CN208091938U - A kind of full-automatic silicon wafer detection sorting unit - Google Patents
A kind of full-automatic silicon wafer detection sorting unit Download PDFInfo
- Publication number
- CN208091938U CN208091938U CN201820652936.6U CN201820652936U CN208091938U CN 208091938 U CN208091938 U CN 208091938U CN 201820652936 U CN201820652936 U CN 201820652936U CN 208091938 U CN208091938 U CN 208091938U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- shell
- conveying roller
- motor
- full
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Abstract
The utility model discloses a kind of full-automatic silicon wafers to detect sorting unit, including shell, the upper end of the shell front surface is embedded with display, the top of shell inner surface is fixedly connected with slide, and the outer surface of slide slidably connects slider, the bottom of the slider is fixedly connected with electric telescopic rod, and the bottom of electric telescopic rod is fixedly connected with inspection head, the bottom of the shell inner surface is movably installed with conveying roller, and the lower end on the left of shell is fixedly connected with motor support base, the upper surface of the motor support base is installed with motor, the output shaft of motor is sequentially connected by belt and conveying roller, and it is connected also by belt transmission between conveying roller and conveying roller.The utility model by the silicon chip that this technique sub-elects have the advantages that efficiently, high-precision, zero error, avoid defective products and be passed to market, be mistakened as doing substandard products and the phenomenon that bringing massive losses to enterprise occurs to influence goodwill and non-defective unit.
Description
Technical field
The utility model is related to silicon chip sorting technology field, specially a kind of full-automatic silicon wafer detects sorting unit.
Background technology
Silicon wafer thickness is a factor for influencing productivity, it is related to the silicon chip quantity that each silico briquette is produced, and is surpassed
Thin silicon chip proposes additional challenge to scroll saw technology, because its production process wants much more difficult, in addition to the machinery of silicon chip is crisp
Property other than, if wire saw process is controlled without accurate, subtle crackle and bending can all have a negative impact to product yield, surpass
Thin silicon wafer scroll saw system is necessary can, cutting speed linear to technique and pressure and the accurate control of cutting coolant liquid progress.
No matter the thickness of silicon chip, crystal silicon photovoltaic cell manufacture commercial city high requirement, silicon are proposed to the quality of silicon chip
Piece cannot have surface damage（Blind crack, the scroll saw marking）, and pattern defect（Bending, concave-convex, became uneven）It minimizes, together
When the requirement that additional back-end processing such as polishes will be also preferably minimized, silicon chip needs to be detected it in process point
Choosing is handled, but that there is the efficiencies of separation is low, precision is low and is easy defective products is made to be passed to market and non-defective unit to be missed for the prior art
The phenomenon that as substandard products, is unfavorable for the interests of enterprise itself.
Utility model content
The purpose of this utility model is to provide a kind of full-automatic silicon wafers to detect sorting unit, to solve above-mentioned background technology
The problem of middle proposition.
To achieve the above object, the utility model provides the following technical solutions：A kind of full-automatic silicon wafer detection sorting unit,
Including shell, the upper end of the shell front surface is embedded with display, and the top of shell inner surface is fixedly connected with slide, and sliding
The outer surface of seat slidably connects slider, and the bottom of the slider is fixedly connected with electric telescopic rod, and electric telescopic rod
Bottom be fixedly connected with inspection head, the bottom of the shell inner surface is movably installed with conveying roller, and the lower end on the left of shell
Be fixedly connected with motor support base, the upper surface of the motor support base is installed with motor, the output shaft of motor by belt with
Conveying roller is sequentially connected, and is connected also by belt transmission between conveying roller and conveying roller, and the surrounding of the housing bottom is solid
Surely it is connected with support leg, and the bottom of support leg is movably installed with idler wheel.
Preferably, shell is additionally provided with thickness detection apparatus, and thickness detection apparatus is electrically connected central processing unit.
Preferably, the thickness detection apparatus includes supporting rod, and the lower end on the right side of supporting rod is movably installed with lower compression roller,
The top of supporting rod right end is fixedly connected with support plate, and the right end of support plate bottom is fixedly connected with sleeve, barrel bore
Top is connected with motion bar by spring, and the middle-end of motion bar bottom is embedded with range sensor, on the right side of motion bar
Lower end is movably installed with pressure roller.
