CN108693485A - A kind of automobile instrument panel circuit board testing device - Google Patents
A kind of automobile instrument panel circuit board testing device Download PDFInfo
- Publication number
- CN108693485A CN108693485A CN201810362637.3A CN201810362637A CN108693485A CN 108693485 A CN108693485 A CN 108693485A CN 201810362637 A CN201810362637 A CN 201810362637A CN 108693485 A CN108693485 A CN 108693485A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- substrate
- plate
- loading plate
- pressing plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/44—Testing lamps
Abstract
The invention discloses one kind capable of being effectively protected test probe and automobile instrument panel circuit board, and the device that can be effectively reduced ambient interference, quickly accurately be tested LED lamp bead on circuit board.It includes substrate, circuit board hold-down mechanism and mechanism for testing circuit boards, and the circuit board hold-down mechanism includes the pressing plate for pushing down circuit board and the gravity pressure compact form mechanism for overturning pressing plate;Mechanism for testing circuit boards includes the loading plate being located on substrate and several test cells, pressing plate, loading plate and substrate are from top to bottom sequentially arranged, the upper surface of loading plate is equipped with several receiving holes for accommodating LED lamp bead on circuit board, the bottom surface of receiving hole is downwardly extending the loophole through loading plate lower surface, test cell includes optical fiber and is arranged test probe in optical fiber one end, it tests probe to correspond with loophole, test probe is stretched by the lower end of loophole in loophole.
Description
Technical field
The present invention relates to field of test instrument more particularly to a kind of automobile instrument panel circuit board testing devices.
Background technology
Automobile instrument panel circuit board is required for testing the LED lamp bead on circuit board, confirms that it can before manufacture
Normal work.After usually circuit board is powered in factory, then operating personnel see the luminous situation of LED lamp bead one by one
It surveys.This traditional test mode more relies on manpower, measuring accuracy not high and less efficient.
206945901 U of Chinese patent Authorization Notice No. CN, authorized announcement date 2018.01.30, a kind of entitled " LED
Lamp bead photoelectricity test mechanism " discloses a kind of test device that test probe can automatically reset, improves measuring accuracy.But
The test probe of this contact is easily during the test because the displacement of circuit board damages, and there is also certain damages for circuit board
Risk needs to improve;Simultaneously in open environment, it is easy to be interfered by ambient, measuring accuracy is not high.
Invention content
Purpose of the invention is to overcome the shortcomings in the prior art, and test probe can be effectively protected by providing one kind
With automobile instrument panel circuit board, and can effectively reduce ambient interference, quickly LED lamp bead on circuit board is accurately surveyed
The device of examination.
To achieve the goals above, the present invention uses following technical scheme:
A kind of automobile instrument panel circuit board testing device, including
Substrate, circuit board hold-down mechanism and mechanism for testing circuit boards, the circuit board hold-down mechanism includes for pushing down circuit board
Pressing plate and gravity pressure compact form mechanism for overturning pressing plate;
The mechanism for testing circuit boards includes the loading plate being located on substrate and several test cells, pressing plate, loading plate and substrate
It is from top to bottom sequentially arranged, the upper surface of loading plate is equipped with several receiving holes for accommodating LED lamp bead on circuit board, receiving hole
Bottom surface be downwardly extending the loophole through loading plate lower surface, test cell includes optical fiber and is arranged in optical fiber one end
Probe is tested, test probe is corresponded with loophole, and test probe is stretched by the lower end of loophole in loophole.Gravity-pressing
Formula mechanism is for circuit board to be firmly pressed between pressing plate and loading plate, and circuit board is in the shape being compacted during the test
State, position will not change, and effective protection tests probe and circuit board.Circuit board equipped with LED lamp bead one facing towards loading plate,
LED lamp bead is located in receiving hole, and the light sent out is received through the directly tested probe of loophole and transferred out through optical fiber, is effectively subtracted
Few ambient interference.
