CN219842971U - Dual-vision alignment device - Google Patents

Abstract

The utility model relates to a dual-vision alignment device, which comprises: the device comprises a base, a movable frame, a static vision structure and a dynamic vision structure, wherein the base comprises a mounting part and an extending part; the movable frame is arranged on the mounting part, a movable mechanism is arranged between the movable frame and the mounting part, and the movable frame moves relative to the mounting part through the movable mechanism; the static vision structure is arranged on the extension part and is used for shooting a first target object; the moving vision structure is mounted on the moving frame and is used for guiding a second target object, and the moving vision structure can move along with the moving frame relative to the mounting part. The utility model is used for guiding the second target object to work on the packaging substrate, meets the requirement of visual guidance during die bonding (chip) and also meets the requirement of the integral mechanism system design of the die bonder.

Description

Dual-vision alignment device

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a double-vision alignment device.

Background

In the field of semiconductor package testing, a semiconductor die bonder is one of the key devices with the largest proportion, and a visual alignment device on the device is one of the most critical modules, so that the function of guiding a second target object to pick up a chip and placing the chip on a package substrate is achieved, and the system design and the system precision of the die bonder influence the system design and the precision of the die bonder.

Currently, two vision systems are commonly used in semiconductor die bonders, one set is used for the top of the wafer table to guide the second target object to pick up the chip, and the other set is used for packaging the top of the substrate to guide the second target object to fix (package) the chip on the substrate. The package substrate has various forms, and besides different materials, some package substrates have larger widths, which are close to 100mm wide, and this requires the vision system to have a large visual field. At this time, the conventional vision system cannot simply rely on improving the field of view of the vision system to meet the situation that the package substrate becomes large, because improving the field of view of the vision system requires changing the vision hardware (lens, light source, camera), which may further affect the design of the entire mechanism system of the die bonder.

Disclosure of Invention

Accordingly, there is a need to provide a dual vision alignment device for solving the problem of vision alignment after the package substrate is enlarged, comprising: the device comprises a base, a movable frame, a static vision structure and a dynamic vision structure, wherein the base comprises a mounting part and an extending part; the movable frame is arranged on the mounting part, a movable mechanism is arranged between the movable frame and the mounting part, and the movable frame moves relative to the mounting part through the movable mechanism; the static vision structure is arranged on the extension part and is used for shooting a first target object; the moving vision structure is mounted on the moving frame and is used for guiding a second target object, and the moving vision structure can move along with the moving frame relative to the mounting part.

In one embodiment, the moving mechanism comprises a driving assembly and a moving track, wherein the driving assembly is arranged on the mounting part and is used for driving the moving frame to move along the moving track.

In one embodiment, the moving rail includes a moving rail and a fixed rail, the fixed rail is mounted on the mounting portion, and the moving rail is mounted on the moving frame.

In one embodiment, the driving assembly comprises a driving motor and a screw rod, wherein the driving motor is connected with the screw rod and used for driving the screw rod to rotate, and the screw rod is connected with the movable frame and used for driving the movable frame to move along the movable track.

In one embodiment, the base is provided with a receiving cavity inside, and the driving assembly is disposed in the receiving cavity.

In one embodiment, the mounting portion is provided with a sensor, the moving frame is provided with a sensing piece, and after the position of the sensing piece coincides with the position of the sensor, the sensing piece blocks the sensor signal and is used for determining the position of the moving frame relative to the mounting portion.

In one embodiment, the sensor includes a first sensor, a second sensor and a third sensor, the first sensor and the third sensor are disposed on two sides of the second sensor, the positions of the first sensor and the third sensor are extreme positions of the moving frame relative to the movement of the mounting portion, and the position of the second sensor is an initial position of the moving frame relative to the movement of the mounting portion.

In one embodiment, the static vision structure comprises a static vision camera, a static vision lens, and a static vision light source, and the static vision structure is disposed on the extension and parallel to the dynamic vision structure.

In one embodiment, the moving vision structure includes a moving vision camera, a moving vision lens, and a moving vision light source, and moves with the moving frame, and keeps coaxial with the second target object in a vertical direction, for guiding the second target object.

In one embodiment, a mounting module is arranged at the bottom of the mounting part, and the mounting module is used for mounting the base on the machine to be used.

