CN108705428A - The High Precision Automatic descaling machine of IC chip back-adhesive film - Google Patents
The High Precision Automatic descaling machine of IC chip back-adhesive film Download PDFInfo
- Publication number
- CN108705428A CN108705428A CN201810506361.1A CN201810506361A CN108705428A CN 108705428 A CN108705428 A CN 108705428A CN 201810506361 A CN201810506361 A CN 201810506361A CN 108705428 A CN108705428 A CN 108705428A
- Authority
- CN
- China
- Prior art keywords
- chip
- grinding
- guide rail
- cylinder
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/033—Other grinding machines or devices for grinding a surface for cleaning purposes, e.g. for descaling or for grinding off flaws in the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/007—Weight compensation; Temperature compensation; Vibration damping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The invention discloses a kind of High Precision Automatic descaling machine of IC chip back-adhesive film, the top of rack is equipped with crossbeam, and middle part is equipped with grinding guide rail；Grinding mechanism is equidistantly equipped with multiple on the crossbeam of rack；It includes reciprocating drive unit, sliding block, pressure sensor and arch grinding assembly to grind mechanism；Reciprocating drive unit is fixed on crossbeam；Sliding block is slidably connected with grinding guide rail；Reciprocating drive unit drives sliding block to reciprocatingly slide on grinding guide rail；It is fixedly connected with a slide block at the top of pressure sensor, the bottom of pressure sensor is fixedly connected with arch grinding assembly；The setting of arch grinding assembly is square on an integrated circuit die；Chip fixed mechanism is arranged in the interior bottom of rack, and IC chip fixed placement is on chip fixed mechanism.The present invention accurately controls the operating pressure and reciprocating frequence of arch grinding assembly by determination of pressure sensor grinding pressure, is effectively guaranteed effect of removing photoresist, improves production efficiency.
Description
Technical field
The present invention relates to the High Precision Automatic descaling machines of IC chip back-adhesive film.
Background technology
IC chip inevitably forms gum in preparing packaging technology, influences conductive effect and the weldering of circuit
Connect installation reliability.Therefore removing glue processing must be carried out to its mounting surface.Existing IC chip gum descaling machine is adopted
With tablet or roller shape lap, there is a problem of that operation precision control is difficult and elimination effect is undesirable, lead to finished product rate
It is relatively low.
Invention content
The object of the present invention is to provide a kind of High Precision Automatic descaling machines of IC chip back-adhesive film, improve production effect
Rate.
Realizing the technical solution of the object of the invention is：The High Precision Automatic descaling machine of IC chip back-adhesive film, including machine
Frame and the grinding mechanism being arranged in rack and chip fixed mechanism；The grinding mechanism can slide in rack, including past
Multiple driving device, sliding block, pressure sensor and arch grinding assembly；The reciprocating drive unit is fixed on the rack；It is described past
Multiple driving device driving sliding block reciprocatingly slides in rack；Pressure sensor setting sliding block and arch grinding assembly it
Between, and connect with the two；The arch grinding assembly is arranged above chip fixed mechanism.
The top of the rack is equipped with crossbeam, and middle part is equipped with grinding guide rail；The sliding block is slidably connected with grinding guide rail；Institute
Chip fixed mechanism is stated to be arranged in the lower section of the grinding guide rail of rack.
The reciprocating drive unit of the grinding mechanism includes cylinder arm and reciprocal driving cylinder；The top of the cylinder arm
Portion is fixed on the crossbeam of rack；The cylinder body of the reciprocal driving cylinder is fixed on cylinder arm；The reciprocal driving cylinder
Piston rod it is horizontally disposed, and be fixedly connected with a slide block.
The arch grinding assembly of the grinding mechanism includes pedestal, upper hanger, lower sunpender, arm, elastic bow plate and flexibility
Grinding layer；The pedestal is fixed on the bottom of pressure sensor；It is fixed on pedestal in the middle part of the upper hanger；The lower sunpender
It is arranged below upper hanger, and the both ends of lower sunpender are fixedly connected by two arms with the both ends of upper hanger respectively；It is described
Upper hanger and lower sunpender are arranged in parallel with the grinding guide rail of rack；The both ends of the elastic bow plate are installed on upper hanger；
The flexible grinding layer is fixed on the lower face of elastic bow plate.
The flexible grinding layer of the grinding mechanism is pasted and fixed on the lower face of elastic bow plate.
The grinding mechanism further includes the trimming assembly of the radian for adjusting elastic bow plate.
