CN108627762B - Test system - Google Patents
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- CN108627762B CN108627762B CN201810589339.8A CN201810589339A CN108627762B CN 108627762 B CN108627762 B CN 108627762B CN 201810589339 A CN201810589339 A CN 201810589339A CN 108627762 B CN108627762 B CN 108627762B
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- 238000012360 testing method Methods 0.000 title claims abstract description 103
- 239000000523 sample Substances 0.000 claims abstract description 80
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 230000003287 optical effect Effects 0.000 claims abstract description 10
- 238000001816 cooling Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 13
- 230000017525 heat dissipation Effects 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 238000007599 discharging Methods 0.000 claims description 8
- 238000004891 communication Methods 0.000 claims description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000000110 cooling liquid Substances 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000000452 restraining effect Effects 0.000 claims description 2
- 238000001514 detection method Methods 0.000 abstract description 9
- 230000002035 prolonged effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 description 7
- 239000000835 fiber Substances 0.000 description 4
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
The application relates to a test system which is used for testing a semiconductor laser chip and comprises a loading and unloading device, a probe assembly and an integrating sphere assembly; the loading and unloading device comprises a plurality of stations, and the stations are used for placing chips to be tested; the probe assembly comprises a plurality of probes, and the probes are arranged above the chip to be tested; the integrating sphere component comprises an integrating sphere, and an opening is formed in the integrating sphere and is close to the chip to be tested; when the current flows through the pins of the chip to be tested through the probes, the opening receives the optical signals sent by the chip to be tested. According to the test device, the probe assembly and the integrating sphere assembly are respectively arranged to be capable of moving along the vertical direction and the horizontal direction, so that the detection element is protected, the service life is prolonged, and the test speed is further improved through ordered movement.
Description
Technical Field
The present disclosure relates to the field of chip testing, and in particular, to a testing system for semiconductor laser chips.
Background
The most common form of packaging for semiconductor laser chips is COS (Chip On Submount), i.e., directly on a heat sink with a high thermal conductivity. The quality of the semiconductor laser is related to the process at this stage, so that after the packaging process step, strict functional detection is needed, and the quality of the semiconductor laser is directly affected by the quality of the performance parameters.
Testing and characterizing performance parameters (such as LIV (Light-Current-Voltage) characteristics, spectral characteristics, FFP (Far-Field Pattern) characteristics) of semiconductor laser chips are key for deeply understanding the characteristics of the laser chips, optimizing the chip structure design and perfecting the chip production process, and are also important bases for judging whether the laser chips are good or bad. Meanwhile, each COS needs to be strictly tested before the products are shipped, so that the quality of the products after shipment is ensured.
The existing COS test system is composed of discrete instruments, and only one test station exists, and mainly has the following problems: the method is purely by manual operation of operators, and because only one test station exists, COS feeding, test operation, data retention and COS discharging are needed to be completed sequentially, and the time consumption is long.
Disclosure of Invention
The purpose of the application is to provide a test system, which can realize the rapid test of a semiconductor laser chip, thereby improving the test efficiency.
In order to solve the technical problems, the technical scheme adopted by the application is as follows:
the test system is used for testing the semiconductor laser chips and comprises a loading and unloading device, a probe assembly and an integrating sphere assembly, wherein the loading and unloading device comprises a plurality of stations, and the stations are used for placing chips to be tested; the probe assembly comprises a plurality of probes which are arranged above the chip to be tested and used for providing current for the chip to be tested; the integrating sphere component comprises an integrating sphere, an opening is formed in the integrating sphere, and the opening is arranged close to the chip to be tested; when the current flows through the pins of the chip to be tested through the probes, the opening receives the optical signals sent by the chip to be tested so as to test the chip to be tested.
In some embodiments, the feeding and discharging device further comprises a rotating base and a supporting substrate, the supporting substrate is arranged on the rotating base, the plurality of stations are arranged on the supporting substrate, the rotating base is used for driving the plurality of stations to rotate, and when one of the plurality of stations rotates to the lower side of the probe, other stations of the plurality of stations feed or discharge.
