CN201226082Y - Glue-spreading developing apparatus with star-shaped lattice structure - Google Patents

Glue-spreading developing apparatus with star-shaped lattice structure Download PDF

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Publication number
CN201226082Y
CN201226082Y CNU2008200137057U CN200820013705U CN201226082Y CN 201226082 Y CN201226082 Y CN 201226082Y CN U2008200137057 U CNU2008200137057 U CN U2008200137057U CN 200820013705 U CN200820013705 U CN 200820013705U CN 201226082 Y CN201226082 Y CN 201226082Y
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CN
China
Prior art keywords
module
box station
gluing
unit
heat treatment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNU2008200137057U
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Chinese (zh)
Inventor
胡延兵
王阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenyang Xinyuan Microelectronics Equipment Co Ltd
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Shenyang Xinyuan Microelectronics Equipment Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenyang Xinyuan Microelectronics Equipment Co Ltd filed Critical Shenyang Xinyuan Microelectronics Equipment Co Ltd
Priority to CNU2008200137057U priority Critical patent/CN201226082Y/en
Application granted granted Critical
Publication of CN201226082Y publication Critical patent/CN201226082Y/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

The utility model relates to a structure of a gluing image development technique processing device which is used to obtain a uniform photoresist and a photoresist graph on a semiconductor wafer. The device consists of the six functional modules which include a box station module, a first gluing or image development module, a second gluing or image development module, a first thermal processing module, a second thermal processing module and a transmission robot; the box station module consists of two box station units and a centralizing adjusting unit; the first thermal processing module or the second thermal processing module consists of a thermal processing tower frame and a plurality of thermal processing units inserted into the tower frame; the six functional modules form the star type lattice structure of a hexagon; the two box station units, the two thermal processing modules and the two gluing or image development modules respectively occupy the six top points of the hexagon; one transmission robot is arranged in the center of the hexagon. The structure of a gluing image development technique processing device can meet the demands of the markets for the middle and small production lines in China on the technical production quality, yield, technical expansibility, and maintainability.

Description

The glue-spreading development equipment of star-like lattice structure
Technical field
The utility model relates to semiconductor equipment, particularly in order to obtain the structure of the gluing developing process treatment facility of uniform photoresist and photoresist figure on semiconductor wafer.
Background technology
Along with the development of technology, the structure of the glue-spreading development equipment in the semiconductor manufacturing factory yellow light area is to modularization, high integration, and the vertical height direction develops.For being fit to explained hereafter quality, production capacity, technique extension and the maintainable demand of middle-size and small-size production line market, China's Mainland to this product, press for a kind of each functional module and cell cube of can guaranteeing and finish the realization of explained hereafter separately, can fast wafer be transmitted between each module and cell cube again, guarantee effective linking of each technological process, satisfy the requirement of high production capacity, and this occupation area of equipment is little, can save the glue-spreading development equipment of the basic input of semiconductor production.
The utility model content
For solving the problems of the technologies described above, glue-spreading development equipment of the present utility model is structurally adjusted, mainly be each module, cell cube, transfer robot to be arranged by ad hoc fashion place, satisfy in the gluing development production explained hereafter quality, production capacity, technique extension and maintainable needs.
The technical solution of the utility model is: a kind of structure of glue-spreading development equipment, be made up of box station module, first gluing or visualization module, second gluing or visualization module, first heat treatment module, second heat treatment module, 6 functional modules of transfer robot module, described box station module is made up of 2 unit, box station and 1 centering adjustment unit; Described first heat treatment module or second heat treatment module are made up of heat treatment tower frame and a plurality of thermal treatment unit body that is inserted in the pylon; Unit, described 2 box stations, 2 heat treatment module, 2 gluings or visualization module occupy hexagonal six summits respectively, and 1 transfer robot is at the center, and such hexagonal module layout has been formed the glue-spreading development equipment structure that star-like dot matrix is arranged.
Described gluing or visualization module be on opposite, unit, box station, side by side about each one, symmetric design can all be the gluing module, can all be visualization module also.
Described heat treatment module is made up of heat treatment tower frame and a plurality of thermal treatment unit body that is inserted in the pylon, is arranged on the transfer robot both sides.
Cell cube can be pulled out outside the machine in the described thermal treatment.
Described first unit, box station and unit, the second box station are placed on the flat board with 110~130 degree angles, and the centering adjustment unit is installed in below this flat board, and the three forms a box station module.
Advantage of the present utility model and beneficial effect are:
1, technical module of the present utility model and thermal treatment unit body are standardized modular design products, be convenient to load and dismounting, the technical module of difference in functionality and thermal treatment unit body matched combined just can be finished different production technologies like this, and the technique extension sex expression of board is outstanding.
2, the thermal treatment unit body can be pulled out outside the machine easily, is convenient to maintenance, and also return rapidly after the maintenance has significantly reduced servicing time of machine, and the equipment that makes has good maintainability.
3, use structural device of the present utility model, each technical module piles up placement, makes the machine floor area reduce greatly, only is 1.7 square metres, has reduced the cost of investment of equipment effectively.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is the utility model structural perspective.
Wherein, TP is that centering adjustment unit, CS1 are that unit, the first box station, CS2 are that unit, the second box station, R are that transfer robot, COT are that gluing module, AD are that tackify thermal treatment unit body, HP are that heat-transfer sheet modules body, CP are the cold drawing cell cube.
Embodiment
Below in conjunction with accompanying drawing the utility model is described in detail.
As shown in Figure 1, the first box station unit CS1 and the second box station unit CS2 are placed on the flat board with the angle of 110~130 degree, and centering adjustment unit TP is installed in below this flat board, and the three forms a box station module; Gluing module COT1 and gluing module COT2 are the independent functional units bodies; Tackify thermal treatment unit body AD1, heat-transfer sheet modules body HP1, cold drawing cell cube CP1 are inserted into a heat treatment tower frame and form first heat treatment module; Tackify thermal treatment unit body AD2, heat-transfer sheet modules body HP2, cold drawing cell cube CP2 are inserted into another heat treatment tower frame and form second heat treatment module; Transfer robot R be can be rotated, the transfer robot module of the transmission wafer of lifting and telescopic arm.
Transfer robot R is positioned over each module centers, and each module is arranged around it.The first box station unit CS1 and the second box station unit CS2 are placed on the flat board with 110~130 degree angles, first heat treatment module and second heat treatment module are placed on transfer robot R both sides, the first gluing module COT1 and the second gluing module COT2 module are placed on the first box station unit CS1 and CS2 opposite, unit, the second box station side by side, and such hexagonal module layout has been formed the glue-spreading development equipment structure that star-like dot matrix is arranged.
For satisfying the different procedure for producing process requirements of semiconductor production factory, module in the glue-spreading development equipment and configuration of cells also will adapt to different variations, glue-spreading development equipment of the present utility model can be two gluing module COT, also can be double-developing DEV, this variation can be to make the configuration of thermal treatment unit bodies such as AD, HP in the heat treatment module, CP change, but general structure can not change, and each module all is to arrange according to star-like dot matrix way.
For ease of return rapidly after maintenance and the maintenance, the thermal treatment unit body in the heat treatment module can be pulled out outside the machine, has significantly reduced the servicing time of machine, and the equipment that makes has good maintainability.
Principle of work of the present utility model is: transfer robot takes out wafer from the film magazine station, according to the program that weaves wafer is sent in each gluing/visualization module and the thermal treatment unit body, after finishing the procedure for producing of gluing development, wafer is sent back in the box station.

