CN108834322A - A kind of method of printed circuit - Google Patents
A kind of method of printed circuit Download PDFInfo
- Publication number
- CN108834322A CN108834322A CN201810688087.4A CN201810688087A CN108834322A CN 108834322 A CN108834322 A CN 108834322A CN 201810688087 A CN201810688087 A CN 201810688087A CN 108834322 A CN108834322 A CN 108834322A
- Authority
- CN
- China
- Prior art keywords
- coating
- water
- substrate
- metal
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/04—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching
- H05K3/046—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed mechanically, e.g. by punching by selective transfer or selective detachment of a conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0766—Rinsing, e.g. after cleaning or polishing a conductive pattern
Abstract
The present invention relates to printed circuit fields, disclose a kind of method of printed circuit, include the following steps：S1. mask coating is formed on substrate with water-soluble substances；S2. metal coating is formed on the mask coating that substrate and step S1 are formed with metal；S3. mask coating and step S2 that step S1 is formed are formed in the elution of the metal coating on mask coating with water.Mask coating is first formed on substrate with water-soluble substances before clad with metal foil, then up clad with metal foil forms metal coating again.When being rinsed with water, water-soluble substances will be dissolved in the water, and overlaying on metal foil thereon also can be with falling; and will not react between water and water-soluble substances and metal simple-substance, in this way, which metal simple-substance is just recycled; be conducive to save metal simple-substance, be also beneficial to environmental protection.
Description
Technical field
The present invention relates to printed circuit fields, more particularly, to a kind of method of printed circuit.
Background technique
Printed circuit board（PCB circuit board）, also known as printed circuit board is important electronic component, is electronic component
Supporter, be electronic component electrical connection carrier.The history of its existing more than 100 years of development；Its design is main
It is layout design；Major advantage using circuit board is to greatly reduce the mistake of wiring and assembly, and can realize electronic component
Automatic inserting or attachment, automatic tin soldering, automatic detection, ensure that the quality of electronic equipment, improve labor productivity, reduce
Cost, and it is easy to repair, improve the gentle productive labor rate of Automated water.Printed circuit board develops to two-sided, multilayer from single layer
And flexibility, and still keep respective development trend.Due to constantly being sent out to high-precision, high density and high reliability direction
Exhibition, constantly diminution volume reduce cost, improve performance, so that printed circuit board is in the development engineering of future electronic equipment, still
So remain powerful vitality.
In the prior art, the production process of printed circuit board can be divided into elimination and addition two major classes mistake according to different technologies
Journey.
One, null method（Subtractive）, it is to utilize chemicals or the mechanical circuit board by blank（It is covered with complete one
The circuit board of the metal foil of block）Upper unwanted place removes, and remaining place is required circuit.
Silk-screen printing：Silk screen mask is made in pre-designed circuit diagram, unwanted circuit part can quilt on silk screen
Wax or the covering of fluid-tight material, are then put into silk screen mask above blank wiring board, then will not be by silk screen oils
The protective agent of corrosion, wiring board is put into corrosive liquid, and the part not covered by protective agent will be eclipsed away, finally protection
Agent cleaning.
Photographic plate：Pre-designed circuit diagram system on the film mask of light transmission（Simplest way is exactly to use to beat
Print machine prints off the transparency come）, it is same the part of needs to be printed as opaque color, then sense is coated on blank wiring board
Ready film mask is put and irradiates strong light on circuit boards several minutes by delustering pigment, uses developer circuit after removing mask
Pattern displaying on plate comes out, finally circuit etch as the method with silk-screen printing.
Marking：Directly the unwanted part in stray line road is removed using milling machine or laser engraving machine.
Two, addition process（Additive）, now it is generally on the substrate for plating thin copper in advance at one piece, to cover photoresist
（D/F), develop again through ultraviolet photoetching, the place of needs is exposed, it is then using plating that route copper formal on wiring board is thick
Required specification is thickened, then plates one layer of anti-etching resist-metal foil tin, finally removes photoresist（This processing procedure is known as
Film）, then the copper foil layer under photoresist etched away.
But no matter which kind of method is used, the copper foil of non-line section is gone by the method corroded bar none
It removes, just results in the waste of copper in this way, and the process can cause larger pollution to environment.
Summary of the invention
In view of this, the present invention is to overcome at least one described in the above-mentioned prior art insufficient, provide a kind of safety and environmental protection,
The method of printed circuit easy to operate.
In order to solve above-mentioned technical problem, the present invention is adopted the following technical solutions：
A kind of method of printed circuit, includes the following steps：
S1. mask coating is formed on substrate with the water-soluble substances with adhesiveness；
S2. metal coating is formed on the mask coating that substrate and step S1 are formed with metal；
S3. mask coating and step S2 that step S1 is formed are formed in the elution of the metal coating on mask coating with water.
The present invention first forms mask coating with water-soluble substances before clad with metal foil on substrate, will not need to cover on substrate
The place of metal foil is coverd with, and is then up covered with one layer of metal foil again and is formed metal coating, therefore, metal coating part is directly covered
It is placed on substrate, is partially covered on mask coating.Since mask coating is made of water-soluble substances, Ke Yiyong
Water is dissolved, and will not be reacted between water and water-soluble substances and metal simple-substance, in this way, which metal simple-substance is just able to
Recycling is conducive to save metal simple-substance, is also beneficial to environmental protection.
Further, in step S1, the water-soluble substances are starch or flour, and starch or flour are to be easier to obtain
Water-soluble substances, and starch or flour naturally have adhesiveness, are conducive to the fixation of mask coating.Further, will
Starch or flour deploy pulp, are then coated with or spray printing is on the inverter circuit Printing Zone of substrate, drying forms mask coating.
Starch or flour containing moisture have better adhesiveness, have mask coating and adhere better on substrate.Preferably,
It is dry in 30 ~ 50 DEG C of baking oven by the starch of pulpous state or flour coating or spray printing after on the inverter circuit Printing Zone of substrate,
Be conducive to improve dry speed.It is highly preferred that in step S3, by the substrate handled by step S1 and step S2 with 20 ~ 50
DEG C water rinse, until mask coating and be covered in metal coating on mask coating and fall off.
Further, in step S2, the metal is copper.Preferably, copper foil is made in copper rolling, then passes through copper foil
Calendering technology is covered on the mask coating that substrate and step S1 are formed, and forms metal coating.Preferably, the copper foil is by thick
It is covered on the mask coating that substrate and step S1 are formed after change processing by calendering technology, forms metal coating.
The present invention has the advantages that compared with prior art：First with water-soluble with adhesiveness before clad with metal foil
Property substance mask coating is formed on substrate, then again up clad with metal foil formed metal coating.When being rinsed with water, water-soluble object
Matter will be dissolved in the water, and overlaying on metal foil thereon also can be with falling, and between water and water-soluble substances and metal simple-substance not
It can react, in this way, which metal simple-substance is just recycled, be conducive to save metal simple-substance, be also beneficial to environmental protection.
Specific embodiment
The present invention is described in further details combined with specific embodiments below.
Embodiment 1
A kind of method of printed circuit, includes the following steps：
S1. starch is deployed into pulp and be coated on the inverter circuit Printing Zone of substrate, dry in 30 ~ 50 DEG C of baking oven, shape
At mask coating；
S2. copper foil is made in copper rolling, then roughening treatment is covered in the mask that substrate and step S1 are formed by calendering technology
On coating, metal coating is formed.
S3. the substrate handled by step S1 and step S2 is rinsed with water, until mask coating and is covered in mask painting
Metal coating falls off on layer.
Embodiment 2
The present embodiment the difference from embodiment 1 is that, in step S1, by starch allotment pulp and spray printing in the inverter circuit of substrate
It is dry in 30 ~ 50 DEG C of baking oven on Printing Zone, form mask coating；The other the same as in Example 1.
Embodiment 3
The present embodiment the difference from embodiment 1 is that, in step S1, by flour deploy pulp and be coated on substrate inverter circuit
It is dry in 30 ~ 50 DEG C of baking oven on Printing Zone, form mask coating；The other the same as in Example 1.
Embodiment 4
The present embodiment the difference from embodiment 1 is that, in step S1, by flour allotment pulp and spray printing in the inverter circuit of substrate
It is dry in 30 ~ 50 DEG C of baking oven on Printing Zone, form mask coating；The other the same as in Example 1.
Embodiment 5
The difference of the present embodiment and above-described embodiment is, in step S3, the substrate handled by step S1 and step S2 is used
20 ~ 50 DEG C of water rinses, and until mask coating and is covered in metal coating on mask coating and falls off.Other same above-described embodiments.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
Made any modifications, equivalent replacements, and improvements etc., should be included in the claims in the present invention within the spirit and principle of invention
Protection scope within.
Claims (9)
1. a kind of method of printed circuit, which is characterized in that include the following steps：
S1. mask coating is formed on substrate with the water-soluble substances with adhesiveness；
S2. metal coating is formed on the mask coating that substrate and step S1 are formed with metal；
S3. mask coating and step S2 that step S1 is formed are formed in the elution of the metal coating on mask coating with water.
2. the method for printed circuit according to claim 1, which is characterized in that in step S1, the water-soluble substances are
Starch or flour.
3. the method for printed circuit according to claim 2, which is characterized in that in step S1, water-soluble substances are deployed
Pulp is then coated on the inverter circuit Printing Zone of substrate, and drying forms mask coating.
4. the method for printed circuit according to claim 2, which is characterized in that in step S1, water-soluble substances are deployed
Pulp, then for spray printing on the inverter circuit Printing Zone of substrate, drying forms mask coating.
5. the method for printed circuit according to claim 3 or 4, which is characterized in that in step S1, starch or face will be covered with
The substrate of powder is dry in 30 ~ 50 DEG C of baking oven.
6. the method for printed circuit according to claim 3 or 4, which is characterized in that in step S3, will by step S1 and
20 ~ 50 DEG C of the water flushing of the substrate of step S2 processing until mask coating and is covered in metal coating on mask coating and falls off.
7. the method for described in any item printed circuits according to claim 1 ~ 4, which is characterized in that in step S2, the metal
For copper.
8. the method for printed circuit according to claim 7, which is characterized in that in step S2, the copper rolling is made
Then copper foil is covered on the mask coating that substrate and step S1 are formed by calendering technology, forms metal coating by copper foil.
9. the method for printed circuit according to claim 8, which is characterized in that in step S2, the copper foil is by roughening
It is covered on the mask coating that substrate and step S1 are formed after processing by calendering technology, forms metal coating.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810289706 | 2018-03-30 | ||
| CN2018102897062 | 2018-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108834322A true CN108834322A (en) | 2018-11-16 |
Family
ID=64133546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810688087.4A Pending CN108834322A (en) | 2018-03-30 | 2018-06-28 | A kind of method of printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108834322A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0594932A1 (en) * | 1992-10-27 | 1994-05-04 | Matsushita Electric Industrial Co., Ltd. | Method for forming patterned transparent conducting film |
| CN1453624A (en) * | 2002-04-24 | 2003-11-05 | 希毕克斯影像有限公司 | Method for forming pattern thin film electric conduction structure on base plate |
| CN1597333A (en) * | 2003-09-19 | 2005-03-23 | 希毕克斯影像有限公司 | Process for forming a patterned thin film structure for in-mold decoration |
-
2018
- 2018-06-28 CN CN201810688087.4A patent/CN108834322A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0594932A1 (en) * | 1992-10-27 | 1994-05-04 | Matsushita Electric Industrial Co., Ltd. | Method for forming patterned transparent conducting film |
| CN1453624A (en) * | 2002-04-24 | 2003-11-05 | 希毕克斯影像有限公司 | Method for forming pattern thin film electric conduction structure on base plate |
| CN1597333A (en) * | 2003-09-19 | 2005-03-23 | 希毕克斯影像有限公司 | Process for forming a patterned thin film structure for in-mold decoration |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181116 |