The utility model provides a visual alignment device of a die bonder, which aims at the integral design of the die bonder, and provides a scheme of combining a static visual structure and a dynamic visual structure, wherein the position of the static visual structure is relatively unchanged, a moving mechanism drives a moving frame to move, and then the moving visual structure is driven to move so as to change the position of the dynamic visual structure, and the visual alignment device is used for guiding a second target object to work on a packaging substrate, thereby meeting the requirement of visual guidance during die bonding (chip) and meeting the requirement of the integral mechanism system design of the die bonder.

Drawings

Fig. 1 is a block diagram of an embodiment of a dual vision alignment device according to the present utility model.

Fig. 2 is a diagram illustrating a base structure of a dual vision alignment device according to an embodiment of the present utility model.

Fig. 3 is a side view of an embodiment of a dual vision alignment device provided by the present utility model.

Reference numerals:

1000-base;

1100-mounting part;

1110-a sensor;

1111—a first sensor;

1112-a second sensor;

1113-a third sensor;

1120—a receiving cavity;

1130-installing a module;

1200-extensions;

2000-moving rack

2001-sensor strip;

3000-a movement mechanism;

3100-drive assembly;

3101-drive motor;

3102-lead screw;

3200—move track;

3201—a moving rail;

3202-tracking;

4000-static vision structure;

4100—a still vision camera;

4200—still vision lens;

4300-static vision light source;

5000-dynamic visual structure;

5100—moving vision camera;

5200—moving vision lens;

5300-dynamic visual light source.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model. The present utility model may be embodied in many other forms than described herein and similarly modified by those skilled in the art without departing from the spirit of the utility model, whereby the utility model is not limited to the specific embodiments disclosed below.

In the description of the present utility model, it should be understood that, if any, these terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., are used herein with respect to the orientation or positional relationship shown in the drawings, these terms refer to the orientation or positional relationship for convenience of description and simplicity of description only, and do not indicate or imply that the apparatus or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, if any, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the terms "plurality" and "a plurality" if any, mean at least two, such as two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly stated and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly. For example, the two parts can be fixedly connected, detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, the meaning of a first feature being "on" or "off" a second feature, and the like, is that the first and second features are either in direct contact or in indirect contact through an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

It will be understood that if an element is referred to as being "fixed" or "disposed" on another element, it can be directly on the other element or intervening elements may also be present. If an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein, if any, are for descriptive purposes only and do not represent a unique embodiment.

Referring to fig. 1, fig. 1 shows a dual vision alignment device according to an embodiment of the utility model, including: a base 1000, a moving frame 2000, a static vision structure 4000, and a dynamic vision structure 5000, the base 1000 including a mounting portion 1100 and an extension portion 1200; the moving frame 2000 is provided on the mounting portion 1100, a moving mechanism 3000 is provided between the moving frame 2000 and the mounting portion 1100, and the moving frame 2000 is moved relative to the mounting portion 1100 by the moving mechanism 3000; the static vision structure 4000 is mounted on the extension 1200, and the static vision structure 4000 is used for shooting a first target object; the moving vision structure 5000 is mounted on the moving frame 2000, the moving vision structure 5000 is used for guiding a second target object, and the moving vision structure 5000 can move along with the moving frame 2000 relative to the mounting portion 1100.

In this embodiment, the present utility model provides a dual vision alignment device for a semiconductor die bonder, wherein the dual vision alignment device provided by the present utility model includes a base 1000, and the base 1000 is used for mounting the dual vision alignment device on the semiconductor die bonder and carrying a moving frame 2000, a static vision structure 4000 and a dynamic vision structure 5000.

In this embodiment, the dual vision alignment device provided by the present utility model includes a static vision and a dynamic vision, wherein the static vision is aligned by the static vision structure 4000, and the dynamic vision is aligned by the dynamic vision structure 5000. The static vision structure 4000 is used for shooting a first target object, specifically a chip on a wafer workbench, and the static vision structure 4000 and the base 1000 are relatively static and do not move, and are placed above the wafer workbench of the die bonder and used for shooting the chip on the wafer; the moving vision structure 5000 is used for guiding a second target object, specifically a soldering head, wherein the soldering head is used for soldering a chip to a die bonding area on a package substrate of a die bonder, the moving vision structure 5000 moves relative to the base 1000, and is used for keeping coaxial with the soldering head and the die bonding area to be soldered, and guiding the work of the soldering head.

