CN108896107B - Single-bus temperature and humidity integrated sensor chip and communication method thereof - Google Patents
Single-bus temperature and humidity integrated sensor chip and communication method thereof Download PDFInfo
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Abstract
The invention provides a single-bus temperature and humidity integrated sensor chip and a communication method thereof, wherein the single-bus temperature and humidity integrated sensor chip comprises the following steps: the device comprises a temperature sensing unit, a humidity sensing unit, a selector, an analog-to-digital converter, a register group, a single bus interface and an alarm circuit; the temperature sensing unit and the humidity sensing unit are connected with the analog-to-digital converter through the selector, the analog-to-digital converter, the single bus interface and the alarm circuit are respectively connected with the register, and the single bus interface is in data communication with an external single bus, receives a temperature and humidity conversion command from the outside and sends temperature information, humidity information and alarm information to the outside. The temperature and humidity sensor of single-wire data communication can realize the purposes of stability and reliability of long-distance transmission and multipoint real-time monitoring, and has the advantages of simple system design, low cost and convenience for system management and maintenance.
Description
Technical Field
The invention relates to the technical field of electronic circuits, in particular to a single-bus temperature and humidity integrated sensor chip and a communication method thereof.
Background
At present, the monitoring of the intelligent temperature and humidity only exists in single-point detection. In the aspect of storage management, soil detection and medicine logistics, the temperature and humidity are integrally monitored, the cost of the system is inevitably improved by using the temperature and humidity sensor with the I2C interface, and the long-distance transmission stability of the system is also reduced.
The temperature and humidity integrated design solves the problems of interference and long conversion time of discrete temperature-sensitive resistors and humidity-sensitive resistor components. However, the humidity sensitive resistor has a phenomenon of high process deviation and poor consistency, so that a false alarm phenomenon of system software is caused.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a single-bus temperature and humidity integrated sensor chip and a communication method thereof.
According to the invention, the single-bus temperature and humidity integrated sensor chip provided by the invention comprises: the device comprises a temperature sensing unit, a humidity sensing unit, a selector, an analog-to-digital converter, a register group, a single bus interface and an alarm circuit;
the temperature sensing unit and the humidity sensing unit are connected with the analog-to-digital converter through the selector, the analog-to-digital converter, the single bus interface and the alarm circuit are respectively connected with the register, and the single bus interface is in data communication with an external single bus, receives a temperature and humidity conversion command from the outside and sends temperature information, humidity information and alarm information to the outside;
the register group includes: the system comprises a temperature register low bit, a temperature register high bit, a humidity register low bit, a humidity register high bit, a TH register, a TL register, an HH register, a configuration register and a check register.
Preferably, the single bus data communication includes:
the outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the number of the first and second groups,
the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
Preferably, the Activation command is a continuous low-level signal, and the duration is greater than 220us and less than 1 s; and the single-bus temperature and humidity integrated sensor chip replies an Activation response with a low level of 120us continuously to the received Activation command.
Preferably, the DEV command includes an external command sent to the single-bus integrated temperature and humidity sensor chip through the single bus:
the method comprises the steps that a Read DEV command is given, and the single-bus temperature and humidity integrated sensor chip sends chip information to the outside after receiving the Read DEV command;
a Match DEV command, namely judging whether the received chip information is matched with the chip information of the single-bus temperature and humidity integrated sensor chip, if not, returning to an activation stage, and if so, entering an inquiry and operation stage;
the method comprises the steps that a Search DEV command is given, a single-bus temperature and humidity integrated sensor chip responds and sends chip information and a chip information negation result, confirmed chip information is returned after the chip information is identified from the outside, after the single-bus temperature and humidity integrated sensor chip receives the chip information, if the confirmed chip information is not consistent with the chip information, an activation stage is returned, and if the confirmed chip information is matched with the chip information, an inquiry and operation stage is started;
a Temp Alarm command is sent by the outside to identify whether a single bus temperature and humidity integrated sensor chip for temperature Alarm exists in the single bus or not;
the method comprises the steps that a Humi Alarm command is sent to the outside, and whether a single-bus temperature and humidity integrated sensor chip for humidity Alarm exists in a single bus or not is identified by the outside through sending the Humi Alarm command;
skip commands, ignoring the identification information, thus directly entering the query and operation phase.
