CN108754429A - A kind of evaporation source - Google Patents
A kind of evaporation source Download PDFInfo
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- CN108754429A CN108754429A CN201810988636.XA CN201810988636A CN108754429A CN 108754429 A CN108754429 A CN 108754429A CN 201810988636 A CN201810988636 A CN 201810988636A CN 108754429 A CN108754429 A CN 108754429A
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- crucible body
- evaporation source
- reflecting plate
- crucible
- warmware
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- 238000001704 evaporation Methods 0.000 title claims abstract description 95
- 230000008020 evaporation Effects 0.000 title claims abstract description 93
- 230000005855 radiation Effects 0.000 claims abstract description 55
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 238000002347 injection Methods 0.000 claims description 4
- 239000007924 injection Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000000463 material Substances 0.000 description 32
- 238000010438 heat treatment Methods 0.000 description 18
- 238000007740 vapor deposition Methods 0.000 description 13
- 238000010586 diagram Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 9
- 238000005019 vapor deposition process Methods 0.000 description 7
- 230000001965 increasing effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 229910052571 earthenware Inorganic materials 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000010025 steaming Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000007738 vacuum evaporation Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides a kind of evaporation source, is related to evaporation coating technique field, excessively high for improving the heat leaked out in the prior art by evaporation source, the problem of leading to mask plate temperature distortion.Evaporation source, heater including crucible and for generating heat radiation, the crucible includes crucible body and the nozzle in the crucible body top surface is arranged, and in addition to the top surface side of the crucible body, at least side in remaining side of the crucible body, which is provided with, adjusts hot component;It is described that hot component is adjusted to be used to make the heat radiation convection current between the hot component of the tune and the crucible body;Wherein, there is gap between tune hot component and the crucible body.
Description
Technical field
The present invention relates to evaporation coating technique field more particularly to a kind of evaporation sources.
Background technology
Organic electroluminescent LED (Organic Light-Emitting Diode, abbreviation OLED) device, which has, to be made
Simple for process, Color tunable, it is low in energy consumption many advantages, such as, be all the hot spot of exploitation and investment in display and lighting area.With
The purposes of OLED display device is further extensive, and manufacture craft also reaches its maturity.Currently, the common production method packet of OLED device
Include the various ways such as vapor deposition, inkjet printing, thermal transfer.In these production methods, vapor deposition mode is a kind of side of comparative maturity
Method, and applied to volume production.
Evaporation process is to make evaporation material fusing (or distillation) at original in certain heated under vacuum evaporation material
Then the steam of son, molecule or atomic group composition condenses in substrate surface film forming, to form the functional layer of OLED device.
For evaporation process, the evaporation source for evaporating material is its core.Existing evaporation source is by crucible and use
In the heater composition for the evaporation material heating in crucible, to realize the basic function of material eruption.However, as shown in Figure 1,
With the progress of vapor deposition process, evaporation material is fewer and fewer in crucible 10, and position is lower and lower.At this point, if desired keeping steaming
The evaporation capacity for plating material is constant, needs the calorific value for improving heater 20 (arrow is closeer, and calorific value is bigger).And it can cause in this way
Excessive heat is dispersed into outside evaporation source, causes to be located at the vapor deposition mask plate temperature distortion above evaporation source, to influence to steam
Plate precision.
Invention content
The embodiment of the present invention provides a kind of evaporation source, for improving the heat mistake leaked out in the prior art by evaporation source
Height, the problem for causing mask plate temperature distortion serious.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that:
A kind of evaporation source is provided, including crucible and the heater for generating heat radiation, the crucible include crucible body
With the nozzle in the crucible body top surface is set, in addition to the top surface side of the crucible body, remaining side of the crucible body
In at least side be provided with and adjust hot component;It is described to adjust hot component for making between tune hot component and the crucible body
Heat radiation convection current;Wherein, there is gap between tune hot component and the crucible body.
Optionally, described that hot component is adjusted to adjust warmware, the first tune warmware and the heater to be arranged at including first
The side of the crucible body, the heater setting are adjusted described first between warmware and the crucible body;Wherein, side
Intersect with the top surface in face.
Optionally, the crucible body is rectangle, and the side where the length of the crucible body and the high side wall surrounded is arranged
There is the heater and described first to adjust warmware.
