CN108695187A - Semiconductor crystal wafer cleaning equipment - Google Patents
Semiconductor crystal wafer cleaning equipment Download PDFInfo
- Publication number
- CN108695187A CN108695187A CN201710225635.5A CN201710225635A CN108695187A CN 108695187 A CN108695187 A CN 108695187A CN 201710225635 A CN201710225635 A CN 201710225635A CN 108695187 A CN108695187 A CN 108695187A
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- CN
- China
- Prior art keywords
- unit
- cleaning
- box station
- wafer
- semiconductor crystal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 146
- 239000013078 crystal Substances 0.000 title claims abstract description 38
- 239000004065 semiconductor Substances 0.000 title claims abstract description 35
- 238000012546 transfer Methods 0.000 claims abstract description 56
- 238000002347 injection Methods 0.000 claims description 6
- 239000007924 injection Substances 0.000 claims description 6
- 239000007788 liquid Substances 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 abstract description 10
- 235000012431 wafers Nutrition 0.000 description 66
- 238000005406 washing Methods 0.000 description 6
- 239000000243 solution Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 241000826860 Trapezium Species 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
This disclosure relates to a kind of semiconductor crystal wafer cleaning equipment, the semiconductor crystal wafer cleaning equipment includes the box station unit for storing wafer, the cleaning unit for cleaning the wafer taken out from box station unit and can rotate and be arranged around the transfer robot for the transfer robot of the transmission wafer between box station unit and the cleaning unit, box station unit and the cleaning unit.It is arranged by the way that box station as described above unit and cleaning unit are surrounded the transfer robot for transmitting wafer between box station unit and cleaning unit, so that the integral arrangement of semiconductor crystal wafer cleaning equipment is compact, occupation area of equipment is small and improves wafer transmission efficiency of the transfer robot between box station unit and cleaning unit.
Description
Technical field
This disclosure relates to semiconductor crystal wafer cleaning technique field, and in particular, to a kind of semiconductor crystal wafer cleaning equipment.
Background technology
With the development of semiconductor crystal wafer making technology technology, the crystal column surface before each processing procedure such as polishing is cleaned
Degree requires higher and higher, and various semiconductor crystal wafer cleaning equipments generate therewith.But its knot of existing semiconductor crystal wafer cleaning equipment
Structure is not compact and takes up a large area, causes Clean room area and use upper waste, while also having the problem of being difficult to safeguard.
Invention content
The disclosure solves the problems, such as to be to provide a kind of semiconductor crystal wafer cleaning equipment of characteristics of compact layout.
To achieve the goals above, the disclosure provides a kind of semiconductor crystal wafer cleaning equipment, and semiconductor crystal wafer cleaning is set
Standby includes the box station unit for storing wafer, cleaning unit and energy for cleaning the wafer taken out from box station unit
Enough rotations and the transfer robot for transmitting wafer between box station unit and the cleaning unit, box station unit
It is arranged around the transfer robot with the cleaning unit.
Optionally, the semiconductor crystal wafer cleaning equipment includes the wafer taken out from the unit of the box station for centering
Centering unit, box station unit are two and are located at the top both sides of the centering unit.
Optionally, center extension line of two box station units relative to the centering unit and the transfer robot
Symmetrically arrangement.
Optionally, the cleaning unit is two and is symmetrically arranged at the both sides of the transfer robot.
Optionally, two box station units and two cleaning units are generally aligned in the same plane and are trapezoidal layout, and two
A box station unit is located at two vertex positions of upper bottom edge, and two cleaning units are located at two vertex position of bottom
It sets.
Optionally, two box station units and two cleaning units are arranged in isosceles trapezoid.
Optionally, the centering unit is located at the center of the upper bottom edge, the transfer robot be located at it is described under
The center on bottom edge.
Optionally, on the basis of the rotary shaft of the transfer robot, the transfer robot is single with the box station respectively
Spacing between the first and described cleaning unit is equal.
Optionally, cloth is spaced with box station unit and the cleaning unit in the vertical direction for one group of cleaning module
Cleaning module described in being equipped with two groups, and cleaning module described in two groups transmits wafer by the transfer robot.
