CN104347466A - Wafer bearing apparatus - Google Patents
Wafer bearing apparatus Download PDFInfo
- Publication number
- CN104347466A CN104347466A CN201310330151.9A CN201310330151A CN104347466A CN 104347466 A CN104347466 A CN 104347466A CN 201310330151 A CN201310330151 A CN 201310330151A CN 104347466 A CN104347466 A CN 104347466A
- Authority
- CN
- China
- Prior art keywords
- wafer
- carrying platform
- bearing device
- wafer bearing
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Abstract
The invention discloses a wafer bearing apparatus comprising a wafer bearing table, bearing table pillars for supporting the wafer bearing table, buffer devices disposed in the bearing table pillars, and a pre-cleaning device. The pre-cleaning device comprises protective covers capable of vertically ascending and descending, a nozzle capable of vertically ascending and descending, and a collection tank. According to the wafer bearing apparatus, the pre-cleaning device is used for pre-cleaning wafers before the wafers are unloaded to the wafer bearing apparatus in order to remove chemical liquid left on the surfaces of the wafers. Therefore, the left chemical liquid is prevented from corroding processed wafers and polluting a mechanical arm when the mechanical arm subsequently catches the wafers. As a result, the processing quality of the wafers is improved and the service life of the mechanical arm is prolonged.
Description
Technical field
The present invention relates to integrated circuit (IC)-components manufacturing installation, particularly relate to a kind of wafer bearing device.
Background technology
In integrated circuit (IC)-components manufacturing installation, wafer bearing device for keeping wafer, to carry out PROCESS FOR TREATMENT to wafer or only for putting wafer temporarily.Common wafer bearing device comprises the plummer pillar of wafer carrying platform and supporting wafer plummer.For electrochemical polish, in electrochemical polish chamber, be provided with wafer bearing device.When carrying out electrochemical polishing process, polished wafer is placed on the wafer carrying platform of wafer bearing device by manipulator, and then, wafer is also moved to electrochemical polish apparatus and sentences and carry out electrochemical polishing process by the wafer on vacuum chuck wafer carrying platform.After electrochemical polishing process terminates, vacuum chuck is by wafer unload on wafer carrying platform, and then manipulator takes wafer away from wafer carrying platform.
The drawback that this common wafer bearing device in use exists is as follows:
After wafer electrochemical polishing process terminates, dry through High Rotation Speed although wafer has, but crystal column surface still can remain some polishing fluids, if not residual to these polishing fluid processes, residual polishing fluid easily transfers to the space of polluting manipulator and manipulator place wash chamber process at wafer from electrochemical polish chamber.And current wafer bearing device does not possess the function of process crystal column surface remaining slurry.
Summary of the invention
The object of this invention is to provide a kind of wafer bearing device, this wafer bearing device can carry out prerinse to wafer, to remove the residual chemical liquids of crystal column surface.
For achieving the above object, the wafer bearing device that the present invention proposes, comprising: the plummer pillar of wafer carrying platform, supporting wafer plummer, be arranged on buffer unit in plummer pillar and precleaning unit.Precleaning unit comprises: can the protective cover of vertical lifting, the shower nozzle of energy vertical lifting and feeder.Protective cover be arranged on wafer carrying platform periphery and around wafer carrying platform.Shower nozzle is arranged on the central shaft of wafer carrying platform.The sidewall that feeder has diapire and upwards extends to form from diapire, the diapire of feeder and sidewall surround a space to place wafer carrying platform, plummer pillar, buffer unit, protective cover and shower nozzle.
In one embodiment, feeder offers leakage fluid dram.
In one embodiment, buffer unit is spring.
In sum, wafer bearing device of the present invention is by arranging precleaning unit, before wafer unload to wafer carrying platform, prerinse is carried out to wafer, remove the chemical liquids that crystal column surface is residual, avoid the chemical liquids remained to produce corrosion to the wafer machined, and when subsequent mechanical hand gets wafer, chemical liquids pollutes manipulator, thus improves the useful life of wafer crudy and prolonged mechanical hand.
Accompanying drawing explanation
Fig. 1 discloses the cross-sectional view of wafer bearing device according to an embodiment of the invention.