Optionally, described first warmware is adjusted to include the first reflecting plate, along the injection direction of the crucible, first reflection
The height of plate is less than the height of the crucible body.
Optionally, the first tune warmware further includes the control structure being connect with first reflecting plate, the control knot
Structure is for driving first reflecting plate to rotate, to adjust first reflecting plate and side corresponding with first reflecting plate
Angle.
Optionally, first reflecting plate includes multiple first daughter boards, and multiple first daughter boards are by the control structure
Independent control.
Optionally, first reflecting plate is bimirror panel.
Optionally, described that hot component is adjusted to adjust warmware including second;The second tune warmware is arranged in the crucible body
Bottom surface side, bottom surface are oppositely arranged with the top surface.
Optionally, described second warmware is adjusted to include the second reflecting plate, pierced pattern is provided on second reflecting plate.
Optionally, the density of the pierced pattern on the extending direction of the crucible body, second reflecting plate
First increase and reduces afterwards.
Optionally, second reflecting plate includes multiple second daughter boards, at least partly described in multiple second daughter boards
The pierced pattern is provided on second daughter board.
Optionally, the evaporation source further includes pedestal, is arranged on the pedestal fluted;The second reflecting plate setting exists
The opening of the groove, the bottom face with the groove.
The embodiment of the present invention provides a kind of evaporation source, by adjusting hot component in crucible body setting so that heater generates
Heat radiation adjusting convection current between hot component and crucible body, to which absorptivity of the crucible body to heat radiation can be improved.With it is existing
There is technology to compare, in use, which stage is the process that no matter is deposited proceed to evaporation source provided by the invention, and heater supplies
The heat radiation answered is lower than the prior art, and higher than the prior art to the utilization rate of heat radiation.It so, can be by heater
The more heat radiations generated are reflected into evaporation material surface, for being heated to evaporation material, can improve heat radiation
Utilization ratio avoids or has cut down the rising of heater heating temperature, to make less heat radiation be dissipated at the top of evaporation source
It loses the vapor deposition mask plate for improving evaporation source top to outside and the problem of thermal expansion deformation, improves vapor deposition accuracy due to heated.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
Obtain other attached drawings according to these attached drawings.
Fig. 1 is a kind of vapor deposition process schematic for evaporation source that the prior art provides;
Fig. 2 is a kind of structural schematic diagram one of evaporation source provided in an embodiment of the present invention;
Fig. 3 is a kind of structural schematic diagram two of evaporation source provided in an embodiment of the present invention;
Fig. 4 is a kind of structural schematic diagram three of evaporation source provided in an embodiment of the present invention;
Fig. 5 is a kind of structural schematic diagram four of evaporation source provided in an embodiment of the present invention;
Fig. 6 is a kind of vapor deposition process schematic of evaporation source provided in an embodiment of the present invention;
Fig. 7 is a kind of structural schematic diagram five of evaporation source provided in an embodiment of the present invention;
Fig. 8 is a kind of structural schematic diagram six of evaporation source provided in an embodiment of the present invention;
Fig. 9 is a kind of structural schematic diagram one of second reflecting plate provided in an embodiment of the present invention;
Figure 10 is a kind of structural schematic diagram two of second reflecting plate provided in an embodiment of the present invention;
The vapor deposition for the evaporation source that Figure 11 provides for the evaporation effect of evaporation source provided in an embodiment of the present invention with the prior art
The contrast schematic diagram of effect;
Figure 12 is the surface chart on the directions A-A in Figure 10;
Figure 13 is the structural schematic diagram seven of evaporation source provided in an embodiment of the present invention;
Figure 14 is the structural schematic diagram eight of evaporation source provided in an embodiment of the present invention.
