CN108767092B - Method and device for transferring MicroLED chips in batches - Google Patents
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Abstract
Description
技术领域Technical Field
本发明涉及发光二极管生产技术领域，尤其涉及一种批量转移MicroLED芯片的方法和装置。The present invention relates to the technical field of light emitting diode production, and in particular to a method and device for batch transferring MicroLED chips.
背景技术Background technique
MicroLED比现有的OLED技术亮度更高、发光效率更好、但功耗更低。MicroLED出色的特性将使得它可以在电视、iPhone、iPad上应用。MicroLED is brighter and more efficient than existing OLED technology, but consumes less power. The outstanding features of MicroLED will enable it to be used in TVs, iPhones, and iPads.
MicroLED Display的显示原理，是将LED结构设计进行薄膜化、微小化、阵列化，其尺寸仅在1-10μm等级左右；后将MicroLED批量式转移至电路基板上，其基板可为硬性、软性之透明、不透明基板上；再利用物理沉积制程完成保护层与上电极，即可进行上基板的封装，完成结构简单的MicroLED显示。The display principle of MicroLED Display is to design the LED structure into a thin film, miniaturized and arrayed structure, with a size of only about 1-10μm. The MicroLED is then transferred in batches to a circuit substrate, which can be a hard, soft, transparent or opaque substrate. The protective layer and the upper electrode are then completed using a physical deposition process, and the upper substrate can be packaged to complete the simple MicroLED display.
批量式转移是指在指甲盖大小的TFT电路基板上，按照光学和电气学的必要规范，均匀焊接三五百，甚至更多个红绿蓝三原色LED微小晶粒，且允许的工艺失败率是有几十万分之一。因此，MicroLED的核心技术之一就是如何实现批量式转移技术。Batch transfer refers to the uniform welding of three to five hundred or even more red, green and blue primary color LED micro grains on a TFT circuit substrate the size of a fingernail in accordance with the necessary optical and electrical specifications, and the allowable process failure rate is one in hundreds of thousands. Therefore, one of the core technologies of MicroLED is how to achieve batch transfer technology.
发明内容Summary of the invention
本发明所要解决的技术问题在于，提供一种批量转移MicroLED芯片的方法，将MicroLED芯片批量准确定位在基板上，操作简单，效率高。The technical problem to be solved by the present invention is to provide a method for batch transferring MicroLED chips, which can accurately position the MicroLED chips on a substrate in batches, with simple operation and high efficiency.
本发明所要解决的技术问题在于，提供一种用于批量转移MicroLED芯片的装置，结构简单，可以将MicroLED芯片批量准确定位在基板上，操作简单，效率高。The technical problem to be solved by the present invention is to provide a device for batch transferring MicroLED chips, which has a simple structure and can accurately position MicroLED chips in batches on a substrate, is easy to operate and has high efficiency.
为了解决上述技术问题，本发明提供了一种批量转移MicroLED芯片的方法，包括：In order to solve the above technical problems, the present invention provides a method for batch transferring MicroLED chips, comprising:
提供一带有通孔的基板；Providing a substrate with a through hole;
在基板的表面喷洒吸附液体；Spraying the adsorption liquid on the surface of the substrate;
将MicroLED芯片放置在基板的表面；Placing the MicroLED chip on the surface of the substrate;
使通孔处于负压状态，将MicroLED芯片吸附在通孔上；The through hole is placed in a negative pressure state to adsorb the MicroLED chip onto the through hole;
除去通孔以外的MicroLED芯片和吸附液体；Remove the MicroLED chip and adsorption liquid outside the through hole;
除去通孔内的吸附液体。Remove the adsorbed liquid in the through-hole.
作为上述方案的改进，采用回翻蓝膜的方式将MicroLED芯片的朝向一致。As an improvement to the above solution, the orientation of the MicroLED chips is aligned by flipping back the blue film.
作为上述方案的改进，所述通孔与负压装置形成连接。As an improvement of the above solution, the through hole is connected to the negative pressure device.
作为上述方案的改进，采用负压装置将通孔内的吸附液体抽走。As an improvement of the above solution, a negative pressure device is used to extract the adsorbed liquid in the through hole.
作为上述方案的改进，所述通孔的面积小于芯片的面积。As an improvement of the above solution, the area of the through hole is smaller than the area of the chip.