Optionally, the cleaning unit include for position wafer and drive wafer be used as centrifugal rotation supporting table and
In the injection apparatus to the needle-shaped jet cleaning liquid of wafer.
Through the above technical solutions, that is, by surrounding box station as described above unit and cleaning unit at box station
The transfer robot arrangement of wafer is transmitted between unit and cleaning unit, so that the whole knot of semiconductor crystal wafer cleaning equipment
Structure characteristics of compact layout, occupation area of equipment are small and improve wafer transmission of the transfer robot between box station unit and cleaning unit
Efficiency.
Other feature and advantage of the disclosure will be described in detail in subsequent specific embodiment part.
Description of the drawings
Attached drawing is for providing further understanding of the disclosure, and a part for constitution instruction, with following tool
Body embodiment is used to explain the disclosure together, but does not constitute the limitation to the disclosure.In the accompanying drawings:
Fig. 1 is the arrangement schematic diagram according to the semiconductor crystal wafer cleaning equipment of disclosure specific implementation mode.
Reference sign
1 box station unit, 2 cleaning unit
3 transfer robot, 4 centering unit
5 supporting table, 6 injection apparatus
Specific implementation mode
The specific implementation mode of the disclosure is described in detail below in conjunction with attached drawing.It should be understood that this place is retouched
The specific implementation mode stated is only used for describing and explaining the disclosure, is not limited to the disclosure.
As shown in Figure 1, the disclosure provides a kind of semiconductor crystal wafer cleaning equipment, which includes using
In the box station unit 1 of storing wafer, the cleaning unit 2 for cleaning the wafer taken out from box station unit 1 and can revolve
Turn and for the transfer robot 3 of the transmission wafer between box station unit 1 and the cleaning unit 2, box station unit 1
It is arranged around the transfer robot 3 with the cleaning unit 2.By the way that box station as described above unit 1 and cleaning unit 2 are enclosed
It is arranged around the transfer robot 3 for transmitting wafer between box station unit 1 and cleaning unit 2, so that semiconductor crystal wafer
The integral arrangement of cleaning equipment is compact, occupation area of equipment is small and improves transfer robot 3 between box station unit 1 and cleaning
Wafer transmission efficiency between unit 2.
It, can be with here, arrangement quantity and structure for box station unit 1 and cleaning unit 2 and disclose and be not construed as limiting
According to different cleanings such as the cleaning of the chemical-mechanical of the different type of wafer, use, ultrasonic cleaning, the cleanings of high-speed flow particle
The actual demand of mode specifically designs.In addition, transfer robot 3 can realize following transmitting path, that is, transfer robot 3
Cleaning unit 2 can be sent to after taking out wafer from box station unit 1 to be cleaned, it later will be on the cleaning unit 2 that complete cleaning
Wafer be sent to box station unit 1 again.But it's not limited to that for the disclosure, and transfer robot 3 can also be according to actual needs
To be designed to the wafer in the cleaning unit 2 for completing cleaning being sent in subsequent handling.
Optionally, the semiconductor crystal wafer cleaning equipment includes the wafer taken out from box station unit 1 for centering
Centering unit 4, box station unit 1 is two and is located at the top both sides of the centering unit 4.Pass through arrangement herein
Two box station units 1 so that whole wafers in box station unit 1 of semiconductor crystal wafer cleaning equipment pair complete washing and cleaning operation
Afterwards, without shutdown and continuity continue in another box station unit 1 wafer carry out washing and cleaning operation, to improve equipment
Whole washing and cleaning operation efficiency.In addition, transfer robot 3 is carried out by being sent into centering unit 4 after taking out wafer from box station unit 1
Centering, to when the wafer after centering is sent to cleaning unit 2 by transfer robot 3 so that the center of wafer is single with cleaning
The center of supporting table for being used to support and positioning wafer in member 2 is consistent, to wafer be admitted to after cleaning unit 2 directly into
Row washing and cleaning operation.But it's not limited to that for the disclosure, for example, transfer robot 3 is direct after can taking out wafer from box station unit 1
It is sent in cleaning unit 2 and in the realization wafer of cleaning unit 2 to middle operation.In addition, centering unit 4 is arranged in box station unit
1 lower section, here, can realize in the following way, that is, box station unit 1, cleaning unit 2, transfer robot 3 and
Centering unit 4 is mounted on a job platform, wherein box station unit 1 is higher than centering unit 4 in the height direction and cleaning is single
Member 2, or, box station unit 1 and cleaning unit 2 are higher than centering unit 4 in the height direction.In this regard, the disclosure does not make spy
It does not limit.
