CN111476991A - Double-point temperature measurement system and method suitable for master-slave single bus communication protocol - Google Patents
Double-point temperature measurement system and method suitable for master-slave single bus communication protocol Download PDFInfo
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- CN111476991A CN111476991A CN202010152623.6A CN202010152623A CN111476991A CN 111476991 A CN111476991 A CN 111476991A CN 202010152623 A CN202010152623 A CN 202010152623A CN 111476991 A CN111476991 A CN 111476991A
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C19/00—Electric signal transmission systems
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/02—Means for indicating or recording specially adapted for thermometers
- G01K1/028—Means for indicating or recording specially adapted for thermometers arrangements for numerical indication
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F13/00—Interconnection of, or transfer of information or other signals between, memories, input/output devices or central processing units
- G06F13/38—Information transfer, e.g. on bus
- G06F13/40—Bus structure
- G06F13/4063—Device-to-bus coupling
- G06F13/4068—Electrical coupling
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- G—PHYSICS
- G08—SIGNALLING
- G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
- G08C19/00—Electric signal transmission systems
- G08C19/16—Electric signal transmission systems in which transmission is by pulses
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Abstract
The invention provides a double-point temperature measurement system and method suitable for a master-slave single-bus communication protocol, which comprises the following steps: the temperature measuring unit, the analog-digital conversion unit, the signal processing unit, the local temperature register, the S-Wire interface circuit and the high-precision temperature processing unit; the temperature measuring unit is connected with the analog-digital conversion unit; the analog-digital conversion unit is connected with the signal processing unit; the signal processing unit is connected with the local temperature register; the S-Wire interface circuit is connected with the local temperature register; the high-precision temperature processing unit is connected with the local temperature register; the analog-digital conversion unit converts the analog current Is into a digital signal code stream. Compared with single-point temperature measurement, the solution provided by the invention has higher accuracy, improves the accuracy of the system, has simple single-bus physical design of S-Wire and has stronger economic value.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a double-point temperature measurement system and method suitable for a master-slave single-bus communication protocol.
Background
In the measurement of intelligence bracelet, if singly use single temperature chip, because the result that can not accurately survey appears in the clearance between temperature sensor and the bracelet, sometimes because the position of wearing of bracelet, there is the gradient of temperature, also can lead to less accuracy. Therefore, the system for testing the double chips is provided aiming at the problem of inaccurate sensing position, and more accurate temperature can be directly output. Meanwhile, a single physical Wire used by the S-Wire technology of the single bus is connected with an interface of the MCU, so that the cost of the product is low. The hardware resource overhead of using the MCU is small.
Patent document CN110823397A discloses a wireless temperature measurement system, which includes: the thermoelectric module is used for converting the temperature difference generated by heating into electric energy and supplying power to the system; the power management module is electrically connected with the thermoelectric module and is used for performing power management on the electric energy output by the thermoelectric module; the temperature measuring bolt is used for fixing the wireless temperature measuring system on a temperature measuring point and transferring heat of the temperature measuring point; the temperature detection module is electrically connected with the power management module and the temperature measuring bolt and is used for receiving the electric energy output by the power management module and detecting the temperature of the heat transferred by the temperature measuring bolt; and the wireless transmission module is electrically connected with the temperature detection module and is used for wirelessly transmitting the temperature data acquired by the temperature detection module. Can utilize thermoelectric generation to supply power in order to realize lasting temperature measurement of voyage to equipment to adopt the fixed mode of mechanical type, need not to lay the cable, make wireless temperature measurement system's application place more extensive. The patent is obviously not well applicable to the dual-point temperature measurement of the master-slave single-bus communication protocol.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a double-point temperature measurement system and a double-point temperature measurement method suitable for a master-slave single-bus communication protocol.
The invention provides a double-point temperature measurement system suitable for a master-slave single-bus communication protocol, which comprises: the temperature measuring unit, the analog-digital conversion unit, the signal processing unit, the local temperature register, the S-Wire interface circuit and the high-precision temperature processing unit; the temperature measuring unit is connected with the analog-digital conversion unit; the analog-digital conversion unit is connected with the signal processing unit; the signal processing unit is connected with the local temperature register; the S-Wire interface circuit is connected with the local temperature register; the high-precision temperature processing unit is connected with the local temperature register; the analog-digital conversion unit converts the analog current Is into a digital signal code stream.