作为上述方案的改进，采用气流将通孔以外的MicroLED芯片吹走，并将吸附液体吹干。As an improvement to the above solution, airflow is used to blow away the MicroLED chips outside the through holes and dry the adsorbed liquid.
作为上述方案的改进，所述气流由氮气或惰性气体组成。As an improvement of the above solution, the gas flow consists of nitrogen or an inert gas.
作为上述方案的改进，所述通孔均匀分布在基板上。As an improvement of the above solution, the through holes are evenly distributed on the substrate.
作为上述方案的改进，在除去通孔内的吸附液体之后，还包括以下步骤：As an improvement of the above solution, after removing the adsorbed liquid in the through hole, the following steps are further included:
将基板上的MicroLED芯片转移到与基板对应的PCB板上。Transfer the MicroLED chip on the substrate to the PCB board corresponding to the substrate.
相应的，本发明还提供了一种用于批量转移MicroLED芯片的装置，包括：Accordingly, the present invention further provides a device for batch transferring MicroLED chips, comprising:
基板，所述基板上设有多个通孔；A substrate, wherein a plurality of through holes are provided on the substrate;
喷洒组件，所述喷洒组件包括储药罐和喷头，所述喷头将储药罐中的溶液喷洒在基板上；A spray assembly, the spray assembly comprising a medicine storage tank and a spray head, the spray head sprays the solution in the medicine storage tank onto the substrate;
与通孔连接的负压组件，所述负压组件包括动力设备，所述动力设备通过管道与通孔形成密封连接，并使通孔处于负压状态；A negative pressure component connected to the through hole, the negative pressure component comprising a power device, the power device forms a sealed connection with the through hole through a pipeline, and puts the through hole in a negative pressure state;
通风组件，所述通风组件将通孔以外的芯片吹走，并将基板上的溶液吹干。A ventilation component is used to blow away the chips outside the through-holes and dry the solution on the substrate.
实施本发明，具有如下有益效果：The implementation of the present invention has the following beneficial effects:
1、本发明通过将基板上的通孔处于负压状态，同时利用吸附液体的表面张力，将随机、零散的MicroLED芯片吸附在通孔上，从而实现准确定位，大量零散的MicroLED芯片以通孔为定位点，实现整齐排列，不需要人工一颗一颗来进行转移，实现了大批量转移，操作简单，效率高。1. The present invention places the through holes on the substrate in a negative pressure state and utilizes the surface tension of the adsorbed liquid to adsorb random and scattered MicroLED chips on the through holes, thereby achieving accurate positioning. A large number of scattered MicroLED chips are neatly arranged with the through holes as positioning points, and there is no need to transfer them one by one manually, thus achieving large-scale transfer with simple operation and high efficiency.
2、本发明采用气流的方式除去MicroLED芯片和吸附液体，既不会损伤芯片，又能同时批量移走通孔以外的芯片，并同时将吸附液体除去，操作简单，效率高。2. The present invention uses airflow to remove MicroLED chips and adsorbed liquid, which will not damage the chips, but can also remove chips outside the through holes in batches and remove the adsorbed liquid at the same time. The operation is simple and efficient.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1是本发明批量转移MicroLED芯片的流程图；FIG1 is a flow chart of batch transfer of MicroLED chips according to the present invention;
图2是本发明用于批量转移MicroLED芯片的装置的结构示意图。FIG. 2 is a schematic diagram of the structure of a device for batch transferring MicroLED chips according to the present invention.
具体实施方式Detailed ways
为使本发明的目的、技术方案和优点更加清楚，下面将结合附图对本发明作进一步地详细描述。In order to make the objectives, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings.
参见图1，图1是本发明批量转移MicroLED芯片的流程图，本发明提供的一种批量转移MicroLED芯片的方法，包括以下步骤：Referring to FIG. 1 , FIG. 1 is a flow chart of the batch transfer of MicroLED chips of the present invention. The present invention provides a method for batch transfer of MicroLED chips, comprising the following steps:
S101、提供一带有通孔的基板。S101, providing a substrate with a through hole.
