CN108893060A - A kind of preparation method of PESD function light-sensitive emulsion - Google Patents
A kind of preparation method of PESD function light-sensitive emulsion Download PDFInfo
- Publication number
- CN108893060A CN108893060A CN201810750068.XA CN201810750068A CN108893060A CN 108893060 A CN108893060 A CN 108893060A CN 201810750068 A CN201810750068 A CN 201810750068A CN 108893060 A CN108893060 A CN 108893060A
- Authority
- CN
- China
- Prior art keywords
- preparation
- sensitive emulsion
- butyl acrylate
- light
- pesd
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention provides a kind of preparation method of PESD function light-sensitive emulsion, which is characterized in that includes the following steps：(1) divalent zinc salt, graphite oxide, polyethyleneimine are added in butyl acrylate, ultrasonic agitation makes it sufficiently dissolve dispersion, 50~70 DEG C isothermal reaction 5~8 hours, obtain uniform sol precursor；(2) epoxy photosensitive resin, two pairs of toluyl tartaric acid, dibutyl phthalate, cation light initiator, silane coupling agent are added in the butyl acrylate colloidal sol of step (1) preparation, room temperature~70 DEG C are stirred, and obtain the photosensitive adhesive of PESD function.The present invention insulate convered structure in the circuit board using the medium of ESD defencive function as electronic component, can effectively save wiring board area, reduces manufacturing cost, can promote device circuit reliability.
Description
Technical field
The invention belongs to electronic materials and adhesive area, are related to a kind of preparation method of PESD function light-sensitive emulsion.
Background technique
Static discharge (ESD) problem is the important harm that each electronic product faces, ESD protection element with protected first device
Part is in parallel, itself is in high resistant state of value, works normally component without influence, when generating transient high voltages, ESD protection member
Part rapidly goes to low-resistance conducting, realizes protective effect.The protection of electronic component transient high voltages, the scheme generallyd use have pressure-sensitive
Resistance (MOV), Transient Suppression Diode (TVS) and macromolecule ESD protective element (PESD).Electronic component is just towards more function
Energy, miniaturization, flexibility direction are developed, and dedicated anti-static elements need to tie up the valuable area on wiring board, in addition discrete member
The factors such as welding, the route design of part also will increase the manufacturing cost of integral device.
Summary of the invention
For prior art defect, the purpose of the present invention is to provide a kind of preparation method of PESD function light-sensitive emulsion,
It is characterized in that, includes the following steps：
(1) divalent zinc salt, graphite oxide, polyethyleneimine are added in butyl acrylate, ultrasonic agitation keeps it sufficiently molten
Solution dispersion, 50~70 DEG C isothermal reaction 5~8 hours, obtain uniform sol precursor；
(2) epoxy photosensitive resin, two pairs of toluyl tartaric acid, dibutyl phthalate, cationic photopolymerization are caused
Agent is added in the butyl acrylate colloidal sol of step (1) preparation, and room temperature~70 DEG C are stirred, and obtain the photosensitive gluing of PESD function
Agent.
Each weight ratio of constituents is：
100 parts of epoxy photosensitive resin
110~200 parts of butyl acrylate colloidal sol
Two pairs 3~6 parts of toluyl tartaric acid
2~6 parts of dibutyl phthalate
8~10 parts of cation light initiator
The graphite oxide 0.5~1.5g/L of concentration in butyl acrylate, polyethyleneimine are dense in butyl acrylate
Spend 1~2g/L.
The divalent zinc salt includes one of zinc nitrate, zinc acetate, zinc chloride, zinc oxalate or combinations thereof, in acrylic acid
Concentration is 0.01mol/L~0.08mol/L in butyl ester.
The cation light initiator includes one of diazonium salt, triaryl sulfonium salts, alkyl sulfosalt.
The PESD function light-sensitive emulsion application method of preparation is that adhesive solidifies bonding electronics member under the conditions of ultraviolet light
Part, for electronic component in the circuit board insulation bonding, contacted with the input and output pin of electronic component, on circuit with
Electronic component internal circuit is in parallel, and ESD function light-sensitive emulsion is in high resistant state of insulation, when electronic component overvoltage condition, ESD function
The conducting of light-sensitive emulsion seepage flow, protects electronic component.
The present invention insulate convered structure in the circuit board using the medium of ESD defencive function as electronic component, can be effective
Wiring board area is saved, manufacturing cost is reduced, device circuit reliability can be promoted.
The contents of the present invention and feature have revealed that as above, however the present invention that describes of front only briefly or pertains only to this
The specific part of invention, feature of the invention may be more than what content disclosed herein was related to.Therefore, protection model of the invention
The revealed content of embodiment should be not limited to by enclosing, and should include the combination of all the elements embodied in different piece, with
And it is various without departing substantially from replacement and modification of the invention, and covered by claims of the present invention.
