1 and the touch substrate 2 of fig. 3E can be assembled by the process shown in fig. 4A to 4C to form the touch display panel 10 shown in fig. 1, which is illustrated in conjunction with fig. 4A to 4C.

Referring to fig. 4A, first, a touch substrate 2 is provided. Next, the sealing member 300 is coated in the groove 241 of the touch substrate 2, so that the sealing member 300 contacts with the surface 241a of the groove 241 of the second sub-insulating layer 240 and the sidewall of the through hole 241 b. Referring to fig. 4B, the pixel array substrate 1 is disposed opposite to the touch substrate 2, such that the sealing member 300 is disposed between the groove 141 of the pixel array substrate 1 and the groove 241 of the second sub-insulating layer 240, the touch electrode 210 and the shielding electrode 230 of the touch substrate 2 are overlapped with the pixel structure PX of the pixel array substrate 1 in a third direction D3, and the second conductive element 250 of the touch substrate 2 is overlapped with the protrusion 151 of the pixel array substrate 1, wherein the third direction D3 is perpendicular to the second direction D2. The shielding electrode 230 is located between the touch electrode 210 and the pixel structure PX.

Referring to fig. 4C, the pixel array substrate 1 and the touch substrate 2 are then assembled, such that the sealing member 300 located in the groove 241 of the touch substrate 2 contacts the surface (i.e., the surface 140e and the sidewall of the through hole 150 e) of the groove 141 of the pixel array substrate 1. In particular, in the present embodiment, the first conductive element 160 covering the protrusion 151 and the second conductive element 250 on the second substrate 200 are abutted to electrically contact each other. In detail, the first sub-portion first conductive element 163 covering the second protrusion 153 and the first sub-portion second conductive element 253 on the second substrate 200 abut against each other to be in electrical contact, so that the touch electrode 210 of the touch substrate 2 can be electrically connected to the pad 165 of the pixel array substrate 1 through the third via pattern 231, the first sub-portion second conductive element 253, the first sub-portion first conductive element 163 and the connection line 135, and the touch signal on the touch electrode 210 can be transmitted to the pad 165; similarly, the second sub-portion first conductive element 164 covering the third protrusion 154 and the second sub-portion second conductive element 254 on the second substrate 200 are abutted against each other to be electrically contacted, so that the peripheral electrode 211 of the touch substrate 2 can be electrically connected to the connection line 136 through the sub-portion third via pattern 232, the second sub-portion second conductive element 254 and the second sub-portion first conductive element 164, so that the peripheral electrode 211 of the touch substrate 2 has the above-mentioned reference potential through the connection line 136.

Then, the sealing member 300 is irradiated with the laser LR, so that the sealing member 300 can be sintered (Sintering) and cured, thereby fixing the touch substrate 2 and the pixel array substrate 1. Thus, the touch display panel 10 of the present embodiment is completed, wherein the touch display panel 10 of fig. 4C is the touch display panel 10 of fig. 1. In the present embodiment, since the light-shielding circuit of the sealing area SA of the touch substrate 2 is less, it is preferable that the laser beam LR is transmitted from the outside of the sealing area SA of the second substrate 200 to the inside of the touch display panel 10 to irradiate the sealing member 300, but the present invention is not limited thereto.

Referring to fig. 1, it is noted that by disposing the sealing member 300 in the groove 241 of the touch substrate 2, the contact surface area between the sealing member 300 and the touch substrate 2 can be increased, and thus the adhesion between the sealing member 300 and the touch substrate 2 is improved, so as to increase the reliability of the touch display panel 10. Particularly, in the embodiment, the sealing member 300 contacts the surface of the groove 241 (i.e., the surface 241a and the sidewall of the through hole 241 b), and the properties of the surface 241a of the first sub-insulating layer 220 and the sidewall of the through hole 241b defining the groove 241 are similar to the properties of the material of the sealing member 300, so that the adhesion between the sealing member 300 and the surface of the groove 241 (i.e., the surface 241a and the sidewall of the through hole 241 b) is stronger than the adhesion between the sealing member 300 and the surface of the second substrate 200 (e.g., glass), which is helpful for improving the reliability of the touch display panel 10.

In the present embodiment, the protrusion 151 has a top surface 151t far from the first substrate 100, and a projection area of the top surface 151t on the first substrate 100 is A, and is 1 μm²≤A≤10000μm²Therefore, the contact resistance between the first conductive element 160 disposed on the top surface 151t of the protrusion 151 and the second conductive element 250 of the touch substrate 2 can be considered, and the size of the protrusion 151 is not too large to support the pixel array substrate 1 and the touch substrate 2. In addition, the distance between the top surface 151t of the protrusion 151 and the first substrate 100 is H1, the distance between the top surface 185t of the isolation structure 185 and the first substrate 100 is H2, andh2 is less than or equal to H1. For example, in the embodiment, the distance H1 between the top surface 151t of the protrusion 151 and the first substrate 100 is greater than the distance H2 between the top surface 185t of the isolation structure 185 and the first substrate 100. That is, the isolation structures 185 with smaller height than the protrusions 151 can prevent the second conductive elements 250 on the second substrate 200 from separating from the first conductive elements 160 on the protrusions 151, so as to improve the contact success rate between the first conductive elements 160 and the second conductive elements 250.