Reference numeral:
10- crucibles;11- crucible bodies;12- nozzles;20- heaters;The hot component of 30- tune;31- first adjusts warmware;311-
First reflecting plate;312- control structures;32- second adjusts warmware;The second reflecting plates of 321-;40- pedestals;41- grooves.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of evaporation source, as shown in Fig. 2, including crucible 10 and the heating for generating heat radiation
Device 20, crucible 10 include crucible body 11 and the nozzle 12 in 11 top surface of crucible body are arranged, and remove the top surface side of crucible body 11
Outside, at least side in remaining side of crucible body 11, which is provided with, adjusts hot component 30 (to be respectively provided with side and bottom surface side in Fig. 2
Have for adjusting hot component 30);Adjust hot component 30 for making the heat radiation convection current between the hot component 30 of tune and crucible body 11;Its
In, adjusting has gap between hot component 30 and crucible body 11.
It should be noted that first, the not concrete structure to crucible 10 and heater 20 and heating of the embodiment of the present invention
Device 20 is defined with respect to the installation position of crucible 10, such as can be same as the prior art.
Second, temperature can generate heat radiation higher than the object of absolute zero, and temperature is higher, and the gross energy given off is got over
Greatly, heater 20 generates heat radiation, for the evaporation material inside heating crucible ontology 11.
It adjusts hot component 30 for making the heat radiation convection current between the hot component 30 of tune and crucible body 11, refers to adjusting hot component 30
Reflection cavity is formed with crucible body 11, the heat radiation part that heater 20 generates is absorbed by crucible body 11 for heating vapor deposition
Material is retained in without absorbed part in reflection cavity, is reflected by crucible body 11 and is adjusted hot component 30, then is adjusted hot component
30 are reflected into crucible body 11, this part heat radiation is absorbed by crucible body 11 for heating evaporation material again.
The size of third, the gap that do not exchange between hot component 30 and crucible body 11 limits, and is closed according to concrete structure
Reason setting, as long as ensuring that hot component 30 is adjusted not to be bonded with crucible body 11.
Wherein, it will be understood by those skilled in the art that make heat radiation right between the hot component 30 of tune and crucible body 11
Stream, adjusts hot component 30 that heat radiation should be able to be reflexed to crucible body 11.
In addition, by taking crucible body 11 is rectangle as an example, adjust hot component 30 that can be provided only on the bottom surface side of crucible body 11,
Certain several side of crucible body 11 can also be provided only on, or in addition to 11 top surface side of crucible body, other sides are all provided with
It is equipped with and adjusts hot component 30.Certainly, in the case of hot component 30 of multiple tune are provided in evaporation source, multiple knots for adjusting hot component 30
Structure is not necessarily identical.
4th, can be that heater 20 is located at the heat for adjusting hot component 30 to be generated far from 11 side of crucible body, heater 20
Radiation can adjust convection current between hot component 30 and crucible body 11 after adjusting hot component 30;It can also be heater 20
In adjusting between hot component 30 and crucible body 11, so that convection current between hot component 30 and crucible body 11 is being adjusted in heat radiation;Also
May be other modes.
5th, during vapor deposition, the material on evaporation material surface is preferentially sprayed from nozzle 12, with vapor deposition process into
It goes, the evaporation material in crucible body 11 is fewer and fewer, and the surface of evaporation material is gradually reduced, the surface distance spray of evaporation material
The space of mouth 12 is increasing.Eruption amount in order to ensure nozzle 12 is constant, it is necessary to ensure material surface away from nozzle 12
Pressure remains constant, and a kind of more mature mode is the heating temperature increased to evaporation material.1., 2., 3. distinguish in Fig. 1
It indicates three states carried out with vapor deposition process, in these three states, passes through the heat of increase heater 20 in the prior art
Radiation supply (being depicted with arrows heat radiation), the eruption amount to ensure nozzle 12 is constant, and this can cause more heat radiations from
Outside is lost at the top of evaporation source.As shown in Fig. 2, the embodiment of the present invention is by making the heat radiation that heater 20 generates adjust hot group
Convection current in the reflection cavity that part 30 is formed with crucible body 11 is compared with improving the utilization rate of the heat radiation generated to heater 20
The prior art, while the heat radiation supply for reducing heater 20, it is possible to reduce the heat radiation being lost to outside evaporation source.