Preferably, the FUNC command includes an instruction sent from the outside to the single-bus integrated temperature and humidity sensor chip via the single bus:
a Convert Temp command, wherein the single-bus temperature and humidity integrated sensor chip sends temperature conversion after receiving the Convert Temp command;
a Convert Humi command, wherein the single-bus temperature and humidity integrated sensor chip sends humidity conversion after receiving the Convert Humi command;
a Convert Temp & Humi command, wherein the single-bus temperature and humidity integrated sensor chip generates temperature and humidity conversion after receiving the Convert Temp & Humi command;
after receiving the Copy Scratcchpad command, the single-bus temperature and humidity integrated sensor chip writes the values of the TH register, the TL register and the HH register into an internal nonvolatile storage unit;
the method comprises the steps that a Write Scratcchpad command is received by a single-bus temperature and humidity integrated sensor chip, and then data are written into a TH register, a TL register, a configuration register and an HH register;
a Read Scratcrachpad command, wherein the single-bus temperature and humidity integrated sensor chip sends the value and check byte of the register after receiving the Read Scratcrachpad command;
the method comprises the following steps that (1) a Recall Mem command is received by a single-bus temperature and humidity integrated sensor chip, and then data stored in an internal nonvolatile storage unit are read back to a corresponding register;
and after the single-bus temperature and humidity integrated sensor chip receives the Read Power Supply command, if the command is parasitic Power Supply, 0 is replied, and if the command is parasitic Power Supply, 1 is replied.
Preferably, the FUNC command further includes:
and other commands, if the single-bus temperature and humidity integrated sensor chip receives other commands, returning to the activation stage.
Preferably, after the single-bus temperature and humidity integrated sensor chip receives the Read scratch pad command, the value and the check byte of the register sent by the single-bus temperature and humidity integrated sensor chip include:
byte 0: the low bit of the temperature register; byte 1: the high position of the temperature register; byte 2: a TH register; byte 3: a TL register; byte 4: a configuration register; byte 5: the humidity register is low; byte 6: a humidity register is high; byte 7: an HH register; byte 8: and checking the register.
Preferably, the humidity sensing unit is in contact with the outside air through an opening in a package of the single-bus integrated temperature and humidity sensor chip.
According to the communication method of the single-bus temperature and humidity integrated sensor chip provided by the invention, the single-bus temperature and humidity integrated sensor chip is in data communication with an external single bus through a single-bus interface, receives a temperature and humidity conversion command from the outside and sends temperature information, humidity information and alarm information to the outside.
Preferably, the single bus data communication includes:
the outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the number of the first and second groups,
the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
Compared with the prior art, the invention has the following beneficial effects:
the temperature and humidity sensor of single-wire data communication can realize the purposes of stability and reliability of long-distance transmission and multipoint real-time monitoring, and has the advantages of simple system design, low cost and convenience for system management and maintenance.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a front view of a single bus integrated temperature and humidity sensor chip according to the present invention;
FIG. 2 is a left side view of a single bus integrated temperature and humidity sensor chip according to the present invention;
FIG. 3 is a schematic diagram of an internal circuit of the single-bus temperature and humidity integrated sensor chip according to the present invention;
FIG. 4 is a single-wire communication protocol of the single-bus temperature and humidity integrated sensor chip of the present invention;
FIG. 5 is a single-wire communication protocol of the single-bus temperature and humidity integrated sensor chip of the present invention;
FIG. 6 is a schematic diagram showing the composition of three sequences according to the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1 to 3, the single-bus temperature and humidity integrated sensor chip provided by the present invention includes: the device comprises a temperature sensing unit, a humidity sensing unit, a selector, an analog-to-digital converter, a register group, a single bus interface and an alarm circuit. Except for the power supply V pin and the common ground G pin, only one D pin of the chip is connected with an external host. The humidity sensing unit is in contact with the outside air through an opening in the package. The radius of the opening is R. The center of the opening is at a distance D from the top edge. The distance from pin number 3 is H. Two different verification functions are provided: CRC and ECC.
