CN108620344A - The automatic sensitive chip automatization test system of smart mobile phone and its control method - Google Patents
The automatic sensitive chip automatization test system of smart mobile phone and its control method Download PDFInfo
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- CN108620344A CN108620344A CN201710167410.9A CN201710167410A CN108620344A CN 108620344 A CN108620344 A CN 108620344A CN 201710167410 A CN201710167410 A CN 201710167410A CN 108620344 A CN108620344 A CN 108620344A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
- B07C5/34—Sorting according to other particular properties
- B07C5/344—Sorting according to other particular properties according to electric or electromagnetic properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2832—Specific tests of electronic circuits not provided for elsewhere
- G01R31/2834—Automated test systems [ATE]; using microprocessors or computers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
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- Microelectronics & Electronic Packaging (AREA)
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- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of automatic sensitive chip automatization test system of smart mobile phone and its control method, which includes V50 test machines, test DUT and manipulator, and manipulator is arranged on V50 test machines, and is provided with shutter and test platform on V50 test machines；After sensitive chip to be measured is placed on test platform, V50 test machines are connect with test DUT, and test DUT is connect with sensitive chip to be measured, and manipulator is connect with sensitive chip to be measured；Manipulator is drivingly connected with shutter, robot drives shutter is blocked in the top of sensitive chip to be measured, after V50 test machines carry out parameter testing to sensitive chip to be measured, robot drives shutter is removed, and V50 test machines carry out sensitive chip to be measured test result is returned to manipulator after parameter testing again, manipulator classifies to sensitive chip to be measured according to the test result received.
Description
Technical field
The invention belongs to chip for cell phone test systems technology field, the more particularly to automatic sensitive chip automations of smart mobile phone
Test system and its control method.
Background technology
Existing smart mobile phone carries light level function mostly, the sensitization function of mobile phone be by light sensor this
Element realizes that the principle that mobile phone is capable of automatic brightness adjustment is using the preposition two light sensors monitoring ring with postposition of mobile phone
Border brightness, to automatically adjust screen intensity to achieve the purpose that power saving.Light sensor is converted into optical signal different electricity
Signal, and then identify the power of light, brightness regulation is realized with this.
The optical signal of reception can be converted to electric signal by light sensor, that is, sensitive chip.The existing photosensitive core of mobile phone
The test system and test process of piece not enough automates, and testing efficiency is low.
Invention content
To solve the above problems, the purpose of the present invention is to provide a kind of automatic sensitive chip automatic tests of smart mobile phone
System and its control method, the test system is by testing process to every direct current of chip and the parameter that exchanges into testing and generate
Corresponding test data.
It is another object of the present invention to provide a kind of automatic sensitive chip automatization test system of smart mobile phone, the surveys
Test result is transmitted to manipulator by test system in the form of TTL signal, and manipulator carries out non-defective unit according to test result signal
BIN and defective products is divided to divide BIN, and testing efficiency is high.
To achieve the above object, technical scheme is as follows.
A kind of automatic sensitive chip automatization test system of smart mobile phone, including V50 test machines, test DUT and manipulator,
The manipulator is arranged on V50 test machines, and is provided with shutter and test platform on the V50 test machines；It is to be measured photosensitive
After chip is placed on test platform, the V50 test machines are connect with test DUT, and the test DUT connects with sensitive chip to be measured
It connects, and the manipulator is connect with sensitive chip to be measured；The manipulator is drivingly connected with shutter, and the robot drives hide
Baffle is blocked in the top of sensitive chip to be measured, after the V50 test machines carry out parameter testing to sensitive chip to be measured, the machine
Tool hand-drive shutter is removed, and the V50 test machines are carried out sensitive chip to be measured after parameter testing again by test result
Manipulator is returned to, the manipulator classifies to sensitive chip to be measured according to the test result received.
The V50 test machines are equipped with mounting bracket, feeding station and Riving Box, and the manipulator is mounted on mounting bracket, and
The mounting bracket is connect with robot drives；The test platform, feeding station and Riving Box are arranged at the lower section of mounting bracket, institute
It states manipulator to slide on mounting bracket, the manipulator is placed on from feeding station feeding on test platform, and the V50 test machines are surveyed
After the completion of examination, sensitive chip after test is placed by classification in Riving Box by the manipulator.