Optionally, two box station units 1 prolong relative to the center of the centering unit 4 and the transfer robot 3
Line is stretched symmetrically to arrange.As a result, the spacing and centering list between two box station units 1 respectively of transfer robot 3
Spacing of the member 4 respectively between two box station units 1 is equal, consequently facilitating establishment transfer robot 3 is to box station unit 1 and centering
The transmitting path of unit 4 so that the control program of transfer robot 3 is simplified.But it's not limited to that for the disclosure, can basis
Actual installation needs to carry out the specific position for designing transfer robot 3, box station unit 1 and centering unit 4.
Optionally, the cleaning unit 2 is two and is symmetrically arranged at the both sides of the transfer robot 3.Here,
Identical structure may be used in two cleaning units 2, or different structures can also be used with according to different cleaning need
It asks and selectively to use one of two cleaning units 2, or each cleaning unit 2 can be passed sequentially through with carrying out deeper
Cleaning wafer.This disclosure is not construed as limiting, specifically the structure of cleaning unit 2 can be designed according to actual needs and make
Use mode.Here, optionally, two cleaning units 2 use identical structure, wherein two cleaning units 2 and each box
Unit 1 of standing is respectively corresponding to be arranged, it is possible thereby to regard a cleaning unit 2 of a box station unit 1 and corresponding arrangement as one group
And as the spare cleaning equipment to break down or when repair, while can also simplify control transfer robot 3 program.
Optionally, two box station units 1 and two cleaning units 2 are generally aligned in the same plane and are trapezoidal layout,
Two box station units 1 are located at two vertex positions of upper bottom edge, and two cleaning units 2 are located at two tops of bottom
Point position.By the structure of characteristics of compact layout as described above transfer robot 3 is carried out within the scope of predetermined angle as a result,
Rotation and wafer is smoothly transmitted between each units such as box station unit 1 and cleaning unit 2, thus by structure as described above
Semiconductor crystal wafer cleaning equipment be suitable for realize the production of high automation when wafer production process.
Optionally, two box station units 1 and two cleaning units 2 are arranged in isosceles trapezoid.At this point, optional
Ground, the centering unit 4 are located at the center of the upper bottom edge, and the transfer robot 3 is located at the center of the bottom
Position.Thus transfer robot 3 can be rotated in 180 ° of rotation angle ranges and box station unit 1, centralising device 4 with
And the high efficiency of wafer and intelligent transmission are realized between cleaning unit 2, at this point, when two box station units 1 and two cleanings
In the case that unit 2 respectively uses identical structure, with the box station unit 1 and cleaning unit 2 of respective corresponding arrangement for one group of mould
Block, then two groups of modules are symmetrical relative to the line of centres of transfer robot 3 and two box station units 1 so that transmission machine
People 3 is also symmetrical for the transmitting path of two groups of modules, so that more simple for the control of transfer robot 3
Change.
Here, optionally, on the basis of the rotary shaft of the transfer robot 3, the transfer robot 3 respectively with it is described
Spacing between box station unit 1 and the cleaning unit 2 is equal.On the basis of with structure as described above, two box stations are single
Spacing (trapezoidal upper bottom edge), each box station unit 1 between member 1 and the spacing between corresponding cleaning unit 2 are (trapezoidal
Two sides) and spacing of the transfer robot 3 respectively with each cleaning unit 2, each box station unit 1 be equal.Change speech
It, what above-mentioned trapezium structure can be put together by the equilateral triangle on three sides with equal length, as a result, conveyer
The arm of device people 3 has a reference value of preset length in order to wafer transmission control procedure simplerization, for example, specifically,
In the case of needing wafer after cleaning by cleaning unit 2 being back to box station unit 1, transfer robot 3 is in its arm
Box station unit 1 is sent in the state that development length is constant after grasping silicon wafer in cleaning unit 2 to be stored.
