CN108677147B - Vapor deposition apparatus and vapor deposition method - Google Patents
Vapor deposition apparatus and vapor deposition method Download PDFInfo
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- CN108677147B CN108677147B CN201810609169.5A CN201810609169A CN108677147B CN 108677147 B CN108677147 B CN 108677147B CN 201810609169 A CN201810609169 A CN 201810609169A CN 108677147 B CN108677147 B CN 108677147B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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Abstract
The invention discloses an evaporation device and an evaporation method, and belongs to the field of display. The vapor deposition device includes: the device comprises an evaporation base, an evaporation source base, a moving assembly and at least two groups of evaporation sources, wherein each group of evaporation sources comprises at least one evaporation source; the evaporation base station is used for fixing a substrate to be evaporated; the moving assembly is fixedly connected with the evaporation source base station and is used for driving the evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated; the at least two groups of evaporation sources are sequentially and fixedly arranged on one side, close to the evaporation base station, of the evaporation source base station along the moving direction of the evaporation source base station, the effective evaporation areas of the at least two groups of evaporation sources at the same moment are not overlapped, and each group of evaporation source is used for forming an evaporation coating layer in the evaporation process. The invention effectively improves the evaporation efficiency of the evaporation device. The invention is used for manufacturing the film layer in the display panel.
Description
Technical Field
The invention relates to the field of display, in particular to an evaporation device and an evaporation method.
Background
In the process of fabricating an Organic Light-Emitting Diode (OLED) display panel, an evaporation method is usually used to fabricate a film layer.
In the related art, the evaporation apparatus generally includes a plurality of evaporation sources, each of which includes an evaporation crucible and a nozzle disposed at an outlet of the evaporation crucible. The principle of the evaporation method is as follows: the method comprises the steps of placing an evaporation source material in an evaporation crucible, heating the evaporation source material in modes of resistance heating or electron beam heating and the like to convert the evaporation source material from a liquid state or a solid state into a gaseous state, spraying the gaseous evaporation source material to the surface of a substrate to be coated through a nozzle, and depositing the gasified evaporation source material on the surface of the substrate to be coated to form a film layer.
The plurality of evaporation sources are used for manufacturing one film layer. Therefore, the vapor deposition device has low vapor deposition efficiency.
Disclosure of Invention
The embodiment of the invention provides an evaporation device and an evaporation method, which can solve the problem of low evaporation efficiency of the evaporation device in the related art. The technical scheme is as follows:
in a first aspect, an evaporation apparatus is provided, the evaporation apparatus including: the device comprises an evaporation base, an evaporation source base, a moving assembly and at least two groups of evaporation sources, wherein each group of evaporation sources comprises at least one evaporation source;
the evaporation base station is used for fixing a substrate to be evaporated;
the moving assembly is fixedly connected with the evaporation source base station and is used for driving the evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated;
the at least two groups of evaporation sources are sequentially and fixedly arranged on one side, close to the evaporation base station, of the evaporation source base station along the moving direction of the evaporation source base station, the effective evaporation areas of the at least two groups of evaporation sources at the same moment are not overlapped, and each group of evaporation source is used for forming an evaporation coating layer in the evaporation process.
Optionally, the evaporation apparatus further includes: a rotation assembly and a substrate replacement assembly;
the rotating assembly is used for driving the integral structure formed by the at least two groups of evaporation sources to rotate 180 degrees in the arrangement surfaces of the at least two groups of evaporation sources when the evaporation source base station moves to any end of the substrate to be evaporated;
the substrate replacing component is used for replacing the substrate to be evaporated and fixed on the evaporation base platform when the evaporation source base platform moves to any end of the substrate to be evaporated and plated.
Optionally, the evaporation device is arranged in the evaporation chamber, one end of the rotating assembly is fixedly connected with the evaporation source base station, and the other end of the rotating assembly is connected with the inner wall of the evaporation chamber.