In some embodiments, the station includes a fixture and a heat sink; the fixing piece is arranged on the surface of the heat dissipation piece; the heat dissipation piece comprises a copper plate, a refrigerating sheet and a cooling block which are sequentially stacked, the surface of the copper plate is plated with gold, the heat absorption surface of the refrigerating sheet is attached to the lower surface of the copper plate, and the heat dissipation surface of the refrigerating sheet is attached to the upper surface of the cooling block.
In some embodiments, a plurality of communication grooves are provided inside the cooling block, and a cooling liquid circulates inside the cooling block through the communication grooves.
In some embodiments, the test device further includes a wire harness groove, the wire harness groove is fixedly arranged on the support substrate, the wire harness groove is arranged in a hollow tube shape, and a central axis of the wire harness groove coincides with a rotation central line of the rotating base; the wire harness slot is used for placing and restraining an electric circuit and a water pipe which are connected with the stations.
In some embodiments, the probe assembly further comprises a cross beam, a first sliding member and a first telescopic member, wherein the first sliding member is fixed on the cross beam, the plurality of probes are connected with the first telescopic member through the first sliding member, and the first telescopic member is used for adjusting the distance between the plurality of probes and the chip to be tested.
In some embodiments, the first slider comprises a first fixed plate, a first slider, and a first rail, the first fixed plate being fixedly connected to the cross beam; the first track is paved on the surface of the first fixed plate.
In some embodiments, the first telescopic member includes a telescopic portion and a connecting rod, the first slider is connected to the telescopic portion through the connecting rod, and the first slider moves along the first guide rail in a vertical direction to adjust distances between the plurality of probes and the chip to be tested.
In some embodiments, the integrating sphere assembly further includes a support base, a second sliding member and a second telescopic member, the second sliding member is fixed on the support base, the integrating sphere is connected with the second telescopic member through the second sliding member, and the second telescopic member is used for adjusting the distance between the integrating sphere and the chip to be tested.
In some embodiments, the second slider comprises a second fixed plate, a second slider, and a second guide rail, wherein the second fixed plate is fixedly connected with the support seat; the second track is paved on the surface of the second fixing plate, the second telescopic piece is connected with the second sliding block, the second sliding block moves along the second guide rail in the horizontal direction, and the distance between the integrating sphere and the chip to be tested is adjusted.
The beneficial effects of this application are: different from the prior art, the application provides a test system, and the test system includes unloader, probe subassembly and integrating sphere subassembly. The loading and unloading device comprises a plurality of stations, wherein the stations can be divided into a testing station and a loading station, and other loading stations are loaded and unloaded while testing chips to be tested, so that the testing speed is improved; the probe assembly and the integrating sphere assembly are respectively arranged to be capable of moving along the vertical direction and the horizontal direction, so that the detection element is protected, the service life is prolonged, and the testing speed is further improved through orderly movement.
Drawings
FIG. 1 is a schematic three-dimensional structure of a test system according to the present application;
FIG. 2 is a schematic view of a partially enlarged structure of the portion of the frame A in FIG. 1;
FIG. 3 is a schematic three-dimensional structure of the loading and unloading device according to the present application
FIG. 4 is a schematic three-dimensional structure of a probe assembly as set forth in the present application;
FIG. 5 is a schematic three-dimensional view of a telescoping member according to the present application;
FIG. 6 is a schematic three-dimensional structure of an integrating sphere assembly according to the present application;
FIG. 7 is a schematic diagram of another embodiment of a test system according to the present application;
FIG. 8 is a schematic view of the cross-sectional structure A-A of FIG. 7.
Detailed Description
The following description of the technical solutions in the embodiments of the present application will be clear and complete, and it is obvious that the described embodiments are only some embodiments of the present application, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the present disclosure.
It is noted that directional terms referred to in this application, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are merely directions referring to the attached drawings, and thus are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application.