The trimming assembly of the grinding mechanism includes fine tuning motor, fine tuning gear and gear nut；The one of the lower sunpender
End is equipped with external screw thread；The internal thread of the gear nut is threadedly coupled with the external screw thread of lower sunpender；The fine tuning motor is fixed on
On the medial surface of the externally threaded arm of lower sunpender；The fine tuning gear is fixed on the output shaft of fine tuning motor, and with
The outer tooth engagement of gear nut.
The chip fixed mechanism includes chip guide rail, chip fixation cylinder and chip pressure head；The chip guide rail is symmetrical
Two are provided with, two chip guide rails are arranged in parallel with the grinding guide rail of rack；The chip guide rail is equipped with inner cavity；The core
It is one group that piece, which fixes cylinder at least two, corresponding up and down with a grinding mechanism；The piston rod that the chip fixes cylinder runs through
The top of chip guide rail is simultaneously fixedly connected with chip pressure head；The both sides of the IC chip are individually positioned in two chips and lead
On rail；The chip fixes cylinder driving chip pressure head and pushes down IC chip to realize the fixation of IC chip.
The inner cavity top of the chip guide rail of the chip fixed mechanism is equipped with multiple correspondingly with chip fixation cylinder
Guide through hole；The piston rod that the chip fixes cylinder is slidably connected with guide through hole.
The guide through hole of the chip guide rail of the chip fixed mechanism is down big up small stepped hole, and chip fixes cylinder
It is correspondingly arranged on limited step on the peripheral surface of piston rod.
The top inside edge of the chip guide rail of the chip fixed mechanism is equipped with chip and places concave station.
One end of the chip pressure head of the chip fixed mechanism is fixed on chip and fixes on the piston rod of cylinder, other end position
It places above concave station and extends downwardly in the chip of chip guide rail.
Above-mentioned technical proposal is used, the present invention has advantageous effect below：(1) present invention is surveyed by pressure sensor
Determine grinding pressure, and then accurately control the operating pressure and reciprocating frequence of arch grinding assembly, is effectively guaranteed effect of removing photoresist,
Improve production efficiency.
(2) present invention is at low cost by back and forth driving cylinder that sliding block is driven to move back and forth, and production efficiency is high.
(3) present invention replaces tablet or roller shape lap with arch lap, and elastic bow plate is adjusted by trimming assembly
Radian, so that grinding pressure is finely tuned, avoid rigid contact, realize bionical working condition.
(4) present invention fixes cylinder driving chip pressure head by chip and pushes down IC chip to realize integrated circuit
The fixation of chip so that the dismounting of IC chip is highly stable, convenient.
(5) inner cavity top of the chip guide rail of chip fixed mechanism of the invention is equipped with fixes cylinder one-to-one correspondence with chip
Multiple guide through hole, play the role of to chip fix cylinder positioning and guiding.
(6) guide through hole of the chip guide rail of chip fixed mechanism of the invention is down big up small stepped hole, and chip is solid
Determine to be correspondingly arranged on limited step on the peripheral surface of the piston rod of cylinder, the piston rod of cylinder can be avoided excessively to stretch out.
(7) the top inside edge of the chip guide rail of chip fixed mechanism of the invention is equipped with chip and places concave station, can
Positioning IC chip well.
(8) other end of the chip pressure head of chip fixed mechanism of the invention is located on the chip placement concave station of chip guide rail
Side simultaneously extends downwardly, and ensure that the fixed validity of IC chip.
Description of the drawings
In order that the present invention can be more clearly and readily understood, right below according to specific embodiment and in conjunction with attached drawing
The present invention is described in further detail, wherein
Fig. 1 is the structural diagram of the present invention.
Fig. 2 is enlarged drawing at the A of Fig. 1.
Fig. 3 is the B-B sectional views of Fig. 1.
Fig. 4 is enlarged drawing at the C of Fig. 3.
In attached drawing marked as：
It is rack 1, crossbeam 1-1, grinding guide rail 1-2, grinding mechanism 2, multiple driving device 2-1, cylinder arm 2-1-1, reciprocal
Drive cylinder 2-1-2, sliding block 2-2, pressure sensor 2-3, arch grinding assembly 2-4, pedestal 2-4-1, upper hanger 2-4-2, under
Sunpender 2-4-3, arm 2-4-4, elastic bow plate 2-4-5, flexible grinding layer 2-4-6, trimming assembly 2-5, fine tuning motor 2-5-1,
Fine tuning gear 2-5-2, gear nut 2-5-3, chip fixed mechanism 3, chip guide rail 3-1, guide through hole 3-1-1, chip are fixed
Cylinder 3-2, chip pressure head 3-3, IC chip 4.
