TWI823248B - Method for transferring wafers - Google Patents

Abstract

A wafer transfer method is disclosed. The wafer transfer method includes: arranging a first row of wafers along a first direction, the first row of wafers including a plurality of wafers; arranging a first row of wafers at a preset first preset interval along the first direction relative to the first row of wafers. two rows of wafers, the second row of wafers including a plurality of wafers; extracting the first row of wafers, the first row of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; along a second direction Arranging the first row of wafers; extracting the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers at a preset The second row of wafers is arranged along the second direction at two predetermined intervals.

Description

Wafer transfer method

References to related applications

This case requires all the rights and interests of the invention patent case with the application number 202110170599.3 and the invention name "Chip Transfer Method" submitted to the National Intellectual Property Bureau of the People's Republic of China on February 8, 2021, and its entire content is incorporated by reference this case.

The case relates generally to the field of semiconductor equipment technology and more specifically to wafer transfer methods.

When cutting a wafer, the performance of the wafer at the center of the wafer is relatively uniform, while the performance of the wafer at the edge of the wafer is significantly different from the performance of the wafer at the center, and there may be a gap of 5 wavelengths.

When using chips on a wafer to make a display screen, if the chips are transferred and arranged according to the order of the chips on the wafer, the quality distribution of the chips on the display screen may be uneven.

This case involves wafer transfer methods, which include:

arranging a first row of wafers along a first direction, the first row of wafers including a plurality of wafers;

Arranging a second row of wafers along the first direction at a predetermined first preset interval relative to the first row of wafers, the second row of wafers including a plurality of wafers;

extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;

arranging the first column of wafers along a second direction;

extracting the second column of wafers, the second column of wafers including at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; and

The second row of wafers is arranged along the second direction at a predetermined second predetermined interval relative to the first row of wafers.

In some embodiments, arranging the first row of wafers along the first direction includes:

Extracting the first row of wafers from a wafer, wherein the wafer includes a first row of wafers and a second row of wafers arranged at a first initial spacing; on the first tray along the first direction arranging the extracted first row of wafers; and

Arranging the second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers includes:

Extract the second row of wafers from the wafer; arrange the extracted second row of wafers on the first tray at a preset first preset interval along the first direction relative to the first row of wafers. Row wafers.

In some embodiments, the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, along a Arranging the first row of wafers in two directions includes:

The first column of wafers is extracted from the first tray, wherein the first column includes a first column of wafers and a second column of wafers arranged at a second initial distance, the first column of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on the fourth tray along the second direction; and

extracting the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers; Arranging the row of wafers along the second direction at a preset second preset interval includes:

The second row of wafers is extracted from the first tray; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers. ; Arrange the extracted second row of wafers on the fourth tray along the second direction at a preset second preset interval relative to the first row of wafers.

In some embodiments, arranging the first row of wafers along the first direction includes:

The first row of wafers is extracted from a second tray, wherein the second tray includes a first row of wafers and a second row of wafers arranged at a first initial interval; in the first row along the first direction, Arrange the extracted first row of wafers on three trays; and

Arranging the second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers includes:

Extract the second row of wafers from the second tray; arrange the second row of wafers on the third tray along the first direction at a preset first preset interval relative to the first row of wafers. Row wafers.

In some embodiments, the extracting a first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, along a Arranging the first row of wafers in two directions includes:

The first column of wafers is extracted from the third tray, wherein the third column includes a first column of wafers and a second column of wafers arranged at a second initial interval; the first column of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on the fifth tray along the second direction; and

extracting the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers; Arranging the row of wafers along the second direction at a preset second preset interval includes:

The second row of wafers is extracted from the third tray; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers. ; Arrange the second row of wafers on the fifth tray along the second direction at a preset second preset interval relative to the first row of wafers.

In some embodiments, the first initial interval is less than the first preset interval.

In some embodiments, the second initial interval is less than the second preset interval.

In some embodiments, there is a first preset angle between the first direction and the second direction, and the first preset angle is between 0° and 180°.

In some embodiments, the first direction and the second direction are perpendicular to each other.