Specific embodiment
Embodiment 1：
(1) 0.01mol/L zinc nitrate, 0.5g/L graphite oxide, 1g/L polyethyleneimine are added in butyl acrylate, are surpassed
Sound stirring makes it sufficiently dissolve dispersion, 70 DEG C isothermal reaction 8 hours, obtain uniform sol precursor；
(2) by 100 parts of epoxy photosensitive resins, 6 parts of two pairs of toluyl tartaric acid, 6 parts of dibutyl phthalates, 8
Part diazonium salt is added in 200 parts of butyl acrylate colloidal sols of step (1) preparation, and 50 DEG C are stirred, and obtain the light of PESD function
Sensitive adhesive, adhesive tensile strength：25Mpa, ESD performance reach IEC6100-4-2.
Embodiment 2：
(1) 0.08mol/L zinc acetate, 1.5g/L graphite oxide, 2g/L polyethyleneimine are added in butyl acrylate, are surpassed
Sound stirring makes it sufficiently dissolve dispersion, 70 DEG C isothermal reaction 5 hours, obtain uniform sol precursor；
(2) by 100 parts of epoxy photosensitive resins, 3 parts of two pairs of toluyl tartaric acid, 2 parts of dibutyl phthalates, 8
Part triaryl sulfonium salts are added in 110 butyl acrylate colloidal sols of step (1) preparation, and 50 DEG C are stirred, and obtain PESD function
Photosensitive adhesive, adhesive tensile strength：34Mpa, ESD performance reach IEC6100-4-2.
Embodiment 3：
(1) 0.04 zinc chloride, 1g/L graphite oxide, 1.5g/L polyethyleneimine are added in butyl acrylate, ultrasound is stirred
Mixing makes it sufficiently dissolve dispersion, 60 DEG C isothermal reaction 6 hours, obtain uniform sol precursor；
(2) by 100 parts of epoxy photosensitive resins, 4 parts of two pairs of toluyl tartaric acid, 4 parts of dibutyl phthalates, 8
Part diazonium salt is added in 160 parts of butyl acrylate colloidal sols of step (1) preparation, and 70 DEG C are stirred, and obtain the light of PESD function
Sensitive adhesive, adhesive tensile strength：31Mpa, ESD performance reach IEC6100-4-2.
Embodiment 4：
(1) 0.03mol/L zinc oxalate, 1g/L graphite oxide, 1g/L polyethyleneimine are added in butyl acrylate, ultrasound
Stirring makes it sufficiently dissolve dispersion, 60 DEG C isothermal reaction 6 hours, obtain uniform sol precursor；
(2) by 100 parts of epoxy photosensitive resins, 5 parts of two pairs of toluyl tartaric acid, 5 parts of dibutyl phthalates, 9
Part alkyl sulfosalt is added in 150 parts of butyl acrylate colloidal sols of step (1) preparation, and mixing is stirred at room temperature, obtains PESD function
Photosensitive adhesive, adhesive tensile strength：33Mpa, ESD performance reach IEC6100-4-2.
Claims (5)
1. a kind of preparation method of PESD function light-sensitive emulsion, which is characterized in that include the following steps：
(1) divalent zinc salt, graphite oxide, polyethyleneimine are added in butyl acrylate, being stirred by ultrasonic, which dissolves it sufficiently, divides
Dissipate, 50~70 DEG C isothermal reaction 5~8 hours, obtain uniform sol precursor；
(2) epoxy photosensitive resin, two pairs of toluyl tartaric acid, dibutyl phthalate, cation light initiators are added
In the butyl acrylate colloidal sol for entering step (1) preparation, room temperature~70 DEG C are stirred, and obtain the photosensitive adhesive of PESD function.
Each weight ratio of constituents is：
100 parts of epoxy photosensitive resin
110~200 parts of butyl acrylate colloidal sol
Two pairs 3~6 parts of toluyl tartaric acid
2~6 parts of dibutyl phthalate
8~10 parts of cation light initiator.
2. a kind of preparation method of PESD function light-sensitive emulsion according to claim 1, which is characterized in that the graphite oxide exists
0.5~1.5g/L of concentration in butyl acrylate, polyethyleneimine 1~2g/L of concentration in butyl acrylate.
3. a kind of preparation method of PESD function light-sensitive emulsion according to claim 1, which is characterized in that the divalent zinc salt packet
Include one of zinc nitrate, zinc acetate, zinc chloride, zinc oxalate or combinations thereof, in butyl acrylate concentration be 0.01mol/L~
0.08mol/L。
4. a kind of preparation method of PESD function light-sensitive emulsion according to claim 1, which is characterized in that the cationic photopolymerization draws
Sending out agent includes one of diazonium salt, triaryl sulfonium salts, alkyl sulfosalt.