Preferably, gravity pressure compact form mechanism includes plate bracket, flip-arm and the vertical peace being fixed on substrate
The upper end of loading board, pressing plate is fixed on plate bracket, and mounting plate is equipped with the first guide groove, and one end of the first guide groove is to downward
It stretches to form the first vertical slot, mounting plate is equipped with the second vertical slot, and the second vertical slot is located at the lower section of the first guide groove, pressing plate branch
Frame is rotatably arranged on by first rotating shaft and the second shaft on mounting plate, and first rotating shaft passes through the first guide groove, the second shaft to wear
The second vertical slot is crossed, flip-arm is equipped with the second guide groove, and flip-arm is rotatably arranged on peace by first rotating shaft and third shaft
In loading board, first rotating shaft passes through the second guide groove.When flip-arm band dynamic pressure plate go to circuit plate, first rotating shaft is in the first guide groove
And second slide in guide groove, when first rotating shaft moves to the upper end of the first vertical slot, it is vertical that the second shaft also is located at second
The upper end of slot, due to pressing plate and the gravity of plate bracket, pressing plate will continue to move down compression circuit board, the first vertical slot and
Two vertical slots ensure that the pressure direction of pressing plate is vertical, will not damage test probe or circuit board by pressure.Gravity pressure compact form mechanism is existing to be turned over
Transfer to use, when opening facilitates the placement of circuit board and takes, while pressing plate has lift action that can compress circuit board again.
Preferably, first guide groove is arc-shaped, the second vertical slot is by rectangular channel and is located at rectangular channel both ends
Half slot is constituted, and the first guide groove and half slot positioned at rectangular channel upper end are coaxially arranged.When first rotating shaft is in the first guide groove
When middle sliding, the second shaft is against in the half slot of rectangular channel upper end, is conducive to ensure that press plate rotary is steady.
Preferably, when first rotating shaft slides into the upper end of the first vertical slot from the first guide groove, pressing plate is in level
State.Ensure to remain horizontal during pressing plate moves down under the gravity of pressing plate and plate bracket, equably compress
Circuit board.
Preferably, being equipped with several buffer structures between the loading plate and substrate, buffer structure includes being located on substrate
Guide post, the spring that is located at the limited block of guide post one end and is set on guide post, in a buffer structure:Loading plate sliding is set
It sets on guide post, limited block is located at the top of loading plate, and spring is between loading plate and substrate.In circuit board compaction process
It works as a buffer, while circuit board reaches self-balancing under the supporting role of pressing plate and the gravity and loading plate of plate bracket
State, further protection test probe and circuit board.
Preferably, the lower surface of the pressing plate is equipped with elastic thimble, elastic thimble is vertical with pressing plate.Elastic thimble prevents
Pressing plate damages the component on circuit board by pressure.
Preferably, the loading plate is equipped with several circuit board locating pins, circuit board locating pin, which is located on loading plate, to be leaned on
The side of nearly pressing plate.Circuit board locating pin is used for position of the Primary Location circuit board on loading plate, ensures LED lamp bead and accommodates
The position in hole corresponds.
Preferably, the lower section of the substrate is equipped with optical fiber containing box, test probe is fixed on substrate, and optical fiber is located at light
In fine containing box.Optical fiber is placed in optical fiber containing box, avoids optical fiber and external contact, and exterior light is reduced while shielding
The interference of line.
Preferably, the upper end opening of the optical fiber containing box, substrate is covered in the upper end of optical fiber containing box, the one of substrate
End is hinged with optical fiber containing box.Substrate opposed optical fibers containing box can be opened, more convenient when test cell overhauls.
Preferably, the upper surface of the substrate and loading plate is covered with black light shield layer.Black light shield layer, which is reduced, to be entered
The extraneous light of receiving hole and loophole improves the accuracy of test probe.
The beneficial effects of the invention are as follows:(1)First vertical slot and the second vertical slot ensure that pressing plate vertically compresses electricity
Road plate, while loading plate is equipped with buffer structure, support of the circuit board in pressing plate and the gravity and loading plate of plate bracket
Reach the state of self-balancing under effect, effective protection tests probe and circuit board;(2)The light that LED lamp bead is sent out is directly tested
Probe collection is simultaneously transferred out by optical fiber, small by extraneous interference, and can disposably obtain the test of all LED lamp beads
As a result, measuring accuracy and testing efficiency are substantially improved.
