CN108842136A - 柔性覆铜板及其制造工艺 - Google Patents
柔性覆铜板及其制造工艺 Download PDFInfo
- Publication number
- CN108842136A CN108842136A CN201810641719.1A CN201810641719A CN108842136A CN 108842136 A CN108842136 A CN 108842136A CN 201810641719 A CN201810641719 A CN 201810641719A CN 108842136 A CN108842136 A CN 108842136A
- Authority
- CN
- China
- Prior art keywords
- copper
- clad plate
- substrate layer
- flexible copper
- transition zone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0647—Boron nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/32—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one pure metallic layer
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/30—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer
- C23C28/34—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates
- C23C28/345—Coatings combining at least one metallic layer and at least one inorganic non-metallic layer including at least one inorganic non-metallic material layer, e.g. metal carbide, nitride, boride, silicide layer and their mixtures, enamels, phosphates and sulphates with at least one oxide layer
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Inorganic Chemistry (AREA)
- Electrochemistry (AREA)
- Laminated Bodies (AREA)
Abstract
本发明提供了一种柔性覆铜板的制造工艺，其特征在于，包括以下步骤，提供一基材层，在所述基材层的上下两面用物理气相沉积法沉积一过渡层，所述过渡层厚度为10nm～1μm，在所述过渡层表面通过电镀法或蒸镀法形成铜层，所述铜层的厚度为2μm～60μm，所述过渡层的材料为活性电极材料。本发明提供的上述柔性覆铜板的制造工艺，可以改善铜层与基材层的结合力，并且摆脱了对进口压机的依赖，大幅降低产品制造成本，可以实现2um‑60um铜层生产，实现了高频超薄超细线路板的基材产出。
Description
技术领域
本发明涉及柔性覆铜板技术领域，具体而言，涉及一种柔性覆铜板及其制造方法。
背景技术
目前市面上高频高速柔性基板主要供应商有佳胜，NIPPON steel chemical等供应商,其中制造方法为传统的压合法，如图1所示，结构为LCP薄膜两面各压合一层RA铜箔，压合方式主要有两种，如图2所示，片型压合法和点型压合法，其中所用的压合设备售价昂贵，一台片型压合机达到两亿美金售价，导致通过压合法生产出的高频高速柔性基板成本较高。并且此种方式生产出来的高频基板结合力在0.8kgf/cm，较常规CCL结合力1.0kfg/cm小，不能满足超细线路的设计。
发明内容
本发明的主要目的在于提供一种柔性覆铜板及其制造方法，可以明显改善铜层与基材层的结合力，并且不需要昂贵的设备成本，摆脱对进口压机的依赖，大幅降低产品制造成本。
本发明的技术方案：
一种柔性覆铜板的制造工艺，其特征在于，包括以下步骤，提供一基材层，在所述基材层的上下两面用物理气相沉积法沉积一过渡层，所述过渡层厚度为10nm～1μm，在所述过渡层表面通过电镀法或蒸镀法形成铜层，所述铜层的厚度为2μm～60μm，所述过渡层的材料为活性电极材料。
优选的，所述活性电极材料为Ni、Zn、Fe，Al，Mg,Cr中的一种或几种。
优选的，在沉积所述过渡层之前，在基材层表面先沉积一打底层，所述打底层所用材料为SiO2(二氧化硅)和BN(氮化硼)中的一种或两种，厚度为10nm～1μm。打底层的作用是改善材料界面问题，使得无机材料与金属材料过渡层两者间结合能力稳固可靠。
所述物理气相沉积法为磁控溅射法或蒸镀法，温度为60℃到400℃。