Be additionally provided with vibrating disk and straight-line oscillation track on the V50 test machines, one end of the straight-line oscillation track with shake
Moving plate be connected, the other end of the straight-line oscillation track is connected with feeding station, and the V50 test machines respectively with vibrating disk and directly
Linearly coupled track is drivingly connected；Sensitive chip to be measured vibrated on vibrating disk and adjustment direction after it is defeated by straight-line oscillation track one end
After being sent to the other end, it is placed on feeding station.
The V50 test machines are equipped with power module and digital channel module, the power module and digital channel module
It is connect with test DUT, the V50 test machines are powered by power module and test DUT to sensitive chip to be measured, and described
V50 test machines apply corresponding pumping signal by digital channel module and test DUT to sensitive chip to be measured, and the V50 is surveyed
Test-run a machine tests the parameters of sensitive chip to be measured, and quality and the classification of sensitive chip to be measured are judged according to test result.
Further, the supply voltage of the power module is one kind in 3.7V, 2.3V or 3V.
A kind of control method of the automatic sensitive chip automatization test system of smart mobile phone, which is characterized in that including following
Step：
Step 1, V50 test machines are connect with test DUT, and test DUT is connect with manipulator；
Step 2, start test system, corresponding test software is transferred, into test；
Step 3, V50 test machines are connected, the communication between manipulator is established；
Step 4, start manipulator and vibrating disk, vibrate disc vibration sensitive chip to be measured, adjustment chip direction；
Step 5, vibrating disk transports sensitive chip to be measured on straight-line oscillation track；
Step 6, sensitive chip to be measured is transported feeding station by straight-line oscillation track；
Step 7, manipulator removes sensitive chip to be measured from feeding station, and sensitive chip to be measured is placed into test platform
On；
Step 8, V50 test machines test sensitive chip to be measured, and test result is returned to manipulator；
Step 9, manipulator carries out sensitive chip to be measured according to the test result received to be classified to Riving Box.
Further, the step 8 is specially：
Step 81, robot drives shutter is blocked in the top of sensitive chip to be measured, and V50 test machines are to be measured photosensitive
Chip carries out parameter testing；
Step 82, robot drives shutter is removed, and V50 test machines carry out parameter testing again to sensitive chip to be measured
Test result is returned into manipulator afterwards.
Further, further include step 10 after the step 9, the step 10 is specially：V50 test machines test one
After sensitive chip to be measured, next sensitive chip is automatically switched to, until test is completed.
Further, in the step 41 and step 42, manipulator includes chip to the test event of sensitive chip to be measured
Whether the function of normal, VIH and VIL is the leakage current of whether normal, chip the IO feet of short circuit to power supply and over the ground of opening of pin
Whether normal, chip is in high pressure and high frequency for whether normal, chip the power consumption of driving function of no normal, chip Output pin
Whether lower function normal, chip environmental light parameter whether normal, environmental light parameter of the chip under darkroom whether normal, chip
Block whether optical parameter normal, whether normal, chip whether TRIM electric currents normal, chip by chip shutter OPEN
Whether whether normal and chip the ISTOP00 electric currents of whether normal, chip the ISTOP_00 electric currents of NOTRIM electric currents are normal.
The automatic sensitive chip automatization test system of smart mobile phone and its control method that the present invention is realized, pass through V50
Test machine, the cooperation for testing DUT and manipulator, simulate the actual working environment of sensitive chip, the DC parameter to chip and friendship
Stream parameter is tested, then carries out trimming calibration to the optical parameter and TRIM units of sensitive chip, to make each chip
Parameters are normal and the consistency adjustment of each parameter is to optimal；Furthermore manipulator judges sense to be measured according to test result
The quality of optical chip comes out defective products Effective selection, and non-defective unit is placed into non-defective unit area, and defective products is placed into bad area, real
The now automatic test to the automatic sensitive chip of smart mobile phone and screening.
Description of the drawings
Fig. 1 is the structural schematic diagram for the automatic sensitive chip automatization test system of smart mobile phone that the present invention is implemented.
Fig. 2 is the block diagram for the automatic sensitive chip automatization test system of smart mobile phone that the present invention is implemented.
The flow of the control method for the automatic sensitive chip automatization test system of smart mobile phone that Fig. 3 is implemented for the present invention
Figure.
Specific implementation mode
In order to make the purpose , technical scheme and advantage of the present invention be clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.