Preferably, the method further comprises the following steps: DIO port, primary and secondary identification port a 0; and the DIO port is respectively connected with an S-Wire interface circuit, a high-precision temperature processing unit and a main and auxiliary identification port A0.
Preferably, the temperature measuring unit adopts an intrinsic diode formed by a semiconductor diode; the current Is flowing through the diode Is different at different temperatures.
Preferably, the signal processing unit can perform any one of the following processes: -first order filtering; -second order filtering; -third order filtering; -fourth order filtering; the signal processing unit can acquire 17 bits of temperature value information.
Preferably, the method further comprises the following steps: an external microprocessor MCU; the local temperature register can store 17 bits of temperature value information; the external microprocessor MCU can read local temperature information through a DIO pin; the S-Wire interface circuit can output the local temperature information to the local temperature register.
Preferably, the method further comprises the following steps: a main chip and a sub chip; the main chip and the auxiliary chip are directly connected through a DIO pin; the main chip and the auxiliary chip are connected with a Microprocessor (MCU) through a pull-up resistor of 5K ohm; and the data communication on the DIO bus follows an S-Wire protocol. The S-Wire interface circuit can recognize commands; the S-Wire interface circuit can read a local temperature command (8' h81) of the main chip; the S-Wire interface circuit can read a local temperature command (8 ' h01) of the sub chip, a command (8 ' hC4) that the main chip and the sub chip can generate temperature transition, a command (8 ' h88) that the host starts to calculate the precision, a local command (8 ' h41) that the main chip reads the sub chip and a command (8 ' h89) that the main chip calculates the precision.
Preferably, the high-precision temperature processing unit is capable of processing the temperature of the workpieceTemperature value Temp read from the secondary chipOutAnd temperature value Temp in local temperature registerLocalThe combined calculation is carried out to obtain a more accurate temperature value TempEX. The pull-down pulse length of the communication reset command sent by the host-side MCU is T _ reset. If a primary or secondary chip is present on the single bus port DIO, a pull-down pulse of length T _ ack occurs after the host releases the bus. Followed by command data CMD [7 ] sent by the host],CMD[6],…CMD[0]. Followed by temperature data and a check code.
Preferably, the data verified in the S-Wire interface circuit is 8 bits of command data and 17 bits of temperature data.
Preferably, the primary and secondary identification port A0 is connected with a primary chip; the sub-chip is grounded.
According to the double-point temperature measurement method suitable for the master-slave single-bus communication protocol, the double-point temperature measurement system suitable for the master-slave single-bus communication protocol is adopted to obtain the double-point temperature measurement result information suitable for the master-slave single-bus communication protocol.
Compared with the prior art, the invention has the following beneficial effects:
compared with single-point temperature measurement, the solution provided by the invention has higher accuracy, improves the accuracy of the system, has simple single-bus physical design of S-Wire and has stronger economic value.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a diagram illustrating a master-slave single bus communication apparatus according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of an internal structure of a chip according to an embodiment of the present invention.
Fig. 3 is a schematic diagram illustrating a process of sending a temperature transition command 8' hC4 according to an embodiment of the present invention.
FIG. 4 is a schematic diagram illustrating a process of sending a command 8' h41 for the master chip to read the temperature of the slave chip according to an embodiment of the present invention.
FIG. 5 is a schematic diagram of the process of sending the command 8' h88 for the master chip to calculate the temperature according to the embodiment of the present invention.
FIG. 6 is a schematic diagram of a process of sending a command 8' h89 for reading the precise temperature of the host chip according to an embodiment of the present invention.
FIG. 7 is a schematic diagram of a data format on a DIO single bus according to an embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
As shown in fig. 1-7, the dual-point temperature measurement system suitable for the master-slave single-bus communication protocol provided by the present invention comprises: the temperature measuring unit, the analog-digital conversion unit, the signal processing unit, the local temperature register, the S-Wire interface circuit and the high-precision temperature processing unit; the temperature measuring unit is connected with the analog-digital conversion unit; the analog-digital conversion unit is connected with the signal processing unit; the signal processing unit is connected with the local temperature register; the S-Wire interface circuit is connected with the local temperature register; the high-precision temperature processing unit is connected with the local temperature register; the analog-digital conversion unit converts the analog current Is into a digital signal code stream.
