CN110581203A - Mass transfer method and device for Micro-LED Micro element - Google Patents
Mass transfer method and device for Micro-LED Micro element Download PDFInfo
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- CN110581203A CN110581203A CN201910736525.4A CN201910736525A CN110581203A CN 110581203 A CN110581203 A CN 110581203A CN 201910736525 A CN201910736525 A CN 201910736525A CN 110581203 A CN110581203 A CN 110581203A
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- 238000004590 computer program Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 238000010586 diagram Methods 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000004065 semiconductor Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 2
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- 239000004973 liquid crystal related substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
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Abstract
the application relates to a massive transfer method and a massive transfer device for Micro-LED Micro elements, wherein the method comprises the following steps: pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate; and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device. By the method, a large number of Micro-LED Micro elements can be transferred, and the transfer efficiency of the Micro-LED Micro elements is improved.
Description
Technical Field
The application relates to the technical field of Micro-LEDs, in particular to a massive transfer method and device for Micro-LED Micro elements.
Background
Micro-LEDs are a new generation of display technology, and have higher brightness, better luminous efficiency and lower power consumption compared with the existing OLED technology. Micro-LED technology, i.e., LED scaling and matrixing, refers to a high density, Micro-sized LED array integrated on a chip, such as an LED display screen, where each pixel can be addressed and individually driven to light. The Micro-LED can be regarded as a miniature version of an outdoor LED display screen, and the distance between pixel points is reduced from a millimeter level to a micron level. However, in Micro-LED technology, due to lattice matching, an LED must be epitaxially grown on a substrate to form an epitaxial wafer, and then an LED chip is formed by semiconductor fabrication.
there are two transfer modes.
the first is to bond the LED chip directly to the substrate by using a semiconductor process integration technique, which requires two sets of semiconductor substrates, resulting in high cost and only small-sized substrates.
The second method is to transfer the elements on the Micro-LED array to the substrate by using pick-and-place technology, and transfer the elements by using the methods of static electricity, stamp, roller, etc., but the prior art is not mature and the transfer efficiency of the Micro-LED Micro-elements is not high.
Therefore, the prior art is in need of improvement.
disclosure of Invention
the technical problem to be solved by the invention is to provide a massive transfer method and a massive transfer device for Micro-LED Micro-elements, so as to improve the transfer efficiency of the Micro-LED Micro-elements and achieve the purpose of improving the production efficiency and yield of the Micro-LED.
in a first aspect, an embodiment of the present invention provides a bulk transfer method for Micro-LED Micro-components, the method including:
Pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
The method for pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain the pre-arranged temporary substrate comprises the following steps:
the Micro-LED Micro element on the material plate corresponds to the position to be placed of the Micro-LED Micro element on the temporary substrate through laser alignment;
And pricking and taking off the Micro-LED Micro-elements on the material plate to the temporary substrate by using a thimble.
Transferring the Micro-LED Micro-components on the pre-arranged temporary substrate to a display circuit substrate by a transfer device, comprising:
Controlling the transfer device to suck the Micro-LED Micro elements away from the pre-arrangement temporary substrate;
controlling the Micro-LED Micro element adsorbed by the transfer device to be transferred to a first preset distance above the display circuit substrate;
Enabling the adsorbed Micro-LED Micro element to correspond to a position to be placed of the Micro-LED Micro element on the display circuit substrate;
And placing the adsorbed Micro-LED Micro element on the display circuit substrate.
Controlling the transfer device to suck the Micro-LED Micro-elements away from the pre-arrangement temporary substrate, comprising:
controlling the transfer device to move to a second preset distance away from the Micro-LED Micro-elements on the pre-arrangement temporary substrate;
And controlling the transfer device to generate negative pressure to suck the Micro-LED Micro elements away from the pre-arrangement substrate.
Placing the adsorbed Micro-LED Micro-element on the display circuit substrate, comprising:
And controlling the transfer device to generate positive pressure, and enabling the Micro-LED Micro element to fall to the display circuit substrate.
The pre-arranged temporary substrate comprises at least one of the following:
Arranging a temporary substrate in advance for the all-red light chips; arranging a temporary substrate in advance for the all-green chips; pre-arranging a temporary substrate by using the all-blue-light chip; the red light chips, the green light chips and the blue light chips are sequentially and circularly prearranged on the temporary substrate. 7. The method as claimed in claim 1, wherein the temporary substrate is provided with a microstructure, the microstructure is a groove, and the size of the groove is matched with the size of the Micro-LED Micro-element.