Description of the drawings
Fig. 1 is the structural schematic diagram of the present invention;
Fig. 2 is the structural schematic diagram at another visual angle of the invention;
Fig. 3 is the enlarged drawing at A in Fig. 2;
Fig. 4 is the explosive view of gravity pressure compact form mechanism in the present invention.
In figure:Substrate 1, optical fiber containing box 11, pressing plate 2, elastic thimble 21, gravity pressure compact form mechanism 3, plate bracket 31,
Flip-arm 32, the first guide groove 331, the first vertical slot 332, the second vertical slot 333, the second guide groove 334, is held mounting plate 33
Support plate 41, circuit board locating pin 411, receiving hole 412, loophole 413, optical fiber 421, test probe 422, guide post 43, limited block
44, spring 45.
Specific implementation mode
The present invention will be further described in the following with reference to the drawings and specific embodiments.
Shown in as shown in Figure 1 to Figure 4, a kind of automobile instrument panel circuit board testing device, including
Substrate 1, circuit board hold-down mechanism and mechanism for testing circuit boards, the circuit board hold-down mechanism includes for pushing down circuit board
Pressing plate 2 and gravity pressure compact form mechanism 3 for overturning pressing plate, the lower surface of pressing plate be equipped with elastic thimble 21, elastic thimble with
Pressing plate is vertical, and elastic thimble prevents pressing plate from damaging the component on circuit board by pressure.Gravity pressure compact form mechanism includes plate bracket 31, turns over
Pivoted arm 32 and the vertical mounting plate 33 being fixed on substrate, the upper end of pressing plate are fixed on plate bracket, and mounting plate is equipped with the
One end of one guide groove 331, the first guide groove is downwardly extending the first vertical slot 332, and mounting plate is equipped with the second vertical slot
333, the second vertical slot is located at the lower section of the first guide groove, and plate bracket is rotatably arranged on peace by first rotating shaft and the second shaft
In loading board, first rotating shaft passes through the first guide groove, the second shaft that the second vertical slot, flip-arm is passed through to be equipped with the second guide groove
334, flip-arm is rotatably arranged on by first rotating shaft and third shaft on mounting plate, and first rotating shaft passes through the second guide groove.The
One guide groove is arc-shaped, and the second vertical slot is by rectangular channel and is located at the half slot at rectangular channel both ends and constitutes, the first guide groove and
Half slot positioned at rectangular channel upper end is coaxially arranged.When first rotating shaft slides into from the first guide groove the upper end of the first vertical slot
When, pressing plate is in horizontality.
When flip-arm band dynamic pressure plate go to circuit plate, first rotating shaft is slided in the first guide groove and the second guide groove, when
When first rotating shaft moves to the upper end of the first vertical slot, the second shaft also is located at the upper end of the second vertical slot, due to pressing plate and pressure
The gravity of board mount, pressing plate will continue to move down compression circuit board, and the first vertical slot and the second vertical slot ensure the pressure of pressing plate
Lower direction is vertical, will not damage test probe or circuit board by pressure.The existing inverting action of gravity pressure compact form mechanism, when opening, facilitate circuit
It the placement of plate and takes, while pressing plate has lift action that can compress circuit board again.
The mechanism for testing circuit boards includes the loading plate 41 being located on substrate and several test cells, pressing plate, loading plate
And substrate is from top to bottom sequentially arranged.Several buffer structures are equipped between loading plate and substrate, buffer structure includes being located at substrate
On guide post 43, the spring 45 that is located at the limited block 44 of guide post one end and is set on guide post, in a buffer structure:Carrying
Plate is slidably arranged on guide post, and limited block is located at the top of loading plate, and between loading plate and substrate, buffer structure exists spring
It is worked as a buffer in circuit board compaction process, while circuit board is in the support of pressing plate and the gravity and loading plate of plate bracket
Reach the state of self-balancing under effect, further protection test probe and circuit board.Loading plate is positioned equipped with several circuit boards
Pin 411, circuit board locating pin are located at the side close to pressing plate, circuit board locating pin on loading plate and exist for Primary Location circuit board
Position on loading plate ensures that the position of LED lamp bead and receiving hole corresponds.The upper surface of loading plate is equipped with several for holding
The bottom surface of the receiving hole 412 of nano circuit onboard led lamp bead, receiving hole is downwardly extending the loophole through loading plate lower surface
413, test cell includes optical fiber 421 and test probe 422 in optical fiber one end is arranged, and test probe is a pair of with loophole one
It answers, test probe is stretched by the lower end of loophole in loophole.The upper surface of substrate and loading plate is covered with black light shield layer, black
Color light shield layer reduces the extraneous light into receiving hole and loophole, improves the accuracy of test probe.
The lower section of substrate is equipped with optical fiber containing box 11, and test probe is fixed on substrate, and optical fiber is located in optical fiber containing box.
The upper end opening of optical fiber containing box, substrate are covered in the upper end of optical fiber containing box, and one end of substrate and optical fiber containing box are hinged.Light
Fibre is placed in optical fiber containing box, avoids optical fiber and external contact, the interference of extraneous light is reduced while shielding, simultaneously
Substrate opposed optical fibers containing box can be opened, in case test cell overhauls.
The present invention opens state in use, pressing plate is at the beginning, facilitates placement circuit board, and first rotating shaft is located at the at this time
The end of one guide groove, the second shaft are against the upper end of the second vertical slot.Circuit board is positioned on loading plate, circuit board is passed through
Positioning pin carries out Primary Location, on circuit board equipped with LED lamp bead one facing towards loading plate, each LED lamp bead is located at corresponding appearance
It receives in hole.Flip-arm is rotated, first rotating shaft is slided in the first guide groove at this time, and the second shaft is against the second vertical slot always
Upper end.When first rotating shaft slides into the upper end of the first vertical slot, pressing plate is in horizontality and the surface positioned at circuit board
(I.e. when first rotating shaft slides into the upper end of the first vertical slot, and the second shaft is against the upper end of the second vertical slot, pressing plate is in water
Level state and the surface for being located at circuit board), first rotating shaft, the second shaft and third shaft are parallel, and pressing plate is in pressing plate and pressure
Continue to decline under the gravity of board mount, first rotating shaft and the second shaft are same in the first vertical slot and the second vertical slot respectively
Step declines, and pressing plate is promoted to compress circuit board, and pressing plate remains horizontal during pressure, and pressure direction remains perpendicular
Directly, circuit board reaches self-balancing, LED lamp bead hair under the supporting role of pressing plate and the gravity and loading plate of plate bracket
Probe receives and is transmitted to the detection devices such as computer by optical fiber and is detected the light gone out after tested, is rotated further by and turns over after being completed
Pivoted arm routs up pressing plate, takes out circuit board.
The beneficial effects of the invention are as follows:First vertical slot and the second vertical slot ensure direction of motion when pressing plate pushes down circuit board
Vertically, while this process pressing plate keeps horizontal, and circuit board will not shift during being compacted, reduce crushing circuit board or
Test the risk of probe;Loading plate is equipped with buffer structure, and circuit board is in pressing plate and the gravity and loading plate of plate bracket
Supporting role under reach the impaction state of self-balancing, in entire test process, circuit board will not shift, and effective protection is surveyed
Sound out needle and circuit board;The directly tested probe collection of the light that LED lamp bead is sent out simultaneously is transferred out by optical fiber, by the external world
Interference it is small, and can disposably obtain the test result of all LED lamp beads, measuring accuracy and testing efficiency are substantially improved.
Claims (10)
1. a kind of automobile instrument panel circuit board testing device, characterized in that including
Substrate, circuit board hold-down mechanism and mechanism for testing circuit boards, the circuit board hold-down mechanism includes for pushing down circuit board
Pressing plate and gravity pressure compact form mechanism for overturning pressing plate;
The mechanism for testing circuit boards includes the loading plate being located on substrate and several test cells, pressing plate, loading plate and substrate
It is from top to bottom sequentially arranged, the upper surface of loading plate is equipped with several receiving holes for accommodating LED lamp bead on circuit board, receiving hole
Bottom surface be downwardly extending the loophole through loading plate lower surface, test cell includes optical fiber and is arranged in optical fiber one end
Probe is tested, test probe is corresponded with loophole, and test probe is stretched by the lower end of loophole in loophole.
