CN108745801B - 一种半导体二极管生产工艺 - Google Patents
一种半导体二极管生产工艺 Download PDFInfo
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- CN108745801B CN108745801B CN201810534070.3A CN201810534070A CN108745801B CN 108745801 B CN108745801 B CN 108745801B CN 201810534070 A CN201810534070 A CN 201810534070A CN 108745801 B CN108745801 B CN 108745801B
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- Prior art keywords
- plate
- arc
- semiconductor diode
- glue
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000003292 glue Substances 0.000 claims abstract description 63
- 238000007789 sealing Methods 0.000 claims abstract description 54
- 238000001035 drying Methods 0.000 claims abstract description 26
- 238000005485 electric heating Methods 0.000 claims abstract description 16
- 238000000034 method Methods 0.000 claims description 10
- 239000004744 fabric Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 239000002253 acid Substances 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 238000005406 washing Methods 0.000 claims description 6
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000004381 surface treatment Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 30
- 210000003781 tooth socket Anatomy 0.000 abstract 1
- 238000004026 adhesive bonding Methods 0.000 description 15
- 239000012634 fragment Substances 0.000 description 9
- 238000010438 heat treatment Methods 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 230000002028 premature Effects 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 230000003116 impacting effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 210000005056 cell body Anatomy 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 210000004027 cell Anatomy 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/002—Pretreatement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/18—Processes for applying liquids or other fluent materials performed by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Automatic Assembly (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810534070.3A CN108745801B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体二极管生产工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810534070.3A CN108745801B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体二极管生产工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108745801A CN108745801A (zh) | 2018-11-06 |
CN108745801B true CN108745801B (zh) | 2020-11-06 |
Family
ID=64003584
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810534070.3A Active CN108745801B (zh) | 2018-05-29 | 2018-05-29 | 一种半导体二极管生产工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN108745801B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112216618B (zh) * | 2020-11-12 | 2023-03-28 | 抚州华成半导体科技有限公司 | 一种用于半导体二极管的封胶装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01281170A (ja) * | 1988-04-30 | 1989-11-13 | Trinity Ind Corp | カップ型容器用乾燥装置 |
WO1999012642A1 (en) * | 1997-09-09 | 1999-03-18 | Ceramem Corporation | Catalytic gas filter and methods |
CN102327852A (zh) * | 2011-08-19 | 2012-01-25 | 姚加荣 | 一种筷子的上涂料方法 |
KR20130085921A (ko) * | 2012-01-20 | 2013-07-30 | 주식회사 영산테크노 | 코팅 및 건조용 바스켓 |
CN203124191U (zh) * | 2013-01-17 | 2013-08-14 | 张爱萍 | 一种探测器自动化生产装置 |
-
2018
- 2018-05-29 CN CN201810534070.3A patent/CN108745801B/zh active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH01281170A (ja) * | 1988-04-30 | 1989-11-13 | Trinity Ind Corp | カップ型容器用乾燥装置 |
WO1999012642A1 (en) * | 1997-09-09 | 1999-03-18 | Ceramem Corporation | Catalytic gas filter and methods |
CN102327852A (zh) * | 2011-08-19 | 2012-01-25 | 姚加荣 | 一种筷子的上涂料方法 |
KR20130085921A (ko) * | 2012-01-20 | 2013-07-30 | 주식회사 영산테크노 | 코팅 및 건조용 바스켓 |
CN203124191U (zh) * | 2013-01-17 | 2013-08-14 | 张爱萍 | 一种探测器自动化生产装置 |
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Publication number | Publication date |
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CN108745801A (zh) | 2018-11-06 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Shi Jinyuan Inventor after: LAN Feng Inventor after: Fang Mingjin Inventor before: LAN Feng Inventor before: Fang Mingjin |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20201012 Address after: 518000 Factory Building of Xinhao Second Industrial Zone, Qiaotou Community, Fuhai Street, Baoan District, Shenzhen City, Guangdong Province Applicant after: SHENZHEN XINZHANTONG ELECTRONICS Co.,Ltd. Address before: 211189 Southeast University, No. 2 Southeast University Road, Jiangning District, Nanjing City, Jiangsu Province Applicant before: LAN Feng |
|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518000 The whole building on the first floor of the factory building of Xinhao Second Industrial Zone, Xintian Community, Fuhai Street, Baoan District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Xinzhantong Electronics Co., Ltd. Address before: 518000 the whole building on the first floor of building B1 in Xinhao second industrial zone, Qiaotou community, Fuhai street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN XINZHANTONG ELECTRONICS CO.,LTD. |