Preferably, the method further comprises the following steps: DIO port, primary and secondary identification port a 0; and the DIO port is respectively connected with an S-Wire interface circuit, a high-precision temperature processing unit and a main and auxiliary identification port A0.
Preferably, the temperature measuring unit adopts an intrinsic diode formed by a semiconductor diode; the current Is flowing through the diode Is different at different temperatures.
Preferably, the signal processing unit can perform any one of the following processes: -first order filtering; -second order filtering; -third order filtering; -fourth order filtering; the signal processing unit can acquire 17 bits of temperature value information.
Preferably, the method further comprises the following steps: an external microprocessor MCU; the local temperature register can store 17 bits of temperature value information; the external microprocessor MCU can read local temperature information through a DIO pin; the S-Wire interface circuit can output the local temperature information to the local temperature register.
Preferably, the method further comprises the following steps: a main chip and a sub chip; the main chip and the auxiliary chip are directly connected through a DIO pin; the main chip and the auxiliary chip are connected with a Microprocessor (MCU) through a pull-up resistor of 5K ohm; and the data communication on the DIO bus follows an S-Wire protocol. The S-Wire interface circuit can recognize commands; the S-Wire interface circuit can read a local temperature command (8' h81) of the main chip; the S-Wire interface circuit can read a local temperature command (8 ' h01) of the sub chip, a command (8 ' hC4) that the main chip and the sub chip can generate temperature transition, a command (8 ' h88) that the host starts to calculate the precision, a local command (8 ' h41) that the main chip reads the sub chip and a command (8 ' h89) that the main chip calculates the precision.
Preferably, the high-precision temperature processing unit is capable of reading a temperature value Temp from the sub-chipOutAnd temperature value Temp in local temperature registerLocalThe combined calculation is carried out to obtain a more accurate temperature value TempEX. The pull-down pulse length of the communication reset command sent by the host-side MCU is T _ reset. If a primary or secondary chip is present on the single bus port DIO, a pull-down pulse of length T _ ack occurs after the host releases the bus. Followed by command data CMD [7 ] sent by the host],CMD[6],…CMD[0]. Followed by temperature data and a check code.
Preferably, the data verified in the S-Wire interface circuit is 8 bits of command data and 17 bits of temperature data.
Preferably, the primary and secondary identification port A0 is connected with a primary chip; the sub-chip is grounded.
Specifically, in one embodiment, a dual-point thermometry system: the protocol and device suitable for master-slave single bus communication are as follows: the temperature measuring device comprises a temperature measuring diode, an analog-digital converter, signal processing and filtering, a local temperature register, an S-Wire interface circuit and a high-precision temperature processing unit. The external pin A0 is connected to the power supply and distinguishes the main chip (M) terminal from the sub chip (S) terminal.
The main chip and the auxiliary chip are directly connected through a DIO pin and connected with a Microprocessor (MCU) through a 5K ohm pull-up resistor. Data communication over the DIO bus follows the S-Wire protocol.
The master sends a communication reset pulse T _ reset of 220us, and the master chip and the slave chip send a communication response pulse T _ ack of 30us after receiving the response. The host sends a communication command CMD ═ 8' hC4, the primary and secondary chips accept the designation, and the temperature transition is started: the current output by the temperature measuring diode is converted into a digital code stream by an analog-digital converter, and after signal processing and filtering, the corresponding high-precision temperature value of 17 bits is stored by a local temperature register. The host sends a communication command with CMD 8' h41, the master chip responds to the command, and the slave chip does not respond to the command. After receiving the command, the main chip sends a pull-down pulse to the DIO bus, and the secondary chip receives the pull-down pulse and sends the local temperature of the secondary chip to the DIO bus, so that the main chip obtains the external temperature Temp _ OUT. After the host sends the communication command CMD 8' h88, the master chip will calculate the combined precise temperature Temp _ EX. After the host sends the communication command CMD 8' h89, the host chip will respond to the command, and the slave chip will not send out the calculated accurate temperature Temp _ EX in response to the command. Meanwhile, the user can selectively receive the CRC-8 of the communication check code. For verifying the temperature of the read. Therefore, the reliability of DIO single bus communication is ensured.
