CN108767092B - Method and device for transferring MicroLED chips in batches - Google Patents
Method and device for transferring MicroLED chips in batches Download PDFInfo
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- CN108767092B CN108767092B CN201810782925.4A CN201810782925A CN108767092B CN 108767092 B CN108767092 B CN 108767092B CN 201810782925 A CN201810782925 A CN 201810782925A CN 108767092 B CN108767092 B CN 108767092B
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 46
- 239000000758 substrate Substances 0.000 claims abstract description 46
- 238000001179 sorption measurement Methods 0.000 claims abstract description 22
- 238000005507 spraying Methods 0.000 claims abstract description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000007789 gas Substances 0.000 claims description 4
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000007921 spray Substances 0.000 description 10
- 239000003814 drug Substances 0.000 description 7
- 230000006872 improvement Effects 0.000 description 7
- 238000003860 storage Methods 0.000 description 5
- 238000009423 ventilation Methods 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005289 physical deposition Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Micromachines (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention discloses a method for transferring MicroLED chips in batches, which comprises the following steps: providing a substrate with a through hole; spraying adsorption liquid on the surface of the substrate; placing MicroLED chips on the surface of a substrate; making the through hole in a negative pressure state, and adsorbing MicroLED chips on the through hole; microLED chips and adsorbed liquid outside the through holes are removed; removing the adsorbed liquid in the through hole. According to the invention, through holes on the substrate are in a negative pressure state, and random and scattered MicroLED chips are adsorbed on the through holes by utilizing the surface tension of adsorption liquid, so that accurate positioning is realized, a large number of scattered MicroLED chips take the through holes as positioning points, ordered arrangement is realized, manual transfer is not needed, mass transfer is realized, and the operation is simple and the efficiency is high. Correspondingly, the invention also provides a device for transferring MicroLED chips in batches, which has a simple structure and is easy to operate.
Description
Technical Field
The invention relates to the technical field of light-emitting diode production, in particular to a method and a device for transferring MicroLED chips in batches.
Background
MicroLED has higher brightness, better luminous efficiency and lower power consumption than the prior OLED technology. The excellent properties of MicroLED would make it applicable on televisions, iphones, ipads.
MicroLED Display, the display principle is that the LED structure design is thinned, miniaturized and arrayed, and the size of the LED structure design is only about 1-10 mu m; then, microLED is transferred to the circuit substrate in batches, wherein the substrate can be a hard and soft transparent and opaque substrate; and then the protective layer and the upper electrode are finished by using a physical deposition process, so that the upper substrate can be packaged, and MicroLED display with a simple structure is finished.
Batch transfer refers to uniformly soldering three-five hundred or even more red, green and blue primary color LED micro-dies on a nail cover-sized TFT circuit substrate according to the necessary specifications of optics and electronics, and the allowable process failure rate is one hundred thousand. Therefore, one of the core technologies of MicroLED is how to implement the batch transfer technology.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for transferring MicroLED chips in batches, which is used for accurately positioning MicroLED chips on a substrate in batches, and has the advantages of simple operation and high efficiency.
The invention aims to solve the technical problem of providing a device for transferring MicroLED chips in batches, which has a simple structure, can accurately position MicroLED chips on a substrate in batches, and is simple to operate and high in efficiency.
In order to solve the technical problems, the invention provides a method for transferring MicroLED chips in batches, which comprises the following steps:
Providing a substrate with a through hole;
Spraying adsorption liquid on the surface of the substrate;
placing MicroLED chips on the surface of a substrate;
Making the through hole in a negative pressure state, and adsorbing MicroLED chips on the through hole;
MicroLED chips and adsorbed liquid outside the through holes are removed;
removing the adsorbed liquid in the through hole.
As an improvement of the scheme, the MicroLED chips are oriented uniformly by adopting a mode of turning back the blue film.
As an improvement of the above solution, the through hole is connected with the negative pressure device.
As an improvement of the scheme, a negative pressure device is adopted to pump away the adsorption liquid in the through hole.
As an improvement of the above scheme, the area of the through hole is smaller than that of the chip.