In this embodiment, the moving vision mechanism is disposed on the moving frame 2000, the moving frame 2000 is mounted on the mounting portion 1100 of the base 1000, and the moving frame 2000 and the base 1000 can perform relative movement, so as to drive the moving vision structure 5000 disposed on the moving frame 2000 to move; the static vision structure 4000 is disposed on the extension 1200 of the base 1000. In this embodiment, a moving structure is provided on the moving frame 2000, whereby the moving frame 2000 is displaced relative to the base 1000.

In this embodiment, the static vision structure 4000 is used for shooting a wafer workbench of the die bonder, for ensuring that chips on the wafer workbench are accurately picked up by the bonding head, the dynamic vision structure 5000 is used for guiding the bonding head to bring the picked chips to a die bonding area at a designated position on the packaging substrate accurately and fixing the chips at the accurate position, and the movable dynamic vision structure 5000 is arranged to guide the position of the bonding head on the packaging substrate, so that the visual field range of a vision system is enlarged, the high-speed high-frequency high-precision movement is realized under the condition that the integral mechanism system of the die bonder is not changed, the requirement of vision guiding during die bonding (chips) is met, and the design requirement of the integral mechanism system of the die bonder is also met.

In one embodiment, the moving mechanism 3000 includes a driving assembly 3100 and a moving rail 3201, and the driving assembly 3100 is disposed on the mounting portion 1100 and is used for driving the moving frame 2000 to move along the moving rail 3201. In this embodiment, the moving mechanism 3000 includes a driving component 3100 for driving the moving frame 2000 to move relative to the base 1000, and a moving track 3201 track 3200 for defining a moving path of the moving frame 2000, so that the moving frame 2000 can only move along the moving track 3201 track 3200 on the mounting portion 1100, which realizes that the moving vision structure 5000 can be accurately controlled and accurately guide the first target object to perform work.

In one embodiment, the moving rail 3201 includes a moving rail 3201 and a fixed rail 3202, the fixed rail 3202 is mounted on the mounting portion 1100, and the moving rail 3201 is mounted on the moving frame 2000. In this embodiment, the moving rail 3201 is divided into a moving rail 3201 and a fixed rail 3202, wherein the positioning is specifically a rail which is fixed with the position of the base 1000 after being arranged on the mounting portion 1100, and the moving rail 3201 is mounted on the moving frame 2000, and by matching the fixed rail 3202 and the moving rail 3201, not only the track of the moving rail 3201 of the moving frame 2000 relative to the base 1000 is limited, but also the energy required when the moving frame 2000 moves relative to the base 1000 is reduced. It should be noted that, the moving rail 3201 and the fixed rail 3202 are rails that can be engaged and matched with each other and can slide with each other, and corresponding protrusions and grooves are provided on the moving rail 3201 and the fixed rail 3202, so that the moving rail 3201 and the fixed rail 3202 can be matched with each other, and derailment and other phenomena in the moving process are avoided.

In one embodiment, the driving assembly 3100 includes a driving motor 3101 and a screw 3102, where the driving motor 3101 is connected to the screw 3102 and is used to drive the screw 3102 to rotate, and the screw 3102 is connected to the moving frame 2000 and is used to drive the moving frame 2000 to move along the moving track 3201 track 3200. In this embodiment, drive assembly 3100 includes a motor for providing kinetic energy and a lead screw 3102 for transmitting kinetic energy to mobile carriage 2000. The arrangement of the lead screw 3102 and the moving track 3201 track 3200 are in a parallel state, so that the kinetic energy transmitted by the lead screw 3102 can drive the moving frame 2000 to move along the moving track 3201 track 3200; the screw 3102 and the motor are both provided on the mounting portion 1100 of the base 1000, and a screw thread capable of being engaged with the screw 3102 is provided on the movement, so that the moving frame 2000 is driven to move when the screw 3102 rotates. In this other embodiment, a corresponding screw 3102 connecting device is provided on the moving frame 2000, the screw 3102 connecting device is provided on the moving frame 2000 near one end of the base 1000, meanwhile, the screw 3102 connecting device is sleeved on the screw 3102, the position where the screw 3102 connecting device is connected with the screw 3102 is provided with threads, when the screw 3102 rotates, the threads on the screw 3102 are engaged with the threads on the screw 3102 connecting device, so as to drive the screw 3102 connecting device to displace, and further, the moving frame 2000 moves relative to the base 1000.