With the increasing expansion of the application fields of semiconductor lasers (LD, laser Diode), such as LD pump Solid-State lasers (DPL), pump sources of various fiber lasers, laser cutting, welding, medical treatment, laser military applications, and the like, the requirements for output power and reliability of semiconductor lasers are also increasing. The semiconductor laser chip is a semiconductor laser core part, and has a name of a semiconductor laser "CPU". Therefore, the development of the rapid test method and the development of the rapid test system of the semiconductor laser assembly have important significance for laser manufacturers, and can greatly improve the production yield of COS. Therefore, in order to increase the test speed of the semiconductor laser chip, improvements are necessary on the basis of the existing chip test system.
As shown in fig. 1, fig. 1 is a schematic three-dimensional structure of a test system according to the present application. In this embodiment, the test system includes a loading and unloading device 110 and a detection device, where the detection device includes a probe assembly 120 and an integrating sphere assembly 130, and the loading and unloading device 110, the probe assembly 120 and the integrating sphere assembly 130 are all fixedly arranged on a workbench 140.
The loading and unloading device 110 includes a plurality of stations, which may be divided into a loading station and a testing station, and the stations may be used to place chips (not shown) to be tested. The probe assembly 120 includes a plurality of probes disposed above the chip under test at the test station, the probes for providing current for light emission during testing of the chip under test. Integrating sphere assembly 130 is disposed on one side of the chip under test at the test station. When the test system works, a plurality of probes in the probe assembly 120 are contacted with pins of the chip to be tested, and current flows through the chip to be tested through the probes, so that the chip to be tested emits light, the integrating sphere assembly 130 collects optical signals of the chip to be tested, and the optical signals are led out to further analyze test results, so that the chip to be tested is tested.
It should be noted that the loading station and the testing station in the present application may be switched with each other, that is, the station opposite to the probe assembly 120 is the testing station, and the remaining stations are the loading stations. When the chip to be tested is positioned at the test station for testing, the rest of the loading stations can be used for blanking and reloading the tested chip.
Specifically, please refer to fig. 2 in conjunction with fig. 1, fig. 2 is a partial enlarged view of the frame a in fig. 1. The loading and unloading device 110 includes a plurality of stations 111, and the stations 111 are located right below the probe assembly 120, so the stations 111 are test stations. The station 111 includes a plurality of fixing members 1111, where the fixing members 1111 are used to fix the chip to be tested, so as to prevent the chip to be tested from moving during the testing process, thereby affecting the testing result.
Probe assembly 120 includes a probe set 121, probe set 121 including a plurality of probes 1211, the probe heads of probes 1211 being opposite stations 111. In the present embodiment, the number of probes 1211 is 4, and in other embodiments, the number of probes 1211 may be adjusted according to the actual test situation.
Integrating sphere assembly 130 includes integrating sphere 131, integrating sphere 131 is provided with an opening 1311, and opening 1311 of integrating sphere 131 is disposed near the chip to be tested at the test station from the lateral horizontal direction. When a current flows through the pins of the chip under test through the probes 1211, the chip under test emits light, and the opening 1311 collects the light signal emitted from the chip under test.
Further, please refer to fig. 1, fig. 2 and fig. 3, fig. 3 is a schematic three-dimensional structure of the feeding and discharging device in the present application. In this embodiment, the loading and unloading device 110 may include two stations 111; in other embodiments, the number of stations 111 may be adjusted based on actual testing conditions.
The loading and unloading device 110 comprises a rotating base 113 and a rotating substrate 112 arranged on the rotating base 113, the rotating substrate 112 is arranged on the rotating base 113, the stations 111 are arranged on the rotating substrate 112, and the rotating base 113 can rotate, so that the two stations 111 are alternately positioned at the opposite positions of the probe groups 121 in the probe assembly 120, and the two stations 111 are respectively used as a device station and a testing station in sequence.