The temperature sensing unit and the humidity sensing unit are connected with the analog-to-digital converter through the selector, the analog-to-digital converter, the single bus interface and the alarm circuit are respectively connected with the register, and the single bus interface is in data communication with an external single bus, receives a temperature and humidity conversion command from the outside and sends temperature information, humidity information and alarm information to the outside; the register group includes: the system comprises a temperature register low bit, a temperature register high bit, a humidity register low bit, a humidity register high bit, a TH register, a TL register, an HH register, a configuration register and a check register.
The single bus data communication mode comprises the following steps:
the outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
Specifically, the Activation command is a continuous low-level signal, and the duration is greater than 220us and less than 1 s; the single-bus temperature and humidity integrated sensor chip replies an Activation response lasting 120us of low level to the received Activation command.
The DEV command comprises the following steps that the DEV command is sent to a single-bus temperature and humidity integrated sensor chip through a single bus from the outside:
a Read DEV command (33h), and the single-bus temperature and humidity integrated sensor chip sends chip information to the outside after receiving the Read DEV command;
a Match DEV command (55h), the single-bus temperature and humidity integrated sensor chip judges whether the received chip information is matched with the chip information of the single-bus temperature and humidity integrated sensor chip, if not, the single-bus temperature and humidity integrated sensor chip returns to an activation stage, and if the chip information is matched, the single-bus temperature and humidity integrated sensor chip enters an inquiry and operation stage;
a Search DEV command (FOh), the single-bus temperature and humidity integrated sensor chip responds and sends the chip information and the result of the chip information negation, the chip information is returned to confirm after being identified externally, after the single-bus temperature and humidity integrated sensor chip receives the chip information, if the chip information is confirmed to be inconsistent with the chip information, the activation stage is returned, and if the chip information is matched with the chip information, the inquiry and operation stage is started;
a Temp Alarm command (ECh), wherein the exterior sends the Temp Alarm command to identify whether a single bus temperature and humidity integrated sensor chip for temperature Alarm exists in the single bus;
a Humi Alarm command (DCh), wherein the outside identifies whether a single bus temperature and humidity integrated sensor chip for humidity Alarm exists in the single bus by sending the Humi Alarm command;
skip command (CCh) ignores the identification information and thus goes directly to the query and operation phase.
The FUNC command comprises the following steps that the external single bus sends to the single bus temperature and humidity integrated sensor chip through the single bus:
a Convert Temp command (44h), wherein the single-bus temperature and humidity integrated sensor chip sends temperature conversion after receiving the Convert Temp command;
a Convert Humi command (C4h), wherein the single-bus temperature and humidity integrated sensor chip sends humidity conversion after receiving the Convert Humi command;
a Convert Temp & Humi command (8Ch), wherein the single-bus temperature and humidity integrated sensor chip generates temperature and humidity conversion after receiving the Convert Temp & Humi command;
a Copy Scratcratchpad command (48h), after receiving the Copy Scratcratchpad command, the single-bus temperature and humidity integrated sensor chip writes the values of the TH register, the TL register and the HH register into the internal nonvolatile storage unit;
a Write Scratchthpad command (4Eh), wherein the single-bus temperature and humidity integrated sensor chip writes data into a TH register, a TL register, a configuration register and an HH register after receiving the Write Scratchthpad command;
a ReadScaratchpad command (BEh), wherein the single-bus temperature and humidity integrated sensor chip sends the value and the check byte of the register after receiving the ReadScaratchpad command;
a Recall Mem command (B8h), wherein the single-bus temperature and humidity integrated sensor chip reads back data stored in the internal nonvolatile memory cell to a corresponding register after receiving the Recall Mem command;
a Read Power Supply command (B4h), after the single-bus temperature and humidity integrated sensor chip receives the Read Power Supply command, if the command is parasitic Power Supply, 0 is replied, otherwise, 1 is replied;
and other commands, if the single-bus temperature and humidity integrated sensor chip receives other commands, returning to the activation stage.