真空磁控溅射时通过电离惰性气体AR，给其粒子能量冲击金属靶材，所述金属靶材即为上述活性电极材料，并赋予金属粒子与能量脱离靶材，在电场的作用下，冲击并嵌入被镀基材面，以原子堆积的方式致密的排列在薄膜基材面形成过渡层，再通过电镀铜的方式进行铜层增厚，通过长晶过程实现铜层和薄膜结合，从而改善了铜层和含氟薄膜层的结合力，其结合力可以在1.0kgf/cm以上，结合力好了有利于做细线路，细线路因为接触面积小，结合力差的话就容易脱落，尤其是弯折的时候脱落。
而传统的压合方式是将LCP薄膜与铜箔粗糙面进行热复合，由于LCP材质具有离型膜效果与铜层结合时界面效应显著，其次在压合过程中由于铜箔面本生具有的铜芽，LCP含氟材料浸润性不佳，从而结合力偏低。
优选的，所述基材层的表面经电晕处理或化学微蚀处理或采用物理方法进行表面粗化后再沉积所述过渡层。物理方法为轧花处理方法。
通过表面处理粗化使得薄膜表面有一定轮廓，且有活性集团，提供了化学力与物理力，进一步改善层间结合力。
优选的，所述基材层为LCP或PFA或PTFE含氟薄膜层。
本发明另一目的是提供一种柔性覆铜板，包括一基材层，所述基材层上下两面各沉积一过渡层，所述过渡层上形成一铜层，所述基材层为含氟薄膜层，所述过渡层为活性电极材料层，厚度为10nm～1μm，所述铜层的厚度为2μm～60μm。
所述含氟薄膜层材料选自为LCP或PFA或PTFE。
优选的，所述活性电极材料为Ni、Zn、Fe，Al，Mg,Cr中的一种或几种。
优选的，所述基材层和过渡层之间沉积一打底层，厚度为10nm～1μm，所述打底层的材料选自SiO2和BN中的一种或两种。
有益效果：
本发明提供的上述柔性覆铜板的制造工艺，可以改善铜层与基材层的结合力，并且摆脱了对进口压机的依赖，大幅降低产品制造成本，可以实现2um-60um铜层生产，实现了高频超薄超细线路板的基材产出。
附图说明
构成本申请的一部分的说明书附图用来提供对本发明的进一步理解，本发明的示意性实施例及其说明用于解释本发明，并不构成对本发明的不当限定。在附图中：
图1示出了现有技术柔性覆铜板的结构示意图；
图2示出了现有技术柔性覆铜板的制造工艺示意图；
图3示出了本发明所述柔性覆铜板实施例1的结构示意图；
图4示出了本发明所述柔性覆铜板实施例2的结构示意图；
图5示出了现有技术柔性覆铜板层间界面微观示意图；
图6示出了本发明所述柔性覆铜板层间界面微观示意图；
其中，1、基材层，2、过渡层，3、铜层，4、打底层
具体实施方式
需要说明的是，在不冲突的情况下，本申请中的实施例及实施例中的特征可以相互组合。下面将参考附图并结合实施例来详细说明本发明。
如图1和图2所示，正如背景技术部分所描述的，现有技术中的柔性覆铜板，采用传统的压合法，结构为LCP薄膜两面各压合一层RA铜箔，压合方式主要有两种，如图2所示，图2左为片型压合法，图2右为点型压合法，这两种压合法所用的压合设备售价昂贵，其中一台片型压合机达到两亿美金售价，导致通过压合法生产出的高频高速柔性基板成本较高，并且LCP层与铜箔间的结合力不能得到有效的保证，如图5所示，由于LCP材质具有离型膜效果与铜层结合时界面效应显著，其次在压合过程中由于铜箔面本生具有的铜芽，LCP材料浸润性不佳，导致铜箔与基材之间填充不实，从而结合力偏低，此种方式生产出来的高频基板结合力在0.8kgf/cm，较常规CCL结合力1.0kfg/cm小，不能满足超细线路的设计。
本发明实施例1如图3所示：包括一基材层1，所述基材层1上下两面各沉积一过渡层2，所述过渡层2上形成一铜层3，所述基材层1为LCP或PFA或PTFE含氟薄膜层，所述过渡层2为活性电极材料层，厚度为10nm～1μm，所述铜层3的厚度为2μm～60μm。所述活性电极材料为Ni、Zn、Fe，Al，Mg,Cr等有色金属中的一种或几种。
本发明实施例2如图3所示，包括一基材层1，所述基材层1上下两面各沉积一打底层4，所述打底层4上沉积一过渡层2，所述过渡层2上形成一铜层3。所述打底层4所用材料为SiO2和BN中的一种或两种，厚度为10nm～1μm。打底层的作用是改善材料界面问题，使得无机材料与金属材料过渡层两者间结合能力稳固可靠。
如上所述柔性覆铜板的制造工艺，包括以下步骤，提供一含氟薄膜基材层1，在所述基材层的上下两面用物理气相沉积法沉积一打底层4，在所述打底层4上再沉积过渡层2，所述2过渡层厚度为10nm～1μm，在所述过渡层2表面通过电镀法或蒸镀法形成铜层2，所述铜层的厚度为2μm～60μm，所述过渡层的材料为活性电极材料。所述物理气相沉积法为磁控溅射法或蒸镀法，温度为60℃到400℃。
所述基材层的表面经电晕处理或化学微蚀处理或采用物理方法进行表面粗化后再沉积所述过渡层。通过表面处理，粗化使得薄膜表面有一定轮廓，且有活性集团，提供了化学力与物理力，进一步改善层间结合力。
所述过渡层2的活性电极材料为Ni、Zn、Fe，Al，Mg,Cr中的一种或几种，在真空磁控溅射时通过电离惰性气体AR，给其粒子能量冲击金属靶材，并赋予金属粒子与能量脱离靶材，在电场的作用下，冲击并嵌入被镀基材面，以原子堆积的方式致密的排列在薄膜基材面，再通过电镀铜的方式进行铜层增厚，通过长晶过程实现铜层和薄膜结合，如图6所示，铜层3和过渡层结合紧密，填充充实，从而整体上改善了铜层和含氟薄膜层的结合力，其结合力可以在1.0kgf/cm以上，结合力好了有利于做细线路，细线路因为接触面积小，结合力差的话就容易脱落，尤其是弯折的时候脱落。