Optionally, the evaporation apparatus further includes: the at least two groups of evaporation sources are sequentially and fixedly arranged on one side, close to the evaporation base, of the evaporation source support plate along the moving direction of the evaporation source base;
one end of the rotating assembly is fixedly connected with the evaporation source base station, and the other end of the rotating assembly is fixedly connected with the evaporation source supporting plate.
Optionally, the evaporation apparatus further includes: a locking structure;
the locking structure is used for locking the rotating assembly in the process that the evaporation source base station moves along the extending direction of the substrate to be evaporated.
Optionally, the evaporation apparatus further includes: a shutter configured to: when the evaporation source base station moves to any end of the substrate to be evaporated, the evaporation source base station moves to a position between the at least two groups of evaporation sources and the evaporation base station so as to shield the at least two groups of evaporation sources.
Optionally, the evaporation device is disposed in the evaporation chamber, and the moving assembly includes: the vapor deposition device comprises a sliding piece and a sliding guide rail arranged on the inner wall of the vapor deposition chamber, wherein one end of the sliding piece is in sliding connection with the sliding guide rail, and the other end of the sliding piece is fixedly connected with the vapor deposition source base platform.
Optionally, the evaporation source comprises: the evaporation crucible is used for placing evaporation source materials, and the nozzle is used for spraying the evaporation source materials to the substrate to be evaporated.
In a second aspect, there is provided an evaporation method applied to the evaporation apparatus according to any one of the first aspects, the method including:
fixing a substrate to be evaporated through an evaporation base;
driving an evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated through a moving assembly;
in the process of moving the evaporation source base station, evaporating an evaporation source material to the substrate to be evaporated through each of at least two groups of evaporation sources to form an evaporation film layer;
the effective evaporation areas of the at least two groups of evaporation sources at the same time are not overlapped.
Optionally, the method further comprises:
when the evaporation source base station moves to any end of the substrate to be evaporated, the whole structure formed by the at least two groups of evaporation sources is driven by the rotating component to rotate 180 degrees in the setting surface of the at least two groups of evaporation sources, and the substrate to be evaporated fixed on the evaporation base station is replaced by the substrate replacing component.
In a third aspect, an evaporation system is provided, which includes: the coating device comprises a coating chamber and the coating device of any one of the first aspect, wherein the coating device is arranged in the coating chamber.
The technical scheme provided by the embodiment of the invention has the following beneficial effects:
according to the evaporation device and the evaporation method provided by the embodiment of the invention, the evaporation is performed on the substrate to be evaporated through at least two groups of evaporation sources in the evaporation device, and the effective evaporation areas of the at least two groups of evaporation sources at the same time are not overlapped, so that at least two film layers are formed on the substrate to be evaporated in a process (also called a primary scanning process) that the moving assembly is used for driving the evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an evaporation chamber in the related art;
fig. 2 is a schematic structural diagram of an evaporation apparatus according to an embodiment of the present invention;
fig. 3 is a schematic structural diagram of another evaporation apparatus provided in an embodiment of the present invention;
fig. 4 is a schematic structural diagram of another evaporation apparatus according to an embodiment of the present invention;
fig. 5 is a schematic structural diagram illustrating the evaporation source base station shown in fig. 3 driven to rotate by the rotating assembly according to the embodiment of the present invention;
fig. 6 is a schematic structural diagram of another evaporation apparatus according to an embodiment of the present invention;
FIG. 7 is a flowchart of a method for evaporation according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of an evaporation system according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
Fig. 1 is a schematic structural diagram of an evaporation chamber in the related art, and as shown in fig. 1, the evaporation apparatus is disposed in the evaporation chamber 1, and includes: an evaporation base 101, an evaporation source base 102, a heating assembly and an evaporation source cluster (cluster). This evaporation source cluster is fixed to be set up on evaporation source base station 102, includes three evaporation source 103 in this evaporation source cluster, and every evaporation source 103 includes: a vapor deposition crucible 1031 and a nozzle 1032 provided at an outlet of the vapor deposition crucible 1031, and effective vapor deposition areas of the three vapor deposition sources 103 at the same timing overlap. For example, in fig. 1, the region indicated by the dashed line a1 is the effective evaporation area of the three evaporation sources at time t. The evaporation base 101 is used for fixing a substrate 20 to be evaporated; the heating assembly is used for heating the evaporation source material to change the phase of the evaporation source material from liquid or solid into gas; the evaporation crucible 1031 is used for placing evaporation source materials; the nozzle 1032 is used for spraying the evaporation source material which is changed into a gaseous state to the substrate 20 to be evaporated, so that the evaporated evaporation source material is deposited on the surface of the substrate to be coated to form a film layer.
