CN208367163U - A kind of test macro - Google Patents

Abstract

This application involves a kind of test macros, and for testing semiconductor laser chip, test macro includes handling equipment, probe assembly and integral ball component；Handling equipment includes multiple stations, and multiple stations are for placing chip to be measured；Probe assembly includes several probes, and the top of the chip to be measured is arranged in several probes；Integral ball component includes integrating sphere, and integrating sphere is equipped with opening, and the opening is close to the chip setting to be measured；When the electric current flows through the pin of the chip to be measured by the probe, the opening receives the optical signal that the chip to be measured issues.The application is by the way that probe assembly and integral ball component to be respectively set on the one hand protect detecting element along the vertical direction with horizontal direction movement, extend service life, on the other hand further improve test speed by orderly movement.

Description

A kind of test macro

Technical field

This application involves chip testing fields, more particularly to a kind of test macro for semiconductor laser chip.

Background technique

The most normal packing forms of semiconductor laser chip are COS (Chip On Submount), that is, are directly encapsulated into thermally conductive On high heat sink of coefficient.This stage process is related to semiconductor laser quality, therefore after this packaging technology step, it needs to pass through Stringent functional detection, the quality of performance parameter directly affect the quality of semiconductor laser.

Performance parameter (such as LIV (Light-Current-Voltage, the light intensity-current-electricity of noise spectra of semiconductor lasers chip Pressure) characteristic, spectral characteristic, FFP (Far-Field Pattern, far field pattern) characteristic) carry out test and characterization be to manage deeply Solution chip of laser characteristic, the design of optimization chip structure and the key for improving chip production process, while being also to judge laser The important evidence of chip quality.Simultaneously as before product turnout, need to carry out every COS stringent test, to guarantee shipment The quality of product afterwards.

Existing COS test macro is all discrete instrument composition, and only exists a test station, be primarily present with Lower problem: this mode purely relies on the manual operation of operator, because only existing a test station, sequence is needed to complete COS Feeding, test operation, holding data, COS blanking, short time consumption are long.

Utility model content

The purpose of the application is to provide a kind of test macro, can be realized the quick test of noise spectra of semiconductor lasers chip, To improve testing efficiency.

In order to solve the above technical problems, the application the technical solution adopted is that:

A kind of test macro, for testing semiconductor laser chip, the test macro includes handling equipment, probe groups Part and integral ball component, the handling equipment include multiple stations, and the multiple station is for placing chip to be measured；The spy Needle assemblies include several probes, and the top of the chip to be measured is arranged in several probes, for mentioning for the chip to be measured For electric current；The integral ball component includes integrating sphere, and the integrating sphere is equipped with opening, and described be open sets close to the chip to be measured It sets；When the electric current flows through the pin of the chip to be measured by the probe, the opening receives the chip to be measured The optical signal of sending, to test the chip to be measured.

In some embodiments, the handling equipment further includes rotating base and supporting substrate, and the supporting substrate is set It sets on the rotating base, the multiple station is arranged on supporting substrate, and the rotating base is the multiple for driving Station is rotated, when one in the multiple station rotation to the lower section of the probe, the multiple station other Station carries out feeding or blanking.

In some embodiments, the station includes fixing piece and radiating piece；The fixing piece is arranged in the radiating piece Surface；The radiating piece includes the copper sheet, cooling piece and cooling block being cascading, the copper sheet surface gold-plating, the system Cold heat-absorbent surface is bonded with the lower surface of the copper sheet, and the upper surface of the radiating surface of the cooling piece and the cooling block is pasted It closes.

In some embodiments, multiple connectivity slots are equipped with inside the cooling block, coolant liquid is by the connectivity slot in institute State circulation in cooling block.

In some embodiments, the test macro further includes bunch slot, and the bunch slot is fixedly arranged on the supporting substrate On, the bunch slot is arranged in hollow pipe type, and the central axis of the bunch slot is overlapped with the rotation centerline of the rotating base； The bunch slot is for placing and constraining the electric wiring and water pipe connecting with the multiple station.

In some embodiments, the probe assembly further comprises crossbeam, the first sliding part and the first extensible member, described First sliding part is fixed on the crossbeam, and several probes are connect by the first sliding part with first extensible member, institute The first extensible member is stated for adjusting several probes at a distance from the chip to be measured.

In some embodiments, first sliding part includes the first fixed plate, the first sliding block and the first guide rail, and described the One fixed plate is fixedly connected with the crossbeam；First guide rail is laid on the described first fixed plate surface.