Evaporation source provided in an embodiment of the present invention adjusts hot component 30 so that heating by being arranged outside crucible body 11
Convection current between hot component 30 and crucible body 11 is being adjusted in the heat radiation that device 20 generates, to which crucible body 11 can be improved to heat radiation
Absorptivity.Compared with prior art, no matter evaporation source provided by the invention in use, is deposited which process proceeds to
Stage, the heat radiation that heater 20 is supplied are lower than the prior art and higher than the prior art to the utilization rate of heat radiation.In this way
One, more heat radiations that heater 20 generates are reflected into evaporation material surface, for being heated to evaporation material, are carried
The utilization ratio of high-heating radiation avoids or has cut down the rising of 20 heating temperature of heater, to make less heat radiation from steaming
Outside is lost at the top of rising, the vapor deposition mask plate (Mask) on improvement evaporation source top is thermal expansion deformation due to heated to ask
Topic improves vapor deposition accuracy.
In order to reduce the waste of the heat radiation generated to heater 20 as possible, in some embodiments, as shown in figure 3, adjusting
Hot component 30 includes the first tune warmware 31, and the first tune warmware 31 and heater 20 are arranged at the side of crucible body 11, add
The setting of hot device 20 is adjusted first between warmware 31 and crucible body 11;Wherein, side is intersected with top surface.
By taking crucible body 11 is rectangle as an example, crucible body 11 includes four sides, can each side be both provided with
Heater 20 can also only be certain several side setting having heaters 20 therein.It is also possible to be that each side is respectively provided with
There is the first tune warmware 31, can also only be that certain several side therein are provided with the first tune warmware 31.Side where certain one side is not
Certain having heaters 20 and first that is arranged simultaneously adjusts warmware 31, if having heaters 20, but also setting had not only been arranged in side where certain one side
There is the first tune warmware 31, first adjusts warmware 31 to be arranged in heater 20 far from 11 side of crucible body.
In some embodiments, it as shown in figure 4, crucible body 11 is rectangle, is surrounded by the length and height of crucible body 11
Side setting having heaters 20 and first adjusts warmware 31 where side.
Wherein, the height of crucible body 11 is size of the crucible body 11 on evaporation material injection direction, crucible body
11 length and wide vertical with the height of crucible body 11, and it is long be more than it is wide.
That is, crucible body 11 includes four sides, it is provided in the side as where long and high two sides surrounded
Heater 20 and first adjusts warmware 31.
The crucible 10 that evaporation source uses is generally line source type crucible, and crucible body 11 is cuboid, the top of crucible body 11
Face is provided with multiple nozzles 12, so, since the length of crucible body 11 is too long, the side where the wide and high side surrounded
Heater 20 it cannot be guaranteed that heating effect to the evaporation material of 11 central area of crucible body, it is ensured that in crucible body 11
The heating effect of evaporation material, the heating effect of the side where the long and high side surrounded of crucible body 11 is with regard to particularly important.Base
In this, the embodiment of the present invention can be improved by adjusting warmware 31 in the side setting first as where the long and high side surrounded by growing
The heating effect of the heater 20 of side setting where the side surrounded with height, so as to reduce the heat for the heater 20 that the side is arranged
Radiation supply, is further reduced the heat for being dispersed into and being gone outside evaporation source.
In some embodiments, as shown in figure 5, first adjusts warmware 31 to include the first reflecting plate 311, along the injection of crucible 10
Direction, the height of the first reflecting plate 311 are less than the height of crucible body 11.
That is, the first reflecting plate 311 is no more than the top surface of crucible body 11, herein for the first reflecting plate 311
Long and width does not limit, such as can be greater than or equal to the length and width of crucible body 11.
During vapor deposition, when evaporation material is reached at nozzle 12, it is in evaporating state, the heat radiation in evaporation source
Degree can ensure the normal ejection of evaporation material, to avoid, because the first reflecting plate 311 is too high, causing heat radiation by the first reflection
Plate 311 reflects evaporation source, and the height of the first reflecting plate 311 is set below to the height of crucible body 11 herein.
In some embodiments, as shown in figure 5, the first tune warmware 31 further includes the control being connect with the first reflecting plate 311
Structure 312, control structure 312 is for driving the rotation of the first reflecting plate 311, to adjust the first reflecting plate 311 and be reflected with first
The angle of 311 corresponding side of plate.
Herein, the concrete structure of control structure 312 is not defined, the first tune warmware 31 can be driven to rotate.