The vapor deposition source base 102 is further provided with a shield plate 104 for shielding the vapor deposition source when the vapor deposition source material is not required to be ejected onto the substrate 20 to be vapor deposited, and a holder 105 for fixing the shield plate 104.
According to the structure of the vapor deposition device, the effective vapor deposition areas of the three vapor deposition sources are overlapped, so that only one film layer can be vapor deposited on the substrate to be vapor deposited in the process that the vapor deposition source base platform moves from one end of the substrate to be vapor deposited to the other end of the substrate to be vapor deposited (also called a one-time scanning process). And after finishing a scanning process, the evaporation source base station needs to drive the evaporation source to move from the other end of the substrate to be evaporated to one end of the substrate to be evaporated, so that the evaporation source is reset, and the scanning process is repeated through the reset evaporation source, so that a film layer is continuously evaporated on the substrate to be evaporated. Because this coating by vaporization device only can a rete of coating by vaporization at a scanning in-process, and after accomplishing the coating by vaporization of a rete, can continue the coating by vaporization after need resetting the coating by vaporization source, consequently, this coating by vaporization device's coating by vaporization efficiency is lower.
To this end, an embodiment of the present invention provides a vapor deposition device 2, and as shown in fig. 2, the vapor deposition device 2 may include: evaporation plating base platform 21, evaporation plating source base platform 22, removal component 23 and an evaporation plating source cluster, this evaporation plating source cluster includes at least two sets of evaporation plating sources, and every group evaporation plating source includes at least one evaporation plating source 24. Fig. 2 shows that one evaporation source cluster includes three evaporation sources 24, and the three evaporation sources 24 are divided into two groups of evaporation sources, where two evaporation sources in a dashed line box T1 are one group of evaporation sources, and two evaporation sources in a dashed line box T2 are one group of evaporation sources. Alternatively, the evaporation source 24 may be a line source evaporation source or a surface source evaporation source.
The vapor deposition base 21 is used to fix the substrate 20 to be vapor deposited.
The moving assembly 23 is fixedly connected to the evaporation source base 22, and the moving assembly 23 is used for driving the evaporation source base 22 to move from one end of the substrate 20 to be evaporated to the other end of the substrate 20 to be evaporated.
At least two sets of coating by vaporization sources along the moving direction B of coating by vaporization source base station 22, fixed setting is in proper order in one side that coating by vaporization source base station 22 is close to coating by vaporization base station 21, and the effective coating by vaporization area of at least two sets of coating by vaporization sources at same moment does not overlap, and wherein, every group coating by vaporization source is used for forming a coating by vaporization layer at the coating by vaporization in-process. And each set of evaporation sources can comprise: a deposition crucible 241 and a nozzle 242, the nozzle 242 being fixedly disposed on an outlet of the deposition crucible 241, the deposition crucible 241 being used for placing a deposition source material, and the nozzle 242 being used for spraying the deposition source material to the substrate 20 to be deposited. Alternatively, the relative positions of the evaporation sources may be adjusted, or the spraying angles of the nozzles 242 in the evaporation sources 24 may be adjusted, so that the effective evaporation areas of the at least two groups of evaporation sources at the same time do not overlap. For example, the effective evaporation areas of the two sets of evaporation sources shown in fig. 2 at time t are shown by a dashed box a2 and a dashed box A3, respectively, and the effective evaporation areas shown by the dashed box a2 and the dashed box A3 do not overlap.
The vapor deposition device 2 may further include: and a heating assembly (not shown in fig. 2) for heating the evaporation source material to change the evaporation source material from a liquid state or a solid state into a gas state.
