CN108896784A - A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits - Google Patents
A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits Download PDFInfo
- Publication number
- CN108896784A CN108896784A CN201810611835.9A CN201810611835A CN108896784A CN 108896784 A CN108896784 A CN 108896784A CN 201810611835 A CN201810611835 A CN 201810611835A CN 108896784 A CN108896784 A CN 108896784A
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- chip
- shell
- mems accelerometer
- substrate
- servo circuit
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacture Of Switches (AREA)
Abstract
A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits are made of thick film hybrid integrated circuit technique, are dived chamber packed by metal casing with dual-in-line, inside is filled with nitrogen protection.The present invention can reliably work in 175 DEG C of environment for a long time, and small volume, can assemble with mems accelerometer gauge outfit perfection, form integral structure, high temperature, high pressure in oil drilling work and when strong vibration, long-term stable operation.
Description
Technical field
The invention belongs to servo circuit fields, and in particular to a kind of 175 DEG C of differential capacitance type mems accelerometers servo electricity
Road.
Background technique
Differential capacitance type mems accelerometer is a kind of inertia type instrument, using inertia force to the acceleration of its sensitive axis direction
It measures, is widely used in the fields such as inertial navigation, oil drilling, oil-gas exploration, groundwork detection.It is answered in field of oil drilling
Used time, mems accelerometer are installed on the position close to drill bit, and the measurement based on acceleration of gravity can measure the appearance of drill bit
State location information, submits necessary information to directed drilling.Since drilling depth is deeper, temperature is higher, is widely used at present
For its temperature of drilling depth up to 175 DEG C, this requires mems accelerometers can work reliably and with long-term at a high temperature of 175 DEG C.
In order to meet the high-temperature working performance of mems accelerometer, matched servo circuit module also want can 175
It works at a high temperature of DEG C.Domestic mems accelerometer servo circuit is widely used within 125 DEG C at present, is not able to satisfy petroleum
The hot operation requirement of drilling well.In addition to high temperature requirement, drill bit can generate greatly vibration and impact in drilling process, this
It is required that accelerometer and accelerometer servo circuit module have high anti-vibration and shock proof requirement.
Summary of the invention
In order to overcome the above problems existing in the prior art, the purpose of the present invention is to provide 175 DEG C of MEMS of one kind
Accelerometer servo circuit is produced using thick film hybrid integrated circuit technique, using heat-resisting material and element manufacturing, Ke Yichang
Phase reliably works in 175 DEG C of environment, and small volume and mems accelerometer gauge outfit perfection assembly, forms integration knot
Structure, high temperature, high pressure in oil drilling work and when strong vibration being capable of long-term stable operations.
The 175 DEG C of mems accelerometer servo circuits provided according to a first aspect of the present invention, including shell, lead and shell
Lid is dived chamber packed by metal casing using dual-in-line, and inside is filled with nitrogen protection, which is characterized in that the shell uses biserial
Straight cutting is dived chamber metal shell, and the material of the shell and lead is that can cut down, and the shell and wire surface are gold-plated to prevent block,
Inside is made of ceramic substrate, IC chip, multi-layer ceramic capacitance and other auxiliary materials, and the ceramic substrate is printed by thick film
Brush sintering makes golden conduction band and thick-film resistor thereon, is welded together by high-temperature-resistant soldering tin and outer casing bottom, the ceramics
Conductive adhesive IC chip and chip ceramic condenser are used on substrate, it is using spun gold that said chip and the golden conduction band is mutual
Even, cap and shell are carried out by welding encapsulation by parallel seam sealing machine.
According to the present invention, after high temperature ageing and test, in the environment of nitrogen protection, with parallel seam sealing machine by cap
Welding encapsulation is carried out with shell, so that product completes encapsulation.In entire encapsulation process, the equipment needed can have heating
Platform, high temperature drying case, digital multimeter make test fixture, parallel seam sealing machine etc. by oneself.
According to mems accelerometer servo circuit described in above-mentioned first aspect, it is characterised in that：The ceramic substrate is using high
The thick-film resistor and golden conductor are made on the ceramic substrate by warm sintering process, the ceramic condenser and integrated electricity
Road chip is connected on substrate using high-temperature electric conduction gluing.