Optionally, it is spaced in the vertical direction for one group of cleaning module with box station unit 1 and the cleaning unit 2
Cleaning module described in being disposed with two groups, and cleaning module described in two groups transmits wafer by the transfer robot 3.As a result,
The cleaning efficiency of semiconductor crystal wafer cleaning equipment can be further increased on the basis of saving mounting area.But the disclosure is not
It is defined in this, multigroup cleaning module can be arranged according to actual needs, omit herein and it is illustrated.
Optionally, the transfer robot 3 has the arm that can be rotated, lift and stretch.From there through as described above
Transfer robot 3 neatly transmit wafer between box station unit 1, centering unit 4, cleaning unit 2, and pass through control device
Intelligentized control method is realized to transfer robot 3.
Optionally, the cleaning unit 2 include for position wafer and drive wafer make centrifugal rotation supporting table 5 and
For the injection apparatus 6 to the needle-shaped jet cleaning liquid of wafer.The wafer that cleaning unit 2 is sent to by transfer robot 3 is propping up
It supports in the state of carrying out centrifugal rotation on platform 5, wafer is realized in such a way that injection apparatus 6 is to the needle-shaped jet cleaning liquid of wafer
Washing and cleaning operation, here, suitable cleaning solution, such as pure water, hydrogen can be selected according to the different type of grinding, polishing process etc.
The cleaning solutions such as amine-oxides herein and are not construed as limiting.In addition, injection apparatus 6 can be by adjusting during jet cleaning liquid
Position and can by cleaning solution by gradually be cut into specified width, which width (such as can be width) more than radius outside crystal round fringes after
The mode for cutting off crystal round fringes again is sprayed, and the washing and cleaning operation to wafer is thus completed.But it's not limited to that for the disclosure, institute
Other structures appropriate can be used according to actual needs by stating cleaning unit 2.
By by structure as described above, that is, box station unit 1 and cleaning unit 2 arrange around transfer robot 3, to
So that the integral arrangement of semiconductor crystal wafer cleaning equipment is compact, occupation area of equipment is small, convenient for maintenance and raising conveyer
Wafer transmission efficiency of the device people 3 between box station unit 1 and cleaning unit 2.In addition, being realized by a transfer robot 3
Wafer transmission between each unit, to save equipment cost.
The preferred embodiment of the disclosure is described in detail above in association with attached drawing, still, the disclosure is not limited to above-mentioned reality
The detail in mode is applied, in the range of the technology design of the disclosure, a variety of letters can be carried out to the technical solution of the disclosure
Monotropic type, these simple variants belong to the protection domain of the disclosure.
It is further to note that specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the disclosure to it is various can
The combination of energy no longer separately illustrates.
In addition, arbitrary combination can also be carried out between a variety of different embodiments of the disclosure, as long as it is without prejudice to originally
Disclosed thought equally should be considered as disclosure disclosure of that.
Claims (10)
1. a kind of semiconductor crystal wafer cleaning equipment, which is characterized in that the semiconductor crystal wafer cleaning equipment includes being used for storing wafer
Box station unit (1), for clean the wafer taken out from box station unit (1) cleaning unit (2) and can rotate and
Transfer robot (3) for transmitting wafer between box station unit (1) and the cleaning unit (2), the box station are single
First (1) and the cleaning unit (2) are arranged around the transfer robot (3).
2. semiconductor crystal wafer cleaning equipment according to claim 1, which is characterized in that the semiconductor crystal wafer cleaning equipment
Centering unit (4) including being used for the wafer that centering is taken out from box station unit (1), box station unit (1) are two
And it is located at the top both sides of the centering unit (4).
3. semiconductor crystal wafer cleaning equipment according to claim 2, which is characterized in that two box station unit (1) phases
The center extension line of the centering unit (4) and the transfer robot (3) is symmetrically arranged.
4. semiconductor crystal wafer cleaning equipment according to claim 2, which is characterized in that the cleaning unit (2) is two
And it is symmetrically arranged at the both sides of the transfer robot (3).
5. semiconductor crystal wafer cleaning equipment according to claim 4, which is characterized in that two box station units (1) and
Two cleaning units (2) are generally aligned in the same plane and are trapezoidal layout, and two box station units (1) are located at the two of upper bottom edge
A vertex position, two cleaning units (2) are located at two vertex positions of bottom.