In some embodiments, first extensible member includes pars contractilis and connecting rod, and first sliding block passes through described Connecting rod is connect with the pars contractilis, and first sliding block moves in the vertical direction along first guide rail, described in adjusting Multiple probes are at a distance from the chip to be measured.

In some embodiments, the integral ball component further comprises support base, the second sliding part and the second extensible member, Second sliding part is fixed on the support base, and the integrating sphere is connected by the second sliding part and second extensible member It connects, second extensible member is for adjusting the integrating sphere at a distance from the chip to be measured.

In some embodiments, second sliding part includes the second fixed plate, the second sliding block and the second guide rail, and described the Two fixed plates are fixedly connected with the support base；Second guide rail is laid on the described second fixed plate surface, and described second stretches Contracting part is connect with second sliding block, and second sliding block moves in the horizontal direction along second guide rail, described in adjusting Integrating sphere is at a distance from the chip to be measured.

The beneficial effect of the application is: being different from the prior art, the application proposes that a kind of test macro, test macro include Handling equipment, probe assembly and integral ball component.Wherein, handling equipment includes multiple stations, and station can be divided into test Station and load station carry out loading and unloading to other load stations, improve test speed while testing chip to be measured； Probe assembly and integral ball component are respectively set to can be mobile with horizontal direction along the vertical direction, on the one hand protects detection Element extends service life, on the other hand further improves test speed by orderly movement.

Detailed description of the invention

Fig. 1 is a kind of three dimensional structure diagram for test macro that the application proposes；

Fig. 2 is the partial enlargement structural representation of A frame portion point in Fig. 1；

Fig. 3 is the three dimensional structure diagram for the handling equipment that the application proposes

Fig. 4 is the three dimensional structure diagram for the probe assembly that the application proposes；

Fig. 5 is the three dimensional structure diagram for the extensible member that the application proposes；

Fig. 6 is the integral ball component three dimensional structure diagram that the application proposes；

Fig. 7 is a kind of another example structure schematic diagram for test macro that the application proposes；

Fig. 8 is A-A the schematic diagram of the section structure in Fig. 7.

Specific embodiment

Below by the technical scheme in the embodiment of the application is clearly and completely described, it is clear that described implementation Example is merely a part but not all of the embodiments of the present application.Based on the embodiment in the application, this field is common Technical staff's every other embodiment obtained without making creative work belongs to the model of the application protection It encloses.

It is worth noting that, the direction term being previously mentioned in the application, for example, "upper", "lower", "front", "rear", " left side ", " right side ", "inner", "outside", " side " etc. are only the directions with reference to annexed drawings, therefore, the direction term used be in order to it is more preferable, Be illustrated more clearly that and understand the application, rather than indicate or imply signified device or element must have a particular orientation, It is constructed and operated in a specific orientation, therefore should not be understood as the limitation to the application.

With semiconductor laser (LD, Laser Diode) application field such as LD light-pumped solid state laser (DPL, Diode- Pumped Solid-State Laser), the pumping source of all kinds of optical fiber lasers, laser cutting, welding, medical treatment and laser it is military Using etc. increasingly widen, noise spectra of semiconductor lasers output power, the requirement of reliability are also increasing.Semiconductor laser core Piece is semiconductor laser core, the title with semiconductor laser " CPU ".Therefore exploitation semiconductor laser elements are fast Fast test method and development semiconductor laser elements fast testing system have great importance for laser production firm, It is greatly improved the production yields of COS.Therefore, in order to improve the test speed of semiconductor laser chip, it is necessary to existing It proposes to improve on the basis of chip test system.

As shown in Figure 1, Fig. 1 is a kind of three dimensional structure diagram for test macro that the application proposes.In the present embodiment, Test macro includes handling equipment 110 and detection device, and detection device includes probe assembly 120 and integrates ball component 130, on Blanking device 110, probe assembly 120 and integral ball component 130 are fixedly arranged on workbench 140.

Wherein, handling equipment 110 includes multiple stations, and station can be divided into load station and test station, and station can For placing chip (not shown) to be measured.Probe assembly 120 includes multiple probes, and probe is set to be measured at test station The top of chip, probe are used to shine when chip testing to be measured and provide electric current.Integral ball component 130 is arranged in test work The side of the chip to be measured of position.When test macro work, the pin of multiple probes and chip to be measured in probe assembly 120 is connect Touching, electric current flows through chip to be measured by probe, so that chip light emitting to be measured, integral ball component 130 collects the light letter of chip to be measured Number, and optical signal is exported further to analyze test result, to realize the test to chip to be measured.