For example, control structure 312 includes servo motor, the shaft of servo motor connects the first reflecting plate 311, and servo motor passes through control
Shaft rotates that the first reflecting plate 311 is driven to rotate.
Wherein, the rotation mode of the first reflecting plate 311 is not defined, can is that (Fig. 6 is side view as shown in Figure 6
Visual angle), with vapor deposition process progress, so that the top of the first reflecting plate 311 is moved closer to the top surface of crucible body 11, bottom
It is gradually distance from the bottom surface of crucible body 11.So, state of first reflecting plate 311 from the plane perpendicular with crucible body 11
Become the state to form an angle with the bottom surface of crucible body 11 so that the heat radiation of the first reflecting plate 311 reflection is closer to earthenware
11 bottom of crucible ontology.Can also be make as shown in Figure 7 the visual angle of vertical view (Fig. 7 be) side of the first reflecting plate 311 by
Gradually close to the side of crucible body 11, another opposite side is gradually distance from the above-mentioned side of crucible body 11.So,
First reflecting plate 311 plane perpendicular with crucible body 11 always, gradually changes with the angle of 11 side of crucible body.Certainly,
Can also be that two kinds of rotation modes exist simultaneously.With the progress of vapor deposition process, the first reflecting plate is controlled by control structure 312
311 angle can make more heat radiations be reflected into the surface of evaporation material, further increase the utilization rate of heat radiation, drop
The low requirement to 20 heating temperature of heater.
The embodiment of the present invention adjusts the angle of the first reflecting plate 311 by control structure 312, can make the first reflecting plate
311 are reflected into heat radiation at evaporation material place, while heat radiation being avoided to go out from evaporation source overhead radiation, optimize heater
The sphere of action of 20 heat radiations, effectively control give off the heat of evaporation source.
In some embodiments, the first reflecting plate 311 includes multiple first daughter boards, and multiple first daughter boards are by control structure
312 independent controls.
Herein, by set the first reflecting plate 311 to include multiple independent first daughter boards structure, and make multiple
One daughter board, on the one hand can be with the first daughter board of separately adjustable different location and crucible body 11 by 312 independent control of control structure
Between angle, further increase the utilization rate of heat radiation;On the other hand multiple first daughter boards can be made independently to replace, reduces life
Produce cost.
In some embodiments, in order to improve reflecting effect of first reflecting plate 311 to heat radiation, the first reflecting plate 311
It is selected as bimirror panel.
In some embodiments, as shown in figure 8, it includes the second tune warmware 32 to adjust hot component 30, second adjusts warmware 32 to be arranged
In the bottom surface side of crucible body 11, bottom surface is oppositely arranged with top surface.
During vapor deposition, evaporation material is arranged always at 11 bottom of crucible body, by being arranged in 11 bottom surface side of crucible body
Second adjusts warmware 32, can promote the heating effect of the evaporation material to 11 bottom of crucible body, to reduce to heater 20
The requirement of heating temperature.
In some embodiments, as shown in Figure 9 and Figure 10, second warmware 32 is adjusted to include the second reflecting plate 321, the second reflection
It is provided with pierced pattern on plate 321.
Wherein, not the arrangement mode to the concrete shape of pierced pattern and pierced pattern on the second reflecting plate 321 into
Row limits, and the pierced pattern of different number can be arranged in different regions as needed, what is be arranged on the second reflecting plate 321 engraves
The shape of null pattern is not necessarily identical.Illustratively, the second reflecting plate 321 can be bimirror panel, the second reflecting plate 321
Shape it is identical as the shape of the bottom surface of crucible body 11, the second reflecting plate 321 is arranged in the underface of crucible body 11.
The embodiment of the present invention by include in the setting of the bottom of crucible 10 pierced pattern the second reflecting plate 321 so that the
Two reflecting plates 321 are different in the albedo of different zones, and then ensure the uniformity to 11 bottom-heated of crucible body.
In some embodiments, as shown in Figure 10, engraving on the extending direction of crucible body 11, the second reflecting plate 321
The density of null pattern first increases to be reduced afterwards.
Wherein, the density of pierced pattern increases, and can be that the quantity of pierced pattern increases, can also be the face of pierced pattern
Product increases, to increase the accounting of vacancy section.The mode that density increaseds or decreases is not necessarily to be increased with certain specific rule, only
To be in integrally the trend increasedd or decreased.