When testing, the chip to be tested can generate a large amount of heat, and if the chip to be tested is not cooled in time, the test result and the service life of the chip to be tested can be influenced. In this embodiment, the station 111 includes a cooling member 1112 and a plurality of fixing members 1111 disposed on a surface of the cooling member 1112, where the fixing members 1111 are used to fix a chip to be tested. In this embodiment, the fixing member 1111 is an elastic pressing member, and at least one end of the fixing member 1111 is fixed to the cooling member 1112. The cooling member 1112 in this embodiment is a water-cooled structure, and a cooling groove is disposed inside the cooling member, and the cooling groove is connected with an external water pipe (not shown), so as to realize circulation of cooling liquid inside the cooling member 1112, and achieve the effect of real-time heat dissipation.
It should be noted that the driving manner of the rotating base 113 in this embodiment may be pneumatic, the air nozzle 1131 may be externally connected with an air pipe (not shown), and the rotating direction and the rotating speed of the rotating base 113 may be controlled by the control system. Of course, in other embodiments, the swivel base 113 may also be driven by a motor.
Because the multiple components in the feeding and discharging device 110 are connected with the water pipe or the air pipe, and meanwhile, other circuits are laid in the feeding and discharging device 110, in order to prevent the multiple circuits or the circuits from affecting the testing efficiency, the feeding and discharging device 110 in this embodiment further includes a wire harness slot 115, where the wire harness slot 115 is fixed with the rotating substrate 112 by a fixing block 116, and the wire harness slot 115 is provided with a through hole 1151 for placing the circuits or the circuits.
The beam slot 115 may be columnar and disposed at a rotation center of the rotation base 113, and a vertical central axis of the beam slot 115 coincides with the rotation center of the rotation base 113. The plurality of stations 111 are all distributed around the beam slot 115, and when the rotating base 113 rotates, the loading and unloading device 110 is fixed on the workbench 140 through the first supporting plate 114, so that stable rotation operation is realized.
Further, please refer to fig. 4 in conjunction with fig. 1 and 2, fig. 4 is a schematic three-dimensional structure of the probe assembly of the present application. The probe assembly 120 comprises a probe set 121, support columns 123, a cross beam 125 and a second support plate 124, wherein the probe set 121 is fixed by the cross beam 125 erected on the two support columns 123, and the support columns 123 are connected and fixed with the workbench 140 by the second support plate 124.
During testing, probe set 121 needs to contact probes 1211 with pins of the chip under test at the test station; after the test is completed, probes 1211 need to be moved away from the test station and separated from the pins of the chip under test. Thus, in the present embodiment, the probe assembly 120 further includes a first slider 126 and a first folder 122, and the probe set 121 is movable up and down in the vertical direction by the first folder 122.
Specifically, the probe set 121 is connected to the first telescopic member 122 through the first slider 126. The first sliding member 126 includes a first fixing plate 1262, where the first fixing plate 1262 is in an L-shape, one surface of one section of the first fixing plate 1262 is attached to and fixed to a vertical surface of the beam 125, the other section of the first fixing plate is fixed to the first telescopic member 122, and two sections of the first fixing plate 1262 are perpendicular to each other. Further, the first slider 126 includes a first slider 1263 and a first guide rail 1261, and the probe set 121 is fixed to the first slider 1263, and the first slider 1263 can move up and down along the first guide rail 1261 with the probe set 121.
Further, for a clearer description of the first telescopic member 122, please refer to fig. 4 in combination with fig. 5, fig. 5 is a schematic three-dimensional structure of the telescopic member 122 in the present embodiment. In this embodiment, the first telescopic member 122 is pneumatically driven, so that the first telescopic member 122 includes two air valves 1222, a telescopic portion 1221, a fixing portion 1224 and a connecting rod 1223, the air valves 1222 are externally connected with an air pipe, the telescopic portion 1221 is connected with the connecting rod 1223, and the telescopic portion 1221 is driven by pneumatic pressure to move.