Fig. 2 discloses the vertical view of wafer bearing device according to an embodiment of the invention.
Fig. 3 discloses the cross-sectional view of wafer bearing device prerinse wafer according to an embodiment of the invention.
Fig. 4 discloses wafer bearing device according to an embodiment of the invention and keeps the cross-sectional view of wafer.
Embodiment
By describing technology contents of the present invention, structural feature in detail, reached object and effect, coordinate graphic being described in detail below in conjunction with embodiment.
Consult Fig. 1 and Fig. 2, disclose cross-sectional view and the vertical view of wafer bearing device according to an embodiment of the invention.This wafer bearing device 100 comprises wafer carrying platform 110 and the several plummer pillars 120 for supporting wafer plummer 110, and in the present embodiment, although the quantity of plummer pillar 120 is 3, the quantity of plummer pillar 120 is not limited in 3.Be provided with buffer unit 130 in each plummer pillar 120, particularly, this buffer unit 130 is spring.The object that buffer unit 130 is set in brace table pillar 120 be when wafer carrying platform 110 bear comparatively heavy duty time, buffer unit 130 can play cushioning effect, avoids causing wafer carrying platform 110 because of overload and placing the wafer damage on wafer carrying platform 110.
Wafer bearing device 100 also comprises precleaning unit, and this precleaning unit comprises feeder 140, protective cover 150 and shower nozzle 160.The sidewall 141 that feeder 140 has diapire 142 and upwards extends to form from diapire 142.Wafer carrying platform 110, the brace table pillar 120 being provided with buffer unit 130, protective cover 150 and shower nozzle 160 are arranged in the space that the diapire 142 of feeder 140 and sidewall 141 surround.The diapire 142 of feeder 140 offers leakage fluid dram (not shown).Protective cover 150 and shower nozzle 160 all can vertical liftings.Protective cover 150 be arranged on wafer carrying platform 110 periphery and around wafer carrying platform 110.Shower nozzle 160 is arranged on the central shaft of wafer carrying platform 110.
Consult Fig. 3 and Fig. 4, be described in detail for the use of electrochemical polish to wafer bearing device 100 below.Electrochemical polish is by being placed in by wafer 300 on wafer chuck plate 200 that is rotatable, that vertically can move and can move horizontally, this wafer chuck plate 200 is generally vacuum chuck, then, the anode of one polishing power supply is conducted with wafer 300 and the negative electrode of this polishing power supply is electrically connected with the nozzle for polished the jet polishing liquid to wafer 300, under the power supply of polishing power supply, make polishing fluid by nozzle ejection to polished of wafer 300, to make the metal generation electrochemical reaction on polished of polishing fluid and wafer 300.After electrochemical polishing process terminates, wafer chuck plate 200 carries wafer 300 and moves to directly over wafer carrying platform 110, and wafer chuck plate 200 drops to the prerinse height of setting.Then, protective cover 150 and shower nozzle 160 are respectively to upper rise, and protective cover 150 surrounds wafer chuck plate 200 and wafer carrying platform 110, and shower nozzle 160 is above the top surface of wafer carrying platform 110.Then, wafer chuck plate 200 low speed rotation, the rotating speed of wafer chuck plate 200 can be 50 revs/min or higher, and shower nozzle 160 is to the surperficial jet cleaning liquid of wafer 300 or deionized water, and object removes the polishing fluid of wafer 300 remained on surface after electrochemical polish.After wafer 300 cleans certain hour, shower nozzle 160 stops to the surperficial jet cleaning liquid of wafer 300 or deionized water, then shower nozzle 160 drops to the below of wafer carrying platform 110, simultaneously, wafer chuck plate 200 High Rotation Speed is to dry wafer 300, and the rotating speed of wafer chuck plate 200 can be 500 revs/min or higher.Due to blocking of protective cover 150, when cleaning or dry wafer 300, cleaning fluid or deionized water can not other devices in ejecta pollution electrochemical polish chamber, and cleaning fluid or deionized water are flow to feeder 140 along the madial wall of protective cover 150 and discharged by the leakage fluid dram of feeder 140.After wafer 300 dries, wafer chuck plate 200 stops the rotation, and protective cover 150 drops to the position lower than wafer carrying platform 110.Finally, wafer 300 is offloaded on wafer carrying platform 110 by wafer chuck plate 200, as shown in Figure 4.Manipulator takes wafer 300 away to carry out subsequent technique process from wafer carrying platform 110.Because wafer 300 carries out prerinse process, therefore, can not pollute by polished liquid when wafer 300 got by manipulator, thus extend the useful life of manipulator.