2. a kind of automobile instrument panel circuit board testing device according to claim 1, characterized in that the gravity pressure compact form
Mechanism includes that plate bracket, flip-arm and the vertical mounting plate being fixed on substrate, the upper end of pressing plate are fixed on plate bracket,
Mounting plate is equipped with the first guide groove, and one end of the first guide groove is downwardly extending the first vertical slot, and mounting plate is equipped with the
Two vertical slots, the second vertical slot are located at the lower section of the first guide groove, and plate bracket is set by first rotating shaft and the rotation of the second shaft
It sets on a mounting board, first rotating shaft passes through the first guide groove, the second shaft that the second vertical slot, flip-arm is passed through to be led equipped with second
To slot, flip-arm is rotatably arranged on by first rotating shaft and third shaft on mounting plate, and first rotating shaft passes through the second guide groove.
3. a kind of automobile instrument panel circuit board testing device according to claim 2, characterized in that first guide groove
It is arc-shaped, the second vertical slot is by rectangular channel and is located at the half slot at rectangular channel both ends and constitutes, and the first guide groove and is located at rectangle
The half slot of slot upper end is coaxially arranged.
4. a kind of automobile instrument panel circuit board testing device according to claim 2, characterized in that when first rotating shaft is from
When one guide groove slides into the upper end of the first vertical slot, pressing plate is in horizontality.
5. a kind of automobile instrument panel circuit board testing device according to claim 1 or 2, characterized in that the loading plate
Several buffer structures are equipped between substrate, buffer structure includes the guide post being located on substrate, is located at the limited block of guide post one end
And it is set in the spring on guide post, in a buffer structure:Loading plate is slidably arranged on guide post, and limited block is located at loading plate
Top, spring is between loading plate and substrate.
6. a kind of automobile instrument panel circuit board testing device according to claim 1 or 2, characterized in that the pressing plate
Lower surface is equipped with elastic thimble, and elastic thimble is vertical with pressing plate.
7. a kind of automobile instrument panel circuit board testing device according to claim 1 or 2, characterized in that the loading plate
Several circuit board locating pins are equipped with, circuit board locating pin is located at the side close to pressing plate on loading plate.
8. a kind of automobile instrument panel circuit board testing device according to claim 1 or 2, characterized in that the substrate
Lower section is equipped with optical fiber containing box, and test probe is fixed on substrate, and optical fiber is located in optical fiber containing box.
9. a kind of automobile instrument panel circuit board testing device according to claim 8, characterized in that the optical fiber containing box
Upper end opening, substrate is covered in the upper end of optical fiber containing box, and one end of substrate and optical fiber containing box are hinged.
10. a kind of automobile instrument panel circuit board testing device according to claim 1 or 2, characterized in that the substrate and
The upper surface of loading plate is covered with black light shield layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810362637.3A CN108693485A (en) | 2018-04-20 | 2018-04-20 | A kind of automobile instrument panel circuit board testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810362637.3A CN108693485A (en) | 2018-04-20 | 2018-04-20 | A kind of automobile instrument panel circuit board testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108693485A true CN108693485A (en) | 2018-10-23 |
Family
ID=63845105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810362637.3A Pending CN108693485A (en) | 2018-04-20 | 2018-04-20 | A kind of automobile instrument panel circuit board testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108693485A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109342976A (en) * | 2018-11-14 | 2019-02-15 | 广东昇辉电子控股有限公司 | A kind of cluster of lamps, ornamental detection device |
| CN112505521A (en) * | 2020-09-25 | 2021-03-16 | 华东光电集成器件研究所 | Three-dimensional assembled circuit testing device |
| CN113058883A (en) * | 2021-03-25 | 2021-07-02 | 中国电子科技集团公司第三十八研究所 | Multi-station integrated linkage type automatic detection mechanism |
| KR20230000345U (en) * | 2021-08-09 | 2023-02-16 | 주식회사 디엠테크코리아 | Printed Circuit Assembly Board Test Jig |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109342976A (en) * | 2018-11-14 | 2019-02-15 | 广东昇辉电子控股有限公司 | A kind of cluster of lamps, ornamental detection device |
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| KR200497397Y1 (en) | 2021-08-09 | 2023-11-01 | 주식회사 디엠테크코리아 | Printed Circuit Assembly Board Test Jig |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181023 |