Herein, during actual evaporation source evaporates evaporation material, along the length direction of crucible body 11, evaporation source
Inside is susceptible to the case where heat is unevenly distributed, and vapor deposition also will appear the case where being unevenly distributed to the film thickness on substrate,
I.e. film thickness uniformity is poor.As shown in (a) in Figure 11, when the second reflecting plate 321 not being arranged, the film thickness distribution that may go out is not
Uniform situation, 10 middle part heat of crucible is higher, causes the evaporation material that middle part sprays relatively more, to cause among film layer
The thin situation in thick both sides.For such film thickness distribution, (b) in Figure 11 is shown, and the second reflecting plate is arranged in 10 bottom of crucible
321, more pierced pattern or pierced pattern are set at second reflecting plate 321 corresponding with the central region that film thickness is thicker
Area design it is larger, to reflect inside less heat to crucible 10, corresponding with the two side areas that film layer is relatively thin
The smaller of the area design of less pierced pattern or pierced pattern is set at two reflecting plates 321, adjusts crucible by this way
10 internal thermal equilibriums, to make film thickness distribution evenly.
The embodiment of the present invention by increasing along the second different reflecting plate 321 of 10 length direction pierced pattern density of crucible,
So that the second reflecting plate 321 is different to the albedo of heat radiation in different zones, to reflect different amounts of heat radiation to earthenware
It inside crucible 10, realizes to the heat regulation inside crucible 10, ensures homogeneity of the film layer on thickness.
In some embodiments, as shown in Figure 10, the second reflecting plate 321 includes multiple second daughter boards, in the second daughter board extremely
It is provided with pierced pattern on second daughter board described in small part.
That is, as shown in Figure 10, it is not necessary to pierced pattern is both provided on each second daughter board, it is of course also possible to root
Pierced pattern is set on each second daughter board according to needs.The pierced pattern being arranged on each second daughter board is also not necessarily complete
It is identical, such as can be intermediate close, both sides are dredged.
The embodiment of the present invention by set the second reflecting plate 321 to include multiple second daughter boards structure, can be in order to
The independent of second daughter board is replaced, and has not only ensured the reflecting effect to heat radiation, but also can reduce production cost.
After being projected from the pierced pattern on the second reflecting plate 321 in order to avoid heat radiation, will not directly it be reflected by pedestal
Return crucible body 11.In some embodiments, as shown in Figure 12 and Figure 13, evaporation source further includes pedestal 40, is arranged on pedestal 40
Fluted 41;The opening in groove 41 is arranged in second reflecting plate 321, the bottom face with groove 41.
Wherein, as shown in figure 14, crucible 10, heater 20 and hot component 30 is adjusted to be arranged in evaporation source shell, the
Two reflecting plates 321 are arranged on the pedestal of evaporation source shell, can not only include the first tune warmware 31, but also packet in the same evaporation source
Include the second tune warmware 32.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (12)
1. a kind of evaporation source, including crucible and the heater for generating heat radiation, the crucible include crucible body and setting
Nozzle in the crucible body top surface, which is characterized in that in addition to the top surface side of the crucible body, the crucible body its
At least side in remaining side, which is provided with, adjusts hot component;
It is described that hot component is adjusted to be used to make the heat radiation convection current between the hot component of the tune and the crucible body;
Wherein, there is gap between tune hot component and the crucible body.
2. evaporation source according to claim 1, which is characterized in that it is described that adjust hot component include first adjusting warmware, and described the
One tune warmware and the heater are arranged at the side of the crucible body, and the heater setting adjusts heat described first
Between part and the crucible body;
Wherein, side is intersected with the top surface.
3. evaporation source according to claim 2, which is characterized in that the crucible body is rectangle, by the crucible body
Length and the high side wall surrounded where side be provided with the heater and described first and adjust warmware.
4. evaporation source according to claim 2, which is characterized in that described first adjusts warmware to include the first reflecting plate, along institute
The injection direction of crucible is stated, the height of first reflecting plate is less than the height of the crucible body.