It is worth noting that, the load station and test station in the application can be converted mutually, that is, probe assembly 120 The station of face is test station, remaining station is load station.When being tested at chip to be measured is located at test station, Remaining load station can carry out blanking and again feeding to chip has been surveyed.

Specifically, incorporated by reference to Fig. 1 and referring to Fig.2, Fig. 2 is the partial enlarged view in Fig. 1 in A frame.Wherein, handling equipment 110 include multiple stations 111, and station 111 is located at the underface of probe assembly 120, thus station 111 be test station.Work Position 111 includes multiple fixing pieces 1111, and fixing piece 1111 is for fixing chip to be measured, during the test to prevent chip to be measured It moves, to influence test result.

Probe assembly 120 includes probe groups 121, and probe groups 121 include multiple probes 1211, and the probe of probe 1211 is just For station 111.In the present embodiment, the number of probe 1211 is 4, and in other embodiments, the quantity of probe 1211 can To be adjusted according to actual test situation.

Integrating ball component 130 includes integrating sphere 131, and integrating sphere 131 is equipped with an opening 1311, and the opening of integrating sphere 131 The 1311 chip to be measured setting from side horizontal direction from test station.When electric current flows through chip to be measured by probe 1211 Pin when, chip light emitting to be measured, opening 1311 collects the optical signal that chips to be measured issue.

It further, is the three-dimensional structure signal of handling equipment in the application incorporated by reference to Fig. 1, Fig. 2 and with reference to Fig. 3, Fig. 3 Figure.In the present embodiment, handling equipment 110 may include two stations 111；In other embodiments, the quantity of station 111 It can be adjusted according to actual test situation.

Handling equipment 110 includes rotating base 113 and the rotary plate 112 being arranged on rotating base 113, rotates base Plate 112 is arranged on rotating base 113, and station 111 is arranged on rotary plate 112, and rotating base 113 can be rotated, So that two stations 111 are alternately located at the face position of 120 middle probe group 121 of probe assembly, so that two stations 111 It is successively used as device station and test station respectively.

When testing, chip to be measured can generate a large amount of heat, can shadow if cooled down not in time to chip to be measured Ring the service life of test result and chip to be measured.In the present embodiment, station 111 includes that cooling piece 1112 and setting exist Multiple fixing pieces 1111 on 1112 surface of cooling piece, fixing piece 1111 is for fixing chip to be measured.In the present embodiment, fixing piece 1111 be elastic pressuring plate, and at least one end of fixing piece 1111 is fixed on cooling piece 1112.Cooling piece 1112 in the present embodiment For water-cooling structure, inside is equipped with cooling bath, and cooling bath is connect with external water pipe (not shown), to realize coolant liquid in cooling Circulation inside part 1112 achievees the effect that radiate in real time.

It is worth noting that, the driving method of the rotating base 113 in the present embodiment can be it is pneumatic, gas nozzle 1131 can be with External tracheae (not shown), the direction of rotation of rotating base 113 and rotation speed can be controlled by control system.Certainly, at it In his embodiment, rotating base 113 can also pass through motor driven.

Since multiple components are connected with water pipe or tracheae in handling equipment 110, while also All other routes being wanted to be laid on In blanking device 110, multiple routes or pipeline have an impact testing efficiency in order to prevent, the handling equipment in the present embodiment 110 further include bunch slot 115, and bunch slot 115 is fixed by fixed block 116 and rotary plate 112, and bunch slot 115 offers logical Hole 1151, for placing route or pipeline.

Wherein, bunch slot 115 can be column, be set at the rotation center of rotating base 113, and bunch slot 115 Vertical central axis is overlapped with the rotation center of rotating base 113.And multiple stations 111 are that bunch slot 115 is arranged in distribution Surrounding, when rotating base 113 rotates, handling equipment 110 is fixed on workbench 140 by the first support plate 114, thus Realize smooth rotation operation.

It further, is the three dimensional structure diagram of the application middle probe component incorporated by reference to Fig. 1, Fig. 2 and refering to Fig. 4, Fig. 4. Probe assembly 120 includes that probe groups 121, support column 123, crossbeam 125 and the second support plate 124, probe groups 121 pass through erection It realizes and fixes in the crossbeam 125 of two support columns 123, support column 123 is connect by the second support plate 124 with workbench 140 solid It is fixed.