In certain embodiments, the wafer transfer method includes:

arranging a first row of wafers along the first direction, the first row of wafers including a plurality of first sub-rows of wafers, the first sub-row of wafers including a plurality of wafers;

A second row of wafers is arranged along the first direction at a predetermined first preset interval relative to the first row of wafers. The second row of wafers includes a plurality of second sub-row wafers, and the second sub-row wafers include multiple wafers;

Extracting a first row of wafers, the first row of wafers including a plurality of first sub-rows of wafers, the first sub-row of wafers including at least one wafer from the first sub-row of wafers and a plurality of wafers from the second sub-row of wafers at least one of the wafers;

arranging the first column of wafers along the second direction;

Extracting the second column of wafers, the second column of wafers including a plurality of second sub-column of wafers, the second sub-column of wafers including at least one remaining wafer from the first sub-column of wafers and the remaining wafers from the first sub-column of wafers. at least one remaining wafer in the second sub-row of wafers; and

The second row of wafers is arranged along the second direction at a predetermined second predetermined interval relative to the first row of wafers.

In some embodiments, the wafer transfer method provided in this case includes: arranging a first row of wafers along a first direction, where the first row of wafers includes a plurality of wafers; Arrange a second row of wafers in a direction, the second row of wafers includes a plurality of wafers; extract a first row of wafers, the first row of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; along Arrange the first row of wafers in the second direction; extract the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; press relative to the first row of wafers The second row of wafers is arranged along the second direction at a second predetermined interval. The above-mentioned wafer transfer method is used to transfer multiple wafers, so that a high-density two-dimensional array arrangement with a certain spacing is formed between the multiple wafers.

In order to have a clearer understanding of the technical features, purposes and effects of this case, the specific implementation of this case is now described in detail with reference to the drawings. In the following description, what needs to be understood is "front", "back", "up", "down", "left", "right", "vertical", "horizontal", "vertical", "horizontal", The orientations or positional relationships indicated by "top", "bottom", "inner", "outer", "head", "tail", etc. are based on the orientation or positional relationship shown in the diagram and are constructed and operated in specific orientations. It is only for the convenience of describing the present technical solution, and does not indicate that the device or element referred to must have a specific orientation, and therefore cannot be understood as a limitation of the present case.

It should also be noted that, unless otherwise expressly stipulated and limited, terms such as "installation", "connection", "connection", "fixing" and "setting" should be understood in a broad sense. For example, it can be a fixed connection or a fixed connection. It can be detachably connected or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be an internal connection between two elements or an interaction between two elements. When an element is referred to as being "on" or "under" another element, it can be "directly" or "indirectly" on the other element or one or more intervening elements may also be present. The terms "first", "second", "third", etc. are only used to facilitate the description of the present technical solution and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of indicated technical features. Therefore, Features defined as "first," "second," "third," etc. may explicitly or implicitly include one or more of these features. For those with ordinary knowledge in the technical field to which the present invention belongs, the specific meanings of the above terms in this case can be understood according to the specific circumstances.

In the following description, for the purpose of explanation rather than limitation, specific details such as specific system structures and technologies are provided to provide a thorough understanding of the embodiments of this case. However, it will be apparent to those of ordinary skill in the art that the present invention may be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description with unnecessary detail.

Referring to Figures 1 and 2, the wafer transfer method provided in this case includes:

S110: Arrange the first row of wafers along the first direction, and the first row of wafers includes multiple wafers;

S120: Arrange the second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, and the second row of wafers includes multiple wafers;

S130: Extract the first row of wafers, where the first row of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;

S140: Arrange the first row of wafers along the second direction;

S150: Extract the second row of wafers, where the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers;

S160: Arrange the second row of wafers in the second direction at a predetermined second preset interval relative to the first row of wafers.

Using the above wafer transfer method, by arranging the first row of wafers along the first direction, and then arranging the second row of wafers relative to the first row of wafers, there is a preset first preset interval between the second row of wafers and the first row of wafers. Then extract the first row of wafers, arrange the first row of wafers in the second direction, extract the second row of wafers, and then arrange the second row of wafers relative to the first row of wafers. There is a preset second preset distance between the second row of wafers and the first row of wafers. In this way, the above steps are repeated multiple times, so that there are preset first preset intervals and preset second preset intervals between the plurality of wafers, so that the intervals between the plurality of wafers can be adjusted according to actual needs, thereby forming a A two-dimensional array of wafers at preset intervals.