After the single-bus temperature and humidity integrated sensor chip receives the Read Scratcrachpad command, the value and check byte of the register sent by the single-bus temperature and humidity integrated sensor chip comprise:
Byte0 | low order of temperature register |
Byte1 | High order of temperature register |
Byte2 | TH register |
Byte3 | TL register |
Byte4 | Configuration register |
Byte5 | Humidity register lowBit |
Byte6 | High position of humidity register |
Byte7 | HH register |
Byte8 | Check register |
As shown in fig. 4 to 6, the single bus communication method and protocol mainly include three sequences, namely, an Activation Sequence, a DEVCommand Sequence, and a FUNC Command Sequence. The Activation Sequence is used to wake up the chip or to interrupt the current operation of the chip in preparation for a corresponding subsequent DEV Command. If the chip immediately sends an Active Response to the external host, the chip can pull down the single bus to indicate that the external host can continue to send the DEV Command; otherwise, the external host must exit the current transmit sequence and wait for the next wakeup. After entering the DEV Command Sequence, the external host sends an 8-bit DEV Command, and the chip enters the DEV response phase, providing chip information or providing temperature or humidity alarm information. After entering FUNC Command Sequence, the external host sends an 8-bit FUNC Command, so that temperature conversion, humidity conversion or temperature and humidity conversion can be carried out on the chip. The time of one transition is determined according to the values of R1 and R0 in the configuration register. When R1: 0 equals 2' b11, the time to switch is 55.92 milliseconds; 2' b10, transition time was 27.96 milliseconds; 2' b01, the transition time was 13.98 milliseconds; 2' b00, the transition time was 6.99 milliseconds.
The alarm of the sensor chip mainly comprises a temperature alarm mechanism and a humidity alarm mechanism. When FQ [1:0] in the configuration register is equal to 2' b00, once the temperature exceeds or equals to the value of the TH register with the high temperature threshold or the temperature is lower than the value registered by the TL with the low temperature threshold, the internal part of the chip sets the flag of Temp Alarm. Once the humidity exceeds or equals the value of the humidity high threshold HH register, the Humi Alarm flag is set internally to the chip. If the chip needs to switch the value of the over-threshold register twice in succession when FQ [1:0] equals 2' b01, the corresponding flag bit will be set. If the chip needs to switch the value of the over-threshold register four consecutive times when FQ [1:0] equals 2' b10, then the corresponding flag bit will be set.
The numerical representation of the temperature register according to the invention is shown in the following table. If the chip needs to switch over the threshold register value six consecutive times when FQ [1:0] equals 2' b11, then the corresponding flag bit will be set.
The low position of the temperature register is as follows:
Bit7 | Bit6 | Bit5 | Bit4 | Bit3 | | Bit1 | Bit0 | |
23 | 22 | 21 | 20 | 2-1 | 2-2 | 2-3 | 2-4 |
high-order of the temperature register:
Bit7 | Bit6 | Bit5 | Bit4 | Bit3 | Bit2 | Bit1 | Bit0 | |
S | S | | S | S | 26 | 25 | 24 |
data relationship of temperature
Temperature(℃) | Digtial Output(Binary) | Digital Output(Hex) |
125 | 0000 0111 1101 0000 | 0x07D0 |
85 | 0000 0101 0101 0000 | 0x0550 |
25.0625 | 0000 0001 1001 0001 | |
0 | 0000 0000 0000 0000 | 0x0000 |
-0.5 | 1111 1111 1111 1000 | 0xFFF8 |
-25.0625 | 1111 1110 0110 1111 | 0xFE6F |
-55 | 1111 1100 1001 0000 | 0xFC90 |
The values of the humidity register of the present invention are shown in the following table.
Humidity register low order
Bit7 | Bit6 | Bit5 | Bit4 | Bit3 | | Bit1 | Bit0 | |
23 | 22 | 21 | 20 | 2-1 | 2-2 | 2-3 | 2-4 |
High position of humidity register
Bit7 | Bit6 | Bit5 | Bit4 | Bit3 | Bit2 | Bit1 | Bit0 | |
Resv | Resv | | Resv | Resv | 26 | 25 | 24 |
Data relationship of humidity
The configuration registers of the present invention are shown in the table below,
HP-1 indicates the moisture content. FQ is favorable for the chip to filter unnecessary temperature alarm.