Specific implementation mode
(embodiment 1)
See Fig. 1 to Fig. 4, the High Precision Automatic descaling machine of IC chip back-adhesive film of the present embodiment, including rack 1, grind
Grinding machine structure 2 and chip fixed mechanism 3.
The top of rack 1 is equipped with crossbeam 1-1, and middle part is equipped with grinding guide rail 1-2.Crossbeam 1-1 of the grinding mechanism 2 in rack 1
On be equidistantly equipped with it is multiple.Chip fixed mechanism 3 is arranged in the interior bottom of rack 1, and 4 fixed placement of IC chip is in chip
On fixed mechanism 3.
Grind mechanism 2 include reciprocating drive unit 2-1, sliding block 2-2, pressure sensor 2-3, arch grinding assembly 2-4 and
Trimming assembly 2-5.Reciprocating drive unit 2-1 is fixed on crossbeam 1-1.Sliding block 2-2 is slidably connected with grinding guide rail 1-2.Back and forth
Driving device 2-1 driving sliding block 2-2 reciprocatingly slide on grinding guide rail 1-2.The top of pressure sensor 2-3 is solid with sliding block 2-2
Fixed connection, the bottom of pressure sensor 2-3 is fixedly connected with arch grinding assembly 2-4.The 2-4 settings of arch grinding assembly are integrated
4 top of circuit chip.
Reciprocating drive unit 2-1 includes cylinder arm 2-1-1 and reciprocal driving cylinder 2-1-2.The top of cylinder arm 2-1-1
Portion is fixed on the crossbeam 1-1 of rack 1.The cylinder body of reciprocal driving cylinder 2-1-2 is fixed on cylinder arm 2-1-1.It is reciprocal to drive
Take offence cylinder 2-1-2 piston rod it is horizontally disposed, and be fixedly connected with sliding block 2-2.
Arch grinding assembly 2-4 includes pedestal 2-4-1, upper hanger 2-4-2, lower sunpender 2-4-3, arm 2-4-4, elastic bow
Plate 2-4-5 and flexible grinding layer 2-4-6.Pedestal 2-4-1 is fixed on the bottom of pressure sensor 2-3.The middle part of upper hanger 2-4-2
It is fixed on pedestal 2-4-1.Lower sunpender 2-4-3 is arranged below upper hanger 2-4-2, and the both ends difference of lower sunpender 2-4-3
It is fixedly connected with the both ends of upper hanger 2-4-2 by two arm 2-4-4.Upper hanger 2-4-2 and lower sunpender 2-4-3 is and rack
1 grinding guide rail 1-2 is arranged in parallel.The both ends of elastic bow plate 2-4-5 are installed on upper hanger 2-4-2.Flexible grinding layer 2-
4-6 is pasted and fixed on the lower face of elastic bow plate 2-4-5.
Trimming assembly 2-5 is used to adjust the radian of elastic bow plate 2-4-5.Trimming assembly 2-5 include fine tuning motor 2-5-1,
Finely tune gear 2-5-2 and gear nut 2-5-3.One end of lower sunpender 2-4-3 is equipped with external screw thread.The interior spiral shell of gear nut 2-5-3
Line is threadedly coupled with the external screw thread of lower sunpender 2-4-3.Fine tuning motor 2-5-1 is fixed on close to the externally threaded of lower sunpender 2-4-3
On the medial surface of arm 2-4-4.Fine tuning gear 2-5-2 is fixed on the output shaft of fine tuning motor 2-5-1, and with gear nut 2-
The outer tooth engagement of 5-3.
Chip fixed mechanism 3 includes chip guide rail 3-1, chip fixation cylinder 3-2 and chip pressure head 3-3.Chip guide rail 3-1
Two are symmetrically arranged with, two chip guide rail 3-1 are arranged in parallel with the grinding guide rail 1-2 of rack 1.Chip guide rail 3-1 is equipped with
Inner cavity.It is one group that chip, which fixes cylinder 3-2 at least two,.Multigroup chip is equidistantly disposed in the inner cavity of chip guide rail 3-1 to fix
Cylinder 3-2, it is corresponding with about 2 mechanism of grinding that each group of chip fixes cylinder 3-2.Chip fixes the piston of cylinder 3-2
Bar is fixedly connected through the top of chip guide rail 3-1 and with chip pressure head 3-3.The both sides of IC chip 4 are individually positioned in
On two chip guide rail 3-1.Chip fixes cylinder 3-2 driving chip pressure heads 3-3 and pushes down IC chip 4 to which realization is integrated
The fixation of circuit chip 4.