In summary, in the evaporation apparatus provided in the embodiment of the present invention, at least two sets of evaporation sources are used to evaporate the substrate 20 to be evaporated, and the effective evaporation areas of the at least two sets of evaporation sources at the same time do not overlap, so that at least two film layers are formed on the substrate 20 to be evaporated in a process that the moving component is used to drive the evaporation source base to move from one end of the substrate 20 to be evaporated to the other end of the substrate 20 to be evaporated (i.e., in a scanning process).
Wherein, the moving assembly 23 includes: a slide member (not shown in fig. 2) and a slide guide (not shown in fig. 2) provided on the inner wall of the evaporation chamber, one end of the slide member is slidably connected to the slide guide, and the other end of the slide member is fixedly connected to the evaporation source base 22.
Optionally, referring to fig. 3 and 4, the evaporation apparatus 2 may further include: a rotation assembly 25 and a substrate replacement assembly (not shown in fig. 3 and 4).
The rotating assembly 25 is used for driving the overall structure formed by at least two sets of evaporation sources to rotate 180 degrees in the arrangement surface of at least two sets of evaporation sources when the evaporation source base 22 moves to any end of the substrate 20 to be evaporated.
The substrate replacing assembly is used for replacing the substrate 20 to be evaporated fixed on the evaporation base table 21 when the evaporation source base table 22 moves to any end of the substrate 20 to be evaporated. Optionally, the substrate replacement assembly may include a robot.
When evaporation source base station 22 is moved to the other end of treating the base plate 20 of coating by vaporization by the one end of treating the base plate 20 of coating by vaporization, drive the overall structure that at least two sets of evaporation sources constitute through this rotating assembly 25, at the setting face internal rotation 180 degrees of at least two sets of evaporation sources to and replace the fixed base plate 20 of treating the coating by vaporization on evaporation base station 21 through the base plate replacement subassembly, make in-process that evaporation source base station 22 is moved to this one end of treating the base plate 20 of coating by this other end of treating the base plate 20 of coating by vaporization, can continue to form two at least retes on the base plate 20 of treating the coating by vaporization after the replacement through this two sets of evaporation sources. Compared with the prior art, the evaporation source base station 22 does not need to be reset to one end of the substrate 20 to be evaporated, the replaced substrate 20 to be evaporated can be evaporated, time consumed by resetting the evaporation source base station 22 can be reduced, so that the evaporation device 2 can evaporate film layers on more substrates 20 to be evaporated within the same time period, and the evaporation efficiency of the evaporation device 2 is further improved. Correspondingly, because the condition that makes the evaporation coating source material phase transition to gaseous state is higher, consequently, this nozzle is in normally open state, no matter deposition device 2 is in the evaporation coating state, this nozzle all keeps being the spray regime, when need not to wait for evaporation coating source base station 22 to reset to this one end of treating the base plate 20 of evaporation coating, just can reduce the waste of evaporation coating source material when treating the base plate 20 of evaporation coating after the replacement when evaporating coating, improves the utilization ratio of evaporation coating source material, and then reduces display panel's manufacturing cost.
As an implementation manner of the rotating assembly 25, referring to fig. 3, one end of the rotating assembly 25 may be fixedly connected to the evaporation source base 22, and the other end of the rotating assembly 25 may be connected to an inner wall of the evaporation chamber (e.g., a bottom of the evaporation chamber). When the rotation member 25 is rotated, a connection point between the other end of the rotation member 25 and the vapor deposition chamber may serve as a fulcrum when the rotation member 25 is rotated, so that the one end of the rotation member 25 is rotated about the fulcrum as a rotation center. In order to reduce the resistance to rotation, the rotation unit 25 may have a telescopic function, and when the vapor deposition source base 22 needs to be rotated, the rotation unit 25 may extend in a direction perpendicular to the installation surface of the vapor deposition source 24 to raise the vapor deposition source base 22 and rotate the vapor deposition source base 22. During the evaporation process, the rotating assembly 25 contracts to reduce the resistance generated by the contact of the rotating assembly 25 and the evaporation chamber. For example, the expansion and contraction function of the rotating assembly 25 may be realized by a spring and a buckle, and when the spring is in an expansion state and the buckle is in a non-locking state, the rotating assembly 25 may expand in a direction perpendicular to the installation surface of the evaporation source 24; when the spring is in a compressed state and the catch is in a locked state, the catch is used to maintain the compressed state of the spring such that the rotating assembly 25 is in a retracted state.