In a second aspect, an embodiment of the present invention provides a bulk transfer device for Micro-LEDs, including:
the external air pump is used for generating positive and negative pressure to adsorb the Micro-LED Micro-elements;
The main body cavity is connected with an external air pump;
The transfer probe is used for transferring the Micro-LED Micro element from the temporary substrate to the display circuit substrate by adsorbing the Micro-LED Micro element, at least one capillary cavity is formed in the transfer probe, and the capillary cavity is communicated with the main body cavity.
in a third aspect, an embodiment of the present invention provides a computer device, including a memory and a processor, where the memory stores a computer program, and the processor implements the following steps when executing the computer program:
pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
in a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the following steps:
Pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
And transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
Compared with the prior art, the embodiment of the invention has the following advantages:
according to the method provided by the embodiment of the invention, firstly, Micro-LED Micro elements are pre-arranged on a temporary substrate to obtain a pre-arranged temporary substrate; and then transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device. The method improves the transfer efficiency of the Micro-LED Micro element and achieves the purpose of improving the production efficiency and yield of the Micro-LED.
drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a bulk transfer device for Micro-LED Micro-components according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a mass transfer method for Micro-LED Micro-devices according to an embodiment of the present invention;
FIG. 3a is a schematic diagram of a red light chip pre-arrangement according to an embodiment of the present invention;
FIG. 3b is a diagram illustrating green chip prearrangement in an embodiment of the present invention;
FIG. 3c is a diagram illustrating a blue light chip pre-arrangement according to an embodiment of the present invention;
FIG. 3d is a schematic diagram of a temporary substrate for red, green and blue light chips being sequentially and cyclically prearranged according to an embodiment of the present invention;
FIG. 4a is a schematic diagram illustrating a process of transferring a chip from a temporary substrate to a display circuit substrate according to an embodiment of the present invention;
FIG. 4b is a schematic diagram illustrating a process of transferring a chip from a temporary substrate to a display circuit substrate according to an embodiment of the present invention;
FIG. 4c is a schematic diagram illustrating a process of transferring a chip from a temporary substrate to a display circuit substrate according to an embodiment of the present invention;
FIG. 4d is a schematic diagram illustrating a process of transferring a chip from a temporary substrate to a display circuit substrate according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a temporary substrate with a pre-arranged full blue light chip according to an embodiment of the present disclosure;
Fig. 6 is an internal structural diagram of a computer device in an embodiment of the present invention.
Detailed Description
in order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
the inventor of the present invention has found that the conventional transfer method for Micro-LED Micro-devices is roughly divided into two types, one of which directly bonds the LED chip to the substrate, thus requiring two sets of semiconductor substrates, which is costly and only requires a small-sized substrate. And the other method uses pick-and-place technology to transfer the element by an electrostatic method, a seal method, a roller method and other methods, but the transfer cost of the Micro-LED Micro-element is high, the efficiency is low, and the Micro-LED production efficiency and the yield are low.
in order to solve the above problems, in the embodiment of the present invention, the transfer device generates positive and negative pressures to absorb and place the Micro-LED Micro-element, and the Micro-LED Micro-element is transferred in a large amount in an absorption manner, so that the transfer efficiency of the Micro-LED Micro-element is improved.
various non-limiting embodiments of the present invention are described in detail below with reference to the accompanying drawings.
Referring to fig. 1, a bulk transfer apparatus 10 for Micro-LEDs in an embodiment of the present invention is shown, the apparatus 10 comprising:
The external air pump 101 is used for generating positive and negative pressure to adsorb the Micro-LED Micro-elements;
The main body cavity 102 is connected with the external air pump 101;
The transfer probe 103 is used for transferring the Micro-LED Micro element from the temporary substrate 34 to the display circuit substrate 40 by adsorbing the Micro-LED Micro element, the transfer probe 103 internally comprises at least one capillary cavity 103a, and the capillary cavity 103a is communicated with the main body cavity 102.
the embodiment of the application also provides a massive transfer method of the Micro-LED Micro element, as shown in FIG. 2, the method comprises the following steps:
And S1, pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate.