以上所述仅为本发明的优选实施例而已，并不用于限制本发明，对于本领域的技术人员来说，本发明可以有各种更改和变化。凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。
Claims (10)
1.一种柔性覆铜板的制造工艺，其特征在于，包括以下步骤，提供一基材层，在所述基材层的上下两面用物理气相沉积法沉积一过渡层，所述过渡层厚度为10nm～1μm，在所述过渡层表面通过电镀法或蒸镀法形成铜层，所述铜层的厚度为2μm～60μm，所述过渡层的材料为活性电极材料。
2.根据权利要求1所述的柔性覆铜板的制造工艺，其特征在于，所述活性电极材料为Ni、Zn、Fe，Al，Mg,Cr中的一种或几种。
3.根据权利要求1所述的柔性覆铜板的制造工艺，其特征在于，在沉积所述过渡层之前，在基材层表面先沉积一打底层，厚度为10nm～1μm。
4.根据权利要求3所述的柔性覆铜板的制造工艺，其特征在于，所述打底层所用材料为SiO2和BN中的一种或两种。
5.根据权利要求1中所述的柔性覆铜板的制造工艺，其特征在于，所述基材层的表面经电晕处理或化学微蚀处理或采用物理方法进行表面粗化后再沉积所述过渡层。
6.根据权利要求1所述的柔性覆铜板的制造工艺，其特征在于，所述基材层为LCP或PFA或PTFE含氟薄膜层。
7.一种柔性覆铜板，其特征在于，包括一基材层，所述基材层上下两面各设有一过渡层，所述过渡层上形成有一铜层，所述基材层为含氟薄膜层，所述过渡层为活性电极材料层，厚度为10nm～1μm，所述铜层的厚度为2μm～60μm。
8.根据权利要求7所述的柔性覆铜板，其特征在于，所述基材层和过渡层之间设置有一打底层，厚度为10nm～1μm。
9.根据权利要求7所述的柔性覆铜板，其特征在于，所述打底层的材料选自SiO2和BN中的一种或两种。
10.根据权利要求7所述的柔性覆铜板，其特征在于，所述活性电极材料为Ni、Zn、Fe，Al，Mg,Cr中的一种或几种。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810641719.1A CN108842136A (zh) | 2018-06-21 | 2018-06-21 | 柔性覆铜板及其制造工艺 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810641719.1A CN108842136A (zh) | 2018-06-21 | 2018-06-21 | 柔性覆铜板及其制造工艺 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108842136A true CN108842136A (zh) | 2018-11-20 |
Family
ID=64202834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810641719.1A Withdrawn CN108842136A (zh) | 2018-06-21 | 2018-06-21 | 柔性覆铜板及其制造工艺 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108842136A (zh) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111613385A (zh) * | 2020-04-16 | 2020-09-01 | 信维通信（江苏）有限公司 | 用于5g高频通信的ptfe覆铜板及其制作方法 |
| WO2022041443A1 (zh) * | 2020-08-22 | 2022-03-03 | 昆山鑫美源电子科技有限公司 | 一种导电薄膜的制备方法、电流汇集传输材料及能量储存装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0428740A1 (en) * | 1989-05-10 | 1991-05-29 | The Furukawa Electric Co., Ltd. | Electric contact material, method of producing said material, and electric contact produced therefrom |
| CN101340774A (zh) * | 2008-08-01 | 2009-01-07 | 浙江大学 | 柔性无胶覆铜板及其制备方法 |
| CN104476847A (zh) * | 2014-12-02 | 2015-04-01 | 广州方邦电子有限公司 | 一种高剥离强度挠性覆铜板及其制作方法 |
-
2018