Shown in Fig. 1-2, for the automatic sensitive chip automatization test system of smart mobile phone that the present invention is realized, this is
System includes V50 test machines 1, test DUT2 and manipulator 3, and manipulator 3 is arranged on V50 test machines 1, and is set on V50 test machines 1
It is equipped with shutter (not shown) and test platform 11；After sensitive chip 4 to be measured is placed on test platform 11, V50 test machines 1 with
DUT2 connections are tested, test DUT2 is connect with sensitive chip 4 to be measured, and manipulator 3 is connect with sensitive chip 4 to be measured；Manipulator 3
It is drivingly connected with shutter, manipulator 3 drives shutter to block in the top of sensitive chip 4 to be measured, and V50 test machines 1 are to be measured
Sensitive chip 4 carry out parameter testing after, manipulator 3 drive shutter remove, and V50 test machines 1 to sensitive chip 4 to be measured again
Test result is returned into manipulator 3 after progress parameter testing, manipulator 3 is according to the test result received to photosensitive core to be measured
Piece 4 is classified.
V50 test machines 1 are equipped with mounting bracket 12, feeding station 13 and Riving Box 14, and manipulator 3 is mounted on mounting bracket 12,
And mounting bracket 12 is drivingly connected with manipulator 3；Test platform 11, feeding station 13 and Riving Box 14 are arranged under mounting bracket 12
Side, manipulator 3 slide on mounting bracket 12, and manipulator 3 is placed on from 13 feeding of feeding station on test platform 11, V50 test machines 1
After the completion of test, sensitive chip after test is placed by classification in Riving Box 14 by manipulator 3.
Vibrating disk 15 and straight-line oscillation track 16, one end of straight-line oscillation track 16 and vibration are additionally provided on V50 test machines 1
Disk 15 be connected, the other end of straight-line oscillation track 16 is connected with feeding station 13, and V50 test machines 1 respectively with vibrating disk 15 and directly
Linearly coupled track 16 is drivingly connected；Sensitive chip 4 to be measured vibrates on vibrating disk 15 and after adjustment direction by straight-line oscillation track
After 16 one end are transported to the other end, it is placed on feeding station 13.
V50 test machines 1 are equipped with power module and digital channel module, power module and number channel module with test
DUT2 connections, V50 test machines 1 are powered by power module and test DUT2 to sensitive chip 4 to be measured, and V50 test machines 1 pass through
Digital channel module and test DUT2 apply corresponding pumping signal to sensitive chip 4 to be measured, and V50 test machines 1 test sense to be measured
The parameters of optical chip 4 judge quality and the classification of sensitive chip 4 to be measured according to test result.
V50 test machines 1 are powered by programmable power supply to chip, then further according to the requirement of testing scheme to chip
Apply corresponding pumping signal, allows chip to be tested in the environment of 1000 lux illumination and trim the photosensitive parameter of chip, then allow
The photosensitive parameter of chip test chip in the environment of 0 lux illumination, then chip top place shutter, to chip into
The test that row blocks board parameter trims, then shutter is removed, and the parameter in the case of shutter is removed is tested, finally according to test
The quality of result judgement chip to be measured, defective products Effective selection is come out.
Test DUT2 is the interface of V50 test machines 1 and sensitive chip 4 to be measured, and V50 test machines 1 are by testing DUT2 electricity
Source and digital signal give chip to be tested, and sensitive chip 4 to be measured again send the test result information of return by testing DUT2
To test machine, the test communication between V50 test machines 1 and sensitive chip to be measured 4 is thereby realized.
Manipulator 3 has been feeding, connection, material-distributing action, and chip to be measured is put into test platform 11 by it, concurrently starts letter
Number V50 test machines 1 are given to, V50 test machines 1 are tested, and V50 test machines 1 return again to the result information of test to manipulator
3, sensitive chip is carried out fine or not classification by manipulator 3 by the result information received.
The supply voltage of power module is one kind in 3.7V, 2.3V or 3V.