Claims (5)

1, a kind of glue-spreading development equipment of star-like lattice structure, it is characterized in that: be made up of box station module, first gluing or visualization module, second gluing or visualization module, first heat treatment module, second heat treatment module, 6 functional modules of transfer robot module, described box station module is made up of unit, the first box station, second unit, box station and 1 centering adjustment unit; Described first heat treatment module or second heat treatment module are made up of heat treatment tower frame and a plurality of thermal treatment unit body that is inserted in the pylon; Unit, described 2 box stations, 2 heat treatment module, 2 gluings or visualization module occupy hexagonal six summits respectively, and 1 transfer robot is at the center, and such hexagonal module layout has been formed the glue-spreading development equipment structure that star-like dot matrix is arranged.
2, press the glue-spreading development equipment of the described a kind of star-like lattice structure of claim 1, it is characterized in that: described 2 gluings or visualization module be on opposite, unit, box station, side by side about each one, symmetric design, can all be the gluing module, can all be visualization module also.
3, press the glue-spreading development equipment of the described a kind of star-like lattice structure of claim 1, it is characterized in that: described first or second heat treatment module is made up of heat treatment tower frame and a plurality of thermal treatment unit body that is inserted in the pylon, is arranged on the transfer robot both sides.
4. by the glue-spreading development equipment of the described a kind of star-like lattice structure of claim 1, it is characterized in that: cell cube can be pulled out outside the machine in described first or second thermal treatment.
5. press the glue-spreading development equipment of the described a kind of star-like lattice structure of claim 1, it is characterized in that: described first unit, box station and unit, the second box station are placed on the flat board with 110~130 degree angles, the centering adjustment unit is installed in below this flat board, and the three forms a box station module.
CNU2008200137057U 2008-06-27 2008-06-27 Glue-spreading developing apparatus with star-shaped lattice structure Expired - Lifetime CN201226082Y (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNU2008200137057U CN201226082Y (en) 2008-06-27 2008-06-27 Glue-spreading developing apparatus with star-shaped lattice structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNU2008200137057U CN201226082Y (en) 2008-06-27 2008-06-27 Glue-spreading developing apparatus with star-shaped lattice structure

Publications (1)

Publication Number Publication Date
CN201226082Y true CN201226082Y (en) 2009-04-22

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CNU2008200137057U Expired - Lifetime CN201226082Y (en) 2008-06-27 2008-06-27 Glue-spreading developing apparatus with star-shaped lattice structure

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102114455A (en) * 2010-12-23 2011-07-06 沈阳芯源微电子设备有限公司 Planar module type equipment structure
CN108695187A (en) * 2017-04-07 2018-10-23 北京华通芯电科技有限公司 Semiconductor crystal wafer cleaning equipment

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102114455A (en) * 2010-12-23 2011-07-06 沈阳芯源微电子设备有限公司 Planar module type equipment structure
CN108695187A (en) * 2017-04-07 2018-10-23 北京华通芯电科技有限公司 Semiconductor crystal wafer cleaning equipment

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CX01 Expiry of patent term

Granted publication date: 20090422

CX01 Expiry of patent term