Preferably, detection method includes the following steps：
A, silicon chip is divided into A level silicon wafers, B level silicon wafers, C level silicon wafers and D level silicon wafer level Four by quality requirement；
B, each silico briquette extracts 200 with silicon wafer sorting device to its conduction type, resistivity, thickness, TTV, few sub- longevity
Life etc. is tested；
C, if there is 30 and 30 or more silicon chips in 200 of sampling observation（Conduction type, resistivity, thickness, TTV,
The total of the undesirable silicon chip number such as minority carrier life time）The requirement of step A is not met, then the silicon chip silicon chip all to the silico briquette
Sorting unit is tested, and carries out apparent inspection to all silicon chips again later；
If D, only 30 silicon chips below in 200 of sampling observation（Conduction type, thickness, TTV, lacks resistivity
The total of the undesirable silicon chip number such as sub- service life）The requirement of step A is not met, then is determined as conduction type not these silicon chips
Symbol, resistivity are not inconsistent, and the silico briquette other silicon chips no longer carry out conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It examines, while apparent full inspection is carried out together with remaining silicon chip in 200 silicon chips of sampling observation；
E, mark and packaging.
Preferably, the A level silicon wafers are divided into A1 by resistivity（0.3~2.5 Ω .cm）And A2（2.5~5 Ω .cm）2 classes
Not, B level silicon wafers are unsatisfactory for A level silicon wafer requirements by partial properties and are divided into B1, B2, B3, B4, B5, B6, B7, B8 and B9 totally 9 type
Not；C level silicon wafers refer to the fragment generated in cleaning, detection and packaging process, and the small dimension of certain size can be divided into through judgement
Silicon chip（Such as 100mm × 100mm）, and other inspection parameters meet A level silicon wafer standards, while silicon chip company is produced by A level silicon wafers,
And allow to provide B level silicon wafers or C level silicon wafers by user's requirement；A level silicon wafers are high-class product, and A, B level silicon wafer are qualified silicon chip,
C, D level silicon wafers are unqualified silicon chip；B level silicon wafers are used by the regulation used in connection with that company formulates, C grades, D level silicon wafers press
Corporate policy is handled.
Preferably, such as a certain silico briquette theory number of slices is 535, has inspected 200 by random samples, has had 29 to be unsatisfactory for step A in the middle
Requirement, then be determined as that conduction type is not inconsistent, resistivity is not inconsistent by 29, remaining 171（200~29）Piece is together with front
335（535~200）Carry out apparent full inspection.
Preferably, the visual examination is hand inspection, i.e., is with the naked eye examined piece by piece to the silicon chip appearance all produced
It surveys, to judge whether each product be qualified.
Preferably, following product marking is at least printed on packing box：1., enterprise name；2., product type or label；
3., build date；4., silicon ingot number；Packaging is divided into inner packing and outer packing, and the silicon chip of inner packing is close using EPS packing boxes
Package fills, and the labeling requirement on packing box pastes neat appearance, upwards and in the same direction, and when sealing, sealing compound requires beauty
It is smooth；" handling with care " and " anti-corrosion, moisture-proof " printed words should be indicated at the babinet of outer packing, have product inventory, extranal packing box in case
Upper label, label substance include name of product, model, quantity, date and bale number etc., the label on extranal packing box
It is required that neat appearance, upwards and in the same direction is pasted, and when sealing, sealing compound across, and require beauty smooth.
Compared with prior art, the beneficial effects of the utility model are as follows：
The utility model has the advantages that efficient, high-precision, zero error by the silicon chip that this technique sub-elects, and avoids not
Non-defective unit is passed to market, is mistakened as doing substandard products and the phenomenon that bring massive losses to enterprise to influence goodwill and non-defective unit
Occur.
Description of the drawings
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is the utility model testing process schematic diagram；
Fig. 3 is the utility model thickness detection apparatus structural schematic diagram.
In figure：1 shell, 2 check heads, 3 sliders, 4 displays, 5 slides, 6 electric telescopic rods, 7 motors, 8 motor support bases,
9 support legs, 10 idler wheels, 11 conveying rollers, 12 supporting rods, 13 range sensors, 14 motion bars, 15 support plates, 16 sleeves, 17 bullets
Spring, 18 lower compression rollers, pressure roller on 19.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, a kind of full-automatic silicon wafer detection sorting unit, including shell 1, the upper end of 1 front surface of shell are embedding
Equipped with display 4, the top of 1 inner surface of shell is fixedly connected with slide 5, and the outer surface of slide 5 slidably connects slider
3, the bottom of slider 3 is fixedly connected with electric telescopic rod 6, and the bottom of electric telescopic rod 6 is fixedly connected with and checks head 2, shell
The bottom of 1 inner surface of body is movably installed with conveying roller 11, and the lower end in 1 left side of shell is fixedly connected with motor support base 8, motor branch
The upper surface of seat 8 is installed with motor 7, and the output shaft of motor 7 is sequentially connected by belt and conveying roller 11, and conveying roller 11
It is connect also by belt transmission between conveying roller 11, the surrounding of 1 bottom of shell has been fixedly connected with support leg 9, and support leg 9
Bottom be movably installed with idler wheel 10, shell 1 is additionally provided with thickness detection apparatus, and thickness detection apparatus is electrically connected centre
Device is managed, thickness detection apparatus includes supporting rod 12, and the lower end on 12 right side of supporting rod is movably installed with lower compression roller 18, supporting rod 12
The top of right end is fixedly connected with support plate 15, and the right end of 15 bottom of support plate is fixedly connected with sleeve 16,16 inner cavity of sleeve
Top motion bar 14 is connected with by spring 17, and the middle-end of 14 bottom of motion bar is embedded with range sensor 13, living
The lower end on 14 right side of lever is movably installed with pressure roller 19.