The fixing portion 1224 is fixed to one section of the first fixing plate 1262, and the first fixing plate 1262 is provided with a through hole (see fig. 4), so that the connecting rod 1223 is connected and fixed to the first slider 1263, thereby enabling the first telescopic element 122 to drive the probe set 121 on the first slider 1263 to move up and down in the vertical direction.
In some embodiments, to prevent the collision between first slider 1263 and first fixing plate 1262 caused by excessive movement, first buffer is further provided on first slider 1263 and opposite to first fixing plate 1262 to avoid the above situation and further protect probe set 121.
Further, because the chip under test is subject to stringent requirements for the testing environment, in some embodiments, the probe assembly 120 further includes a vacuum detection device 127, wherein the vacuum detection device 127 is secured to the beam 125.
Further, please refer to fig. 6 in conjunction with fig. 1, fig. 6 is a schematic three-dimensional structure of the integrating sphere assembly in the present application. In this embodiment, the integrating sphere assembly 130 includes an integrating sphere 131, a support rod 135, a support post 133 and a third support plate 134, the integrating sphere 131 is provided with an opening 1311, the integrating sphere 131 is fixed by the support rod 135, the support rod 135 is fixed on the support base 133, and the support base 133 is fixed with the workbench 140 through the third support plate 134.
Further, since the opening 1311 of the integrating sphere 131 needs to be close to the chip to be tested of the test station from the side in the horizontal direction at the time of the test, so as to collect as many optical signals as possible; after the test is finished, the integrating sphere 131 is required to be far away from the test station, so that the integrating sphere 131 is prevented from being impacted when the loading and unloading device 110 rotates to switch the station, and the integrating sphere 131 is prevented from being damaged. Therefore, in some embodiments, the integrating sphere 131 and the supporting seat 133 are arranged to move along the horizontal direction, and the integrating sphere 131 moves left and right along the horizontal direction through the second telescopic member 132.
Specifically, integrating sphere assembly 130 further includes a second slider 136, and integrating sphere 131 is coupled to second telescoping member 132 via second slider 136. The second sliding member 136 includes a second fixing plate 1362, where the second fixing plate 1362 is in an L-shape, one surface of a section of the second fixing plate 1362 is fixed to the upper surface of the supporting seat 133 in a fitting manner, the other section of the second fixing plate 1362 is fixed to the second telescopic member 132, and two sections of the second fixing plate 1362 are perpendicular to each other.
The second slider 136 further includes a second slider 1363 and a second guide 1361, the support bar 135 is fixed to the second slider 1363, and the second slider 1363 can move left and right along the second guide 1361 with the integrating sphere 131.
It should be noted that, in order to prevent the integrating sphere 131 from colliding with the supporting base 133 during the moving process, a second buffer 1331 is further disposed on a side surface of the supporting base 133 for protecting the integrating sphere 131.
It should be noted that the specific structure of the second telescopic member 132 in this embodiment is the same as that in the previous embodiment, and will not be described in detail herein.
The application provides a test system, test system includes unloader, probe subassembly and integrating sphere subassembly. The loading and unloading device comprises a plurality of stations, wherein the stations can be divided into a testing station and a loading station, and other loading stations are loaded and unloaded while testing chips to be tested, so that the testing speed is improved; the probe assembly and the integrating sphere assembly are respectively arranged to be capable of moving along the vertical direction and the horizontal direction, so that on one hand, the detection element is protected, the service life is prolonged, and on the other hand, the testing speed is further improved through ordered movement.
Further, referring to fig. 7, fig. 7 is another embodiment of a test system according to the present application. In this embodiment, the test system also includes a loading and unloading device 210, a probe assembly 220, and an integrating sphere assembly 230. The feeding and discharging device 210 comprises a rotary base 213 and a wire harness groove 215 arranged on the rotary base 213, and a plurality of stations 211 uniformly arranged around the periphery of the wire harness groove 215; the probe assembly 220 includes a probe set 221, a first slide assembly 226, and a first bellows 222; integrating sphere assembly 230 includes integrating sphere 231, second slide assembly 236, and second telescoping member 232.