Of course, the chip transfer method provided in this case can not only transfer single wafers, but also transfer rows of wafers, and can also be applied to packaged multi-functional integrated units. A color picture element unit composed of multiple RGB chips, or a backlight unit composed of multiple LED chips. The wafer transfer method provided in this embodiment can be applied to a multi-function integrated circuit unit integrating one or more of a logic chip, a MEMS device, or a sensor.

Referring to Figure 2, a two-dimensional rectangular coordinate system is established with one of the wafers as the origin, with one side of the wafer as the x-axis, and another side of the wafer perpendicular to the side as the y-axis. In the figure, the first direction is the A direction, and the second direction is the B direction, that is, the first direction is along the x-axis direction, and the second direction is along the y-axis direction. The first preset interval is y1, and the second preset interval is x1. Of course, in some embodiments, the first direction may also be the y-axis direction, and the second direction may be the x-axis direction.

In some embodiments, the wafer transfer method provided by this example includes:

S210: Arrange the first row of wafers along the first direction, and the first row of wafers includes multiple wafers;

S220: Arrange the second row of wafers in the first direction at a preset first preset interval relative to the first row of wafers;

S230: Extract the first row of wafers, where the first row of wafers includes at least one wafer from the first row of wafers;

S240: Arrange the first row of wafers along the second direction;

S250: Extract the second row of wafers, where the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one wafer from the second row of wafers;

S260: Arrange the second row of wafers in the second direction at a predetermined second preset interval relative to the first row of wafers.

In the above wafer transfer method, when the first row of wafers is extracted, the first row of wafers includes at least one wafer in the first row of wafers; when the second row of wafers is extracted, the second row of wafers includes at least one remaining wafer from the first row of wafers. One wafer and at least one wafer from the second row of wafers. That is, the number of wafers in the first row is less than the number of wafers in the second row, so that the wafers can be transferred and arranged according to the number of wafers in the first row or the second row, so that there is a first preset interval between the plurality of wafers and a second row of wafers. Two preset intervals.

In certain embodiments, the first row of wafers includes two wafers and the second row of wafers includes one wafer. Extracting the first row of wafers means extracting one wafer in the first row of wafers; extracting the second row of wafers means extracting the remaining one wafer in the first row of wafers and one wafer in the second row of wafers. Of course, the first row of wafers can also include one wafer, and the second row of wafers can also include two wafers. In this way, extracting the first row of wafers means extracting one wafer in the first row of wafers and one wafer in the second row of wafers. Extracting the second row of wafers means extracting the remaining wafer in the second row of wafers.

In some embodiments, the wafer transfer method provided by this example includes:

S310: Arrange the first row of wafers along the first direction, and the first row of wafers includes multiple wafers;

S320: Arrange the second row of wafers in the first direction at a preset first preset interval relative to the first row of wafers;

S330: Extract the first row of wafers, where the first row of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers;

S340: Arrange the first row of wafers along the second direction;

S350: Extract the second row of wafers, where the second row of wafers includes at least one remaining wafer from the first row of wafers;

S360: Arrange the second row of wafers in the second direction at a predetermined second preset interval relative to the first row of wafers.

In the above wafer transfer method, when extracting the first row of wafers, the first row of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; when extracting the second row of wafers, the second row of wafers The wafers include at least one remaining wafer from the first row of wafers. That is, the number of wafers in the first row is greater than the number of wafers in the second row, so that the wafers can be transferred and arranged according to the number of wafers in the first row or the second row, so that there is a first preset interval between the plurality of wafers and a second row of wafers. Two preset intervals.

In some embodiments, the first row of wafers includes two wafers and the second row of wafers includes one wafer, and extracting the first row of wafers is extracting one wafer from the first row of wafers and one wafer from the second row of wafers. Extracting the second row of wafers means extracting the remaining wafer in the first row of wafers. Of course, the first row of wafers may also include one wafer, and the second row of wafers may include two wafers. Extracting the first row of wafers means extracting one wafer in the first row of wafers and one wafer in the second row of wafers.

In certain embodiments, arranging the first row of wafers in the first direction includes:

Extracting a first row of wafers from a wafer, wherein the wafer includes a first row of wafers and a second row of wafers arranged at a first initial interval; arranging the extracted first row of wafers on a first tray along a first direction;

Arranging the second row of wafers along the first direction at a predetermined first preset interval relative to the first row of wafers includes:

A second row of wafers is extracted from the wafer; and the extracted second row of wafers are arranged on the first material tray at a first preset interval relative to the first row of wafers along a first direction.