Referring to Fig. 3, the present invention also provides a kind of controlling parties of the automatic sensitive chip automatization test system of smart mobile phone
Method includes the following steps：
V50 test machines connect with test DUT, and test DUT are connect with manipulator by step S1；
Step S2 starts test system, corresponding test software is transferred, into test；
Step S3 connects V50 test machines, establishes the communication between manipulator；
Step S4 starts manipulator and vibrating disk, vibrates disc vibration sensitive chip to be measured, adjustment chip direction；
Step S5, vibrating disk transport sensitive chip to be measured on straight-line oscillation track；
Sensitive chip to be measured is transported feeding station by step S6, straight-line oscillation track；
Step S7, manipulator removes sensitive chip to be measured from feeding station, and sensitive chip to be measured is placed into test platform
On；
Step S8, V50 test machine tests sensitive chip to be measured, and test result is returned to manipulator；
Step S9, manipulator carry out sensitive chip to be measured according to the test result received to be classified to Riving Box.
Step S8 is specially：
Step S81, robot drives shutter is blocked in the top of sensitive chip to be measured, and V50 test machines are to sense to be measured
Optical chip carries out parameter testing；
Step S82, robot drives shutter are removed, and V50 test machines carry out parameter survey again to sensitive chip to be measured
Test result is returned into manipulator after examination.After the test result that manipulator receives, if the photosensitive core to be measured of manipulator test
Piece is non-defective unit, then non-defective unit is placed into the non-defective unit area of Riving Box；If the chip to be measured of manipulator test is defective products, will be bad
Product are placed into the bad area of Riving Box.
Further include step 10 after step S9, step S10 is specially：V50 test machines test a sensitive chip to be measured
Afterwards, next sensitive chip is automatically switched to, until test is completed.
In step S81 and step S82, manipulator includes that opening for the pin of chip is short to the test event of sensitive chip to be measured
Whether road normal, the leakage current of chip IO feet to power supply and over the ground whether the function of normal, VIH and VIL whether normal, chip
Output pin whether driving function normal, power consumption of chip whether normal, chip under high pressure and high frequency function whether
Normally, normally whether the environmental light parameter of chip, whether environmental light parameter of the chip under darkroom be normal, chip blocks beche-de-mer without spike
Whether number normal, whether normal, chip the NOTRIM electric currents of whether normal, chip the TRIM electric currents of chip shutter OPEN whether
Normally, whether normal and chip the ISTOP00 electric currents of the ISTOP_00 electric currents of chip are normal.
The specific test event stream of the control method of the automatic sensitive chip automatization test system of smart mobile phone of the present invention
Journey is described as：
1) V50 test machines give the protection diode of the pin of the testing current sensitive chip of +/- 100uA to power supply and over the ground
Characteristic judges whether opening for the pin of sensitive chip be short-circuit normal by reading diode turn-on voltage.
2) V50 test machines give sensitive chip power supply, pressurize flow measurement to the IO feet of sensitive chip, according to the result of current value come
Judge whether the leakage current of the IO feet of sensitive chip to power supply and over the ground is normal.
3) V50 test machines are powered to sensitive chip, and Vih=0.7VDD and Vil=0.3VDD, fortune are inputted to Input pins
Row test vector judges whether VIH, the function of VIL are normal according to the result of vector operation.
4) V50 test machines are powered to sensitive chip, and operation vector makes Output pin export low level, then to Output
Pin is carried out plus stream pressure measurement, judges whether the driving function of the Output pin of sensitive chip is normal according to the result of voltage.
5) V50 test machines are powered to sensitive chip, and operation vector makes sensitive chip enter working condition, is tested under darkroom
The electric current of the supply pin of sensitive chip judges whether the power consumption of sensitive chip is normal according to the result of electric current.
6) V50 test machines run vector, according to the knot of operation vector to sensitive chip for 3.7V voltages with the frequency of 5MHZ
Whether fruit is normal to judge sensitive chip function under high pressure and high frequency.
7) V50 test machines run vector, according to the knot of operation vector to sensitive chip for 2.3V voltages with the frequency of 5MHZ
Whether fruit is normal to judge sensitive chip function under low pressure and high frequency.
8) V50 test machines run vector, according to operation vector to sensitive chip for 3.7V voltages with the frequency of 0.7MHZ
As a result judge whether sensitive chip function under high pressure and low frequency is normal.
9) V50 test machines run vector, according to operation vector to sensitive chip for 2.3V voltages with the frequency of 0.7MHZ
As a result judge whether sensitive chip function under low pressure and low frequency is normal.
10) V50 test machines irradiate the LED of sensitive chip with the ambient light of 1000Lx to sensitive chip for 3V voltages, according to
The ADC output valves of sensitive chip carry out the configuration photosensitive parameter of adjustment to the memory inside sensitive chip, are judged according to this parameter
Whether the environmental light parameter of sensitive chip is normal.