According to mems accelerometer servo circuit described in above-mentioned first aspect, it is characterised in that：The ceramic substrate is logical
It crosses high temperature scolding tin and welds together with shell can be cut down.
According to mems accelerometer servo circuit described in above-mentioned first aspect, it is characterised in that：The ic core
The connection type of golden conductor is gold ball bonding on piece and the substrate, with the spun gold by the pad of chip（PAD）With golden conductor
Under 150 DEG C of high temperature, bonding connection is carried out by ultrasound.
175 DEG C of mems accelerometer servo circuits according to the present invention can be realized reliable in 175 DEG C of environment for a long time
Work and mems accelerometer gauge outfit can be rated as perfect assembly, form integral structure, high temperature, height in oil drilling work
In the case of pressure and strong vibration, long-term stable operation can be realized.
According to the second aspect of the invention, a kind of system of 175 DEG C of differential capacitance type mems accelerometer servo circuits is provided
Make method, which is characterized in that the shell of the servo circuit is using the latent chamber metal of dual-in-line, the material use of shell and lead
It can cut down, it is gold-plated in the shell and wire surface, it to prevent block, is sintered by thick film screen printing, wheat flour is made on a ceramic substrate
Then golden conduction band and thick-film resistor are welded together ceramic substrate and outer casing bottom by high-temperature-resistant soldering tin, in ceramic substrate
It is upper to use conductive adhesive IC chip and chip ceramic condenser, then with spun gold by chip and golden conduction band interconnection, through excessively high
After warm aging and test, in the environment of nitrogen protection, cap and shell are subjected to welding encapsulation with parallel seam sealing machine, thus complete
At the production of servo circuit.
According to the production method of mems accelerometer servo circuit described in above-mentioned second aspect, it is characterised in that：It is described
Ceramic substrate uses high-sintering process, by thick-film resistor and the production of golden conductor on substrate, the ceramic condenser and integrates
Circuit chip uses on high-temperature electric conduction glue sticking and substrate.
According to the production method of mems accelerometer servo circuit described in above-mentioned second aspect, it is characterised in that：It is described
Ceramic substrate is welded together by high temperature scolding tin with that can cut down shell.
According to the production method of mems accelerometer servo circuit described in above-mentioned second aspect, it is characterised in that：It is described
The connection type of golden conductor is gold ball bonding on IC chip and substrate, with spun gold by the pad of chip（PAD）It is led with gold
Body carries out bonding connection under 150 DEG C of high temperature, through ultrasound.
Detailed description of the invention
Fig. 1 is the overall schematic for showing the specific embodiment of mems accelerometer servo circuit of the present invention；
Fig. 2 is the pin row for showing the specific embodiment of mems accelerometer servo circuit of the present invention and preparation method thereof
List intention；
Fig. 3 is the circuit original for showing the specific embodiment of mems accelerometer servo circuit of the present invention and preparation method thereof
Reason figure；
Fig. 4 is the outside drawing for showing the specific embodiment of mems accelerometer servo circuit of the present invention；
Appended drawing reference in figure：
1. shell M24065Q can be cut down；2. ceramic substrate；3,4,5,6. IC chip；7,8. multi-layer ceramic capacitance；10. piece
Formula resistance；11. spun gold；
Specific embodiment
With reference to the accompanying drawings, in conjunction with specific embodiments, 175 DEG C of differential capacitor mems accelerometers provided by the invention are watched
Circuit and preparation method thereof is taken, is described in detail.Those skilled in the art will recognize that the restriction is exemplary, the present invention
It is not limited in the specific embodiment.
Fig. 1 shows the entirety of the specific embodiment of mems accelerometer servo circuit of the present invention and preparation method thereof
Schematic diagram.Fig. 2 shows the pins of the specific embodiment of mems accelerometer servo circuit of the present invention and preparation method thereof
Arrange schematic diagram.Fig. 3 shows the specific embodiment of mems accelerometer servo circuit of the present invention and preparation method thereof
Circuit diagram.
