CN101615563A - The semiconductor wafer processing equipment of trapezoidal-structure - Google Patents
The semiconductor wafer processing equipment of trapezoidal-structure Download PDFInfo
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- CN101615563A CN101615563A CN200810012024A CN200810012024A CN101615563A CN 101615563 A CN101615563 A CN 101615563A CN 200810012024 A CN200810012024 A CN 200810012024A CN 200810012024 A CN200810012024 A CN 200810012024A CN 101615563 A CN101615563 A CN 101615563A
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Abstract
The present invention relates to the structure of the wafer processing apparatus of semiconductor production, particularly remove the structure of residue equipment on edge photoresist or the removal wafer with chemical method.Comprise box station module, the first processing of wafers module, the second processing of wafers module, transfer robot module, described box station module comprises first unit, box station and unit, the second box station, described module and component units are trapezium structure, unit, 2 box stations occupies two summits that two summits of trapezoidal upper topside, 2 processing of wafers modules occupy trapezoidal bottom, and 1 robot is at the center of bottom.Like this simple and practical is convenient to maintenance, and the equipment that makes has good maintainability, also makes the wafer quality of stability promote greatly.
Description
Technical field
The present invention relates to the wafer processing apparatus structure of semiconductor production, particularly remove the structure of residue equipment on edge photoresist or the removal wafer with chemical method.
Background technology
Production environment in the semiconductor production factory requires very high, in facility work when operation that guarantees this production environment, is very expensive, is one of big expense expenditure of factory, in order to reduce this expenditure, during purchase of equipment, the machine floor space is an important examination technical indicator.This makes machine develop to high direction, and it is the trend of technical development that technical module piles up placement.
Automatic double surface gluer in the semiconductor manufacturing factory yellow light area is that the centrifugal spin coating mode of application of known realizes basically, from the characteristics of making technology, gluing, chemical method remove the edge photoresist be in the gluing module in sequence.
Development along with technology, production capacity to automatic double surface gluer requires to strengthen, especially the production capacity to the automatic double surface gluer that is coated with thick glue requires progressively to strengthen, just occurred being coated with thick glue and chemical method remove these two of edge photoresists in sequence technology in a technical module, do not finish, but order is carried out in the equipment of two different process.In addition, because the development of semiconductor manufacturing factory making technology technology, wafer surface cleaning degree before each processing procedure is required more and more stricter, various semiconductor cleaning devices produce thereupon, therefore, press for the needs that a kind of energy is fit to production process of semiconductor, the semiconductor wafer processing equipment of the demand of the explained hereafter quality of simultaneous adaptation product, production capacity, maintainability.
Summary of the invention
For solving the problems of the technologies described above, semiconductor wafer processing equipment of the present invention has carried out trapezoidal arranging in topology layout, the needs that chemical method is removed the explained hereafter quality of residue equipment on photoresist or the removal wafer, production capacity, maintainability are satisfied in such arranging.
Technical scheme of the present invention is: a kind of semiconductor wafer processing equipment of trapezoidal-structure, comprise box station module, the first processing of wafers module, the second processing of wafers module, transfer robot module, described box station module comprises first unit, box station and unit, the second box station, described module and component units are trapezium structure, unit, 2 box stations occupies two summits that two summits of trapezoidal upper topside, 2 processing of wafers modules occupy trapezoidal bottom, and 1 transfer robot is at the center of bottom.
Described trapezium structure is the antiparallelogram structure.
Described first unit, box station and unit, second box station angle are 110～130 degree.
Described two processing of wafers modules are independent functional units bodies, can be that chemical method is removed edge photoresist module or removed residue module on the wafer.
Advantage of the present invention and beneficial effect are:
1, technical module of the present invention mainly is that chemical liquid is sprayed the method for removing the Waffer edge photoresist with syringe needle, and processed wafer rotates, and such method is simple and practical, not only satisfies the requirement of explained hereafter, also makes the board production capacity promote greatly.
2, the composition of board is modularized design, is convenient to maintenance, and the equipment that makes has good maintainability.
3, technical process of the present invention is to transmit wafer by robot to flow in each module, has realized the automatic production of sequencing, has not only satisfied the requirement of monolithic production technology, also makes product wafer quality of stability promote greatly.
Description of drawings
Fig. 1 is a structural representation of the present invention;
Fig. 2 is a structural perspective of the present invention.
Wherein, CA is that centering adjustment unit, CS1 are that unit, the first box station, CS2 are that unit, the second box station, ROBOT are that transfer robot, EBR1/SCRUBBER1 are the first processing of wafers module, the EBR2/SCRUBBER2 second processing of wafers module.
Embodiment
Below in conjunction with accompanying drawing the present invention is described in detail.