5. evaporation source according to claim 4, which is characterized in that the first tune warmware further includes and described first reflects
The control structure of plate connection, the control structure is for driving first reflecting plate to rotate, to adjust first reflecting plate
The angle of side corresponding with first reflecting plate.
6. evaporation source according to claim 5, which is characterized in that first reflecting plate includes multiple first daughter boards, more
A first daughter board is by the control structure independent control.
7. according to claim 4-6 any one of them evaporation sources, which is characterized in that first reflecting plate is bimirror panel.
8. evaporation source according to claim 1, which is characterized in that described that hot component is adjusted to adjust warmware including second;
The bottom surface side in the crucible body is arranged in the second tune warmware, and bottom surface is oppositely arranged with the top surface.
9. evaporation source according to claim 8, which is characterized in that described second adjusts warmware to include the second reflecting plate, described
It is provided with pierced pattern on second reflecting plate.
10. evaporation source according to claim 9, which is characterized in that along the extending direction of the crucible body, described second
The density of the pierced pattern on reflecting plate first increases to be reduced afterwards.
11. evaporation source according to claim 9, which is characterized in that second reflecting plate includes multiple second daughter boards, more
In a second daughter board the pierced pattern is provided at least partly described second daughter board.
12. evaporation source according to claim 9, which is characterized in that the evaporation source further includes pedestal, is set on the pedestal
It is equipped with groove;
The opening in the groove is arranged in second reflecting plate, the bottom face with the groove.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810988636.XA CN108754429B (en) | 2018-08-28 | 2018-08-28 | Evaporation source |
US16/396,734 US20200071814A1 (en) | 2018-08-28 | 2019-04-28 | Evaporation source |
US17/680,478 US20220178013A1 (en) | 2018-08-28 | 2022-02-25 | Evaporation source |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810988636.XA CN108754429B (en) | 2018-08-28 | 2018-08-28 | Evaporation source |
Publications (2)
Publication Number | Publication Date |
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CN108754429A true CN108754429A (en) | 2018-11-06 |
CN108754429B CN108754429B (en) | 2020-11-06 |
Family
ID=63966650
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810988636.XA Expired - Fee Related CN108754429B (en) | 2018-08-28 | 2018-08-28 | Evaporation source |
Country Status (2)
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US (2) | US20200071814A1 (en) |
CN (1) | CN108754429B (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110093586A (en) * | 2019-06-06 | 2019-08-06 | 京东方科技集团股份有限公司 | Evaporation source and evaporation coating method |
CN112853271A (en) * | 2019-11-27 | 2021-05-28 | 合肥欣奕华智能机器有限公司 | Linear evaporation source |
CN113088892A (en) * | 2021-03-31 | 2021-07-09 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
CN114182208A (en) * | 2021-12-10 | 2022-03-15 | 深圳市华星光电半导体显示技术有限公司 | Evaporation source and evaporation equipment |
CN114875365A (en) * | 2022-05-10 | 2022-08-09 | 苏州方昇光电股份有限公司 | Vacuum evaporation source, control method thereof and vacuum coating device |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1676660A (en) * | 2004-03-30 | 2005-10-05 | 株式会社延原表 | Nozzle evaporating source for steam plating |
KR20060034812A (en) * | 2004-10-20 | 2006-04-26 | (주)알파플러스 | Equipment and applied system of effusion cell for downward coating system |
CN102820206A (en) * | 2011-06-10 | 2012-12-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heat reflection device and semiconductor processing device |