Detection method includes the following steps for it：
A, silicon chip is divided into A level silicon wafers, B level silicon wafers, C level silicon wafers and D level silicon wafer level Four by quality requirement；
B, each silico briquette extracts 200 with silicon wafer sorting device to its conduction type, resistivity, thickness, TTV, few sub- longevity
Life etc. is tested；
C, if there is 30 and 30 or more silicon chips in 200 of sampling observation（Conduction type, resistivity, thickness, TTV,
The total of the undesirable silicon chip number such as minority carrier life time）The requirement of step A is not met, then the silicon chip silicon chip all to the silico briquette
Sorting unit is tested, and carries out apparent inspection to all silicon chips again later；
If D, only 30 silicon chips below in 200 of sampling observation（Conduction type, thickness, TTV, lacks resistivity
The total of the undesirable silicon chip number such as sub- service life）The requirement of step A is not met, then is determined as conduction type not these silicon chips
Symbol, resistivity are not inconsistent, and the silico briquette other silicon chips no longer carry out conduction type, resistivity, thickness, TTV, minority carrier life time etc.
It examines, while apparent full inspection is carried out together with remaining silicon chip in 200 silicon chips of sampling observation；
E, mark and packaging.
A level silicon wafers are divided into A1 by resistivity（0.3~2.5 Ω .cm）And A2（2.5~5 Ω .cm）2 classifications, B level silicon wafers
It is unsatisfactory for A level silicon wafer requirements by partial properties and is divided into B1, B2, B3, B4, B5, B6, B7, B8 and B9 totally 9 kinds of classifications；C level silicon wafers refer to
The fragment generated in cleaning, detection and packaging process, the small dimension silicon chip of certain size can be divided into through judgement（Such as 100mm
×100mm）, and other inspection parameters meet A level silicon wafer standards, while silicon chip company is produced by A level silicon wafers, and allow by user
It is required that providing B level silicon wafers or C level silicon wafers；A level silicon wafers are high-class product, and A, B level silicon wafer are qualified silicon chip, and C, D level silicon wafer are equal
For unqualified silicon chip；B level silicon wafers are used by the regulation used in connection with that company formulates, C grades, D level silicon wafers by corporate policy into
Row processing.
If a certain silico briquette theory number of slices is 535, inspects 200 by random samples, there are 29 requirements for being unsatisfactory for step A in the middle,
Then it is determined as that conduction type is not inconsistent, resistivity is not inconsistent by 29, remaining 171（200~29）335 together with front of piece
（535~200）Carry out apparent full inspection.
Visual examination is hand inspection, i.e., is with the naked eye detected piece by piece to the silicon chip appearance all produced, to judge
Whether each product be qualified.
Following product marking is at least printed on packing box：1., enterprise name；2., product type or label；3., manufacture
Date；4., silicon ingot number；Packaging is divided into inner packing and outer packing, and the silicon chip of inner packing is packed using EPS packing boxes,
Labeling requirement on packing box pastes neat appearance, upwards and in the same direction, and when sealing, sealing compound requires beauty smooth；Outside
" handling with care " and " anti-corrosion, moisture-proof " printed words should be indicated at the babinet of packaging, have product inventory in case, mark is posted on extranal packing box
Label, label substance include name of product, model, quantity, date and bale number etc., and the labeling requirement on extranal packing box is pasted
Neat appearance, upwards and in the same direction, when sealing, sealing compound across, and require beauty smooth.
In use, having the advantages that efficient, high-precision, zero error by the silicon chip that this technique sub-elects, avoid bad
Product are passed to market, are mistakened as doing substandard products and the phenomenon that bringing massive losses to enterprise is sent out to influence goodwill and non-defective unit
It is raw.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (3)
1. a kind of full-automatic silicon wafer detects sorting unit, including shell（1）, it is characterised in that：The shell（1）Front surface it is upper
End is embedded with display（4）, shell（1）The top of inner surface is fixedly connected with slide（5）, and slide（5）Outer surface sliding
It is connected with slider（3）, the slider（3）Bottom be fixedly connected with electric telescopic rod（6）, and electric telescopic rod（6）'s
Bottom is fixedly connected with inspection head（2）, the shell（1）The bottom of inner surface is movably installed with conveying roller（11）, and shell（1）
The lower end in left side is fixedly connected with motor support base（8）, the motor support base（8）Upper surface be installed with motor（7）, motor
（7）Output shaft pass through belt and conveying roller（11）It is sequentially connected, and conveying roller（11）With conveying roller（11）Between also by skin
V belt translation connects, the shell（1）The surrounding of bottom has been fixedly connected with support leg（9）, and support leg（9）Bottom activity peace
Equipped with idler wheel（10）.