In one embodiment, the base 1000 has an accommodating cavity 1120 formed therein, and the driving assembly 3100 is disposed in the accommodating cavity 1120. In this embodiment, the mounting portion 1100 of the base 1000 is provided with a receiving cavity 1120, and the driving assembly 3100 is disposed in the receiving cavity 1120, so that not only can the driving structure be stably connected with the base 1000, but also the space for mounting the driving structure can be saved, the size of the dual vision alignment device provided by the utility model is greatly reduced, in addition, the receiving cavity 1120 can protect the driving assembly 3100, and the service life of the dual vision alignment device provided by the utility model is prolonged.

In one embodiment, the mounting portion 1100 is provided with a sensor 1110, the moving frame 2000 is provided with a sensing piece 2001, and after the position of the sensing piece 2001 coincides with the position of the sensor 1110, the sensing piece 2001 blocks the signal of the sensor 1110, so as to determine the position of the moving frame 2000 relative to the mounting portion 1100. In this embodiment, the base 1000 is provided with a sensor 1110, specifically, disposed on top of the mounting portion 1100, and the sensor 1110 cooperates with the sensing piece 2001 mounted on the moving frame 2000; when the moving frame 2000 moves, the sensing piece 2001 can be driven to move, and when the position of the sensing piece 2001 is overlapped with the sensor 1110, the sensing piece 2001 is inserted into the middle of the receiving end of the transmitting end snake of the sensor 1110, so that the signal transmitted by the sensor 1110 is blocked, and at the moment, the sensor 1110 transmits a warning signal. According to the position where the sensor 1110 is installed, the sensor 1110 is inserted into the middle of the sensor 1110 so that the sensor 1110 emits a warning signal, at this time, the position of the sensor 1110 and the position of the sensor 2001 can be determined to be coincident, and since the sensor 2001 is fixed on the moving frame 2000, the relative positions of the sensor 2001 and the moving frame 2000 are not changed, so that the position of the moving frame 2000 can be determined at this time; therefore, the position of the movable frame 2000 with respect to the base 1000 can be determined by the cooperation of the sensor 1110 and the sensor blade 2001. In this embodiment, the choice of the sensor chip 2001 is not limited, and may be any sensor chip 2001 that can be inserted between the transmitting end and the receiving end of the sensor 1110, and in particular, the thickness of the sensor chip 2001 needs to be smaller than the distance between the transmitting end and the receiving end of the sensor 1110.

In one embodiment, the sensor 1110 includes a first sensor 1111, a second sensor 1112, and a third sensor 1113, where the first sensor 1111 and the third sensor 1113 are disposed on two sides of the second sensor 1112, the positions of the first sensor 1111 and the third sensor 1113 are the extreme positions of the movement of the moving frame 2000 relative to the mounting portion 1100, and the position of the second sensor 1112 is the initial position of the movement of the moving frame 2000 relative to the mounting portion 1100.

In this embodiment, the sensor 1110 includes a first sensor 1111, a second sensor 1112 and a third sensor 1113, and referring to fig. 1, the first sensor 1111, the second sensor 1112 and the third sensor 1113 are disposed on top of the mounting portion 1100 of the base 1000, and the first sensor 1111, the second sensor 1112 and the third sensor 1113 are uniformly distributed; the second sensor 1112 is disposed in the middle of the first sensor 1111 and the third sensor 1113, the position identified by the second sensor 1112 is an initial position of the movable frame 2000, the first sensor 1111 and the third sensor 1113 are disposed on two sides of the second sensor 1112, the distances between the first sensor 1111 and the third sensor 1113 and the second sensor 1112 are equal, and are respectively limit positions in two directions, when the first sensor 1111 and the third sensor 1113 send out an alarm signal, the limit positions where two ends of the movable frame 2000 can move can be known, so that the movable frame 2000 can stop in time, and damage caused by exceeding the limit positions is avoided.

In one embodiment, the static vision structure 4000 includes a static vision camera 4100, a static vision lens 4200, and a static vision light source 4300, the static vision structure 4000 being disposed on the extension 1200 and parallel to the dynamic vision structure 5000. In this embodiment, the static vision structure 4000 includes a static vision camera 4100, a static vision lens 4200 and a static vision light source 4300 for capturing, focusing and supplementing light, respectively, and the static vision structure 4000 and the dynamic vision structure 5000 are arranged in parallel, so that after the chip is picked up under the capturing of the static vision mechanism of the second target object, the second target object can be quickly transferred to the field of view of the dynamic vision structure 5000, and the second target object is prevented from entering the blind area of the field of view.