Among them, the rotating assembly 25 may include: in this first embodiment, the stationary part is fixedly connected to the deposition chamber and the rotary part is fixedly connected to the deposition source base 22. When the rotating portion rotates, the rotating portion can drive the evaporation source base station 22 to rotate, and the overall structure formed by at least two groups of evaporation sources can rotate 180 degrees in the setting surface of the at least two groups of evaporation sources under the driving of the evaporation source base station 22.
For example, in this implementation manner, after the evaporation source base 22 shown in fig. 3 is driven to rotate by the rotating component 25, referring to fig. 5, it can be seen from fig. 5 that the overall structure formed by at least two sets of evaporation sources is rotated 180 degrees in the installation surface of the at least two sets of evaporation sources under the driving of the evaporation source base 22.
Optionally, referring to fig. 4, the evaporation apparatus 2 may further include: and a vapor deposition source support plate 26, which is fixedly provided on the side of the vapor deposition source support plate 26 close to the vapor deposition base 21 in the moving direction B of the vapor deposition source base 22. Accordingly, as another implementation manner of the rotation member 25, one end of the rotation member 25 may be fixedly connected to the evaporation source base 22, and the other end of the rotation member 25 may be fixedly connected to the evaporation source support plate 26.
Wherein the rotating assembly 25 comprises: a fixed portion (not shown in fig. 4) to which the rotation portion is rotatable, and a rotation portion (not shown in fig. 4) to which the deposition source support plate 26 is fixedly connected. When the rotating part rotates, the rotating part can drive the evaporation source supporting plate 26 to rotate, and the overall structure formed by at least two groups of evaporation sources can rotate 180 degrees in the setting surface of the at least two groups of evaporation sources under the driving of the evaporation source supporting plate 26.
Further, the vapor deposition device 2 includes: a locking structure (not shown in fig. 5). The locking structure is used for locking the rotating assembly 25 in the process of moving the evaporation source base platform 22 along the extending direction of the substrate 20 to be evaporated. Alternatively, the locking structure may be a snap or the like. In the moving process, the locking mechanism locks the rotating assembly 25, so that the evaporation source base table 22 can be ensured not to be driven by the rotating assembly 25 to rotate in the moving process, and the thickness uniformity of a film layer formed on the substrate 20 to be evaporated can be ensured.
Referring to fig. 6, the evaporation apparatus 2 may further include: a shielding plate 27, wherein the shielding plate 27 can be fixed on the vapor deposition source base 22 by a holder 28. The shielding plate 27 is configured to: when the evaporation source base table 22 moves to any end of the substrate 20 to be evaporated, the evaporation source base table moves to a position between at least two groups of evaporation sources and the evaporation base table 21 to shield the at least two groups of evaporation sources, so that in the rotating process of the overall structure formed by the at least two groups of evaporation sources, the evaporation source material cannot be sprayed onto the substrate 20 to be evaporated, and the thickness uniformity of a film layer formed on the substrate 20 to be evaporated is further ensured.
In summary, the evaporation apparatus provided in the embodiments of the present invention performs evaporation on a substrate to be evaporated by at least two sets of evaporation sources, and the effective evaporation areas of the at least two sets of evaporation sources at the same time do not overlap, so that at least two film layers are formed on the substrate to be evaporated in a process in which a moving component is used to drive an evaporation source base to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated (i.e. in a scanning process), compared to the related art, the number of film layers formed in a scanning process is increased, and the rotating component drives the at least two sets of evaporation sources to rotate 180 degrees in the setting surface, and the substrate to be evaporated fixed on the evaporation base is replaced by a substrate replacement component, so as to reduce the time consumed by resetting the evaporation source base, so that the evaporation apparatus can perform evaporation on more substrates to be evaporated in the same time period, effectively improving the evaporation efficiency of the evaporation method.