As shown in the figure, the first box station unit CS1 and the second box station unit CS2 are placed on the flat board with 110～130 degree angles, and centering adjustment unit CA is installed in below this flat board, and the three forms a box station module; Transfer robot ROBOT can be rotated, lifting and telescopic arm; Two processing of wafers modules are independent functional units bodies, can be that chemical method is removed edge photoresist module EBR1, EBR2 or removed residue module SCRUBBER1, SCRUBBER2 on the wafer, two processing of wafers modules be arranged in transfer robot ROBOT both sides.
The technological process of production that chemical method is removed the edge photoresist is: CS1/CS2-CA-EBR1/EBR2-CS1/CS2.
Transfer robot ROBOT is by rotation, lifting and telescopic arm take out wafer from the first box station unit CS1 or the second box station unit CS2, deliver to the centering of carrying out wafer among the centering adjustment unit CA, wafer after the centering is transmitted the ROBOT of robot again and sends into respectively among first chemical method removal edge photoresist module EBR1 and second chemical method removal edge photoresist module EBR2, by the centrifugal rotation of the wafer in the module, after being cut into specified width, which width outward gradually by Waffer edge, the chemical liquid that needle-like is sprayed cuts off Waffer edge again, after finishing functional purpose, by transfer robot ROBOT wafer is sent back among the box station first box station unit CS1 or the second box station unit CS2 more at last.
The technological process of production that chemical mechanical method is removed residue on the wafer is: CS1/CS2-CA-SCRUBBER1/SCRUBBER2-CS1/CS2.
Transfer robot ROBOT is by rotation, lifting and telescopic arm take out wafer from the first box station unit CS1 or the second box station unit CS2, deliver to the centering of carrying out wafer among the centering adjustment unit CA, wafer after the centering is transmitted the ROBOT of robot again and sends into first respectively and remove on the wafer residue module module SCRUBBER1 and second and remove on the wafer among the residue module SCRUBBER2, by the centrifugal rotation of the wafer in the module, after being cut into specified width, which width outward gradually by Waffer edge, the chemical liquid that needle-like is sprayed cuts off Waffer edge again, after finishing functional purpose, by transfer robot ROBOT wafer is sent back among the first box station unit CS1 or the second box station unit CS2 at last.
Claims (4)
1, a kind of semiconductor wafer processing equipment of trapezoidal-structure, comprise box station module, the first processing of wafers module, the second processing of wafers module, transfer robot module, described box station module comprises first unit, box station and unit, the second box station, it is characterized in that: described module and component units are trapezium structure, unit, 2 box stations occupies two summits that two summits of trapezoidal upper topside, 2 processing of wafers modules occupy trapezoidal bottom, and 1 transfer robot is at the center of bottom.
2, by the described structure of claim 1, it is characterized in that: described trapezium structure is the antiparallelogram structure.
3. by the described structure of claim 1, it is characterized in that: described first unit, box station and unit, second box station angle are 110～130 degree.
4. by the described structure of claim 1, it is characterized in that: described two processing of wafers modules are independent functional units bodies, can be that chemical method is removed edge photoresist module or removed residue module on the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810012024A CN101615563A (en) | 2008-06-25 | 2008-06-25 | The semiconductor wafer processing equipment of trapezoidal-structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200810012024A CN101615563A (en) | 2008-06-25 | 2008-06-25 | The semiconductor wafer processing equipment of trapezoidal-structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101615563A true CN101615563A (en) | 2009-12-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200810012024A Pending CN101615563A (en) | 2008-06-25 | 2008-06-25 | The semiconductor wafer processing equipment of trapezoidal-structure |
Country Status (1)
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| CN (1) | CN101615563A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219267A (en) * | 2013-04-10 | 2013-07-24 | 南京农业大学 | Automatic conveying system for wafer testing |
| CN108695187A (en) * | 2017-04-07 | 2018-10-23 | 北京华通芯电科技有限公司 | Semiconductor crystal wafer cleaning equipment |
| CN111262145A (en) * | 2020-03-20 | 2020-06-09 | 刘元丽 | Easy-maintenance distribution box based on Internet of things |
-
2008
- 2008-06-25 CN CN200810012024A patent/CN101615563A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103219267A (en) * | 2013-04-10 | 2013-07-24 | 南京农业大学 | Automatic conveying system for wafer testing |
| CN108695187A (en) * | 2017-04-07 | 2018-10-23 | 北京华通芯电科技有限公司 | Semiconductor crystal wafer cleaning equipment |
| CN111262145A (en) * | 2020-03-20 | 2020-06-09 | 刘元丽 | Easy-maintenance distribution box based on Internet of things |
| CN111262145B (en) * | 2020-03-20 | 2021-07-02 | 江西丰源电气有限公司 | Easy-maintenance distribution box based on Internet of things |
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Open date: 20091230 |