As an improvement of the scheme, microLED chips except the through holes are blown away by air flow, and adsorbed liquid is dried.
As a modification of the above, the gas stream is composed of nitrogen or an inert gas.
As an improvement of the scheme, the through holes are uniformly distributed on the substrate.
As an improvement of the above-mentioned scheme, after removing the adsorbed liquid in the through hole, the method further comprises the steps of:
And transferring MicroLED chips on the substrate to a PCB corresponding to the substrate.
Correspondingly, the invention also provides a device for transferring MicroLED chips in batches, which comprises:
A substrate provided with a plurality of through holes;
the spraying assembly comprises a medicine storage tank and a spray head, and the spray head sprays the solution in the medicine storage tank on the substrate;
The negative pressure assembly is connected with the through hole and comprises power equipment, and the power equipment is in sealing connection with the through hole through a pipeline and enables the through hole to be in a negative pressure state;
and the ventilation assembly blows away the chips except the through holes and dries the solution on the substrate.
The implementation of the invention has the following beneficial effects:
1. According to the invention, through holes on the substrate are in a negative pressure state, and random and scattered MicroLED chips are adsorbed on the through holes by utilizing the surface tension of adsorption liquid, so that accurate positioning is realized, a large number of scattered MicroLED chips take the through holes as positioning points, ordered arrangement is realized, manual transfer is not needed, mass transfer is realized, and the operation is simple and the efficiency is high.
2. The invention removes MicroLED chips and adsorption liquid in an air flow mode, does not damage the chips, can simultaneously remove chips except through holes in batches, simultaneously removes adsorption liquid, and has simple operation and high efficiency.
Drawings
FIG. 1 is a flow chart of the present invention for batch transfer MicroLED of chips;
Fig. 2 is a schematic diagram of an apparatus for batch transfer MicroLED of chips according to the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present invention more apparent.
Referring to fig. 1, fig. 1 is a flow chart of batch transfer MicroLED of chips according to the present invention, and a method for batch transfer MicroLED of chips according to the present invention includes the following steps:
s101, providing a substrate with a through hole.
The substrate is made of glass, metal or plastic, but is not limited thereto. The substrate is provided with evenly distributed through holes, and MicroLED chips on the through holes are finally required to be transferred to the PCB, so that the through holes on the substrate correspond to the chip welding points on the PCB, and in addition, the area of the through holes is smaller than that of MicroLED chips. If the area of the through hole is larger than that of the chip, the chip can be adsorbed in the through hole, and the subsequent chip is inconvenient to transfer to the PCB.
S102, spraying adsorption liquid on the surface of the substrate.
According to the invention, the adsorption liquid is sprayed on the surface of the substrate, and the surface tension of the adsorption liquid is utilized to be matched with the negative pressure of the through hole, so that MicroLED chips can be adsorbed on the through hole, and the accurate positioning of the chips is realized.
In order to make MicroLED chips more easily adsorbed on the through holes, the adsorption liquid is a volatile liquid with high surface tension. The highly volatile liquid is advantageous for subsequent operations, since the adsorbed liquid eventually needs to be removed. Preferably, the volatile liquid is ethanol, acetone or water.
S103, placing MicroLED chips on the surface of the substrate.
Since the MicroLED chips are accurately positioned through the through hole negative pressure, the MicroLED chips can be randomly and scattered placed on the substrate for saving manpower and time.
S104, enabling the through holes to be in a negative pressure state, and adsorbing MicroLED chips on the through holes.
In order to enable the through holes to form a negative pressure state, microLED chips are adsorbed on the through holes, and the through holes are connected with a negative pressure device. In other embodiments of the present application, the through hole may be in a negative pressure state in a conventional manner, which is not meant to be limiting. Wherein, negative pressure device is current negative pressure equipment, for example: negative pressure pumps, vacuum pumps, etc.
When the negative pressure device is started, the through holes are in a negative pressure state, microLED chips near the through holes are adsorbed on the through holes under the action of the surface tension of adsorbed liquid, so that accurate positioning is realized, a large number of scattered MicroLED chips take the through holes as positioning points, orderly arrangement is realized, manual transfer is not required, and mass transfer is realized.