An embodiment of the present invention further provides an evaporation method, which can be applied to the evaporation apparatus provided in the embodiment of the present invention, and referring to fig. 7, the method may include:
Alternatively, the evaporation base can generate an adsorption force, and the adsorption force can fix the substrate to be evaporated on the evaporation base. The substrate to be evaporated may be a transparent substrate, and specifically, the substrate may be a substrate made of a light-guiding and non-metallic material having a certain hardness, such as glass, quartz, or transparent resin.
Step 602, driving the evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated through the moving assembly, and evaporating the evaporation source material to the substrate to be evaporated through each evaporation source of the at least two groups of evaporation sources in the moving process of the evaporation source base station to form an evaporation film layer.
Because at least two sets of coating by vaporization sources are the moving direction of following the coating by vaporization source base station, fixed setting is close to one side of coating by vaporization base station at the coating by vaporization source base station in proper order, and at least two sets of effective coating by vaporization sources are at same moment the effective coating by vaporization area non-overlapping, at the in-process that the coating by vaporization source moved, should treat the coating by vaporization base plate other end by nearly to distant distance according to the coating by vaporization source, a set of coating by vaporization source that is close to this and treats the coating by vaporization base plate other end can form a rete on the surface of the base plate of treating the coating by vaporization earlier, keep away from this and treat that a set of coating by vaporization source of the coating by vaporization base plate other end can form a rete on the rete of this formation again, analogi.
Further, the vapor deposition apparatus may further include: a rotation assembly and a substrate replacement assembly. Correspondingly, the evaporation method can also comprise the following steps:
When the evaporation source base station moves from one end of the substrate to be evaporated to the other end of the substrate to be evaporated, the rotating assembly drives at least two groups of evaporation sources to form an integral structure, the integral structure rotates 180 degrees in the arrangement surfaces of the at least two groups of evaporation sources, and the substrate to be evaporated fixed on the evaporation base station is replaced by the substrate replacement assembly, so that in the process that the evaporation source base station moves from the other end of the substrate to be evaporated to one end of the substrate to be evaporated, at least two film layers can be continuously formed on the replaced substrate to be evaporated by the at least two groups of evaporation sources, relative to the related technology, the evaporation device can evaporate film layers on more substrates to be evaporated in the same time period without waiting for the evaporation source base station to reset to one end of the substrate to be evaporated, further improving the evaporation efficiency of the evaporation device.
In summary, in the evaporation method provided by the embodiments of the present invention, during the moving process of the evaporation source base, at least two sets of evaporation sources are used to evaporate the substrate to be evaporated, and the effective evaporation areas of the at least two sets of evaporation sources at the same time are not overlapped, so that at least two film layers are formed on the substrate to be evaporated in the process that the moving component is used to drive the evaporation source base to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated (also referred to as a primary scanning process), compared with the related art, the number of film layers formed in the primary scanning process is increased, and the rotation component drives the installation surface of the at least two sets of evaporation sources to rotate 180 degrees, and the substrate to be evaporated fixed on the evaporation base is replaced by the substrate replacement component, so as to reduce the time consumed by resetting the evaporation source base, the evaporation device can evaporate film layers on more substrates to be evaporated within the same time, and the evaporation efficiency of the evaporation method is effectively improved.