In this way, by arranging the wafers on the wafer on the first tray, not only the transfer of the wafers is realized, but also the wafers are arranged according to the first preset intervals, thereby improving the efficiency of the wafer transfer. This avoids the need to transfer the wafers from the wafer to other carriers, then arrange the wafers on other carriers, and then transfer the wafers to the target tray. Using the wafer transfer method provided by the embodiment of this case, the wafers can be arranged while transferring the wafers, thereby realizing the transfer of a large amount of wafers.

In some embodiments, extracting the first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, arranging the first column of wafers in the second direction includes :

A first column of wafers is extracted from a first tray, wherein the first tray includes a first column of wafers and a second column of wafers arranged at a second initial spacing, the first column of wafers including at least one wafer from the first row wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on a fourth tray along a second direction;

Extracting the second row of wafers, the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers at a preset second preset interval along the first row of wafers The second row of wafers arranged in two directions includes:

The second row of wafers is extracted from the first row of wafers; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers, the preset number is Arrange the extracted second row of wafers on the fourth material tray at two preset intervals along the second direction.

In this way, when the first column of wafers on the first material tray is transferred to the fourth material tray, there is a first preset interval and a second preset interval between the plurality of wafers on the fourth material tray, so that the third Multiple wafers on the four trays are arranged in a two-dimensional array. This enables massive transfer of wafers and improves the efficiency of wafer transfer.

In certain embodiments, arranging the first row of wafers in the first direction includes:

A first row of wafers is extracted from a second tray, wherein the second tray includes a first row of wafers and a second row of wafers arranged at a first initial interval; and the extracted third row of wafers is arranged on a third tray along a first direction. a row of wafers;

Arranging the second row of wafers along the first direction at a predetermined first preset interval relative to the first row of wafers includes:

Extract the second row of wafers from the second material tray; arrange the second row of wafers on the third material tray at a preset first preset interval along a first direction relative to the first row of wafers.

In this way, by arranging the wafers on the second tray on the third tray, not only the transfer between multiple wafers is realized, but also the wafers are arranged according to the first preset interval, thereby improving the efficiency of wafer transfer. s efficiency. It is avoided that after transferring the wafers from the second material tray to other carriers, arranging the wafers on other carriers and then transferring the wafers to the third material tray is avoided. Using the wafer transfer method provided by the embodiment of this case, the wafers can be arranged while transferring the wafers, thereby realizing the transfer of a large amount of wafers.

In some embodiments, extracting the first column of wafers, the first column of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers, arranging the first column of wafers in the second direction includes :

The first column of wafers is extracted from a third tray, wherein the third tray includes a first column of wafers and a second column of wafers arranged at a second initial interval; the first column of wafers includes at least one of the first row of wafers. wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on a fifth tray along a second direction;

Extracting the second row of wafers, the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers at a preset second preset interval along the first row of wafers The second row of wafers arranged in two directions includes:

The second row of wafers is extracted from the third tray; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers, the preset number is Arrange the second row of wafers on the fifth material tray at two preset intervals along the second direction.

In this way, when the first row of wafers on the third tray is transferred to the fifth tray, there is a first preset interval and a second preset interval between the plurality of wafers on the fifth tray, so that the third Multiple wafers on the five-material tray form a two-dimensional array arrangement. This enables massive transfer of wafers and improves the efficiency of wafer transfer.

In some implementations, the first initial interval is less than the first preset interval. In this way, the transferred plurality of wafers can have a first preset interval. The first preset interval can be set according to actual needs. At the same time, the multiple wafers after wafer cutting are arranged according to the first preset interval. It is also possible to arrange the plurality of wafers on the first material tray according to the first preset interval after being transferred to the second material tray.

In some embodiments, the second initial interval is less than the second preset interval. In this way, the plurality of transferred wafers can have a second preset interval, and the second preset interval can be set according to actual needs. At the same time, the plurality of wafers on the first material tray can be arranged according to the second preset interval after being transferred to the third material tray. It is also possible to arrange the plurality of wafers on the third material tray according to the first preset interval after being transferred to the fifth material tray.