2. a kind of full-automatic silicon wafer according to claim 1 detects sorting unit, it is characterised in that：The shell（1）Also
It is provided with thickness detection apparatus, and thickness detection apparatus is electrically connected central processing unit.
3. a kind of full-automatic silicon wafer according to claim 2 detects sorting unit, it is characterised in that：The Thickness sensitivity dress
It sets including supporting rod（12）, and supporting rod（12）The lower end on right side is movably installed with lower compression roller（18）, supporting rod（12）Right end
Top is fixedly connected with support plate（15）, and support plate（15）The right end of bottom is fixedly connected with sleeve（16）, sleeve（16）It is interior
The top of chamber passes through spring（17）It is connected with motion bar（14）, and motion bar（14）The middle-end of bottom is embedded with Distance-sensing
Device（13）, motion bar（14）The lower end on right side is movably installed with pressure roller（19）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820652936.6U CN208091938U (en) | 2018-05-03 | 2018-05-03 | A kind of full-automatic silicon wafer detection sorting unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820652936.6U CN208091938U (en) | 2018-05-03 | 2018-05-03 | A kind of full-automatic silicon wafer detection sorting unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208091938U true CN208091938U (en) | 2018-11-13 |
Family
ID=64052740
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820652936.6U Expired - Fee Related CN208091938U (en) | 2018-05-03 | 2018-05-03 | A kind of full-automatic silicon wafer detection sorting unit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208091938U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108680580A (en) * | 2018-05-03 | 2018-10-19 | 浙江海顺新能源有限公司 | A kind of full-automatic silicon wafer detection sorting unit |
| CN115219513A (en) * | 2022-06-24 | 2022-10-21 | 江苏南星家纺有限公司 | A intelligent fabrics examines test table for quality detects |
-
2018
- 2018-05-03 CN CN201820652936.6U patent/CN208091938U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108680580A (en) * | 2018-05-03 | 2018-10-19 | 浙江海顺新能源有限公司 | A kind of full-automatic silicon wafer detection sorting unit |
| CN115219513A (en) * | 2022-06-24 | 2022-10-21 | 江苏南星家纺有限公司 | A intelligent fabrics examines test table for quality detects |
| CN115219513B (en) * | 2022-06-24 | 2024-04-05 | 江苏南星家纺有限公司 | Intelligent textile detection table for quality detection |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI653450B (en) | Linear inspection system | |
| CN208091938U (en) | A kind of full-automatic silicon wafer detection sorting unit | |
| CN202049116U (en) | Device for detecting and classifying packaging chips | |
| CN108680580A (en) | A kind of full-automatic silicon wafer detection sorting unit | |
| CN104124182B (en) | Turret type detection machine and using method thereof | |
| CN206057205U (en) | A kind of notebook computer assembly quality automatic detection device | |
| CN211253276U (en) | Automatic intelligent detection and packaging production line equipment for memory bank | |
| CN107403737A (en) | Automatic packaging production line, packaging method and packaging system | |
| CN1705875A (en) | Vessel inspection method and vessel inspection device | |
| CN104417788A (en) | Small-sized packing horizontal sealing detection method and small-sized packing horizontal sealing detection system having quality tracing function | |
| CN204674955U (en) | Automatic measurement banding machine | |
| KR101995888B1 (en) | Lead frame automatic inspection system | |
| CN206691423U (en) | A kind of range estimation packing machine at a high speed | |
| CN205810339U (en) | A kind of carrier device for liquid crystal module detection | |
| CN202533382U (en) | Visual appearance on-line detection machine | |
| CN108355982A (en) | A kind of dispensing detection all-in-one machine | |
| CN206142367U (en) | Intelligent test braider | |
| CN204425806U (en) | A kind of LED inserter of tape test mechanism | |
| CN105021622A (en) | Welding rod quality detection system | |
| CN206292180U (en) | A kind of video detecting system for bottle cap production | |
| CN207474597U (en) | Poly-lithium battery automatic production line | |
| CN209326570U (en) | The flat woollen selecting device for shining the production of aluminium label | |
| CN206450247U (en) | A kind of efficent electronic product detection device | |
| CN207413821U (en) | A kind of centre-to-centre spacing full inspection sorting unit of battery pole ear | |
| CN102916092B (en) | The device and method of detection and classification wafer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181113 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |