CN108680580A - A kind of full-automatic silicon wafer detection sorting unit - Google Patents
A kind of full-automatic silicon wafer detection sorting unit Download PDFInfo
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- CN108680580A CN108680580A CN201810413912.XA CN201810413912A CN108680580A CN 108680580 A CN108680580 A CN 108680580A CN 201810413912 A CN201810413912 A CN 201810413912A CN 108680580 A CN108680580 A CN 108680580A
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 140
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 122
- 239000010703 silicon Substances 0.000 title claims abstract description 122
- 238000001514 detection method Methods 0.000 title claims description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 69
- 238000007689 inspection Methods 0.000 claims abstract description 20
- 238000012856 packing Methods 0.000 claims description 26
- 239000004484 Briquette Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 12
- 238000005070 sampling Methods 0.000 claims description 9
- 238000012360 testing method Methods 0.000 claims description 8
- 238000004806 packaging method and process Methods 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- 230000003796 beauty Effects 0.000 claims description 5
- 238000002372 labelling Methods 0.000 claims description 5
- 230000006835 compression Effects 0.000 claims description 4
- 238000007906 compression Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000005260 corrosion Methods 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 3
- 239000012634 fragment Substances 0.000 claims description 3
- 230000036961 partial effect Effects 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 230000000007 visual effect Effects 0.000 claims description 3
- 230000000694 effects Effects 0.000 claims 1
- 230000035945 sensitivity Effects 0.000 claims 1
- 238000013519 translation Methods 0.000 claims 1
- 230000002950 deficient Effects 0.000 abstract description 7
- 238000000034 method Methods 0.000 abstract description 7
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 208000037656 Respiratory Sounds Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
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- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention discloses a kind of full-automatic silicon wafers to detect sorting unit, including shell, the upper end of the shell front surface is embedded with display, the top of shell inner surface is fixedly connected with slide, and the outer surface of slide slidably connects slider, the bottom of the slider is fixedly connected with electric telescopic rod, and the bottom of electric telescopic rod is fixedly connected with inspection head, the bottom of the shell inner surface is movably installed with conveying roller, and the lower end on the left of shell is fixedly connected with motor support base, the upper surface of the motor support base is installed with motor, the output shaft of motor is sequentially connected by belt and conveying roller, and it is connected also by belt transmission between conveying roller and conveying roller.The present invention by the silicon chip that this technique sub-elects have the advantages that efficiently, high-precision, zero error, avoid defective products and be passed to market, be mistakened as doing substandard products and the phenomenon that bringing massive losses to enterprise occurs to influence goodwill and non-defective unit.
Description
Technical field
The present invention relates to silicon chip sorting technology field, specially a kind of full-automatic silicon wafer detects sorting unit.
Background technology
Silicon wafer thickness is a factor for influencing productivity, it is related to the silicon chip quantity that each silico briquette is produced, and is surpassed
Thin silicon chip proposes additional challenge to scroll saw technology, because its production process wants much more difficult, in addition to the machinery of silicon chip is crisp
Property other than, if wire saw process is controlled without accurate, subtle crackle and bending can all have a negative impact to product yield, surpass
Thin silicon wafer scroll saw system is necessary can, cutting speed linear to technique and pressure and the accurate control of cutting coolant liquid progress.
No matter the thickness of silicon chip, crystal silicon photovoltaic cell manufacture commercial city high requirement, silicon are proposed to the quality of silicon chip
Piece cannot have surface damage（Blind crack, the scroll saw marking）, and pattern defect（Bending, concave-convex, became uneven）It minimizes, together
When the requirement that additional back-end processing such as polishes will be also preferably minimized, silicon chip needs to be detected it in process point
Choosing is handled, but that there is the efficiencies of separation is low, precision is low and is easy defective products is made to be passed to market and non-defective unit to be missed for the prior art
The phenomenon that as substandard products, is unfavorable for the interests of enterprise itself.
Invention content
The purpose of the present invention is to provide a kind of full-automatic silicon wafers to detect sorting unit, to solve to carry in above-mentioned background technology
The problem of going out.
To achieve the above object, the present invention provides the following technical solutions：A kind of full-automatic silicon wafer detection sorting unit, including
Shell, the upper end of the shell front surface are embedded with display, and the top of shell inner surface is fixedly connected with slide, and slide
Outer surface slidably connects slider, and the bottom of the slider is fixedly connected with electric telescopic rod, and the bottom of electric telescopic rod
Portion is fixedly connected with inspection head, and the bottom of the shell inner surface is movably installed with conveying roller, and the lower end on the left of shell is fixed
It is connected with motor support base, the upper surface of the motor support base is installed with motor, and the output shaft of motor passes through belt and conveying
Roller is sequentially connected, and is connected also by belt transmission between conveying roller and conveying roller, and the surrounding of the housing bottom is fixed to be connected
It is connected to support leg, and the bottom of support leg is movably installed with idler wheel.
Preferably, shell is additionally provided with thickness detection apparatus, and thickness detection apparatus is electrically connected central processing unit.
Preferably, the thickness detection apparatus includes supporting rod, and the lower end on the right side of supporting rod is movably installed with lower compression roller,
The top of supporting rod right end is fixedly connected with support plate, and the right end of support plate bottom is fixedly connected with sleeve, barrel bore
Top is connected with motion bar by spring, and the middle-end of motion bar bottom is embedded with range sensor, on the right side of motion bar
Lower end is movably installed with pressure roller.
Preferably, detection method includes the following steps：
A, silicon chip is divided into A level silicon wafers, B level silicon wafers, C level silicon wafers and D level silicon wafer level Four by quality requirement；
B, each silico briquette extracts 200 with silicon wafer sorting device to its conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests；
C, if there is 30 and 30 or more silicon chips in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few son
The total of the undesirable silicon chip number such as service life）The requirement of step A is not met, then the silicon chip all to the silico briquette is sorted with silicon chip
Device is tested, and carries out apparent inspection to all silicon chips again later；
If D, only 30 silicon chips below in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few sub- longevity
The total of the undesirable silicon chip numbers such as life）Do not meet the requirement of step A, then by these silicon chips be determined as conduction type be not inconsistent,
Resistivity is not inconsistent, and the silico briquette other silicon chips no longer carry out the inspection of conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests, while apparent full inspection is carried out together with remaining silicon chip in 200 silicon chips of sampling observation；
E, mark and packaging.
Preferably, the A level silicon wafers are divided into A1 by resistivity（0.3~2.5 Ω .cm）And A2（2.5~5 Ω .cm）2 classes
Not, B level silicon wafers are unsatisfactory for A level silicon wafer requirements by partial properties and are divided into B1, B2, B3, B4, B5, B6, B7, B8 and B9 totally 9 type
Not；C level silicon wafers refer to the fragment generated in cleaning, detection and packaging process, and the small dimension of certain size can be divided into through judgement
Silicon chip（Such as 100mm × 100mm）, and other inspection parameters meet A level silicon wafer standards, while silicon chip company is produced by A level silicon wafers,
And allow to provide B level silicon wafers or C level silicon wafers by user's requirement；A level silicon wafers are high-class product, and A, B level silicon wafer are qualified silicon chip,
C, D level silicon wafers are unqualified silicon chip；B level silicon wafers are used by the regulation used in connection with that company formulates, C grades, D level silicon wafers press
Corporate policy is handled.
Preferably, such as a certain silico briquette theory number of slices is 535, has inspected 200 by random samples, has had 29 to be unsatisfactory for step A in the middle
Requirement, then be determined as that conduction type is not inconsistent, resistivity is not inconsistent by 29, remaining 171（200~29）Piece is together with front
335（535~200）Carry out apparent full inspection.
Preferably, the visual examination is hand inspection, i.e., is with the naked eye examined piece by piece to the silicon chip appearance all produced
It surveys, to judge whether each product be qualified.
Preferably, following product marking is at least printed on packing box：1., enterprise name；2., product type or label；
3., build date；4., silicon ingot number；Packaging is divided into inner packing and outer packing, and the silicon chip of inner packing is close using EPS packing boxes
Package fills, and the labeling requirement on packing box pastes neat appearance, upwards and in the same direction, and when sealing, sealing compound requires beauty
It is smooth；" handling with care " and " anti-corrosion, moisture-proof " printed words should be indicated at the babinet of outer packing, have product inventory, extranal packing box in case
Upper label, label substance include name of product, model, quantity, date and bale number etc., the label on extranal packing box
It is required that neat appearance, upwards and in the same direction is pasted, and when sealing, sealing compound across, and require beauty smooth.
Compared with prior art, beneficial effects of the present invention are as follows：
The present invention has the advantages that efficient, high-precision, zero error by the silicon chip that this technique sub-elects, and avoids defective products circulation
To market, it is mistakened as doing substandard products and the phenomenon that bringing massive losses to enterprise occurs to influence goodwill and non-defective unit.
Description of the drawings
Fig. 1 is schematic structural view of the invention；
Fig. 2 is testing process schematic diagram of the present invention；
Fig. 3 is thickness detection apparatus structural schematic diagram of the present invention.
In figure：1 shell, 2 check heads, 3 sliders, 4 displays, 5 slides, 6 electric telescopic rods, 7 motors, 8 motor support bases,
9 support legs, 10 idler wheels, 11 conveying rollers, 12 supporting rods, 13 range sensors, 14 motion bars, 15 support plates, 16 sleeves, 17 bullets
Spring, 18 lower compression rollers, pressure roller on 19.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, a kind of full-automatic silicon wafer detection sorting unit, including shell 1, the upper end of 1 front surface of shell are embedding
Equipped with display 4, the top of 1 inner surface of shell is fixedly connected with slide 5, and the outer surface of slide 5 slidably connects slider
3, the bottom of slider 3 is fixedly connected with electric telescopic rod 6, and the bottom of electric telescopic rod 6 is fixedly connected with and checks head 2, shell
The bottom of 1 inner surface of body is movably installed with conveying roller 11, and the lower end in 1 left side of shell is fixedly connected with motor support base 8, motor branch
The upper surface of seat 8 is installed with motor 7, and the output shaft of motor 7 is sequentially connected by belt and conveying roller 11, and conveying roller 11
It is connect also by belt transmission between conveying roller 11, the surrounding of 1 bottom of shell has been fixedly connected with support leg 9, and support leg 9
Bottom be movably installed with idler wheel 10, shell 1 is additionally provided with thickness detection apparatus, and thickness detection apparatus is electrically connected centre
Device is managed, thickness detection apparatus includes supporting rod 12, and the lower end on 12 right side of supporting rod is movably installed with lower compression roller 18, supporting rod 12
The top of right end is fixedly connected with support plate 15, and the right end of 15 bottom of support plate is fixedly connected with sleeve 16,16 inner cavity of sleeve
Top motion bar 14 is connected with by spring 17, and the middle-end of 14 bottom of motion bar is embedded with range sensor 13, living
The lower end on 14 right side of lever is movably installed with pressure roller 19.
Detection method includes the following steps for it：
A, silicon chip is divided into A level silicon wafers, B level silicon wafers, C level silicon wafers and D level silicon wafer level Four by quality requirement；
B, each silico briquette extracts 200 with silicon wafer sorting device to its conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests；
C, if there is 30 and 30 or more silicon chips in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few son
The total of the undesirable silicon chip number such as service life）The requirement of step A is not met, then the silicon chip all to the silico briquette is sorted with silicon chip
Device is tested, and carries out apparent inspection to all silicon chips again later；
If D, only 30 silicon chips below in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few sub- longevity
The total of the undesirable silicon chip numbers such as life）Do not meet the requirement of step A, then by these silicon chips be determined as conduction type be not inconsistent,
Resistivity is not inconsistent, and the silico briquette other silicon chips no longer carry out the inspection of conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests, while apparent full inspection is carried out together with remaining silicon chip in 200 silicon chips of sampling observation；
E, mark and packaging.
A level silicon wafers are divided into A1 by resistivity（0.3~2.5 Ω .cm）And A2（2.5~5 Ω .cm）2 classifications, B level silicon wafers
It is unsatisfactory for A level silicon wafer requirements by partial properties and is divided into B1, B2, B3, B4, B5, B6, B7, B8 and B9 totally 9 kinds of classifications；C level silicon wafers refer to
The fragment generated in cleaning, detection and packaging process, the small dimension silicon chip of certain size can be divided into through judgement（Such as 100mm
×100mm）, and other inspection parameters meet A level silicon wafer standards, while silicon chip company is produced by A level silicon wafers, and allow by user
It is required that providing B level silicon wafers or C level silicon wafers；A level silicon wafers are high-class product, and A, B level silicon wafer are qualified silicon chip, and C, D level silicon wafer are equal
For unqualified silicon chip；B level silicon wafers are used by the regulation used in connection with that company formulates, C grades, D level silicon wafers by corporate policy into
Row processing.
If a certain silico briquette theory number of slices is 535, inspects 200 by random samples, there are 29 requirements for being unsatisfactory for step A in the middle,
Then it is determined as that conduction type is not inconsistent, resistivity is not inconsistent by 29, remaining 171（200~29）335 together with front of piece
（535~200）Carry out apparent full inspection.
Visual examination is hand inspection, i.e., is with the naked eye detected piece by piece to the silicon chip appearance all produced, to judge
Whether each product be qualified.
Following product marking is at least printed on packing box：1., enterprise name；2., product type or label；3., manufacture
Date；4., silicon ingot number；Packaging is divided into inner packing and outer packing, and the silicon chip of inner packing is packed using EPS packing boxes,
Labeling requirement on packing box pastes neat appearance, upwards and in the same direction, and when sealing, sealing compound requires beauty smooth；Outside
" handling with care " and " anti-corrosion, moisture-proof " printed words should be indicated at the babinet of packaging, have product inventory in case, mark is posted on extranal packing box
Label, label substance include name of product, model, quantity, date and bale number etc., and the labeling requirement on extranal packing box is pasted
Neat appearance, upwards and in the same direction, when sealing, sealing compound across, and require beauty smooth.
In use, having the advantages that efficient, high-precision, zero error by the silicon chip that this technique sub-elects, avoid bad
Product are passed to market, are mistakened as doing substandard products and the phenomenon that bringing massive losses to enterprise is sent out to influence goodwill and non-defective unit
It is raw.
It although an embodiment of the present invention has been shown and described, for the ordinary skill in the art, can be with
Understanding without departing from the principles and spirit of the present invention can carry out these embodiments a variety of variations, modification, replace
And modification, the scope of the present invention is defined by the appended.
Claims (8)
1. a kind of full-automatic silicon wafer detects sorting unit, including shell（1）, it is characterised in that：The shell（1）Front surface it is upper
End is embedded with display（4）, shell（1）The top of inner surface is fixedly connected with slide（5）, and slide（5）Outer surface sliding
It is connected with slider（3）, the slider（3）Bottom be fixedly connected with electric telescopic rod（6）, and electric telescopic rod（6）'s
Bottom is fixedly connected with inspection head（2）, the shell（1）The bottom of inner surface is movably installed with conveying roller（11）, and shell（1）
The lower end in left side is fixedly connected with motor support base（8）, the motor support base（8）Upper surface be installed with motor（7）, motor
（7）Output shaft pass through belt and conveying roller（11）It is sequentially connected, and conveying roller（11）With conveying roller（11）Between also by skin
V belt translation connects, the shell（1）The surrounding of bottom has been fixedly connected with support leg（9）, and support leg（9）Bottom activity peace
Equipped with idler wheel（10）.
2. a kind of full-automatic silicon wafer according to claim 1 detects sorting unit, it is characterised in that：The shell（1）Also
It is provided with thickness detection apparatus, and thickness detection apparatus is electrically connected central processing unit.
3. a kind of full-automatic silicon wafer according to claim 2 detects sorting unit, it is characterised in that：The Thickness sensitivity dress
It sets including supporting rod（12）, and supporting rod（12）The lower end on right side is movably installed with lower compression roller（18）, supporting rod（12）Right end
Top is fixedly connected with support plate（15）, and support plate（15）The right end of bottom is fixedly connected with sleeve（16）, sleeve（16）It is interior
The top of chamber passes through spring（17）It is connected with motion bar（14）, and motion bar（14）The middle-end of bottom is embedded with Distance-sensing
Device（13）, motion bar（14）The lower end on right side is movably installed with pressure roller（19）.