11) V50 test machines irradiate the LED of sensitive chip with the ambient light of 0Lx, according to sense to sensitive chip for 3V voltages
Whether the ADC output valves of optical chip are normal to judge environmental light parameter of the sensitive chip under darkroom.
12) V50 test machines block the LED of sensitive chip with shutter, according to sensitive chip to sensitive chip for 3V voltages
ADC output valves to the memory inside sensitive chip carry out configuration the photosensitive parameter of adjustment, sensitive chip is judged according to this parameter
Whether block optical parameter normal.
13) V50 test machines remove shutter to sensitive chip for 3V voltages, according to the ADC output valves of sensitive chip come
Judge whether sensitive chip shutter OPEN is normal.
14) V50 test machines give sensitive chip power 3V voltages, to sensitive chip carry out electric current TRIM, by current value come
Judge whether the TRIM electric currents of sensitive chip are normal.
15) V50 test machines give sensitive chip power supply 3V voltages, carry out electric current NOTRIM to sensitive chip, pass through current value
Whether the NOTRIM electric currents to judge sensitive chip are normal.
16) V50 test machines give sensitive chip power supply 3V voltages, to sensitive chip operation ISTOP_00 vectors, pass through electric current
Whether value is normal to judge the ISTOP_00 electric currents of sensitive chip.
17) V50 test machines give sensitive chip power supply 3V voltages, to sensitive chip operation ISTOPFF vectors, pass through current value
Whether the ISTOP00 electric currents to judge sensitive chip are normal.
18) V50 test machines are powered off to sensitive chip.
19) all of above project testing passes through, and sensitive chip to be measured is determined as non-defective unit, is otherwise judged to defective products.
The automatic sensitive chip automatization test system of smart mobile phone and its control method that the present invention is realized, pass through V50
Test machine, the cooperation for testing DUT and manipulator, simulate the actual working environment of sensitive chip, the DC parameter to chip and friendship
Stream parameter is tested, then carries out trimming calibration to the optical parameter and TRIM units of sensitive chip, to make each chip
Parameters are normal and the consistency adjustment of each parameter is to optimal；Furthermore manipulator judges sense to be measured according to test result
The quality of optical chip comes out defective products Effective selection, and non-defective unit is placed into non-defective unit area, and defective products is placed into bad area, real
The now automatic test to the automatic sensitive chip of smart mobile phone and screening.
The above is merely preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
All any modification, equivalent and improvement made by within principle etc., should all be included in the protection scope of the present invention.
Claims (9)
1. a kind of automatic sensitive chip automatization test system of smart mobile phone, which is characterized in that the system include V50 test machines,
DUT and manipulator are tested, the manipulator is arranged on V50 test machines, and is provided with shutter and survey on the V50 test machines
Try platform；After sensitive chip to be measured is placed on test platform, the V50 test machines are connect with test DUT, the test DUT
It is connect with sensitive chip to be measured, and the manipulator is connect with sensitive chip to be measured；The manipulator is drivingly connected with shutter,
The robot drives shutter is blocked in the top of sensitive chip to be measured, and the V50 test machines carry out sensitive chip to be measured
After parameter testing, the robot drives shutter is removed, and the V50 test machines carry out parameter again to sensitive chip to be measured
Test result is returned into manipulator after test, the manipulator carries out sensitive chip to be measured according to the test result received
Classification.
2. the automatic sensitive chip automatization test system of smart mobile phone as described in claim 1, which is characterized in that the V50
Test machine is equipped with mounting bracket, feeding station and Riving Box, and the manipulator is mounted on mounting bracket, and the mounting bracket and machinery
Hand-drive connects；The test platform, feeding station and Riving Box are arranged at the lower section of mounting bracket, and the manipulator is in mounting bracket
Upper sliding, the manipulator are placed on from feeding station feeding on test platform, after the completion of the V50 test machines test, the machine
Sensitive chip after test is placed by classification in Riving Box by tool hand.
3. the automatic sensitive chip automatization test system of smart mobile phone as claimed in claim 2, which is characterized in that the V50
Vibrating disk and straight-line oscillation track are additionally provided on test machine, one end of the straight-line oscillation track is connected with vibrating disk, described straight
The other end of linearly coupled track is connected with feeding station, and the V50 test machines drive with vibrating disk and straight-line oscillation track respectively
Connection；After sensitive chip to be measured vibrates on vibrating disk and is transported to the other end by straight-line oscillation track one end after adjustment direction,
It is placed on feeding station.
4. the automatic sensitive chip automatization test system of smart mobile phone as described in claim 1, which is characterized in that the V50
Test machine is equipped with power module and digital channel module, and the power module and digital channel module are connect with test DUT,
The V50 test machines are powered by power module and test DUT to sensitive chip to be measured, and the V50 test machines pass through number
Channel module and test DUT apply corresponding pumping signal to sensitive chip to be measured, and the V50 test machines test photosensitive core to be measured
The parameters of piece judge quality and the classification of sensitive chip to be measured according to test result.
5. the automatic sensitive chip automatization test system of smart mobile phone as claimed in claim 4, which is characterized in that the power supply
The supply voltage of module is one kind in 3.7V, 2.3V or 3V.
6. a kind of control method of the automatic sensitive chip automatization test system of smart mobile phone, which is characterized in that including following step
Suddenly：
Step 1, V50 test machines are connect with test DUT, and test DUT is connect with manipulator；
Step 2, start test system, corresponding test software is transferred, into test；
Step 3, V50 test machines are connected, the communication between manipulator is established；
Step 4, start manipulator and vibrating disk, vibrate disc vibration sensitive chip to be measured, adjustment chip direction；
Step 5, vibrating disk transports sensitive chip to be measured on straight-line oscillation track；
Step 6, sensitive chip to be measured is transported feeding station by straight-line oscillation track；
Step 7, manipulator removes sensitive chip to be measured from feeding station, and sensitive chip to be measured is placed on test platform；
Step 8, V50 test machines test sensitive chip to be measured, and test result is returned to manipulator；
Step 9, manipulator carries out sensitive chip to be measured according to the test result received to be classified to Riving Box.
7. the control method of the automatic sensitive chip automatization test system of smart mobile phone as claimed in claim 6, feature exist
In the step 8 is specially：
Step 81, robot drives shutter is blocked in the top of sensitive chip to be measured, and V50 test machines are to sensitive chip to be measured
Carry out parameter testing；
Step 82, robot drives shutter is removed, and V50 test machines carry out sensitive chip to be measured general after parameter testing again
Test result returns to manipulator.
8. the control method of the automatic sensitive chip automatization test system of smart mobile phone as claimed in claim 7, feature exist
In further including step 10 after the step 9, the step 10 is specially：V50 test machines test a sensitive chip to be measured
Afterwards, next sensitive chip is automatically switched to, until test is completed.
9. the control method of the automatic sensitive chip automatization test system of smart mobile phone as claimed in claim 7, feature exist
In in the step 81 and step 82, manipulator includes that the pin of chip opens short circuit to the test event of sensitive chip to be measured
Normally whether, whether the function of normal, VIH and VIL is normal, chip for the leakage current of the IO feet of chip to power supply and over the ground
Whether the driving function of Output pin normal, chip power consumption whether normal, chip just whether function under high pressure and high frequency
Often, normally whether the environmental light parameter of chip, whether environmental light parameter of the chip under darkroom be normal, chip blocks optical parameter
Just whether normal, chip the NOTRIM electric currents of whether normal, chip the TRIM electric currents of whether normal, chip shutter OPEN
Often, whether normal and chip the ISTOP00 electric currents of the ISTOP_00 electric currents of chip are normal.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110376430A (en) * | 2019-07-17 | 2019-10-25 | 广州市伟粤通讯设备有限公司 | A kind of communication component evaluation system based on big data |
| CN110568345A (en) * | 2019-09-27 | 2019-12-13 | 北京中电华大电子设计有限责任公司 | automatic test equipment and control method thereof |
| CN114247664A (en) * | 2021-12-27 | 2022-03-29 | 厦门科塔电子有限公司 | Chip FT test system and method integrating sorting and testing |
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| CN110376430B (en) * | 2019-07-17 | 2020-05-22 | 广州市伟粤通讯设备有限公司 | Communication components and parts test evaluation system based on big data |
| CN110568345A (en) * | 2019-09-27 | 2019-12-13 | 北京中电华大电子设计有限责任公司 | automatic test equipment and control method thereof |
| CN114247664A (en) * | 2021-12-27 | 2022-03-29 | 厦门科塔电子有限公司 | Chip FT test system and method integrating sorting and testing |
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