It should be noted that, the conventional MicroLED chip is generally in a vertical structure, the light-emitting surface is a front surface, a back surface and a side surface, wherein the front surface and the back surface of the chip are in the same state, and the front surface and the back surface of the chip are both made of metal (i.e. electrodes). In order to make the front and back faces of the chips consistent, the MicroLED chips can be oriented in a mode of turning back the blue film. Specifically, blue films with different viscosities are adopted to turn back and forth, so that the chip orientation is consistent.
S105, removing MicroLED chips except the through holes and adsorbing liquid.
Specifically, the MicroLED chips outside the through holes are blown away by adopting air flow, and the adsorption liquid is dried. The MicroLED chips and the adsorption liquid are removed in an airflow mode, the chips can not be damaged, the chips except the through holes can be removed in batches, the adsorption liquid is removed, the operation is simple, and the efficiency is high. In order to avoid the reaction of the gas flow with the chip and to prevent static electricity, it is preferable that the gas flow is composed of nitrogen or inert gas. In other embodiments of the application, fans or air cylinders may be used to remove MicroLED chips and adsorbed liquids outside of the through holes.
In order to avoid that the chip in the through hole is blown away by the air flow, the pressure in the through hole can be reduced, or the wind power of the air flow is controlled, preferably, the wind power of the unit area vertical to the direction of the chip is not less than 50N/m 2.
S106, removing the adsorption liquid in the through holes.
And sucking away the adsorption liquid in the through hole by adopting a negative pressure device.
After removing the adsorbed liquid in the through hole, the method further comprises the following steps: and transferring MicroLED chips on the substrate to a PCB corresponding to the substrate.
Referring to fig. 2, the present invention also provides an apparatus for transferring MicroLED chips in a batch, including a substrate 1, a spray assembly, a negative pressure assembly, and a ventilation assembly 4.
The substrate 1 is made of glass, metal or plastic, but is not limited thereto. The substrate 1 is provided with a plurality of through holes 11. Preferably, the through holes 11 are uniformly arranged on the substrate 1, and since MicroLED chips 6 on the through holes 11 are finally required to be transferred to the PCB, the through holes 11 on the substrate 1 correspond to the chip bonding points on the PCB, and in addition, the area of the through holes 11 is smaller than that of the MicroLED chips 6. If the area of the through hole 11 is larger than that of the MicroLED chip 6, the chip is absorbed in the through hole 11, so that the subsequent chip is inconvenient to transfer to the PCB.
The spray assembly comprises a medicine tank 21 and a spray head 22, wherein the spray head 22 sprays the solution in the medicine tank 21 on the substrate 1. The medicine storage tank 21 is filled with adsorption liquid, and the adsorption liquid is used for forming surface tension on the surface of the MicroLED chip 6, so that the MicroLED chip 6 can be adsorbed on the through hole 11, and accurate positioning of the chip is realized.
In order to make MicroLED the chip 6 more easily adsorbed on the through hole, the adsorption liquid is a volatile liquid with high surface tension. The highly volatile liquid is advantageous for subsequent operations, since the adsorbed liquid eventually needs to be removed. Preferably, the volatile liquid is ethanol, acetone or water.
In order to facilitate spraying the adsorption liquid on the surface of the substrate 1, the medicine storage tank 21 is connected with the spray head 22 through the pipeline 5, preferably, a motor 23 is arranged on the pipeline 5, and the adsorption liquid in the medicine storage tank 21 is automatically conveyed to the spray head 22 by the motor 23 and sprayed on the surface of the substrate 1.
In order to enable the through hole 11 to be in a negative pressure state, microLED chips 6 are adsorbed on the through hole 11, and the through hole 11 is connected with a negative pressure component. Specifically, the negative pressure assembly comprises a power device 31, and the power device 31 is in sealing connection with the through hole 11 through the pipeline 5, and enables the through hole 11 to be in a negative pressure state. The negative pressure assembly further comprises a sucker 32, and the sucker 32 is adsorbed at the bottom of the through hole 11 and is connected with the pipeline 5. It should be noted that, the power device 31 is an existing negative pressure device, for example: negative pressure pumps, vacuum pumps, etc.