In test, probe groups 121 need to contact probe 1211 with the pin for the chip to be measured for being located at test station；Knot After beam test, need to separate by probe 1211 far from test station and with the pin of chip to be measured.Therefore, in the present embodiment, Probe assembly 120 further includes the first sliding part 126 and the first extensible member 122, and probe groups 121 can be with by the first extensible member 122 It moves up and down along vertical direction.

Specifically, probe groups 121 are connect by the first sliding part 126 with the first extensible member 122.First sliding part 126 packet Include the first fixed plate 1262, the L-shaped setting of the first fixed plate 1262, the first fixed plate 1262 wherein a surface of one section of component with One vertical plane of crossbeam 125, which is bonded, to be fixed, and another section of component and the first extensible member 122 are fixed, and two sections of the first fixed plate 1262 Component is arranged in a mutually vertical manner.Further, the first sliding part 126 includes the first sliding block 1263 and the first guide rail 1261, probe groups 121 are fixed on the first sliding block 1263, and the first sliding block 1263 can move down on the first guide rail 1261 with probe groups 121 It is dynamic.

It further, is this implementation incorporated by reference to Fig. 4 and refering to Fig. 5, Fig. 5 in order to more clearly describe the first extensible member 122 The three dimensional structure diagram of extensible member 122 in example.In this implementation, the first extensible member 122 is by the way of pneumatic actuation, therefore, First extensible member 122 includes two air valves 1222, pars contractilis 1221, fixed part 1224 and connecting rod 1223, and air valve 1222 is external There is tracheae, pars contractilis 1221 is connect with connecting rod 1223, and pars contractilis 1221 sends movement under the driving of Pneumatic pressure.

Wherein, wherein one section of fixation of fixed part 1224 and the first fixed plate 1262, the first fixed plate 1262 offer logical Hole (refering to Fig. 4), so that connecting rod 1223 is connected and fixed with the first sliding block 1263, to realize that the first extensible member 122 drives the The lower movement in the vertical direction of probe groups 121 on one sliding block 1263.

In some embodiments, excessively movement causes the first sliding block 1263 to collide with the first fixed plate 1262 in order to prevent The case where, the first buffer is additionally provided on the first sliding block 1263, and be oppositely arranged with the first fixed plate 1262, to avoid above-mentioned feelings The generation of condition, and further protect probe groups 121.

Further, the requirement due to chip to be measured to test environment is also very stringent, in some embodiments, probe Component 120 further includes vacuum checking device 127, wherein vacuum checking device 127 is fixed on crossbeam 125.

It further, is the three dimensional structure diagram of integral ball component in the application incorporated by reference to Fig. 1 and refering to Fig. 6, Fig. 6.? In the present embodiment, integral ball component 130 includes integrating sphere 131, support rod 135, support column 133 and third support plate 134, integral Ball 131 is equipped with opening 1311, and integrating sphere 131 is fixed by support rod 135, and support rod 135 is fixed on support base 133, support base 133 is fixed by third support plate 134 and workbench 140.

Further, due to the opening 1311 of integrating sphere 131 test when need from horizontal direction side close to test station Chip to be measured, to collect optical signal as much as possible；After terminating test, integrating sphere 131 will prevent up and down far from test station Integrating sphere 131 is collided when the material rotation switching station of device 110, thus lesion extent ball 131.Therefore, in some embodiments, It is set as that the second extensible member can be passed through along horizontal motion, integrating sphere 131 between integrating sphere 131 and support base 133 132 realizations are moved left and right along horizontal direction.

Specifically, integral ball component 130 further includes the second sliding part 136, integrating sphere 131 by the second sliding part 136 with The connection of second extensible member 132.Second sliding part 136 includes the second fixed plate 1362, the L-shaped setting of the second fixed plate 1362, and the A surface with the upper surface of support base 133 for two fixed plates 1362 wherein one section of component is bonded fixation, another section of component and second Extensible member 132 is fixed, and two sections of components of the second fixed plate 1362 are arranged in a mutually vertical manner.

Second sliding part 136 further comprises the second sliding block 1363 and the second guide rail 1361, and support rod 135 is fixed on On two sliding blocks 1363, the second sliding block 1363 can be moved left and right with integrating sphere 131 along the second guide rail 1361.

It is worth noting that, integrating sphere 131 collides in moving process with support base 133 in order to prevent, supporting The side of seat 133 is additionally provided with the second buffer 1331, for protecting integrating sphere 131.