It should be noted that, in the present embodiment, the integrating sphere 231 further includes a photoelectric sensor 2312, and the photoelectric sensor 2312 can guide a power meter (not shown) by detecting an optical signal to perform the power measurement; integrating sphere 231 further includes a fiber interface 2313, and fiber interface 2313 may be coupled to a fiber (not shown) that directs the spectral information received by integrating sphere 231 into a spectrometer for spectral analysis.
For a clearer description of the heat dissipation structure of the working site 211 in this embodiment, please refer to fig. 7 in combination with fig. 8, fig. 8 is a sectional view along A-A direction in fig. 7. In this embodiment, station 211 includes a fixture 2111 and a heat sink 2112. The heat dissipation element 2112 includes a heat dissipation copper plate 21121, a cooling fin 21122, a cooling block 21123, and a pad 21125, which are stacked. The surface of the heat dissipation copper plate 21121 is plated with gold, so that the heat dissipation effect is improved; the heat absorbing surface (i.e., upper surface) of the cooling plate 21122 is bonded to the lower surface of the copper plate 21121, the heat dissipating surface (i.e., lower surface) of the cooling plate 21122 is bonded to the upper surface of the cooling block 21123, and the pad 21125 is bonded to the rotary substrate 212. In some embodiments, a plurality of communication grooves 21124 are provided inside the cooling block 21123, and a cooling liquid circulates inside the cooling block 21123 through the communication grooves 21124.
Further, in this embodiment, a control method of the test system is provided, and specifically, the working steps of the test system in this embodiment are as follows:
in the first step, the loading and unloading device 210 is in an initial state before testing, and the stations 211 are loading stations because no chip to be tested is placed. Both the set of probes 221 in probe assembly 220 and the integrating sphere 231 in integrating sphere assembly 230 are located remotely from station 211.
In a second step, the rotating base 213 rotates the station 211 in a clockwise direction by a certain angle, for example 180 °. At this time, one station 211 where the chip to be tested is placed is rotated to the position right below the probe and is used as a test station for testing, and the rest stations 211 are not placed with the chip to be tested and are used as loading stations for loading. At this time, the probes in the probe group 221 vertically move downward and contact with pins of the chip to be tested, and current passes through the pins to make the chip to be tested emit light; meanwhile, integrating sphere 231 in integrating sphere assembly 230 approaches the test station from the horizontal direction, and collects the optical signals emitted by the chip to be tested.
Third, integrating sphere 231 collects the completed optical signal and directs the optical signal to a power meter and a spectrometer. Integrating sphere 231 is first moved horizontally away from the testing station, and then probe set 221 is moved vertically upward away from the testing station. Then, the rotating base 213 drives the station 211 to rotate a certain angle in a counterclockwise direction, for example, 180 °, the station 211 located at the testing station before is a loading station, the station 211 where loading is completed before is a testing station, the tested semiconductor chips are subjected to unloading and reloading, and the above steps are repeated.
It should be noted that the rotation angle of the rotation base 213 in the present application may be adjusted according to the number of stations 211, and in principle, the angle in the present embodiment should be N/360 °, where N is the number of stations. Because the wire harness slot 215 of the rotating base 214 also includes the water pipe and the air pipe and a plurality of wires, the rotating direction of the rotating base 213 is clockwise-anticlockwise or anticlockwise-clockwise, so as to ensure that each pipe and wire in the wire harness slot 215 is not damaged due to excessive rotation in the testing process.
In summary, the present application provides a test system, which includes a loading and unloading device, a probe assembly and an integrating sphere assembly. The loading and unloading device comprises a plurality of stations, wherein the stations can be divided into a testing station and a loading station, and other loading stations are loaded and unloaded while testing chips to be tested, so that the testing speed is improved; the probe assembly and the integrating sphere assembly are respectively arranged to be capable of moving along the vertical direction and the horizontal direction, so that on one hand, the detection element is protected, the service life is prolonged, and on the other hand, the testing speed is further improved through ordered movement.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the patent application, and all equivalent structures or equivalent processes using the descriptions and the contents of the present application or other related technical fields are included in the scope of the patent application.