Optionally, the Micro-LED Micro-component is a component to be used in fabricating a Micro-LED display, such as a red (R) chip, a blue (B) chip, and a green (G) chip, and the pre-arranged temporary substrate includes at least one of: arranging a temporary substrate in advance for the all-red light chips; arranging a temporary substrate in advance for the all-green chips; pre-arranging a temporary substrate by using the all-blue-light chip; the red light chips, the green light chips and the blue light chips are sequentially and circularly prearranged on the temporary substrate.
optionally, a Micro structure is arranged on the temporary substrate, the Micro structure is a groove, and the size of the groove is matched with that of the Micro-LED Micro element. The Micro-structure is arranged on the temporary substrate, so that alignment and pre-fixing of the Micro-LED Micro-element are facilitated.
step S1 includes:
s11, aligning the Micro-LED Micro-elements on the material plate with the positions, to be placed, of the Micro-LED Micro-elements on the temporary substrate through laser alignment.
optionally, the material plate stores elements, such as an R chip, a G chip, and a B chip, used for manufacturing the Micro-LED display, and in the embodiment of the present application, the Micro-LED elements are arranged on the temporary substrate in advance and then transferred to the display circuit substrate.
S12, piercing the Micro-LED Micro-elements on the material plate to the temporary substrate by using a thimble.
for example, the following steps are carried out: through laser alignment, the R chip on the R chip material plate corresponds to the position, where the R chip is to be placed, on the temporary substrate, and then the R chip on the R chip material plate is stabbed and taken off to the temporary substrate through the ejector pins.
and S2, transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate through a transfer device.
Optionally, negative pressure is generated in the main body cavity 102 and the capillary cavity 103a by the transfer device 10, the probe 103 of the transfer device adsorbs the Micro-LED Micro-component placed on the prearranged temporary substrate and transfers the adsorbed Micro-LED Micro-component to the upper side of the display circuit substrate, the Micro-LED Micro-component is placed on the display circuit substrate by the transfer device 10 and positive pressure is generated in the main body cavity 102 and the capillary cavity 103a, the Micro-LED Micro-component is not adsorbed by the transfer device 10, and the transfer process of the Micro-LED Micro-component from the prearranged temporary substrate to the display circuit substrate is completed.
Specifically, step S2 includes:
And S21, controlling the transfer device to suck the Micro-LED Micro-elements away from the pre-arrangement temporary substrate.
Before the transfer device sucks the Micro-LED Micro-elements away from the pre-arrangement temporary substrate, controlling the transfer device to align with the Micro-elements on the pre-arrangement temporary substrate, and controlling the transfer device to suck the Micro-LED Micro-elements away from the pre-arrangement temporary substrate under the condition that the position of a probe on the transfer device corresponds to the position of the Micro-LED Micro-elements.
Specifically, step S21 includes:
S211, controlling the transfer device to move to a pre-arrangement temporary substrate and a second preset distance away from the Micro-LED Micro elements.
Alternatively, the second predetermined distance may be altered to control the movement of the probe 103 of the transfer device 10 to a second predetermined distance from the Micro-LED Micro-components on the pre-aligned temporary substrate.
for example, the following steps are carried out: the probe 103 of the transfer device 10 was controlled to move to a distance of 0.1mm from the blue chips on the full blue chip prearranged temporary substrate.
S212, controlling the transfer device to generate negative pressure, and sucking the Micro-LED Micro-elements away from the pre-arrangement substrate.
S22, controlling the Micro-LED Micro-element adsorbed by the transfer device to be transferred to a first preset distance above the display circuit substrate.
optionally, the probe 103 of the transfer device 10, which is attached to the Micro-LED Micro-component, is controlled to move to a first preset distance on the display circuit substrate. The first preset distance can be changed, and the first preset distance is the distance from the probe 103 to the display circuit substrate plane a.
for example, the following steps are carried out: the probe 103 of the transfer device 10 which is controlled to adsorb the blue chip is moved to a distance of 0.1mm from the plane of the display circuit substrate.
S23, enabling the adsorbed Micro-LED Micro element to correspond to the position, to be placed, of the Micro-LED Micro element on the display circuit substrate.
in this embodiment of the application, the transfer device 10 is controlled to transfer in a manner of adsorbing the Micro-LED Micro element, because the main cavity 102 of the transfer device 10 and the capillary cavity 103a in the transfer probe 103 are negative pressure, the Micro-LED Micro element is adsorbed on the transfer device 10 and will not fall off, and the adsorbed Micro-LED Micro element is consistent with the position before adsorption, optionally, when the Micro-LED Micro element corresponds to the position to be placed of the Micro-LED Micro element on the display circuit substrate, the position of one adsorbed Micro element may correspond to the position to be placed on the display circuit substrate, and the positions of other adsorbed Micro elements also complete correspondence.