Wafer bearing device of the present invention is not only applicable to electrochemical polish chamber, is applicable to such as plating chamber, cmp chamber etc. yet.
Wafer bearing device of the present invention is by arranging precleaning unit, before wafer unload to wafer carrying platform, prerinse is carried out to wafer, remove the chemical liquids that crystal column surface is residual, the chemical liquids remained is avoided to produce corrosion to the wafer machined, and subsequent mechanical hand is when getting wafer, chemical liquids pollutes manipulator, thus improves the useful life of wafer crudy and prolonged mechanical hand.
In sum, the present invention is illustrated by above-mentioned execution mode and correlative type, and what oneself was concrete, full and accurate discloses correlation technique, and those skilled in the art can be implemented according to this.And the above embodiment be only used to illustrate the present invention, instead of be used for restriction of the present invention, interest field of the present invention, should be defined by claim of the present invention.Still all interest field of the present invention should be belonged to as the change of described component number herein or the replacement etc. of equivalence element.
Claims (3)
1. a wafer bearing device, is characterized in that, comprising: the plummer pillar of wafer carrying platform, supporting wafer plummer, be arranged on buffer unit in plummer pillar and precleaning unit, and wherein said precleaning unit comprises:
Can the protective cover of vertical lifting, described protective cover be arranged on wafer carrying platform periphery and around wafer carrying platform;
The shower nozzle of energy vertical lifting, described shower nozzle is arranged on the central shaft of wafer carrying platform; And
Feeder, the sidewall that described feeder has diapire and upwards extends to form from diapire, the diapire of feeder and sidewall surround a space to place wafer carrying platform, plummer pillar, buffer unit, protective cover and shower nozzle.
2. wafer bearing device according to claim 1, is characterized in that, described feeder offers leakage fluid dram.
3. wafer bearing device according to claim 1, is characterized in that, described buffer unit is spring.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330151.9A CN104347466A (en) | 2013-07-31 | 2013-07-31 | Wafer bearing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310330151.9A CN104347466A (en) | 2013-07-31 | 2013-07-31 | Wafer bearing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104347466A true CN104347466A (en) | 2015-02-11 |
Family
ID=52502803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310330151.9A Pending CN104347466A (en) | 2013-07-31 | 2013-07-31 | Wafer bearing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104347466A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107910250A (en) * | 2017-11-16 | 2018-04-13 | 德淮半导体有限公司 | Wafer processing apparatus and method |
| CN109494180A (en) * | 2017-09-13 | 2019-03-19 | 上海新昇半导体科技有限公司 | A kind of wafer bearing device |
| CN111326448A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Semiconductor cleaning device |
| CN111890218A (en) * | 2020-07-04 | 2020-11-06 | 刘永 | Chemical mechanical polishing splash guard capable of rotating and lifting |
| CN112682465A (en) * | 2019-10-17 | 2021-04-20 | 夏泰鑫半导体(青岛)有限公司 | Carrier device and loading member of semiconductor manufacturing apparatus |
| CN114523420A (en) * | 2022-04-21 | 2022-05-24 | 成都大学 | Automatic change water jet cutting machine for car panel beating |
| CN115132623A (en) * | 2022-06-20 | 2022-09-30 | 北京烁科精微电子装备有限公司 | Wafer grinding and polishing device and transmission method |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1388568A (en) * | 2001-05-30 | 2003-01-01 | S.E.S.株式会社 | Vane type substrate cleaning method and its apparatus |