In one embodiment, the moving vision structure 5000 includes a moving vision camera 5100, a moving vision lens 5200 and a moving vision light source 5300, and the moving vision structure 5000 moves along with the moving frame 2000, keeps coaxial with the second target object in the vertical direction, and is used for guiding the second target object. In this embodiment, the moving vision structure 5000 includes a moving vision camera 5100, a moving vision lens 5200 and a moving vision light source 5300, which are respectively used for shooting, focusing and light supplementing, and the moving vision structure 5000 is always coaxial with the second target object in the vertical direction, and functions as the second target object.

In one embodiment, a mounting module 1130 is disposed at the bottom of the mounting portion 1100, and the mounting module 1130 is used to mount the base 1000 to a machine to be used. In this embodiment, an installation module 1130 is disposed at the bottom of the installation portion 1100 of the base 1000, and the installation module 1130 is of a standard design, so that the dual-vision alignment structure provided by the utility model can be installed on any die bonder with a structure capable of being clamped with the installation module 1130, and is convenient to install and detach.

The utility model provides a visual alignment device of a die bonder, which aims at the integral design of the die bonder, and provides a scheme of combining a static visual structure 4000 and a dynamic visual structure 5000, wherein the position of the static visual structure 4000 is relatively unchanged, a moving mechanism 3000 drives a moving frame 2000 to move, and then the moving visual structure 5000 is driven to move so as to change the position of the dynamic visual structure 5000, and the visual alignment device is used for guiding a second target object to work on a packaging substrate, thereby meeting the requirement of visual guidance during die bonding (chip) and meeting the requirement of the integral mechanism system design of the die bonder.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims (10)

1. A dual vision alignment device, characterized in that the dual vision alignment device comprises:

a base including a mounting portion and an extension portion;

the movable frame is arranged at the mounting part, a movable mechanism is arranged between the movable frame and the mounting part, and the movable frame moves relative to the mounting part through the movable mechanism;

the static vision structure is arranged on the extension part and is used for shooting a first target object;

and the movable visual structure is mounted on the movable frame and used for guiding the second target object, and can move along with the movable frame relative to the mounting part.

2. The dual vision alignment device of claim 1, wherein the movement mechanism comprises a drive assembly and a movement track, the drive assembly being disposed at the mounting portion for driving the movement frame along the movement track.

3. The dual vision alignment device of claim 2, wherein the moving track comprises a moving track and a fixed track, the fixed track being mounted on the mounting portion, the moving track being mounted on the moving frame.

4. The dual vision alignment device of claim 2, wherein the drive assembly comprises a drive motor and a screw, the drive motor is connected with the screw for driving the screw to rotate, and the screw is connected with the moving frame for driving the moving frame to move along the moving track.

5. The dual vision alignment device of claim 2, wherein the interior of the base defines a receiving cavity, and the drive assembly is disposed within the receiving cavity.

6. The dual vision alignment device of claim 1, wherein a sensor is disposed on the mounting portion, and an induction piece is disposed on the moving frame, and the induction piece blocks the sensor signal after the position of the induction piece coincides with the position of the sensor, so as to determine the position of the moving frame relative to the mounting portion.

7. The dual vision alignment device of claim 6, wherein the sensor comprises a first sensor, a second sensor, and a third sensor, the first sensor and the third sensor are disposed on two sides of the second sensor, the first sensor and the third sensor are positioned at extreme positions of the moving frame relative to the movement of the mounting portion, and the second sensor is positioned at an initial position of the moving frame relative to the movement of the mounting portion.

8. The dual vision alignment device of claim 1, wherein the static vision structure comprises a static vision camera, a static vision lens, and a static vision light source, the static vision structure being disposed on the extension and parallel to the dynamic vision structure.

9. The dual vision alignment device of claim 1, wherein the moving vision structure comprises a moving vision camera, a moving vision lens, and a moving vision light source, the moving vision structure moving with the moving frame to maintain a vertical alignment with the second target object for guiding the second target object.

10. The dual vision alignment device of claim 1, wherein a mounting module is provided at the bottom of the mounting portion for mounting the base to a machine to be used.