According to the double-point temperature measurement method suitable for the master-slave single-bus communication protocol, the double-point temperature measurement system suitable for the master-slave single-bus communication protocol is adopted to obtain the double-point temperature measurement result information suitable for the master-slave single-bus communication protocol.
Compared with single-point temperature measurement, the solution provided by the invention has higher accuracy, improves the accuracy of the system, has simple single-bus physical design of S-Wire and has stronger economic value.
Those skilled in the art will appreciate that, in addition to implementing the system and its various devices, modules, units provided by the present invention as pure computer readable program code, the system and its various devices, modules, units provided by the present invention can be fully implemented by logically programming method steps in the form of logic gates, switches, application specific integrated circuits, programmable logic controllers, embedded microcontrollers and the like. Therefore, the system and various devices, modules and units thereof provided by the invention can be regarded as a hardware component, and the devices, modules and units included in the system for realizing various functions can also be regarded as structures in the hardware component; means, modules, units for performing the various functions may also be regarded as structures within both software modules and hardware components for performing the method.
In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present application and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes or modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention. The embodiments and features of the embodiments of the present application may be combined with each other arbitrarily without conflict.
Claims (10)
1. A double-point temperature measurement system suitable for a master-slave single bus communication protocol is characterized by comprising: the temperature measuring unit, the analog-digital conversion unit, the signal processing unit, the local temperature register, the S-Wire interface circuit and the high-precision temperature processing unit;
the temperature measuring unit is connected with the analog-digital conversion unit;
the analog-digital conversion unit is connected with the signal processing unit;
the signal processing unit is connected with the local temperature register;
the S-Wire interface circuit is connected with the local temperature register;
the high-precision temperature processing unit is connected with the local temperature register;
the analog-digital conversion unit converts the analog current into a digital signal code stream.
2. The dual-point thermometry system of claim 1, further comprising: DIO port, primary and secondary identification port a 0;
and the DIO port is respectively connected with an S-Wire interface circuit, a high-precision temperature processing unit and a main and auxiliary identification port A0.
3. The dual-point thermometry system according to claim 1, wherein the thermometry unit is an intrinsic diode formed by a semiconductor diode.
4. The dual-point thermometry system according to claim 1, wherein the signal processing unit is capable of performing any one of the following processes:
-first order filtering;
-second order filtering;
-third order filtering;
-fourth order filtering;
the signal processing unit can acquire 17 bits of temperature value information.
5. The dual-point thermometry system of claim 1, further comprising: an external microprocessor MCU;
the local temperature register can store 17 bits of temperature value information;
the external microprocessor MCU can read local temperature information through a DIO pin;
the S-Wire interface circuit can output the local temperature information to the local temperature register.
6. The dual-point thermometry system of claim 1, further comprising: a main chip and a sub chip;
the main chip and the auxiliary chip are directly connected through a DIO pin;
the S-Wire interface circuit can read a local temperature command of the main chip;
the S-Wire interface circuit can read a local temperature command of the secondary chip;
the main chip and the sub chip can generate a temperature conversion command.
7. The dual-point thermometry system according to claim 1, wherein the high-precision temperature processing unit is capable of performing a combined calculation of the temperature value read from the secondary chip and the temperature value in the local temperature register.
8. The dual-point thermometry system according to claim 1, wherein the verified data in the S-Wire interface circuit is 8 bits of command data and 17 bits of temperature data.
9. The dual-point temperature measurement system suitable for the master-slave single-bus communication protocol according to claim 1, wherein the master-slave identification port a0 is connected with the master chip;
the sub-chip is grounded.
10. A double-point temperature measurement method suitable for a master-slave single-bus communication protocol is characterized in that the double-point temperature measurement system suitable for the master-slave single-bus communication protocol of any one of claims 1 to 9 is adopted to obtain double-point temperature measurement result information suitable for the master-slave single-bus communication protocol.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113518267A (en) * | 2021-03-15 | 2021-10-19 | 上海申矽凌微电子科技有限公司 | Concentrator device of pulse counting agreement |
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