Claims (5)
1. The testing system is used for testing the semiconductor laser chips and is characterized by comprising a loading and unloading device, a probe assembly and an integrating sphere assembly, wherein the loading and unloading device comprises a plurality of stations, and the stations are used for placing chips to be tested; the probe assembly comprises a plurality of probes which are arranged above the chip to be tested and used for providing current for the chip to be tested; the integrating sphere component comprises an integrating sphere, an opening is formed in the integrating sphere, and the opening is arranged close to the chip to be tested; when the current flows through the pins of the chip to be tested through the probes, the opening receives the optical signals sent by the chip to be tested so as to test the chip to be tested;
the feeding and discharging device further comprises a rotating base and a supporting substrate, the supporting substrate is arranged on the rotating base, the plurality of stations are arranged on the supporting substrate, the rotating base is used for driving the plurality of stations to rotate, and when one station of the plurality of stations rotates to the position below the probe, the other stations of the plurality of stations feed or discharge;
the rotating direction of the rotating base is clockwise-anticlockwise or anticlockwise-clockwise;
the test system further comprises a wire harness groove, the wire harness groove is fixedly arranged on the supporting substrate, the wire harness groove is arranged in a hollow tube shape, and the central shaft of the wire harness groove coincides with the rotation central line of the rotating base; the wire harness groove is used for placing and restraining an electric circuit and a water pipe which are connected with the stations;
the probe assembly further comprises a probe group, a support column, a cross beam, a first sliding piece and a first telescopic piece, wherein the probe group comprises a plurality of probes, the first sliding piece is fixed on the cross beam, the plurality of probes are connected with the first telescopic piece through the first sliding piece, and the first telescopic piece is used for adjusting the distance between the plurality of probes and the chip to be tested;
the first sliding piece comprises a first fixed plate, a first sliding block and a first guide rail, and the first fixed plate is fixedly connected with the cross beam; the first guide rail is paved on the surface of the first fixed plate; the first sliding block is used for driving the probe group to move along the first guide rail;
the first telescopic piece comprises a telescopic part and a connecting rod, the first sliding block is connected with the telescopic part through the connecting rod, and moves along the first guide rail in the vertical direction to adjust the distance between the probes and the chip to be tested.
2. The test system of claim 1, wherein the station comprises a fixture and a heat sink; the fixing piece is arranged on the surface of the heat dissipation piece; the heat dissipation piece comprises a copper plate, a refrigerating sheet and a cooling block which are sequentially stacked, wherein the heat absorption surface of the refrigerating sheet is attached to the copper plate, and the heat dissipation surface of the refrigerating sheet is attached to the cooling block.
3. The test system of claim 2, wherein a plurality of communication grooves are provided inside the cooling block, and a cooling liquid circulates inside the cooling block through the communication grooves.
4. The test system of claim 1, wherein the integrating sphere assembly further comprises a support base, a second sliding member and a second telescopic member, the second sliding member is fixed on the support base, the integrating sphere is connected with the second telescopic member through the second sliding member, and the second telescopic member is used for adjusting the distance between the integrating sphere and the chip to be tested.
5. The test system of claim 4, wherein the second slider comprises a second fixed plate, a second slider, and a second rail, the second fixed plate being fixedly connected to the support base; the second guide rail is paved on the surface of the second fixing plate, the second telescopic piece is connected with the second sliding block, the second sliding block moves along the second guide rail in the horizontal direction, and the distance between the integrating sphere and the chip to be tested is adjusted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810589339.8A CN108627762B (en) | 2018-06-08 | 2018-06-08 | Test system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810589339.8A CN108627762B (en) | 2018-06-08 | 2018-06-08 | Test system |
Publications (2)
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