Referring to fig. 1 and 2, in the present embodiment, on a projection plane parallel to the first substrate 100, the sealing element 300 has a neck portion 300a, and a line width W1 of the neck portion 300a is smaller than a line width W2 of other portions of the sealing element 300. The neck 300a is the start and end of the sintering path of the package laser; that is, the neck portion 300a of the sealing member 300 is sintered at least twice and thus has a narrow line width W1. On a projection plane parallel to the first substrate 100, the neck 300a has a first projection P1, the first protrusion 152 has a second projection P2, and the shortest distance between the first projection P1 and the second projection P2 on the projection plane parallel to the first substrate 100 is L, wherein L is greater than or equal to 1 mm. Since the neck portion 300a of the sealing member 300 is sintered at least twice, the adhesion force of the neck portion 300a is lower than that of other portions of the sealing member 300, and the proper distance L is maintained between the neck portion 300a and the first protrusion 152, so that the pixel array substrate 1 and the touch substrate 2 can be prevented from being spread by the first protrusion 152 due to the reduced adhesion force of the sealing member 300 on the neck portion 300 a.

In summary, in the touch display panel of the embodiments of the invention, the sealing element is disposed in the groove of the insulating layer of the touch substrate, so that the contact surface area between the sealing element and the touch substrate is increased, and the adhesion between the sealing element and the touch substrate is further improved, thereby improving the reliability of the touch display panel. Particularly, in one embodiment, the sealing member contacts the surface of the recess of the touch substrate, and the properties of the surface of the first sub-insulating layer defining the recess and the sidewall of the through hole are similar to the properties of the material of the sealing member, so that the adhesion between the sealing member and the surface of the recess is stronger than the adhesion between the sealing member and the surface of the second substrate (e.g., glass), which is helpful to further improve the reliability of the touch display panel.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. A touch display panel, comprising:

a first substrate having a display region, a peripheral region and a sealing region sequentially arranged from the inside of the first substrate to the edge of the first substrate;

a plurality of pixel structures disposed in the display region of the first substrate;

a protrusion disposed on the peripheral region of the first substrate;

a first conductive element covering the protrusion;

a second substrate disposed opposite to the first substrate;

a touch electrode disposed on the second substrate and overlapping with the at least one pixel structure;

an insulating layer disposed on the second substrate and covering the touch electrode, wherein the insulating layer has a groove;

the second conductive element is arranged on the insulating layer and electrically connected with the touch electrode, and the first conductive element covering the bulge and the second conductive element positioned on the second substrate are mutually abutted and electrically contacted; and

and the sealing element is arranged between the sealing area of the first substrate and the groove of the insulating layer so as to connect the first substrate and the second substrate, wherein the sealing element is in contact with one surface of the groove of the insulating layer.

2. The touch display panel of claim 1, further comprising:

a shielding electrode disposed on the second substrate and located between the touch electrode and at least one pixel structure, wherein the insulating layer includes:

a first sub-insulating layer covering the touch electrode, wherein the shielding electrode is disposed on the first sub-insulating layer; and

and a second sub-insulating layer covering the shielding electrode, wherein the groove of the insulating layer is defined by a surface of the first sub-insulating layer facing the first substrate and a sidewall of a through hole of the second sub-insulating layer.

3. The touch display panel of claim 2, wherein the second sub-insulating layer further comprises a contact hole, and the second conductive element is electrically connected to the touch electrode through the contact hole.

4. The touch display panel of claim 1, wherein the insulating layer is made of silicon oxide.

5. The touch display panel of claim 1, wherein the sealing member is made of silicon oxide, boron, bismuth, or a combination thereof.

6. The touch display panel of claim 1, wherein the first substrate further has a bonding area, the display area, the peripheral area, the sealing area, and the bonding area are sequentially arranged from an inner portion of the first substrate to an edge of the first substrate, and the touch display panel further comprises:

a connecting line disposed on the first substrate and extending from the peripheral region to the bonding region to cross the sealing region;

a protective layer disposed on the connection line and having a contact window, wherein the first conductive element covering the protrusion is electrically connected to the connection line via the contact window of the protective layer, and the sealing member is in contact with the protective layer; and

and the connecting pad is arranged in the joint area, and the first conductive element covering the bulge is electrically connected to the connecting pad through the connecting wire.

7. The touch display panel of claim 6, wherein the passivation layer is made of silicon nitride, silicon oxide, or a combination thereof.

8. The touch display panel of claim 1, wherein each of the pixel structures comprises:

an active element disposed on the first substrate;

a first electrode electrically connected to the active device;

a pixel defining layer disposed on the first electrode and having an opening overlapping the first electrode;

a light-emitting pattern disposed in the opening of the pixel defining layer; and

a second electrode disposed on the light-emitting pattern, wherein the touch display panel further includes:

the isolation structure is arranged on the pixel definition layer and isolates the light-emitting patterns of two adjacent pixel structures;

wherein, the distance between a top surface of the protrusion and the first substrate is H1, the distance between a top surface of the isolation structure and the first substrate is H2, and H2 is not less than H1.

9. The touch display panel of claim 1, wherein the protrusion has a top surface far from the first substrate, a projection area of the top surface on the first substrate is A, and 1 μm²≤A≤10000μm²。

10. The touch display panel of claim 1, wherein the sealing member has a neck portion on a projection plane parallel to the first substrate, the neck portion has a first projection, the protrusion has a second projection, and a shortest distance between the first projection and the second projection on the projection plane parallel to the first substrate is L ≧ 1 mm.