When the power equipment 31 is started, the through holes 11 are in a negative pressure state, microLED chips 6 near the through holes 11 are adsorbed on the through holes 11 under the action of the surface tension of adsorbed liquid, so that accurate positioning is realized, a large number of scattered MicroLED chips 6 take the through holes as positioning points, ordered arrangement is realized, manual transfer is not needed, and mass transfer is realized.
The ventilation assembly 4 is used for blowing away chips except the through holes 11 and drying the solution on the substrate 11. The ventilation assembly 4 may be disposed above the base plate 11 or may be disposed on the base plate 11, and the present application is not particularly limited. Wherein, the ventilation component 4 is a fan or a wind barrel, but is not limited thereto.
The above disclosure is only a preferred embodiment of the present invention, and it is needless to say that the scope of the invention is not limited thereto, and therefore, the equivalent changes according to the claims of the present invention still fall within the scope of the present invention.
Claims (9)
1. A method for batch transfer MicroLED of chips, comprising:
Providing a substrate with a through hole;
Spraying adsorption liquid on the surface of the substrate;
placing MicroLED chips on the surface of a substrate;
Making the through hole in a negative pressure state, and adsorbing MicroLED chips on the through hole;
MicroLED chips and adsorbed liquid outside the through holes are removed;
removing the adsorbed liquid in the through hole.
2. The method for batch transfer MicroLED of chips as defined in claim 1, wherein MicroLED chips are oriented in a uniform manner by flipping back the blue film.
3. The method of batch transfer MicroLED of chips as defined in claim 1, wherein said through holes are connected to a negative pressure device.
4. The method for batch transfer MicroLED of chips as defined in claim 3, wherein the adsorbing liquid in the through-hole is pumped away by a negative pressure device.
5. The method of batch transfer MicroLED of chips as defined in claim 1, wherein the area of said through holes is smaller than the area of the chips.
6. The method for batch transfer MicroLED of chips as defined in claim 1, wherein MicroLED chips outside the through holes are blown away by an air flow and the adsorbed liquid is blow-dried.
7. The method for batch transfer MicroLED of chips as defined in claim 6, wherein said gas stream is comprised of nitrogen or an inert gas.
8. The method for batch transfer MicroLED of chips as defined in claim 1, wherein said through holes are uniformly distributed on the substrate.
9. The method for batch transfer MicroLED of chips as defined in claim 1, further comprising the steps of, after removing the adsorbed liquid in the through-holes:
And transferring MicroLED chips on the substrate to a PCB corresponding to the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782925.4A CN108767092B (en) | 2018-07-17 | 2018-07-17 | Method and device for transferring MicroLED chips in batches |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810782925.4A CN108767092B (en) | 2018-07-17 | 2018-07-17 | Method and device for transferring MicroLED chips in batches |
Publications (2)
| Publication Number | Publication Date |
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| CN108767092A CN108767092A (en) | 2018-11-06 |
| CN108767092B true CN108767092B (en) | 2024-05-31 |
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| CN201810782925.4A Active CN108767092B (en) | 2018-07-17 | 2018-07-17 | Method and device for transferring MicroLED chips in batches |
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| CN110323162B (en) * | 2019-05-08 | 2021-11-30 | 京东方科技集团股份有限公司 | Mass transfer device and mass transfer method |
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| CN111341710B (en) * | 2020-03-12 | 2022-12-06 | Tcl华星光电技术有限公司 | LED chip transfer system and LED chip transfer method |
| CN112967981B (en) * | 2020-08-31 | 2022-05-13 | 重庆康佳光电技术研究院有限公司 | Chip transfer head and manufacturing method thereof, die bonder and chip transfer method |
| CN112992759B (en) * | 2020-10-16 | 2022-04-19 | 重庆康佳光电技术研究院有限公司 | Device transfer equipment, preparation method thereof and device transfer method |
| CN113964147B (en) * | 2021-10-21 | 2024-07-09 | 上海天马微电子有限公司 | Display panel, assembly method thereof and display device |
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| CN108767092A (en) | 2018-11-06 |
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