| CN1894779A (en) * | 2004-11-10 | 2007-01-10 | 三益半导体工业株式会社 | Plate-sheet-type chip processing device |
| CN101551602A (en) * | 2008-04-03 | 2009-10-07 | 东京毅力科创株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| CN101740450A (en) * | 2008-11-26 | 2010-06-16 | 细美事有限公司 | Substrate supporting unit, and apparatus and method for polishing substrate using the same |
-
2013
- 2013-07-31 CN CN201310330151.9A patent/CN104347466A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1388568A (en) * | 2001-05-30 | 2003-01-01 | S.E.S.株式会社 | Vane type substrate cleaning method and its apparatus |
| CN1894779A (en) * | 2004-11-10 | 2007-01-10 | 三益半导体工业株式会社 | Plate-sheet-type chip processing device |
| CN101551602A (en) * | 2008-04-03 | 2009-10-07 | 东京毅力科创株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| US20090250079A1 (en) * | 2008-04-03 | 2009-10-08 | Tokyo Electron Limited | Substrate cleaning method and substrate cleaning apparatus |
| CN102654735A (en) * | 2008-04-03 | 2012-09-05 | 东京毅力科创株式会社 | Substrate cleaning method and substrate cleaning apparatus |
| CN101740450A (en) * | 2008-11-26 | 2010-06-16 | 细美事有限公司 | Substrate supporting unit, and apparatus and method for polishing substrate using the same |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109494180A (en) * | 2017-09-13 | 2019-03-19 | 上海新昇半导体科技有限公司 | A kind of wafer bearing device |
| CN107910250A (en) * | 2017-11-16 | 2018-04-13 | 德淮半导体有限公司 | Wafer processing apparatus and method |
| CN111326448A (en) * | 2018-12-13 | 2020-06-23 | 夏泰鑫半导体(青岛)有限公司 | Semiconductor cleaning device |
| CN112682465A (en) * | 2019-10-17 | 2021-04-20 | 夏泰鑫半导体(青岛)有限公司 | Carrier device and loading member of semiconductor manufacturing apparatus |
| CN111890218A (en) * | 2020-07-04 | 2020-11-06 | 刘永 | Chemical mechanical polishing splash guard capable of rotating and lifting |
| CN111890218B (en) * | 2020-07-04 | 2021-09-03 | 林燕 | Chemical mechanical polishing splash guard capable of rotating and lifting |
| CN114523420A (en) * | 2022-04-21 | 2022-05-24 | 成都大学 | Automatic change water jet cutting machine for car panel beating |
| CN115132623A (en) * | 2022-06-20 | 2022-09-30 | 北京烁科精微电子装备有限公司 | Wafer grinding and polishing device and transmission method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104347466A (en) | Wafer bearing apparatus | |
| US20220379356A1 (en) | Cleaning device for cleaning electroplating substrate holder | |
| KR20130097053A (en) | Substrate cleaning method | |
| CN101062503A (en) | Wafer cleaning method after chemical milling | |
| KR20080067286A (en) | Substrate processing apparatus and substrate processing method | |
| CN104637836B (en) | Wafer processing apparatus | |
| CN109277940B (en) | Chemical mechanical polishing device and chemical mechanical polishing method | |
| US9478444B2 (en) | Mechanisms for cleaning wafer and scrubber | |
| CN102485358A (en) | Wafer cleaning device and method | |
| CN105185734A (en) | Wafer wet etching cleaning device | |
| TW201639061A (en) | Semiconductor apparatus and washing method | |
| JP2018026461A (en) | Substrate cleaning technique after chemical mechanical polishing | |
| CN202053164U (en) | Cleaning device for polishing pad and polishing device | |
| CN102806525A (en) | Polishing device and method for removing polishing by-products | |
| CN201841472U (en) | Grinding fluid arm and chemical mechanical grinding equipment | |
| CN103909474A (en) | System and Method for CMP Station Cleanliness | |
| CN209981183U (en) | Wafer boat cleaning device | |
| CN202058706U (en) | Wafer spray rinsing drying device | |
| CN202003963U (en) | Wafer cleaning device | |
| CN201894999U (en) | Cleaning device | |
| CN204497200U (en) | The clean board of ic substrate | |
| CN103223637A (en) | Chemical machinery polishing device | |
| CN104625941A (en) | Wafer processing device | |
| CN214817691U (en) | Polishing carrier disc cleaning and storing device | |
| CN209969058U (en) | Probe card cleaning device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150211 |