On the basis of the single-bus temperature and humidity integrated sensor chip, the invention also provides a communication method of the single-bus temperature and humidity integrated sensor chip, the single-bus temperature and humidity integrated sensor chip is in data communication with an external single bus through a single-bus interface, receives a temperature and humidity conversion command from a host, and sends temperature information, humidity information and alarm information to the host.
The outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the number of the first and second groups,
the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
Specifically, one or more single-wire temperature and humidity sensors are connected with a host or a control panel of the host through a single wire, and the host is usually a microcontroller such as a C51 single chip microcomputer, an ARM chip or a desktop. The single bus requires an external pull-up resistor of 4.7K ohms. This ensures that after power up, the host does not send a command and the chip receives an input at a high level.
And 2, the host sends a Search DEV command to the bus, and the host replies the identified chip information according to the signal on the bus. Thus, all chips on the single bus can be searched, in the host memory, DEV _ ID0, DEV _ ID1, DEV _ ID2, … … DEV _ IDN. The storage size of these variables is 64 bits.
And 3, continuously pulling down the single bus for 300us by the host, namely sending an Activation Reset sequence to the single bus, and receiving the awakening command by the chip. An Activation Response will be sent. A pull-down signal lasting about 120us can be seen on the single bus.
And 4, the host sends a Skip DEV Command to the bus, then enters an FUNC Command sequence, sends a Convert Temp & Humi Command, and all chips on the single bus enter the conversion of temperature and humidity. After waiting for 112 milliseconds, the temperature-humidity conversion is completed.
And step 5, the host continuously pulls down the single bus for 300us again, namely, an Activation Reset sequence is sent to the single bus, and the chip receives the awakening command. An Activation Response will be sent. A pull-down signal lasting about 120us can be seen on the single bus.
And 6, the host sends a Match DEV command to the bus, and then obtains the stored DEV _ ID0 chip information from the memory and sends the DEV _ ID0 chip information to the single bus. Entering the FUNC Command sequence, sending a Read Scratcchpad Command, 9 bytes of data of the selected chip will appear on the single bus, so that the temperature and humidity values can be calculated.
And repeating the step 5 and the step 6 to obtain the temperature and humidity values of all the chips on the single bus.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. The utility model provides a monobus humiture integrated sensor chip which characterized in that includes: the device comprises a temperature sensing unit, a humidity sensing unit, a selector, an analog-to-digital converter, a register group, a single bus interface and an alarm circuit;
the temperature sensing unit and the humidity sensing unit are connected with the analog-to-digital converter through the selector, the analog-to-digital converter, the single bus interface and the alarm circuit are respectively connected with the register, and the single bus interface is in data communication with an external single bus, receives a temperature and humidity conversion command from the outside and sends temperature information, humidity information and alarm information to the outside;
the register group includes: the system comprises a temperature register low bit, a temperature register high bit, a humidity register low bit, a humidity register high bit, a TH register, a TL register, an HH register, a configuration register and a check register.
2. The single-bus integrated temperature and humidity sensor chip of claim 1, wherein the single-bus data communication comprises:
the outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the number of the first and second groups,
the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
3. The single-bus temperature and humidity integrated sensor chip of claim 2, wherein the Activation command is a continuous low-level signal with a duration greater than 220us and less than 1 s; and the single-bus temperature and humidity integrated sensor chip replies an Activation response with a low level of 120us continuously to the received Activation command.
4. The single-bus integrated temperature and humidity sensor chip of claim 2, wherein the DEV command comprises an external command sent to the single-bus integrated temperature and humidity sensor chip via the single bus:
the method comprises the steps that a Read DEV command is given, and the single-bus temperature and humidity integrated sensor chip sends chip information to the outside after receiving the Read DEV command;
a Match DEV command, namely judging whether the received chip information is matched with the chip information of the single-bus temperature and humidity integrated sensor chip, if not, returning to an activation stage, and if so, entering an inquiry and operation stage;
the method comprises the steps that a Search DEV command is given, a single-bus temperature and humidity integrated sensor chip responds and sends chip information and a chip information negation result, confirmed chip information is returned after the chip information is identified from the outside, after the single-bus temperature and humidity integrated sensor chip receives the chip information, if the confirmed chip information is not consistent with the chip information, an activation stage is returned, and if the confirmed chip information is matched with the chip information, an inquiry and operation stage is started;
a Temp Alarm command is sent by the outside to identify whether a single bus temperature and humidity integrated sensor chip for temperature Alarm exists in the single bus or not;
the method comprises the steps that a Humi Alarm command is sent to the outside, and whether a single-bus temperature and humidity integrated sensor chip for humidity Alarm exists in a single bus or not is identified by the outside through sending the Humi Alarm command;
skip commands, ignoring the identification information, thus directly entering the query and operation phase.