The first preset interval is between 0.5um and 5mm, and the second preset interval is between 0.5um and 5mm. In some embodiments, the first preset interval is between 0.6um and 5mm, and the second preset interval is between 0.6um and 5mm. The first preset interval and the second preset interval are the required intervals between the plurality of chips on the LED display screen. A high-definition LED display with a conventional resolution of 1920*1080 requires 1920*1080*3 Micro LED chips, a total of 6.2 million chips. The chips on the display screen need to form a high-density two-dimensional array structure with a first preset interval and a second preset interval.

There is a first preset angle between the first direction and the second direction, and the first preset angle is between 0° and 180°. There is a first preset angle between the first direction and the second direction, so that the wafers to be transferred can be selected according to actual wafer arrangement requirements.

In some embodiments, the first direction and the second direction are perpendicular to each other. The first preset angle is 90°. This can improve the efficiency of wafer transfer and facilitate the adjustment of the wafer arrangement position. At the same time, a two-dimensional array structure is formed between multiple wafers.

In some embodiments, before arranging the first row of wafers along the first direction, the method further includes detecting parameters of the wafers, and the parameters of the wafers include one or more of wafer type, color difference, or wavelength. The type of chip includes one or more of a red light chip, a blue light chip, a white light chip, and a green light chip.

In certain embodiments, the wafer transfer method includes:

S410: Arrange the first row of wafers along the first direction, the first row of wafers includes a plurality of first sub-row wafers, and the first sub-row of wafers includes a plurality of wafers;

S420: Arrange the second row of wafers along the first direction at a preset first preset interval relative to the first row of wafers, the second row of wafers includes a plurality of second sub-row wafers, and the second sub-row of wafers includes a plurality of wafers;

S430: Extract the first row of wafers. The first row of wafers includes a plurality of first sub-row wafers. The first sub-row of wafers includes at least one wafer from the first sub-row of wafers and at least one wafer from the second sub-row of wafers. ;

S440: Arrange the first row of wafers along the second direction;

S450: Extract the second row of wafers. The second row of wafers includes a plurality of second sub-row wafers. The second sub-row of wafers includes at least one remaining wafer from the first sub-row of wafers and at least one remaining wafer from the second sub-row of wafers. a wafer;

S460: Arrange the second row of wafers in the second direction at a predetermined second preset interval relative to the first row of wafers.

The above-mentioned wafer transfer method arranges the first row of wafers and the second row of wafers, and arranges the first row of wafers and the second row of wafers, wherein the first row of wafers includes a plurality of first sub-row wafers, and the second row of wafers includes A plurality of first sub-row wafers. During the process of transferring wafers, the transfer of multiple wafers can be achieved by arranging a plurality of first sub-row wafers and a plurality of second sub-row wafers, and a plurality of first sub-row wafers and a plurality of second sub-row wafers, thereby Form a two-dimensional array structure.

It can be understood that the above embodiments only express the preferred embodiments of the present invention, and their descriptions are relatively specific and detailed, but they cannot be understood as limiting the patent scope of the present invention; it should be noted that, for the technology to which the present invention belongs, For those with ordinary knowledge in the field, the above technical features can be freely combined without departing from the concept of the present invention, and several modifications and improvements can be made, which all belong to the protection scope of the present invention; therefore, anything following Equal transformations and modifications made within the patentable scope of the present invention shall all fall within the scope of the patentable scope of the present invention.

(without)

The drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the present application.

In order to explain the technical solution of this case more clearly, the drawings needed to be used in the description of this case will be briefly introduced below. Obviously, for those with ordinary knowledge in the technical field of the present invention, without excessive experimentation, Below, other schemas can also be obtained based on these schemas.

Figure 1 is a flow chart of a wafer transfer method provided by an embodiment of this case; and

FIG. 2 is a schematic diagram of the operation of a wafer transfer method according to an embodiment of the present invention.