S24, placing the adsorbed Micro-LED Micro element on the display circuit substrate.
Optionally, the transfer device is controlled to generate positive pressure, and the Micro-LED Micro-component falls to the display circuit substrate. Or controlling the transfer device to place the Micro-LED Micro element on the display circuit substrate; and controlling the transfer device to generate positive pressure, wherein the transfer device does not adsorb the Micro-LED Micro element any more.
in an alternative embodiment, taking red, green, and blue chips as an example, and sequentially circulating and pre-arranging the temporary substrate, as shown in fig. 3a-3d, the bulk transfer method of Micro-LED Micro-devices is as follows,
The temporary substrate is arranged, red light chips, green light chips and blue light chips are arranged on the temporary substrate according to the placement positions of the red light chips, the green light chips and the blue light chips on the display circuit substrate, specifically, as shown in fig. 3a, the current red light chips are aligned through laser alignment, and the red light chips on the red light material plate 31 are pricked and taken off to the placement positions of the red light chips on the temporary substrate 30 by ejector pins after the red light chips correspond to the placement positions. Then, as shown in fig. 3b, the current green chip is aligned by laser alignment at the position adjacent to the red chip, and the green chip on the green material plate 32 is pricked and removed to the placement position of the green chip on the temporary substrate 30 by an ejector pin after the green chip is aligned with the placement position. Then, as shown in fig. 3c, aligning the current blue chip at the adjacent position of the green chip by laser alignment, aligning the blue chip with the placement position, piercing and releasing the blue chip on the blue material plate 33 to the placement position of the blue chip on the temporary substrate 30 by using an ejector pin, and repeating the above process until the chip pre-arrangement process is completed, so as to obtain a red, green and blue chips, which are sequentially and cyclically pre-arranged on the temporary substrate 34, as shown in fig. 3 d.
as shown in fig. 4a, the transfer probe 103 of the transfer device 10 is controlled to move to the red light, green light and blue light chips to sequentially circulate and pre-arrange the temporary substrate 34 at a distance of 0.1mm from the red light, green light and blue light chips, as shown in fig. 4b, the transfer device 10 is controlled to generate negative pressure, and the transfer probe 103 of the transfer device 10 sucks the Micro-LED Micro-components away from the red light, green light and blue light chips to sequentially pre-arrange the substrate 34. As shown in fig. 4c, the absorbed red light, green light, and blue light chips correspond to the positions, to be placed, of the red light, green light, and blue light chips on the display circuit substrate 40, the red light, green light, and blue light chips 40 absorbed by the transfer probe 103 of the transfer device 10 are controlled to be transferred onto the display circuit substrate 40, the transfer device 10 is controlled to generate positive pressure, the chips are not absorbed any more, and finally, a large number of red light, green light, and blue light chips are transferred from the temporary substrate to the display circuit substrate.
in the embodiment of the present application, the chip may also be transferred by an insertion method. Arranging a chip on the temporary substrate to obtain a full blue light chip prearranged temporary substrate, a full green light chip prearranged temporary substrate and a full red light chip prearranged temporary substrate, wherein the full blue light chip prearranged temporary substrate is as shown in fig. 5. And then, according to the position on the display circuit substrate, the chips are respectively transferred from the corresponding prearranged temporary substrates to the display circuit substrate. Optionally, corresponding chips may be sequentially transferred from the pre-arranged temporary substrate according to a sequence on the display circuit substrate, or a pre-arranged temporary substrate may be transferred according to a position on the display circuit substrate, for example, a first row of red light chips on the full red light chip pre-arranged temporary substrate is transferred to a corresponding position on the display circuit substrate, then a second row of red light chips on the full red light chip pre-arranged temporary substrate is transferred to a corresponding position on the display circuit substrate, the position is separated from the transferred red light chips by two rows (green light chips and blue light chips), and after the red light chips are transferred, the blue light chips and the green light chips are respectively transferred according to the red light chip transfer process.
in the embodiment of the application, a blue light and quantum film colorization technology can be used, all transferred chips are blue light chips, and then the blue light chips are changed into red light chips and green light chips at the positions of the red light chips and the green light chips in a film coating mode, wherein the temporary substrate is prearranged by the full blue light chips as shown in fig. 5.