5. The single-bus integrated temperature and humidity sensor chip according to claim 2, wherein the FUNC command comprises an instruction sent externally to the single-bus integrated temperature and humidity sensor chip via the single bus:
a Convert Temp command, wherein the single-bus temperature and humidity integrated sensor chip sends temperature conversion after receiving the Convert Temp command;
a Convert Humi command, wherein the single-bus temperature and humidity integrated sensor chip sends humidity conversion after receiving the Convert Humi command;
a Convert Temp & Humi command, wherein the single-bus temperature and humidity integrated sensor chip generates temperature and humidity conversion after receiving the Convert Temp & Humi command;
after receiving the Copy Scratcchpad command, the single-bus temperature and humidity integrated sensor chip writes the values of the TH register, the TL register and the HH register into an internal nonvolatile storage unit;
the method comprises the steps that a Write Scratcchpad command is received by a single-bus temperature and humidity integrated sensor chip, and then data are written into a TH register, a TL register, a configuration register and an HH register;
a Read Scratcrachpad command, wherein the single-bus temperature and humidity integrated sensor chip sends the value and check byte of the register after receiving the Read Scratcrachpad command;
the method comprises the following steps that (1) a Recall Mem command is received by a single-bus temperature and humidity integrated sensor chip, and then data stored in an internal nonvolatile storage unit are read back to a corresponding register;
and after the single-bus temperature and humidity integrated sensor chip receives the Read Power Supply command, if the command is parasitic Power Supply, 0 is replied, and if the command is parasitic Power Supply, 1 is replied.
6. The single-bus integrated temperature and humidity sensor chip of claim 5, wherein the FUNC command further comprises:
and other commands, if the single-bus temperature and humidity integrated sensor chip receives other commands, returning to the activation stage.
7. The single-bus integrated temperature and humidity sensor chip according to claim 5, wherein the values and check bytes of the register sent by the single-bus integrated temperature and humidity sensor chip after receiving the Read Scratcchpad command include:
byte 0: the low bit of the temperature register; byte 1: the high position of the temperature register; byte 2: a TH register; byte 3: a TL register; byte 4: a configuration register; byte 5: the humidity register is low; byte 6: a humidity register is high; byte 7: an HH register; byte 8: and checking the register.
8. The single-bus integrated temperature and humidity sensor chip according to claim 7, wherein the humidity sensing unit is in contact with the outside air through an opening on a package of the single-bus integrated temperature and humidity sensor chip.
9. A communication method of a single-bus temperature and humidity integrated sensor chip is characterized in that the single-bus temperature and humidity integrated sensor chip disclosed by any one of claims 1 to 8 is adopted, the single-bus temperature and humidity integrated sensor chip is in data communication with an external single bus through a single bus interface, receives a temperature and humidity conversion command from the outside, and sends temperature information, humidity information and alarm information to the outside.
10. The communication method of the single-bus temperature and humidity integrated sensor chip according to claim 9, wherein the single-bus data communication comprises:
the outside is through single bus to the integrated sensor chip of single bus humiture send: activating a single-bus temperature and humidity integrated sensor chip by an Activation command; the DEV command identifies a single-bus temperature and humidity integrated sensor chip; the method comprises the steps of carrying out an FUNC command, inquiring and operating a single-bus temperature and humidity integrated sensor chip; and the number of the first and second groups,
the single-bus temperature and humidity integrated sensor chip responds to the received Activation command, DEV command and FUNC command correspondingly.
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