- 2018-06-21 CN CN201810641719.1A patent/CN108842136A/zh not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0428740A1 (en) * | 1989-05-10 | 1991-05-29 | The Furukawa Electric Co., Ltd. | Electric contact material, method of producing said material, and electric contact produced therefrom |
| CN101340774A (zh) * | 2008-08-01 | 2009-01-07 | 浙江大学 | 柔性无胶覆铜板及其制备方法 |
| CN104476847A (zh) * | 2014-12-02 | 2015-04-01 | 广州方邦电子有限公司 | 一种高剥离强度挠性覆铜板及其制作方法 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111613385A (zh) * | 2020-04-16 | 2020-09-01 | 信维通信（江苏）有限公司 | 用于5g高频通信的ptfe覆铜板及其制作方法 |
| CN111613385B (zh) * | 2020-04-16 | 2022-01-18 | 信维通信（江苏）有限公司 | 用于5g高频通信的ptfe覆铜板及其制作方法 |
| WO2022041443A1 (zh) * | 2020-08-22 | 2022-03-03 | 昆山鑫美源电子科技有限公司 | 一种导电薄膜的制备方法、电流汇集传输材料及能量储存装置 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108697007A (zh) | 一种柔性覆铜板 | |
| CN1727179B (zh) | 多层金属复合薄膜及其制造方法 | |
| US8187722B2 (en) | Copper foil with carrier sheet, method for manufacturing copper foil with carrier sheet, and surface-treated copper foil with carrier sheet | |
| JP4754402B2 (ja) | キャリア箔付銅箔、キャリア箔付銅箔の製造方法、キャリア箔付表面処理銅箔及びそのキャリア箔付表面処理銅箔を用いた銅張積層板 | |
| JP2011516729A (ja) | マグネトロンスパッタリングによる厚膜の製造方法 | |
| CN108842136A (zh) | 柔性覆铜板及其制造工艺 | |
| KR20100014249A (ko) | 스퍼터링 타겟 및 제조 방법 | |
| TW201230913A (en) | Copper-clad laminate and method for manufacturing same | |
| US20080121414A1 (en) | Printed circuit board and method for manufacturing thereof | |
| JP2021035755A (ja) | キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板 | |
| WO2016086428A1 (zh) | 一种真空离子溅镀靶材装置 | |
| CN102612256A (zh) | 配线部件及其制造方法 | |
| JP6051492B2 (ja) | 拡散接合スパッター・ターゲット・アセンブリの製造方法 | |
| JP2023033313A (ja) | キャリア付銅箔 | |
| TWI783190B (zh) | 層積體 | |
| CN111823664A (zh) | 一种石墨复合散热片及其制备方法 | |
| JP2015157472A (ja) | 離型フィルム付銅箔 | |
| KR20150116523A (ko) | 지르코늄 복합소재 코팅층 및 상기 코팅층의 형성 방법 | |
| JP2009253274A (ja) | 金属印刷回路基板の原板及び原板の製造方法 | |
| WO2021039759A1 (ja) | キャリア層付き金属積層基材及びその製造方法、金属積層基材及びその製造方法、並びにプリント配線板 | |
| CN209357574U (zh) | 一种多弧打底金属化磁芯和贴片电感 | |
| TWI361842B (en) | Target designs and related methods for nehanced cooling and reduced deflection and deformation | |
| CN206022878U (zh) | 一种射频二氧化碳激光器用平板电极 | |
| TWI717107B (zh) | 層積體 | |
| TWI821628B (zh) | 靶材及其製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181120 |
|
| WW01 | Invention patent application withdrawn after publication |