CN103774095A (en) * | 2012-10-22 | 2014-05-07 | 三星显示有限公司 | Linear deposition source and vacuum deposition apparatus including the same |
KR101473788B1 (en) * | 2007-12-25 | 2014-12-17 | 신에쯔 한도타이 가부시키가이샤 | Single-crystal manufacturing apparatus and manufacturing method |
CN105296934A (en) * | 2015-11-09 | 2016-02-03 | 合肥欣奕华智能机器有限公司 | Linear evaporation source and evaporation plating device |
US9318359B2 (en) * | 2012-05-03 | 2016-04-19 | Ap Systems Inc. | Apparatus for substrate treatment and heating apparatus |
CN106987810A (en) * | 2017-05-24 | 2017-07-28 | 昆山国显光电有限公司 | Crucible thermal field control device and deposition system is deposited |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100645688B1 (en) * | 2005-08-30 | 2006-11-14 | 삼성에스디아이 주식회사 | Heater and vapor deposition source having the same |
KR101106289B1 (en) * | 2006-08-04 | 2012-01-18 | 순천향대학교 산학협력단 | Linear deposition sources for deposition processes |
JP4782219B2 (en) * | 2009-07-02 | 2011-09-28 | 三菱重工業株式会社 | Vacuum deposition equipment |
KR102007697B1 (en) * | 2013-02-28 | 2019-08-06 | 삼성에스디아이 주식회사 | Electrode fabricating appratus for rechargeable battery |
CN104404451A (en) * | 2014-12-16 | 2015-03-11 | 合肥鑫晟光电科技有限公司 | Evaporation source and evaporation device |
-
2018
- 2018-08-28 CN CN201810988636.XA patent/CN108754429B/en not_active Expired - Fee Related
-
2019
- 2019-04-28 US US16/396,734 patent/US20200071814A1/en not_active Abandoned
-
2022
- 2022-02-25 US US17/680,478 patent/US20220178013A1/en not_active Abandoned
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1676660A (en) * | 2004-03-30 | 2005-10-05 | 株式会社延原表 | Nozzle evaporating source for steam plating |
KR20060034812A (en) * | 2004-10-20 | 2006-04-26 | (주)알파플러스 | Equipment and applied system of effusion cell for downward coating system |
KR101473788B1 (en) * | 2007-12-25 | 2014-12-17 | 신에쯔 한도타이 가부시키가이샤 | Single-crystal manufacturing apparatus and manufacturing method |
CN102820206A (en) * | 2011-06-10 | 2012-12-12 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heat reflection device and semiconductor processing device |
US9318359B2 (en) * | 2012-05-03 | 2016-04-19 | Ap Systems Inc. | Apparatus for substrate treatment and heating apparatus |
CN103774095A (en) * | 2012-10-22 | 2014-05-07 | 三星显示有限公司 | Linear deposition source and vacuum deposition apparatus including the same |
CN105296934A (en) * | 2015-11-09 | 2016-02-03 | 合肥欣奕华智能机器有限公司 | Linear evaporation source and evaporation plating device |
CN106987810A (en) * | 2017-05-24 | 2017-07-28 | 昆山国显光电有限公司 | Crucible thermal field control device and deposition system is deposited |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110093586A (en) * | 2019-06-06 | 2019-08-06 | 京东方科技集团股份有限公司 | Evaporation source and evaporation coating method |
CN110093586B (en) * | 2019-06-06 | 2022-09-02 | 京东方科技集团股份有限公司 | Evaporation source and evaporation method |
CN112853271A (en) * | 2019-11-27 | 2021-05-28 | 合肥欣奕华智能机器有限公司 | Linear evaporation source |
CN112853271B (en) * | 2019-11-27 | 2023-11-14 | 合肥欣奕华智能机器股份有限公司 | Linear evaporation source |
CN113088892A (en) * | 2021-03-31 | 2021-07-09 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
CN113088892B (en) * | 2021-03-31 | 2023-02-28 | 京东方科技集团股份有限公司 | Vapor deposition source and vapor deposition device |
CN114182208A (en) * | 2021-12-10 | 2022-03-15 | 深圳市华星光电半导体显示技术有限公司 | Evaporation source and evaporation equipment |
CN114182208B (en) * | 2021-12-10 | 2024-01-23 | 深圳市华星光电半导体显示技术有限公司 | Evaporation source and evaporation equipment |
CN114875365A (en) * | 2022-05-10 | 2022-08-09 | 苏州方昇光电股份有限公司 | Vacuum evaporation source, control method thereof and vacuum coating device |
CN114875365B (en) * | 2022-05-10 | 2024-05-24 | 苏州方昇光电股份有限公司 | Vacuum evaporation source, control method thereof and vacuum coating device |
Also Published As
Publication number | Publication date |
---|---|
US20200071814A1 (en) | 2020-03-05 |
CN108754429B (en) | 2020-11-06 |
US20220178013A1 (en) | 2022-06-09 |
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