In the method and the device for transferring the Micro-LED Micro-element in large quantities, positive pressure and negative pressure are generated by the transferring device to absorb and place the Micro-LED Micro-element, and the Micro-LED Micro-element is transferred in an absorption mode, so that the transferring efficiency of the Micro-LED Micro-element is improved, and the aims of improving the production efficiency and the yield of the Micro-LED are fulfilled.
in one embodiment, the present invention provides a computer device, which may be a terminal, having an internal structure as shown in fig. 6. The computer device includes a processor, a memory, a network interface, a display screen, and an input device connected by a system bus. Wherein the processor of the computer device is configured to provide computing and control capabilities. The memory of the computer device comprises a nonvolatile storage medium and an internal memory. The non-volatile storage medium stores an operating system and a computer program. The internal memory provides an environment for the operation of an operating system and computer programs in the non-volatile storage medium. The network interface of the computer device is used for communicating with an external terminal through a network connection. The computer program is executed by a processor to implement a method of generating a natural language model. The display screen of the computer equipment can be a liquid crystal display screen or an electronic ink display screen, and the input device of the computer equipment can be a touch layer covered on the display screen, a key, a track ball or a touch pad arranged on the shell of the computer equipment, an external keyboard, a touch pad or a mouse and the like.
those skilled in the art will appreciate that the illustration in fig. 6 is merely a block diagram of a portion of the structure associated with the disclosed aspects and is not intended to limit the computing devices to which the disclosed aspects apply, as particular computing devices may include more or less components than those shown, or may combine certain components, or have a different arrangement of components.
the embodiment of the invention provides computer equipment, which comprises a memory and a processor, wherein the memory stores a computer program, and the computer equipment is characterized in that the processor executes the computer program and realizes the following steps:
Pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
An embodiment of the present invention further provides a computer-readable storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the following steps:
pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
And transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
in summary, compared with the prior art, the embodiment of the invention has the following advantages:
according to the embodiment of the invention, the method and the device for transferring the Micro-LED Micro element in bulk are provided, wherein the method comprises the following steps: pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate; and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device. By the method, a large number of Micro-LED Micro elements can be transferred, the transfer efficiency of the Micro-LED Micro elements is improved, and the production efficiency and yield of the Micro-LEDs are improved.
the technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. a method for bulk transfer of Micro-LED Micro-components, said method comprising:
Pre-arranging the Micro-LED Micro elements on the temporary substrate to obtain a pre-arranged temporary substrate;
and transferring the Micro-LED Micro-elements on the pre-arranged temporary substrate to a display circuit substrate by a transfer device.
2. the method of claim 1, wherein pre-arranging Micro-LED Micro-components on a temporary substrate to obtain a pre-arranged temporary substrate comprises:
The Micro-LED Micro element on the material plate corresponds to the position to be placed of the Micro-LED Micro element on the temporary substrate through laser alignment;
And pricking and taking off the Micro-LED Micro-elements on the material plate to the temporary substrate by using a thimble.
3. The method of claim 1, wherein transferring the Micro-LED Micro-components on the pre-aligned temporary substrate to a display circuit substrate by a transfer device comprises:
Controlling the transfer device to suck the Micro-LED Micro elements away from the pre-arrangement temporary substrate;
Controlling the Micro-LED Micro element adsorbed by the transfer device to be transferred to a first preset distance above the display circuit substrate;
Enabling the adsorbed Micro-LED Micro element to correspond to a position to be placed of the Micro-LED Micro element on the display circuit substrate;
And placing the adsorbed Micro-LED Micro element on the display circuit substrate.
4. The method of claim 3, wherein controlling the transfer device to suck the Micro-LED Micro-components off the pre-alignment temporary substrate comprises:
controlling the transfer device to move to a second preset distance away from the Micro-LED Micro-elements on the pre-arrangement temporary substrate;
And controlling the transfer device to generate negative pressure to suck the Micro-LED Micro elements away from the pre-arrangement substrate.
5. The method of claim 3, wherein placing the Micro-LED Micro-component on the display circuit substrate comprises:
And controlling the transfer device to generate positive pressure, and enabling the Micro-LED Micro element to fall to the display circuit substrate.
6. The method of claim 1, wherein the prearranged temporary substrate comprises at least one of:
Arranging a temporary substrate in advance for the all-red light chips; arranging a temporary substrate in advance for the all-green chips; pre-arranging a temporary substrate by using the all-blue-light chip; the red light chips, the green light chips and the blue light chips are sequentially and circularly prearranged on the temporary substrate.
7. The method as claimed in claim 1, wherein the temporary substrate is provided with a microstructure, the microstructure is a groove, and the size of the groove is matched with the size of the Micro-LED Micro-element.