Claims (9)

A wafer transfer method, which includes: arranging a first row of wafers along a first direction, the first row of wafers including a plurality of wafers; and relative to the first row of wafers at a preset first preset interval along the first direction. arranging a second row of wafers, the second row of wafers including a plurality of wafers; extracting a first row of wafers, the first row of wafers including at least one wafer from the first row of wafers and from the second row of wafers at least one wafer in the first row of wafers; arranging the first row of wafers in a second direction; extracting a second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and from the second row of wafers. at least one remaining wafer in the row of wafers; and arranging the second row of wafers along the second direction at a preset second preset interval relative to the first row of wafers; wherein the first row of wafers is arranged along the first direction. Arranging wafers includes: extracting the first row of wafers from a wafer, wherein the wafer includes a first row of wafers and a second row of wafers arranged at a first initial interval; Arranging the extracted first row of wafers on a tray; and arranging the second row of wafers at a preset first preset interval along the first direction relative to the first row of wafers includes: Extract the second row of wafers from above; arrange the extracted second row of wafers on the first material tray at a predetermined first preset interval along the first direction relative to the first row of wafers. The wafer transfer method according to claim 1, wherein the first column of wafers is extracted, and the first column of wafers includes at least one wafer from the first row of wafers and a wafer from the second row of wafers. At least one wafer, arranging the first row of wafers in the second direction includes: extracting the first row of wafers from the first tray, wherein the first tray includes a first row of wafers arranged at a second initial spacing. A row of wafers and a second row of wafers, the first row of wafers including at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on four trays; and extracting the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and the remaining wafers from the first row of wafers. At least one wafer remaining in the two rows of wafers; arranging the second row of wafers in the second direction at a preset second preset interval relative to the first row of wafers includes: extracting all the wafers from the first tray The second row of wafers; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers in a predetermined Arrange the extracted second row of wafers on the fourth tray along the second direction at a second preset interval. The wafer transfer method of claim 1, wherein arranging the first row of wafers in the first direction includes: extracting the first row of wafers from a second material tray, wherein the second material tray includes: a first row of wafers and a second row of wafers initially arranged at intervals; arranging the extracted first row of wafers on a third tray along the first direction; Arranging the second row of wafers along the first direction with a first preset interval includes: extracting the second row of wafers from the second tray; and maintaining a first preset interval with respect to the first row of wafers. The second row of wafers is arranged on the third tray along the first direction. The wafer transfer method according to claim 3, wherein the first column of wafers is extracted, and the first column of wafers includes at least one wafer from the first row of wafers and a wafer from the second row of wafers. At least one wafer, arranging the first row of wafers in the second direction includes: extracting the first row of wafers from the third tray, wherein the third tray includes a third row of wafers arranged at a second initial spacing. One row of wafers and a second row of wafers; the first row of wafers includes at least one wafer from the first row of wafers and at least one wafer from the second row of wafers; arranging the extracted first row of wafers on a five-material tray; and extracting the second row of wafers, the second row of wafers including at least one remaining wafer from the first row of wafers and the remaining wafers from the first row of wafers. At least one wafer remaining in the two rows of wafers; arranging the second row of wafers in the second direction at a preset second preset interval relative to the first row of wafers includes: extracting all the wafers from the third tray The second row of wafers; the second row of wafers includes at least one remaining wafer from the first row of wafers and at least one remaining wafer from the second row of wafers; relative to the first row of wafers in a predetermined Arrange the second row of wafers on the fifth tray along the second direction with a second preset interval. The wafer transfer method according to any one of claims 1 to 4, wherein the first initial interval is smaller than the first preset interval. The wafer transfer method according to claim 2 or 4, wherein the second initial interval is smaller than the second preset interval. The wafer transfer method according to claim 1, wherein there is a first preset angle between the first direction and the second direction, and the first preset angle is between 0° and 180°. The wafer transfer method according to claim 7, wherein the first direction and the second direction are perpendicular to each other. The wafer transfer method according to claim 1, wherein the wafer transfer method includes: arranging a first row of wafers along the first direction, the first row of wafers including a plurality of first sub-row wafers, and the first row of wafers. A sub-row of wafers includes a plurality of wafers; a second row of wafers is arranged along the first direction at a predetermined first preset interval relative to the first row of wafers, and the second row of wafers includes a plurality of second sub-row wafers. , the second sub-row of wafers includes a plurality of wafers; extracting a first row of wafers, the first row of wafers includes a plurality of first sub-row wafers, the first sub-row of wafers includes wafers from the first sub-row and at least one wafer from the second sub-row of wafers; arranging the first row of wafers along the second direction; extracting the second row of wafers, the second row of wafers including a plurality of a second sub-row of wafers, the second sub-row of wafers including at least one remaining wafer from the first sub-row of wafers and at least one remaining wafer from the second sub-row of wafers; and relative to the first sub-row of wafers; A row of wafers arranges the second row of wafers along the second direction at a predetermined second preset interval.