所述基板由玻璃、金属或塑料制成，但不限于此。所述基板上设有均匀分布的通孔，由于通孔上的MicroLED芯片最终需要转移到PCB板上，因此基板上的通孔与PCB板上的芯片焊接点相对应，此外，所述通孔的面积小于MicroLED芯片的面积。如果通孔的面积大于芯片的面积，则芯片会被吸附在通孔内，不便于后续芯片转移到PCB板上。The substrate is made of glass, metal or plastic, but not limited thereto. The substrate is provided with evenly distributed through holes. Since the MicroLED chips on the through holes need to be transferred to the PCB board eventually, the through holes on the substrate correspond to the chip welding points on the PCB board. In addition, the area of the through holes is smaller than the area of the MicroLED chip. If the area of the through holes is larger than the area of the chip, the chip will be adsorbed in the through holes, which is not convenient for the subsequent transfer of the chip to the PCB board.
S102、在基板的表面喷洒吸附液体。S102, spraying adsorption liquid on the surface of the substrate.
本发明在基板的表面喷洒吸附液体，利用吸附液体的表面张力，与通孔负压相配合，从而使MicroLED芯片能够被吸附在通孔上，实现芯片的准确定位。The present invention sprays adsorption liquid on the surface of the substrate, and utilizes the surface tension of the adsorption liquid in coordination with the negative pressure of the through hole, so that the MicroLED chip can be adsorbed on the through hole, thereby achieving accurate positioning of the chip.
为了使MicroLED芯片更加容易吸附在通孔上，所述吸附液体为表面张力大的挥发性液体。由于吸附液体最终需要除去，挥发性强的液体有利于后续的操作。优选的，所述挥发性液体为乙醇、丙酮或水。In order to make the MicroLED chip easier to adsorb on the through hole, the adsorption liquid is a volatile liquid with high surface tension. Since the adsorption liquid needs to be removed in the end, a highly volatile liquid is beneficial for subsequent operations. Preferably, the volatile liquid is ethanol, acetone or water.
S103、将MicroLED芯片放置在基板的表面。S103, placing the MicroLED chip on the surface of the substrate.
由于后续是通过通孔负压来将MicroLED芯片进行准确定位，为了节省人力和时间，所述MicroLED芯片可以随机、零散的放置在基板上。Since the MicroLED chips are subsequently accurately positioned by negative pressure from the through holes, in order to save manpower and time, the MicroLED chips can be randomly and scatteredly placed on the substrate.
S104、使通孔处于负压状态，将MicroLED芯片吸附在通孔上。S104, placing the through hole in a negative pressure state, and adsorbing the MicroLED chip onto the through hole.
为了使通孔能够形成负压状态，将MicroLED芯片吸附在通孔上，所述通孔与负压装置形成连接。在本申请的其他实施中，还可以通过现有的方式是通孔处于负压状态，本发明不一一列举。其中，所述负压装置为现有负压设备，例如：负压泵、真空泵等。In order to enable the through hole to form a negative pressure state, the MicroLED chip is adsorbed on the through hole, and the through hole is connected to the negative pressure device. In other embodiments of the present application, the through hole can also be in a negative pressure state by existing methods, which are not listed one by one in the present invention. Among them, the negative pressure device is an existing negative pressure device, such as: a negative pressure pump, a vacuum pump, etc.
启动负压装置时，所述通孔处于负压状态，在通孔附近的MicroLED芯片在吸附液体表面张力的作用下，被吸附在通孔上，从而实现准确定位，大量零散的MicroLED芯片以通孔为定位点，实现整齐排列，不需要人工一颗一颗来进行转移，实现了大批量转移。When the negative pressure device is started, the through hole is in a negative pressure state, and the MicroLED chips near the through hole are adsorbed on the through hole under the action of the surface tension of the adsorbed liquid, thereby achieving accurate positioning. A large number of scattered MicroLED chips are neatly arranged with the through hole as the positioning point, and there is no need to transfer them one by one manually, thus achieving large-scale transfer.
需要说明的是，现有的MicroLED芯片一般为垂直结构，发光面为正反两面及侧面，其中，芯片的正反面为同一状态，芯片的正反表面均为金属(即电极)。其中，为了使得芯片的正反面朝向一致，可以采用回翻蓝膜的方式将MicroLED芯片的朝向一致。具体的，采用不同粘度的蓝膜来回翻蓝膜，从而使芯片朝向一致。It should be noted that the existing MicroLED chips are generally vertical structures, with the light-emitting surfaces being the front, back and side surfaces, wherein the front and back surfaces of the chip are in the same state, and the front and back surfaces of the chip are both metal (i.e., electrodes). In order to make the front and back surfaces of the chip face the same direction, the MicroLED chips can be oriented in the same direction by flipping back the blue film. Specifically, blue films of different viscosities are used to flip back and forth the blue film, so that the chips face the same direction.