It is worth noting that, the specific structure of the second extensible member 132 in the present embodiment is consistent in a upper embodiment, It will not repeat them here.

The application proposes that a kind of test macro, test macro include handling equipment, probe assembly and integral ball component.Its In, handling equipment includes multiple stations, and station can be divided into test station and load station, is testing the same of chip to be measured When, loading and unloading are carried out to other load stations, improve test speed；Probe assembly and integral ball component are respectively set to can With horizontal direction movement, on the one hand to protect detecting element along the vertical direction, extend service life, on the other hand further Test speed is improved by ordered movement.

Further, referring to Fig. 7, Fig. 7 is a kind of another embodiment for test macro that the application proposes.The present embodiment In, test macro equally includes handling equipment 210, probe assembly 220 and integral ball component 230.Wherein, handling equipment 210 include rotating basis 213, the bunch slot 215 being set on rotating basis 213, evenly around the setting of 215 periphery of bunch slot Multiple stations 211；Probe assembly 220 includes probe groups 221, the first slide assemblies 226 and the first extensible member 222；Integrating sphere Component 230 includes integrating sphere 231, the second slide assemblies 236 and the second extensible member 232.

It is worth noting that, in the present embodiment, integrating sphere 231 further includes photoelectric sensor 2312, photoelectric sensor 2312 can import power meter (not shown) by detecting optical signal, complete the measurement of power；Integrating sphere 231 further includes that optical fiber connects Mouth 2313, optical fiber interface 2313 can be connected with optical fiber (not shown), and optical fiber imports the received spectral information of integrating sphere 231 Spectrometer completes spectrum analysis.

In order to become apparent to describe the radiator structure of station 211 in the present embodiment, it is incorporated by reference to Fig. 7 and refering to Fig. 8, Fig. 8 The cross-sectional view in the direction A-A in Fig. 7.In this embodiment, station 211 includes fixing piece 2111 and radiating piece 2112.Wherein, it radiates Part 2112 includes heat dissipation copper sheet 21121, cooling piece 21122, cooling block 21123 and the cushion block 21125 being stacked.Radiate copper sheet 21121 surface gold-plating increases heat dissipation effect；The heat-absorbent surface (i.e. upper surface) of cooling piece 21122 and the copper sheet 21121 Lower surface fitting, the radiating surface (i.e. lower surface) of cooling piece 21122 is bonded with the upper surface of cooling block 21123, cushion block 21125 and The fitting of rotary plate 212 is fixed.In some embodiments, multiple connectivity slots 21124, coolant liquid are equipped with inside cooling block 21123 It is recycled inside the cooling block 21123 by connectivity slot 21124.

Further, a kind of control method of test macro is additionally provided in the present embodiment, specifically, is tested in the present embodiment The work step of system is as follows:

The first step, handling equipment 210 are in the original state before test, and multiple stations 211 are not due to placing at this time There is chip to be measured, therefore is load station.Integrating sphere in probe assembly in 220 probe groups 221 and integral ball component 230 231 are arranged far from station 211.

Second step, rotating base 213 drive station 211 to rotate certain angle, such as 180 ° in a clockwise direction.This When, it is placed on a station 211 of chip to be measured and rotates to the underface of probe, and tested as test station, remaining Chip to be measured is not placed on station 211, carries out feeding as load station.At this point, the probe in probe groups 221 is straight down Movement, and be in contact with the pin of chip to be measured, electric current makes chip light emitting to be measured by pin；Meanwhile integrating ball component 230 In integrating sphere 231 from horizontal direction close to test station, collect the optical signal that chip to be measured issues.

Third step, integrating sphere 231, which is collected, completes optical signal, and optical signal is imported power meter and spectrometer.Integrating sphere 231 First in the horizontal direction far from test station, then probe groups 221 move up in the vertical direction, far from test station. Then rotating base 213 drives station 211 to rotate certain angle, such as 180 ° in a counterclockwise direction, is located at test work before The station 211 of position is load station at this time, and the station 211 for completing feeding before is test station, to being completed the half of test Conductor chip carries out blanking and again feeding, and repeats the above steps.