4. a kind of full-automatic silicon wafer according to claim 1 detects sorting unit, it is characterised in that：Its detection method includes
Following steps：
A, silicon chip is divided into A level silicon wafers, B level silicon wafers, C level silicon wafers and D level silicon wafer level Four by quality requirement；
B, each silico briquette extracts 200 with silicon wafer sorting device to its conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests；
C, if there is 30 and 30 or more silicon chips in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few son
The total of the undesirable silicon chip number such as service life）The requirement of step A is not met, then the silicon chip all to the silico briquette is sorted with silicon chip
Device is tested, and carries out apparent inspection to all silicon chips again later；
If D, only 30 silicon chips below in 200 of sampling observation（Conduction type, resistivity, thickness, TTV, few sub- longevity
The total of the undesirable silicon chip numbers such as life）Do not meet the requirement of step A, then by these silicon chips be determined as conduction type be not inconsistent,
Resistivity is not inconsistent, and the silico briquette other silicon chips no longer carry out the inspection of conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It tests, while apparent full inspection is carried out together with remaining silicon chip in 200 silicon chips of sampling observation；
E, mark and packaging.
5. a kind of full-automatic silicon wafer according to claim 4 detects sorting unit, it is characterised in that：The A level silicon wafers are pressed
Resistivity is divided into A1（0.3~2.5 Ω .cm）And A2（2.5~5 Ω .cm）2 classifications, B level silicon wafers are unsatisfactory for A by partial properties
Level silicon wafer requires to be divided into B1, B2, B3, B4, B5, B6, B7, B8 and B9 totally 9 kinds of classifications；C level silicon wafers refer to cleaning, detection and packed
The fragment generated in journey can be divided into the small dimension silicon chip of certain size through judgement（Such as 100mm × 100mm）, and other are examined
Test parameter and meet A level silicon wafer standards, while silicon chip company is produced by A level silicon wafers, and allow by user's requirements offer B level silicon wafers or
It is C level silicon wafers；A level silicon wafers are high-class product, and A, B level silicon wafer are qualified silicon chip, and C, D level silicon wafer are unqualified silicon chip；B grades of silicon
Piece is used by the regulation used in connection with that company formulates, C grades, D level silicon wafers are handled by corporate policy.
6. a kind of full-automatic silicon wafer according to claim 4 detects sorting unit, it is characterised in that：As a certain silico briquette is theoretical
Number of slices is 535, has inspected 200 by random samples, has had 29 requirements for being unsatisfactory for step A in the middle, be then determined as conduction type by 29
Be not inconsistent, resistivity is not inconsistent, remaining 171（200~29）335 together with front of piece（535~200）It carries out apparent complete
Inspection.
7. a kind of full-automatic silicon wafer according to claim 4 detects sorting unit, it is characterised in that：The visual examination is
Hand inspection is with the naked eye detected the silicon chip appearance all produced piece by piece, to judge whether each product be qualified.
8. a kind of full-automatic silicon wafer according to claim 4 detects sorting unit, it is characterised in that：On packing box at least
It is printed on following product marking：1., enterprise name；2., product type or label；3., build date；4., silicon ingot number；Packaging point
For inner packing and outer packing, and the silicon chip of inner packing is packed using EPS packing boxes, and the labeling requirement on packing box is pasted whole
Neat beautiful, upwards and in the same direction, when sealing, sealing compound requires beauty smooth；It should be indicated at the babinet of outer packing " careful light
Put " and " anti-corrosion, moisture-proof " printed words, have product inventory in case, label on extranal packing box, label substance include name of product,
Model, quantity, date and bale number etc., labeling requirement on extranal packing box paste neat appearance, upwards and towards same side
To when, sealing, sealing compound across, and require beautiful smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201810413912.XA CN108680580A (en) | 2018-05-03 | 2018-05-03 | A kind of full-automatic silicon wafer detection sorting unit |
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| CN201810413912.XA CN108680580A (en) | 2018-05-03 | 2018-05-03 | A kind of full-automatic silicon wafer detection sorting unit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110006912A (en) * | 2019-04-26 | 2019-07-12 | 上海电气集团股份有限公司 | A kind of silicon steel sheet Surface Quality Inspection System and operation method for generator |
| CN113701692A (en) * | 2021-11-01 | 2021-11-26 | 邳州千润模具有限公司 | Quick fixing device for silicon block size detection and detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110006912A (en) * | 2019-04-26 | 2019-07-12 | 上海电气集团股份有限公司 | A kind of silicon steel sheet Surface Quality Inspection System and operation method for generator |
| CN113701692A (en) * | 2021-11-01 | 2021-11-26 | 邳州千润模具有限公司 | Quick fixing device for silicon block size detection and detection method |
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