The inner cavity top of chip guide rail 3-1 is equipped with fixes cylinder 3-2 multiple guide through hole 3-1- correspondingly with chip
1.The piston rod that chip fixes cylinder 3-2 is slidably connected with guide through hole 3-1-1.Guide through hole 3-1-1 is down big up small platform
Rank hole, chip are fixed on the peripheral surface of the piston rod of cylinder 3-2 and are correspondingly arranged on limited step.In the top of chip guide rail 3-1
Edge is equipped with chip and places concave station.One end of chip pressure head 3-3 is fixed on chip and fixes on the piston rod of cylinder 3-2, another
It places above concave station and extends downwardly positioned at the chip of chip guide rail 3-1 in end.
The present embodiment carries out as steps described below when being cleared up：
1., pass through the appropriate grinding pressure of testing setup and reciprocating frequence parameter；
2., the pressure between pressure sensor 2-3 detection elastic bow plate 2-4-5 and 4 surface of IC chip；
3., the reciprocal driving cylinder 2-1-2 driving sliding block 2-2 of control system control it is reciprocating along grinding guide rail 1-2, into
And arch grinding assembly 2-4 is driven to move reciprocatingly, start removing glue work；When work, the reciprocal driving cylinder of control system control
2-1-2 keeps the working frequency of setting, while trimming assembly 2-5 changes the radian of elastic bow plate 2-4-5, is allowed to and integrated circuit
Preset flexible working pressure (i.e. grinding pressure) is kept between 4 surface of chip at any time；
4., in the course of work, according to actual condition, control system adjusts the reciprocating frequence of arch grinding assembly 2-4 at any time
With pressure parameter.
Particular embodiments described above has carried out further in detail the purpose of the present invention, technical solution and advantageous effect
It describes in detail bright, it should be understood that the above is only a specific embodiment of the present invention, is not intended to restrict the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the present invention
Within the scope of shield.
Claims (10)
1. the High Precision Automatic descaling machine of IC chip back-adhesive film, it is characterised in that：Including rack (1) and it is arranged in machine
Grinding mechanism (2) on frame (1) and chip fixed mechanism (3)；The grinding mechanism (2) can be slided in rack (1), including past
Multiple driving device (2-1), sliding block (2-2), pressure sensor (2-3) and arch grinding assembly (2-4)；The reciprocating drive unit
(2-1) is fixed in rack (1)；Reciprocating drive unit (2-1) the driving sliding block (2-2) reciprocatingly slides in rack (1)；Institute
It states pressure sensor (2-3) to be arranged between sliding block (2-2) and arch grinding assembly (2-4), and is connect with the two；The arch
Grinding assembly (2-4) setting is above chip fixed mechanism (3).
2. the High Precision Automatic cleaning machine of IC chip back-adhesive film according to claim 1, it is characterised in that：The machine
The top of frame (1) is equipped with crossbeam (1-1), and middle part is equipped with grinding guide rail (1-2)；The sliding block (2-2) is sliding with grinding guide rail (1-2)
Dynamic connection；The lower section of grinding guide rail (1-2) of chip fixed mechanism (3) setting in rack (1).
3. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 2, it is characterised in that：It is described to grind
The reciprocating drive unit (2-1) of grinding machine structure (2) includes cylinder arm (2-1-1) and reciprocal driving cylinder (2-1-2)；The cylinder
It is fixed at the top of arm (2-1-1) on the crossbeam (1-1) of rack (1)；The cylinder body of the reciprocal driving cylinder (2-1-2) is fixed
On cylinder arm (2-1-1)；The piston rod of the reciprocal driving cylinder (2-1-2) is horizontally disposed, and fixed with sliding block (2-2)
Connection.
4. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 2, it is characterised in that：It is described to grind
The arch grinding assembly (2-4) of grinding machine structure (2) includes pedestal (2-4-1), upper hanger (2-4-2), lower sunpender (2-4-3), arm
(2-4-4), elastic bow plate (2-4-5) and flexible grinding layer (2-4-6)；The pedestal (2-4-1) is fixed on pressure sensor (2-
3) bottom；It is fixed on pedestal (2-4-1) in the middle part of the upper hanger (2-4-2)；The lower sunpender (2-4-3) is arranged upper
Below sunpender (2-4-2), and the both ends of lower sunpender (2-4-3) pass through two arms (2-4-4) and upper hanger (2-4-2) respectively
Both ends be fixedly connected；The upper hanger (2-4-2) and lower sunpender (2-4-3) are parallel with grinding guide rail (1-2) of rack (1)
Setting；The both ends of the elastic bow plate (2-4-5) are installed on upper hanger (2-4-2)；The flexible grinding layer (2-4-6) is solid
It is scheduled on the lower face of elastic bow plate (2-4-5).
5. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 4, it is characterised in that：It is described to grind
Grinding machine structure (2) further includes the trimming assembly (2-5) of the radian for adjusting elastic bow plate (2-4-5).
6. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 5, it is characterised in that：It is described to grind
The trimming assembly (2-5) of grinding machine structure (2) includes fine tuning motor (2-5-1), fine tuning gear (2-5-2) and gear nut (2-5-3)；
One end of the lower sunpender (2-4-3) is equipped with external screw thread；The internal thread of the gear nut (2-5-3) and lower sunpender (2-4-3)
External screw thread be threadedly coupled；The fine tuning motor (2-5-1) is fixed on the externally threaded arm (2- close to lower sunpender (2-4-3)
On medial surface 4-4)；It is described fine tuning gear (2-5-2) be fixed on fine tuning motor (2-5-1) output shaft on, and with gear spiral shell
The outer tooth engagement of female (2-5-3).
7. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 2, it is characterised in that：The core
Piece fixed mechanism (3) includes chip guide rail (3-1), chip fixation cylinder (3-2) and chip pressure head (3-3)；The chip guide rail
(3-1) is symmetrically arranged with two, and two chip guide rails (3-1) are arranged in parallel with the grinding guide rail of rack (1) (1-2)；It is described
Chip guide rail (3-1) is equipped with inner cavity；It is one group that the chip, which fixes cylinder (3-2) at least two, and up and down with grinding mechanism (2)
It is corresponding；The piston rod that the chip fixes cylinder (3-2) is through the top of chip guide rail (3-1) and solid with chip pressure head (3-3)
Fixed connection；The both sides of the IC chip (4) are individually positioned on two chip guide rails (3-1)；The chip fixes gas
Cylinder (3-2) driving chip pressure head (3-3) pushes down IC chip (4) to realize the fixation of IC chip (4).
8. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 7, it is characterised in that：The core
Equipped with being fixed with chip, cylinder (3-2) is multiple correspondingly to lead the inner cavity top of the chip guide rail (3-1) of piece fixed mechanism (3)
To through-hole (3-1-1)；The piston rod that the chip fixes cylinder (3-2) is slidably connected with guide through hole (3-1-1).
9. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 8, it is characterised in that：The core
The guide through hole (3-1-1) of the chip guide rail (3-1) of piece fixed mechanism (3) is down big up small stepped hole, and chip fixes cylinder
It is correspondingly arranged on limited step on the peripheral surface of the piston rod of (3-2).
10. the High Precision Automatic descaling machine of IC chip back-adhesive film according to claim 9, it is characterised in that：It is described
The top inside edge of the chip guide rail (3-1) of chip fixed mechanism (3) is equipped with chip and places concave station.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810506361.1A CN108705428A (en) | 2018-05-23 | 2018-05-23 | The High Precision Automatic descaling machine of IC chip back-adhesive film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810506361.1A CN108705428A (en) | 2018-05-23 | 2018-05-23 | The High Precision Automatic descaling machine of IC chip back-adhesive film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108705428A true CN108705428A (en) | 2018-10-26 |
Family
ID=63870543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810506361.1A Withdrawn CN108705428A (en) | 2018-05-23 | 2018-05-23 | The High Precision Automatic descaling machine of IC chip back-adhesive film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108705428A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589597A (en) * | 2022-02-18 | 2022-06-07 | 业成科技（成都）有限公司 | Pressure control device, glue removing device and display device manufacturing system |
-
2018
- 2018-05-23 CN CN201810506361.1A patent/CN108705428A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114589597A (en) * | 2022-02-18 | 2022-06-07 | 业成科技（成都）有限公司 | Pressure control device, glue removing device and display device manufacturing system |
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|---|---|---|---|
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| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181026 |
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| WW01 | Invention patent application withdrawn after publication |