6. semiconductor crystal wafer cleaning equipment according to claim 5, which is characterized in that two box station units (1) and
Two cleaning units (2) are arranged in isosceles trapezoid.
7. semiconductor crystal wafer cleaning equipment according to claim 6, which is characterized in that the centering unit (4) is located at institute
The center of upper bottom edge is stated, the transfer robot (3) is located at the center of the bottom.
8. the semiconductor crystal wafer cleaning equipment according to any one of claim 1-7, which is characterized in that with the conveyer
On the basis of the rotary shaft of device people (3), the transfer robot (3) respectively with box station unit (1) and the cleaning unit (2)
Between spacing it is equal.
9. the semiconductor crystal wafer cleaning equipment according to any one of claim 1-7, which is characterized in that with box station list
First (1) and the cleaning unit (2) are one group of cleaning module, in the vertical direction arranged for interval have two groups described in cleaning module,
And cleaning module described in two groups transmits wafer by the transfer robot (3).
10. semiconductor crystal wafer cleaning equipment according to claim 1, which is characterized in that the cleaning unit (2) includes using
In positioning wafer and wafer is driven to make the supporting table (5) of centrifugal rotation and for being filled to the injection of the needle-shaped jet cleaning liquid of wafer
It sets (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225635.5A CN108695187A (en) | 2017-04-07 | 2017-04-07 | Semiconductor crystal wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710225635.5A CN108695187A (en) | 2017-04-07 | 2017-04-07 | Semiconductor crystal wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108695187A true CN108695187A (en) | 2018-10-23 |
Family
ID=63843034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710225635.5A Withdrawn CN108695187A (en) | 2017-04-07 | 2017-04-07 | Semiconductor crystal wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108695187A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295464A (en) * | 2022-08-08 | 2022-11-04 | 魅杰光电科技(上海)有限公司 | Wafer conveying system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030027295A (en) * | 2001-09-28 | 2003-04-07 | 한국디엔에스 주식회사 | Apparatus for cleaning wafer of semiconductor fabrication equipment |
| CN201226082Y (en) * | 2008-06-27 | 2009-04-22 | 沈阳芯源微电子设备有限公司 | Glue-spreading developing apparatus with star-shaped lattice structure |
| CN101615563A (en) * | 2008-06-25 | 2009-12-30 | 沈阳芯源微电子设备有限公司 | The semiconductor wafer processing equipment of trapezoidal-structure |
| CN106409717A (en) * | 2015-07-27 | 2017-02-15 | 沈阳芯源微电子设备有限公司 | Wafer metal-stripping and photoresist-stripping cleaning device |
-
2017
- 2017-04-07 CN CN201710225635.5A patent/CN108695187A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20030027295A (en) * | 2001-09-28 | 2003-04-07 | 한국디엔에스 주식회사 | Apparatus for cleaning wafer of semiconductor fabrication equipment |
| CN101615563A (en) * | 2008-06-25 | 2009-12-30 | 沈阳芯源微电子设备有限公司 | The semiconductor wafer processing equipment of trapezoidal-structure |
| CN201226082Y (en) * | 2008-06-27 | 2009-04-22 | 沈阳芯源微电子设备有限公司 | Glue-spreading developing apparatus with star-shaped lattice structure |
| CN106409717A (en) * | 2015-07-27 | 2017-02-15 | 沈阳芯源微电子设备有限公司 | Wafer metal-stripping and photoresist-stripping cleaning device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115295464A (en) * | 2022-08-08 | 2022-11-04 | 魅杰光电科技(上海)有限公司 | Wafer conveying system |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20220712 Address after: 330052 south of Fushan Avenue and west of Jinhu, Xiaolan economic and Technological Development Zone, Nanchang County, Nanchang City, Jiangxi Province Applicant after: Huatong Xindian (Nanchang) Electronic Technology Co.,Ltd. Address before: 818-113, 8th floor, new material venture building, No. 7, Fenghui Middle Road, Haidian District, Beijing 100097 Applicant before: BEIJING WOOTION XINDIAN TECHNOLOGY CO.,LTD. |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20181023 |
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| WW01 | Invention patent application withdrawn after publication |