8. a mass transfer device for Micro-LEDs, the device comprising:
The external air pump is used for generating positive and negative pressure to adsorb the Micro-LED Micro-elements;
the main body cavity is connected with an external air pump;
The transfer probe is used for transferring the Micro-LED Micro element from the temporary substrate to the display circuit substrate by adsorbing the Micro-LED Micro element, at least one capillary cavity is formed in the transfer probe, and the capillary cavity is communicated with the main body cavity.
9. a computer device comprising a memory and a processor, the memory storing a computer program, wherein the processor implements the steps of the method of any one of claims 1 to 7 when executing the computer program.
10. A computer-readable storage medium, on which a computer program is stored, which, when being executed by a processor, carries out the steps of the method of any one of claims 1 to 7.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736525.4A CN110581203A (en) | 2019-08-09 | 2019-08-09 | Mass transfer method and device for Micro-LED Micro element |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910736525.4A CN110581203A (en) | 2019-08-09 | 2019-08-09 | Mass transfer method and device for Micro-LED Micro element |
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| Publication Number | Publication Date |
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| CN110581203A true CN110581203A (en) | 2019-12-17 |
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| CN201910736525.4A Pending CN110581203A (en) | 2019-08-09 | 2019-08-09 | Mass transfer method and device for Micro-LED Micro element |
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| CN112768370A (en) * | 2019-11-06 | 2021-05-07 | 成都辰显光电有限公司 | Transfer method and transfer device for micro-component |
| CN112967988A (en) * | 2020-11-04 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Transfer device and method for micro-element |
| CN112967977A (en) * | 2020-06-23 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Mass transfer device and mass transfer method |
| CN112992758A (en) * | 2020-07-08 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Mass transfer device, method, system and equipment |
| CN112992754A (en) * | 2020-05-22 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | Mass transfer device and transfer method thereof |
| CN113764546A (en) * | 2021-08-30 | 2021-12-07 | 东莞市中麒光电技术有限公司 | Mini-LED device, LED display module and manufacturing method thereof |
| WO2022166953A1 (en) * | 2021-02-08 | 2022-08-11 | 深圳市丰泰工业科技有限公司 | Wafer transfer device and wafer transfer method |
| WO2022257017A1 (en) * | 2021-06-08 | 2022-12-15 | 重庆康佳光电技术研究院有限公司 | Transfer device and manufacturing method therefor, detection method, and detection device |
| CN115903306A (en) * | 2022-11-14 | 2023-04-04 | 上海芯元基半导体科技有限公司 | Preparation method of backlight module, chip module and backlight module |
| WO2023071765A1 (en) * | 2021-10-28 | 2023-05-04 | 重庆康佳光电技术研究院有限公司 | Transfer substrate, preparing method, and method for bulk transfer of led chips |
| TWI823248B (en) * | 2021-02-08 | 2023-11-21 | 中國大陸商深圳市豐泰工業科技有限公司 | Method for transferring wafers |
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| CN112768370B (en) * | 2019-11-06 | 2023-02-10 | 成都辰显光电有限公司 | Transfer method and transfer device for micro-component |
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| CN112967988B (en) * | 2020-11-04 | 2022-07-29 | 重庆康佳光电技术研究院有限公司 | Transfer device and method for micro-element |
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| WO2022166953A1 (en) * | 2021-02-08 | 2022-08-11 | 深圳市丰泰工业科技有限公司 | Wafer transfer device and wafer transfer method |
| TWI823248B (en) * | 2021-02-08 | 2023-11-21 | 中國大陸商深圳市豐泰工業科技有限公司 | Method for transferring wafers |
| WO2022257017A1 (en) * | 2021-06-08 | 2022-12-15 | 重庆康佳光电技术研究院有限公司 | Transfer device and manufacturing method therefor, detection method, and detection device |
| CN113764546A (en) * | 2021-08-30 | 2021-12-07 | 东莞市中麒光电技术有限公司 | Mini-LED device, LED display module and manufacturing method thereof |
| WO2023071765A1 (en) * | 2021-10-28 | 2023-05-04 | 重庆康佳光电技术研究院有限公司 | Transfer substrate, preparing method, and method for bulk transfer of led chips |
| CN115903306A (en) * | 2022-11-14 | 2023-04-04 | 上海芯元基半导体科技有限公司 | Preparation method of backlight module, chip module and backlight module |
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Application publication date: 20191217 |