Referring to figure 1 ~ 4, the shell of the mems accelerometer servo circuit of the embodiment of the present invention is latent using dual-in-line
The material of chamber metal shell, shell and lead is that can cut down, and shell and wire surface are gold-plated, prevent from aoxidizing.The MEMS acceleration
It is made of inside meter servo circuit ceramic substrate, IC chip, capacitor and other auxiliary materials, ceramic substrate passes through thick film screen printing
Sintering, golden conduction band and thick-film resistor is produced on above, then ceramic substrate is welded on by high-temperature-resistant soldering tin and outer casing bottom
Together.Conductive adhesive IC chip and sheet capacitor are used on ceramic substrate, it is then with spun gold that chip and golden conduction band is mutual
Even.After high temperature ageing and test, cap and shell are subjected to welding encapsulation with parallel seam sealing machine, product just completes.Fig. 2
It is mems accelerometer servo circuit Pin arrangement figure, as shown in Fig. 2, 1 foot is NC sky foot, 2 feet are VEE negative power end, and 3 feet are
TP test lead, 4 feet are F1 feedback end, and 5 feet are GND ground terminal, and 6 feet are IN signal input part, and 7 feet are NC sky foot, and 8 feet are G increasing
Benefit selection end, 9 feet are OUT DC voltage output end, and 10 feet are F3 feedback end, and 11 feet are cage connection end, and 12 feet are NC sky foot,
13 feet be NC sky foot, 14 feet be the external average value capacitance terminal of C, 15 feet be GND ground terminal, 16 feet be NC sky foot, 17 feet be VCC just
Power end, 18 feet are NC sky foot, and 19 feet are F2 feedback end, and 20 feet, 21 feet, 22 feet, 23 feet, 24 feet are NC sky foot.MEMS accelerates
The degree meter specific inner connecting way of servo circuit is as follows：6 foot IN are connected with the left end of 100K resistance R1, with 100K resistance R2
Left end be connected.The right end of resistance R1 is connected with 6 foot of inverting input terminal of operational amplifier U1B, with NPN triode Q1
Collector is connected.The base earth of NPN triode Q1, emitter are connected with the collector of NPN triode Q2, the base stage of Q2
It is connected with the collector of Q2, the emitter of Q2 is connected with 7 foot of output end of operational amplifier U1B.Operational amplifier U1B's
8 feet are connected with positive supply VDD, and 4 feet of U1B are connected with negative supply VEE, and 5 foot of non-inverting input terminal of U1B is connected to the ground.
6 foot of inverting input terminal of operational amplifier U1B is connected with the right end of 100K resistance R4.The right end and fortune of resistance R2
2 foot of inverting input terminal for calculating amplifier U1A is connected, and the right end of resistance R2 is connected with the left end of 100K resistance R3, resistance R2
Right end be connected with the anode of diode D1.The right end of resistance R3 is connected with the left end of resistance R4.The right end of resistance R3 with
The cathode of diode D2 is connected.The cathode of diode D1 is connected with the anode of diode D2.The cathode and fortune of diode D1
Calculate amplifier U1A 1 foot of output end be connected, 8 feet of operational amplifier U1A are connected with positive supply VDD, 4 feet of U1A with bear
Power supply VEE is connected, and 3 foot of non-inverting input terminal of U1A is connected to the ground.7 foot of output end of operational amplifier U1B and tri- pole NPN
The emitter of pipe Q3 is connected, and the collector of Q3 is connected with 2 foot of inverting input terminal of operational amplifier U2A, the collector of Q3
It is connected with the left end of 200K resistance R8, the collector of Q3 is connected with average value capacitance terminal C.The base stage and NPN triode of Q3
The emitter of Q4 is connected, and the base stage of NPN triode Q4 is connected to the ground, the base stage of Q3 and the output end of operational amplifier U2B
7 feet are connected.The collector of Q4 is connected with 6 foot of inverting input terminal of operational amplifier U2B.The collector and 100K resistance of Q4
The left end of R7 is connected.8 feet of operational amplifier U2B are connected with positive supply VDD, and 4 feet of U2B are connected with negative supply VEE,
5 foot of non-inverting input terminal of U2B is connected to the ground.The right end of resistance R7 is connected with feedback end F2.The right end of resistance R8 and operation
1 foot of output end of amplifier U2A is connected,