An embodiment of the present invention further provides an evaporation system, please refer to fig. 8, where the evaporation system may include: the vapor deposition chamber 01 and the vapor deposition device 2 according to the above embodiment, the vapor deposition device 2 is provided in the vapor deposition chamber 01.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (8)
1. An evaporation apparatus, comprising: the device comprises an evaporation base platform, an evaporation source base platform, a moving assembly, a rotating assembly, a substrate replacing assembly and at least two groups of evaporation sources, wherein each group of evaporation sources comprises at least one evaporation source;
the evaporation base station is used for fixing a substrate to be evaporated;
the moving assembly is fixedly connected with the evaporation source base station and is used for driving the evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated;
the at least two groups of evaporation sources are sequentially and fixedly arranged on one side, close to the evaporation base, of the evaporation source base along the moving direction of the evaporation source base, the effective evaporation areas of the at least two groups of evaporation sources at the same moment are not overlapped, and each group of evaporation sources is used for forming an evaporation coating layer in the evaporation process;
the rotating assembly is used for driving the integral structure formed by the at least two groups of evaporation sources to rotate 180 degrees in the arrangement surfaces of the at least two groups of evaporation sources when the evaporation source base station moves to any end of the substrate to be evaporated;
the substrate replacing component is used for replacing the substrate to be evaporated and fixed on the evaporation base platform when the evaporation source base platform moves to any end of the substrate to be evaporated and plated.
2. The evaporation device according to claim 1, wherein the evaporation device is disposed in an evaporation chamber, one end of the rotating assembly is fixedly connected to the evaporation source base, and the other end of the rotating assembly is connected to an inner wall of the evaporation chamber.
3. The vapor deposition device according to claim 1, further comprising: the at least two groups of evaporation sources are sequentially and fixedly arranged on one side, close to the evaporation base, of the evaporation source support plate along the moving direction of the evaporation source base;
one end of the rotating assembly is fixedly connected with the evaporation source base station, and the other end of the rotating assembly is fixedly connected with the evaporation source supporting plate.
4. The vapor deposition apparatus according to any one of claims 1 to 3, further comprising: a locking structure;
the locking structure is used for locking the rotating assembly in the process that the evaporation source base station moves along the extending direction of the substrate to be evaporated.
5. The vapor deposition apparatus according to any one of claims 1 to 3, further comprising: a shutter configured to: when the evaporation source base station moves to any end of the substrate to be evaporated, the evaporation source base station moves to a position between the at least two groups of evaporation sources and the evaporation base station so as to shield the at least two groups of evaporation sources.
6. A deposition apparatus according to any one of claims 1 to 3, wherein the deposition apparatus is disposed in a deposition chamber, and the moving assembly comprises: the vapor deposition device comprises a sliding piece and a sliding guide rail arranged on the inner wall of the vapor deposition chamber, wherein one end of the sliding piece is in sliding connection with the sliding guide rail, and the other end of the sliding piece is fixedly connected with the vapor deposition source base platform.
7. The vapor deposition device according to any one of claims 1 to 3, wherein the vapor deposition source comprises: the evaporation crucible is used for placing evaporation source materials, and the nozzle is used for spraying the evaporation source materials to the substrate to be evaporated.
8. A vapor deposition method applied to the vapor deposition apparatus according to any one of claims 1 to 7, the method comprising:
fixing a substrate to be evaporated through an evaporation base;
driving an evaporation source base station to move from one end of the substrate to be evaporated to the other end of the substrate to be evaporated through a moving assembly;
in the process of moving the evaporation source base station, evaporating an evaporation source material to the substrate to be evaporated through each of at least two groups of evaporation sources to form an evaporation film layer, wherein the effective evaporation areas of the at least two groups of evaporation sources at the same moment are not overlapped;
when the evaporation source base station moves to any end of the substrate to be evaporated, the whole structure formed by the at least two groups of evaporation sources is driven by the rotating component to rotate 180 degrees in the setting surface of the at least two groups of evaporation sources, and the substrate to be evaporated fixed on the evaporation base station is replaced by the substrate replacing component.
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| CN109609909B (en) * | 2019-01-03 | 2021-01-26 | 京东方科技集团股份有限公司 | Evaporation method and system |
| CN109628886B (en) * | 2019-01-10 | 2021-01-19 | 云谷（固安）科技有限公司 | Evaporation device, evaporation method, mixing layer and display panel |
| CN111394698A (en) * | 2020-05-06 | 2020-07-10 | 贵州省高新光电材料及器件研究院有限公司 | Method for uniformly coating film |
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