S105、除去通孔以外的MicroLED芯片和吸附液体。S105, removing the MicroLED chip and adsorption liquid outside the through hole.
具体的，采用气流将通孔以外的MicroLED芯片吹走，并将吸附液体吹干。采用气流的方式除去MicroLED芯片和吸附液体，既不会损伤芯片，又能同时批量移走通孔以外的芯片，并同时将吸附液体除去，操作简单，效率高。为了避免气流与芯片发生反应，防止静电，优选的，所述气流由氮气或惰性气体组成。在本申请的其他实施例中，也可以采用风机或风筒来除去通孔以外的MicroLED芯片和吸附液体。Specifically, an airflow is used to blow away the MicroLED chips outside the through-holes, and the adsorbed liquid is blown dry. The use of airflow to remove the MicroLED chips and the adsorbed liquid will not damage the chips, and can simultaneously remove the chips outside the through-holes in batches, and remove the adsorbed liquid at the same time. The operation is simple and efficient. In order to avoid the reaction between the airflow and the chips and prevent static electricity, preferably, the airflow is composed of nitrogen or an inert gas. In other embodiments of the present application, a fan or a blower can also be used to remove the MicroLED chips and the adsorbed liquid outside the through-holes.
为了避免通孔中的芯片被气流吹走，可以减少通孔内的压强，或者控制气流的风力，优选的，垂直于芯片方向的单位面积的风力不小于50N/m2。To prevent the chip in the through hole from being blown away by the airflow, the pressure in the through hole can be reduced, or the wind force of the airflow can be controlled. Preferably, the wind force per unit area perpendicular to the chip direction is not less than 50 N/m 2 .
S106、除去通孔内的吸附液体。S106, removing the adsorbed liquid in the through hole.
采用负压装置将通孔内的吸附液体抽走。A negative pressure device is used to extract the adsorbed liquid in the through hole.
需要说明的是，在除去通孔内的吸附液体之后，还包括以下步骤：将基板上的MicroLED芯片转移到与基板对应的PCB板上。It should be noted that after removing the adsorbed liquid in the through hole, the following step is also included: transferring the MicroLED chip on the substrate to a PCB board corresponding to the substrate.
参见图2，本发明还提供了一种用于批量转移MicroLED芯片的装置，包括基板1、喷洒组件、负压组件、和通风组件4。Referring to FIG. 2 , the present invention further provides a device for batch transferring MicroLED chips, comprising a substrate 1 , a spraying component, a negative pressure component, and a ventilation component 4 .
所述基板1由玻璃、金属或塑料制成，但不限于此。所述基板1上设有多个通孔11。优选的，所述通孔11均匀设置在基板1上，由于通孔11上的MicroLED芯片6最终需要转移到PCB板上，因此基板1上的通孔11与PCB板上的芯片焊接点相对应，此外，所述通孔11的面积小于MicroLED芯片6的面积。如果通孔11的面积大于MicroLED芯片6的面积，则芯片会被吸附在通孔11内，不便于后续芯片转移到PCB板上。The substrate 1 is made of glass, metal or plastic, but is not limited thereto. A plurality of through holes 11 are provided on the substrate 1. Preferably, the through holes 11 are evenly arranged on the substrate 1. Since the MicroLED chip 6 on the through hole 11 needs to be transferred to the PCB board eventually, the through hole 11 on the substrate 1 corresponds to the chip welding point on the PCB board. In addition, the area of the through hole 11 is smaller than the area of the MicroLED chip 6. If the area of the through hole 11 is larger than the area of the MicroLED chip 6, the chip will be adsorbed in the through hole 11, which is not convenient for the subsequent chip transfer to the PCB board.
所述喷洒组件包括储药罐21和喷头22，所述喷头22将储药罐21中的溶液喷洒在基板1上。所述储药罐21内装有吸附液体，所述吸附液体用于将MicroLED芯片6的表面形成表面张力，使MicroLED芯片6能够被吸附在通孔11上，实现芯片的准确定位。The spraying assembly includes a medicine storage tank 21 and a nozzle 22, and the nozzle 22 sprays the solution in the medicine storage tank 21 onto the substrate 1. The medicine storage tank 21 contains an adsorption liquid, and the adsorption liquid is used to form surface tension on the surface of the MicroLED chip 6, so that the MicroLED chip 6 can be adsorbed on the through hole 11, thereby achieving accurate positioning of the chip.
为了使MicroLED芯片6更加容易吸附在通孔上，所述吸附液体为表面张力大的挥发性液体。由于吸附液体最终需要除去，挥发性强的液体有利于后续的操作。优选的，所述挥发性液体为乙醇、丙酮或水。In order to make the MicroLED chip 6 more easily adsorbed on the through hole, the adsorption liquid is a volatile liquid with large surface tension. Since the adsorption liquid needs to be removed in the end, a highly volatile liquid is beneficial to subsequent operations. Preferably, the volatile liquid is ethanol, acetone or water.
为了便于将吸附液体喷洒在基板1的表面上，节省人力，所述储药罐21通过管道5与喷头22连接，优选的，管道5上设有电机23，所述电机23将储药罐21中的吸附液体自动输送到喷头22，并喷洒在基板1的表面上。In order to facilitate spraying the adsorption liquid on the surface of the substrate 1 and save manpower, the medicine storage tank 21 is connected to the nozzle 22 through a pipe 5. Preferably, a motor 23 is provided on the pipe 5, and the motor 23 automatically transports the adsorption liquid in the medicine storage tank 21 to the nozzle 22 and sprays it on the surface of the substrate 1.
为了使通孔11能有处于负压状态，将MicroLED芯片6吸附在通孔11上，所述通孔11与负压组件形成连接。具体的，所述负压组件包括动力设备31，所述动力设备31通过管道5与通孔11形成密封连接，并使通孔11处于负压状态。其中，所述负压组件还包括吸盘32，所述吸盘32吸附在通孔11的底部并与管道5连接。需要说明的是，所述动力设备31为现有负压设备，例如：负压泵、真空泵等。In order to make the through hole 11 in a negative pressure state, the MicroLED chip 6 is adsorbed on the through hole 11, and the through hole 11 is connected to the negative pressure component. Specifically, the negative pressure component includes a power device 31, and the power device 31 forms a sealed connection with the through hole 11 through the pipeline 5, and makes the through hole 11 in a negative pressure state. Among them, the negative pressure component also includes a suction cup 32, and the suction cup 32 is adsorbed on the bottom of the through hole 11 and connected to the pipeline 5. It should be noted that the power device 31 is an existing negative pressure device, such as: a negative pressure pump, a vacuum pump, etc.
启动动力设备31时，所述通孔11处于负压状态，在通孔11附近的MicroLED芯片6在吸附液体表面张力的作用下，被吸附在通孔11上，从而实现准确定位，大量零散的MicroLED芯片6以通孔为定位点，实现整齐排列，不需要人工一颗一颗来进行转移，实现了大批量转移。When the power device 31 is started, the through hole 11 is in a negative pressure state, and the MicroLED chip 6 near the through hole 11 is adsorbed on the through hole 11 under the action of the surface tension of the adsorption liquid, thereby achieving accurate positioning. A large number of scattered MicroLED chips 6 are neatly arranged with the through hole as the positioning point, and there is no need to transfer them one by one manually, thus achieving large-scale transfer.
所述通风组件4用于将通孔11以外的芯片吹走，并将基板11上的溶液吹干。通风组件4可以设置在基板11的上方，也可以设置在基板11的上，本申请不做具体限定。其中，所述通风组件4为风机或风筒，但不限于此。The ventilation component 4 is used to blow away the chips outside the through hole 11 and dry the solution on the substrate 11. The ventilation component 4 can be arranged above the substrate 11 or on the substrate 11, which is not specifically limited in this application. The ventilation component 4 is a fan or a wind tube, but is not limited thereto.
以上所揭露的仅为本发明一种较佳实施例而已，当然不能以此来限定本发明之权利范围，因此依本发明权利要求所作的等同变化，仍属本发明所涵盖的范围。The above disclosure is only a preferred embodiment of the present invention, which certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope of the present invention.
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