1 foot of output end of operational amplifier U2A is connected with feedback end F1,1 foot of output end and the 200K electricity of operational amplifier U2A
The right end of resistance R9 is connected.8 feet of operational amplifier U2A are connected with positive supply VDD, and 4 feet of U2A are connected with negative supply VEE
It connects, 3 foot of non-inverting input terminal of U2A is connected to the ground.The right end of resistance R9 is connected with the right end of 200K resistance R10, resistance R9
The right end of 105 capacitor C4 of right end be connected.The left end of capacitor C4 is connected with 1 foot of output end of operational amplifier U3A, operation
1 foot of output end of amplifier U3A is connected with 2 foot of inverting input terminal of operational amplifier U3A, the output of operational amplifier U3A
1 foot is held to be connected with feedback end F3.The left end of resistance R10 is connected with 3 foot of non-inverting input terminal of operational amplifier U3A, resistance
The left end of R10 is connected with the lower end of 105 capacitor C3, and the upper end of capacitor C3 is connected to the ground.The output end of operational amplifier U3A
1 foot is connected with the right end of 200K resistance R11, and the left end of resistance R11 is connected with the right end of 200K resistance R12, resistance R11's
Left end is connected with the right end of 105 capacitor C2, and the left end of resistance R12 is connected with 105 lower end capacitor C1, and capacitor C1's is upper
End is connected to the ground.The left end of resistance R12 is connected with 5 foot of non-inverting input terminal of operational amplifier U3B.The left end of capacitor C2 with
7 foot of output end of operational amplifier U3B is connected, the left end phase of 7 foot of output end and 100K resistance R14 of operational amplifier U3B
Connection, 7 foot of output end of operational amplifier U3B are connected with signal output end OUT.The right end and 100K resistance R13 of resistance R14
Lower end be connected, the right end of resistance R14 is connected with 6 foot of inverting input terminal of operational amplifier U3B.The upper end of resistance R13
It is connected to the ground.
Fig. 4 is the outside drawing for showing the specific embodiment of mems accelerometer servo circuit of the present invention.Figure subscript
The unit of the product of note is millimeter.In the embodiment of the present invention, mems accelerometer servo circuit outer dimension is 35 millimeters of length, wide
It is 20.29 millimeters, 5.2 millimeters high.15.24 millimeters of two rows of lead spacing, 2.54 millimeters of adjacent legs spacing.Share 24 leads
（12 are only shown in figure）, pin cross section is round, and 0.5 millimeter of diameter.
To sum up, the present invention is described in detail referring to specific embodiment, those skilled in the art will recognize that the explanation
It is exemplary, various changes and modification can be made on its basis, without departing from the various of present inventive concept and spirit
Change and modification should all be fallen within scope of the invention, and protection scope of the present invention has the appended claims restriction.
Claims (8)
1. a kind of mems accelerometer servo circuit, including shell, lead and cap, dived chamber metal shell envelope using dual-in-line
Dress, inside is filled with nitrogen protection, which is characterized in that the shell is dived chamber metal shell using dual-in-line, the shell and is drawn
The material of line is that can cut down, and the shell and wire surface are gold-plated to prevent block, it is internal by ceramic substrate, IC chip,
Multi-layer ceramic capacitance and other auxiliary materials composition, the ceramic substrate are sintered by thick film screen printing, make golden conduction band and thickness thereon
Film resistance is welded together by high-temperature-resistant soldering tin and outer casing bottom, and conductive adhesive integrated circuit is used on the ceramic substrate
Chip and chip ceramic condenser, using spun gold by said chip and the golden conduction band interconnection, by parallel seam sealing machine by cap with
Shell carries out welding encapsulation.
2. according to mems accelerometer servo circuit described in the claims 1, it is characterised in that：The ceramic substrate uses
The thick-film resistor and golden conductor are made on the ceramic substrate by high-sintering process, the ceramic condenser and integrated
Circuit chip is connected on substrate using high-temperature electric conduction gluing.
3. according to mems accelerometer servo circuit described in the claims 1, it is characterised in that：The ceramic substrate passes through
High temperature scolding tin welds together with that can cut down shell.
4. according to mems accelerometer servo circuit described in the claims 1, it is characterised in that：The IC chip
Connection type with conductor golden on the substrate is gold ball bonding, with the spun gold by the pad of chip（PAD）Exist with golden conductor
Under 150 DEG C of high temperature, bonding connection is carried out by ultrasound.
5. a kind of production method of mems accelerometer servo circuit, which is characterized in that the shell of the servo circuit is using double
Column straight cutting is dived chamber metal, and the material of shell and lead is gold-plated in the shell and wire surface using can cut down, to prevent block,
It is sintered by thick film screen printing, wheat flour makees golden conduction band and thick-film resistor on a ceramic substrate, then will be ceramic by high-temperature-resistant soldering tin
Substrate welds together with outer casing bottom, uses conductive adhesive IC chip and chip ceramic condenser on a ceramic substrate,
Then with spun gold by chip and golden conduction band interconnection, after high temperature ageing and test, in the environment of nitrogen protection, with parallel seam
Cap and shell are carried out welding encapsulation by welding machine, to complete the production of servo circuit.
6. according to the production method of mems accelerometer servo circuit described in the claims 5, it is characterised in that：The pottery
Porcelain substrate uses high-sintering process, on thick-film resistor and golden conductor production and substrate, the ceramic condenser and integrated electricity
Road chip uses on high-temperature electric conduction glue sticking and substrate.
7. according to the production method of mems accelerometer servo circuit described in the claims 5, it is characterised in that：The pottery
Porcelain substrate is welded together by high temperature scolding tin with that can cut down shell.
8. according to the production method of mems accelerometer servo circuit described in the claims 5, it is characterised in that：The collection
Connection type at conductor golden on circuit chip and substrate is gold ball bonding, with spun gold by the pad of chip（PAD）With golden conductor
Under 150 DEG C of high temperature, bonding connection is carried out by ultrasound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611835.9A CN108896784A (en) | 2018-06-14 | 2018-06-14 | A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810611835.9A CN108896784A (en) | 2018-06-14 | 2018-06-14 | A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits |
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| Publication Number | Publication Date |
|---|---|
| CN108896784A true CN108896784A (en) | 2018-11-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810611835.9A Pending CN108896784A (en) | 2018-06-14 | 2018-06-14 | A kind of 175 DEG C of differential capacitance type mems accelerometer servo circuits |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579626A (en) * | 2019-10-22 | 2019-12-17 | 西安微电子技术研究所 | Miniature metal full-sealed quartz flexible accelerometer servo circuit and processing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201498510U (en) * | 2009-09-22 | 2010-06-02 | 贵州振华风光半导体有限公司 | High-reliability thick film hybrid integrated circuit bonding system |
| CN103681364A (en) * | 2013-12-19 | 2014-03-26 | 贵州振华风光半导体有限公司 | Integration method of lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit |
| CN205584014U (en) * | 2016-03-14 | 2016-09-14 | 青岛汉源传感技术有限公司 | A DCDC power supply circuit for under 150 DEG C of high temperature environment |
-
2018
- 2018-06-14 CN CN201810611835.9A patent/CN108896784A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201498510U (en) * | 2009-09-22 | 2010-06-02 | 贵州振华风光半导体有限公司 | High-reliability thick film hybrid integrated circuit bonding system |
| CN103681364A (en) * | 2013-12-19 | 2014-03-26 | 贵州振华风光半导体有限公司 | Integration method of lead-less ball pin surface mounting type high-density thick-film hybrid integrated circuit |
| CN205584014U (en) * | 2016-03-14 | 2016-09-14 | 青岛汉源传感技术有限公司 | A DCDC power supply circuit for under 150 DEG C of high temperature environment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110579626A (en) * | 2019-10-22 | 2019-12-17 | 西安微电子技术研究所 | Miniature metal full-sealed quartz flexible accelerometer servo circuit and processing method thereof |
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