It is worth noting that, the rotation angle of rotating base 213 can be carried out according to the quantity of station 211 in the application Adjustment, the angle in the present embodiment should be N/360 ° in principle, and wherein N is the quantity of station.Due to the beam of rotating base 214 It further include water pipe and tracheae and several conducting wires in wire casing 215, therefore, the direction of rotation of rotating base 213 is clockwise-inverse time Needle or counterclockwise-clockwise, to guarantee that each pipeline in bunch slot 215 and conducting wire are not rotated excessively during the test And it is destroyed.

In conclusion the application proposes that a kind of test macro, test macro include handling equipment, probe assembly and integral Ball component.Wherein, handling equipment includes multiple stations, and station can be divided into test station and load station, to be measured testing While chip, loading and unloading are carried out to other load stations, improve test speed；By probe assembly and integral ball component difference Being set as can be mobile with horizontal direction along the vertical direction, on the one hand protects detecting element, extends service life, another party Face further improves test speed by orderly movement.

The foregoing is merely presently filed embodiments, are not intended to limit the scope of the patents of the application, all to utilize this Equivalent structure or equivalent flow shift made by application specification and accompanying drawing content, it is relevant to be applied directly or indirectly in other Technical field similarly includes in the scope of patent protection of the application.

Claims (10)

1. a kind of test macro, for testing semiconductor laser chip, which is characterized in that the test macro includes loading and unloading dress It sets, probe assembly and integral ball component, the handling equipment includes multiple stations, and the multiple station is for placing core to be measured Piece；The probe assembly includes several probes, and the top of the chip to be measured is arranged in several probes, for for it is described to It surveys chip and electric current is provided；The integral ball component includes integrating sphere, and the integrating sphere is equipped with opening, the opening close to it is described to Survey chip setting；When the electric current flows through the pin of the chip to be measured by the probe, the opening receives described The optical signal that chip to be measured issues, to test the chip to be measured.

2. test macro according to claim 1, which is characterized in that the handling equipment further includes rotating base and branch Support group plate, the supporting substrate are arranged on the rotating base, and the multiple station is arranged on supporting substrate, the rotation Pedestal is for driving the multiple station to be rotated, when under a station rotary to the probe in the multiple station Other stations of Fang Shi, the multiple station carry out feeding or blanking.

3. test macro according to claim 2, which is characterized in that the station includes fixing piece and radiating piece；It is described Fixing piece is arranged on the radiating piece surface；The radiating piece includes the copper sheet, cooling piece and cooling block being cascading, institute The heat-absorbent surface for stating cooling piece is bonded with the copper sheet, and the radiating surface of the cooling piece is bonded with the cooling block.

4. test macro according to claim 3, which is characterized in that multiple connectivity slots are equipped with inside the cooling block, it is cold But liquid is recycled in the cooling block by the connectivity slot.

5. test macro according to claim 4, which is characterized in that the test macro further includes bunch slot, the beam Wire casing is fixedly arranged on the supporting substrate, and the bunch slot is arranged in hollow pipe type, the central axis of the bunch slot and the rotation The rotation centerline for turning pedestal is overlapped；The bunch slot for place and constrain the electric wiring being connect with the multiple station and Water pipe.

6. test macro according to claim 1, which is characterized in that the probe assembly further comprises crossbeam, first Sliding part and the first extensible member, first sliding part are fixed on the crossbeam, and several probes pass through the first sliding part It is connect with first extensible member, first extensible member is for adjusting several probes at a distance from the chip to be measured.

7. test macro according to claim 6, which is characterized in that first sliding part includes the first fixed plate, the One sliding block and the first guide rail, first fixed plate are fixedly connected with the crossbeam；First guide rail is laid on described first Fixed plate surface.

8. test macro according to claim 7, which is characterized in that first extensible member includes pars contractilis and connection Bar, first sliding block are connect by the connecting rod with the pars contractilis, and first sliding block exists along first guide rail It is moved on vertical direction, adjusts the multiple probe at a distance from the chip to be measured.

9. test macro according to claim 1, which is characterized in that the integral ball component further comprise support base, Second sliding part and the second extensible member, second sliding part are fixed on the support base, and the integrating sphere is sliding by second Moving part is connect with second extensible member, second extensible member be used to adjust the integrating sphere and the chip to be measured away from From.

10. test macro according to claim 9, which is characterized in that second sliding part includes the second fixed plate, the Two sliding blocks and the second guide rail, second fixed plate are fixedly connected with the support base；Second guide rail is laid on described Two fixed plate surfaces, second extensible member are connect with second sliding block, and second sliding block exists along second guide rail It is moved in horizontal direction, adjusts the integrating sphere at a distance from the chip to be measured.