CN108884300A - 可固化的环氧树脂浇注物料 - Google Patents

可固化的环氧树脂浇注物料 Download PDF

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Publication number
CN108884300A
CN108884300A CN201780021260.9A CN201780021260A CN108884300A CN 108884300 A CN108884300 A CN 108884300A CN 201780021260 A CN201780021260 A CN 201780021260A CN 108884300 A CN108884300 A CN 108884300A
Authority
CN
China
Prior art keywords
epoxy resin
poured
resin material
percentile
aluminium oxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201780021260.9A
Other languages
English (en)
Chinese (zh)
Inventor
F.赫佐格
S.霍夫曼
T.贝格尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of CN108884300A publication Critical patent/CN108884300A/zh
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Epoxy Resins (AREA)
CN201780021260.9A 2016-03-31 2017-01-27 可固化的环氧树脂浇注物料 Pending CN108884300A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102016205386.8A DE102016205386A1 (de) 2016-03-31 2016-03-31 Härtbare Epoxidharz-Gießmasse
DE102016205386.8 2016-03-31
PCT/EP2017/051847 WO2017167468A1 (fr) 2016-03-31 2017-01-27 Masse de coulée à base de résine époxyde durcissable

Publications (1)

Publication Number Publication Date
CN108884300A true CN108884300A (zh) 2018-11-23

Family

ID=58044020

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201780021260.9A Pending CN108884300A (zh) 2016-03-31 2017-01-27 可固化的环氧树脂浇注物料

Country Status (3)

Country Link
CN (1) CN108884300A (fr)
DE (1) DE102016205386A1 (fr)
WO (1) WO2017167468A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113906524A (zh) * 2019-03-27 2022-01-07 西门子股份公司 浇注树脂、由其制成的成型材料、其用途和电绝缘

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1478127A (zh) * 2000-11-29 2004-02-25 ���ٿƹɷݹ�˾ 具有高力学强度值的填充环氧树脂体系
CN102317344A (zh) * 2009-02-10 2012-01-11 西门子公司 开关装置中绝缘材料用的铸模树脂体系
US20130109785A1 (en) * 2011-10-31 2013-05-02 Taiyo Ink Mfg. Co., Ltd. Thermosetting resin composition, cured product thereof, and printed wiring board using the same
CN104788911A (zh) * 2015-04-29 2015-07-22 华中科技大学 一种环氧树脂复合材料、其制备方法及应用

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3032093A1 (de) * 1980-08-26 1982-04-01 Brown, Boveri & Cie Ag, 6800 Mannheim Elektrisch isolierender kunstharz

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1478127A (zh) * 2000-11-29 2004-02-25 ���ٿƹɷݹ�˾ 具有高力学强度值的填充环氧树脂体系
CN102317344A (zh) * 2009-02-10 2012-01-11 西门子公司 开关装置中绝缘材料用的铸模树脂体系
US20130109785A1 (en) * 2011-10-31 2013-05-02 Taiyo Ink Mfg. Co., Ltd. Thermosetting resin composition, cured product thereof, and printed wiring board using the same
CN104788911A (zh) * 2015-04-29 2015-07-22 华中科技大学 一种环氧树脂复合材料、其制备方法及应用

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113906524A (zh) * 2019-03-27 2022-01-07 西门子股份公司 浇注树脂、由其制成的成型材料、其用途和电绝缘

Also Published As

Publication number Publication date
WO2017167468A1 (fr) 2017-10-05
DE102016205386A1 (de) 2017-10-05

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Application publication date: 20181123