5. PESD function prepared by a kind of preparation method of the PESD function light-sensitive emulsion as described in Claims 1 to 4 any one
Energy light-sensitive emulsion, application method is that adhesive solidifies bonding electronic component under the conditions of ultraviolet light, online for electronic component
Insulation bonding on the plate of road, contacts, on circuit simultaneously with electronic component internal circuit with the input and output pin of electronic component
Connection, ESD function light-sensitive emulsion is in high resistant state of insulation, and when electronic component overvoltage condition, the conducting of ESD function light-sensitive emulsion seepage flow is protected
Protect electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810750068.XA CN108893060A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of PESD function light-sensitive emulsion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810750068.XA CN108893060A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of PESD function light-sensitive emulsion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108893060A true CN108893060A (en) | 2018-11-27 |
Family
ID=64348964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810750068.XA Withdrawn CN108893060A (en) | 2018-07-02 | 2018-07-02 | A kind of preparation method of PESD function light-sensitive emulsion |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108893060A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622283A (en) * | 2004-12-15 | 2005-06-01 | 贺平 | Method for preparing composite oxide semiconductor nano material |
| CN101319370A (en) * | 2008-06-24 | 2008-12-10 | 济南大学 | Method for controlling orientation and profile characteristic of zinc oxide nano-stick/nano-tube array |
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
| CN101560059A (en) * | 2009-05-27 | 2009-10-21 | 中南大学 | Aluminum-doped zinc oxide film coating and nano-rod array material as well as preparation method thereof |
-
2018
- 2018-07-02 CN CN201810750068.XA patent/CN108893060A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1622283A (en) * | 2004-12-15 | 2005-06-01 | 贺平 | Method for preparing composite oxide semiconductor nano material |
| CN101496113A (en) * | 2006-07-29 | 2009-07-29 | 肖克科技有限公司 | Voltage switchable dielectric material having high aspect ratio particles |
| CN101319370A (en) * | 2008-06-24 | 2008-12-10 | 济南大学 | Method for controlling orientation and profile characteristic of zinc oxide nano-stick/nano-tube array |
| CN101560059A (en) * | 2009-05-27 | 2009-10-21 | 中南大学 | Aluminum-doped zinc oxide film coating and nano-rod array material as well as preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101506769B1 (en) | Liquid resin compositions for electronic components and processes for preparing the same, and electronic component devices | |
| TWI746849B (en) | Resin composition | |
| KR102668254B1 (en) | Underfilling resin composition, electronic component device, and method for manufacturing electronic component device | |
| JP2007277525A5 (en) | Adhesive composition for electronic equipment, adhesive sheet for electronic equipment using the same, and electronic component | |
| CN101583648A (en) | Latent curing agent | |
| CN108893060A (en) | A kind of preparation method of PESD function light-sensitive emulsion | |
| CN104231982B (en) | Adhesive composition, using the adhesive film and surface protection film of the adhesive composition | |
| JP2011132541A (en) | Adhesive composition | |
| JP6530478B2 (en) | Surface protection film | |
| JP3953234B2 (en) | Adhesive composition for flexible printed wiring board | |
| JP6283520B2 (en) | Adhesive composition for semiconductor and semiconductor device | |
| KR101368986B1 (en) | Epoxy Resin Composition for LCD driving element | |
| JP5662366B2 (en) | adhesive | |
| KR101167819B1 (en) | Inorganic composition for encapsulating electronic component and method of preparing the same | |
| JP5319082B2 (en) | Liquid epoxy resin composition for sealing and sealing semiconductor device | |
| JP2010024384A (en) | Anisotropically electroconductive composition | |
| JP2013134983A (en) | Insulation layer forming composition, insulation layer forming film, and substrate | |
| CN109111895A (en) | A kind of organic silicon adhesive of PESD function | |
| JP2009215345A (en) | Thermosetting organic and inorganic hybrid transparent sealing material | |
| CN109054660A (en) | A kind of preparation method of PESD function adhesive | |
| CN109207100A (en) | A kind of production method of ESD function pressure sensitive adhesive | |
| JP5358240B2 (en) | Adhesive for semiconductor | |
| KR20190133022A (en) | Adhesive Compositions and Structures | |
| CN109082257A (en) | A kind of wet dual-purpose solidification glue of PESD function light | |
| CN108350341A (en) | Adhesive composite and structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181127 |
|
| WW01 | Invention patent application withdrawn after publication |