CN110376430A - A kind of communication component evaluation system based on big data - Google Patents
A kind of communication component evaluation system based on big data Download PDFInfo
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R23/00—Arrangements for measuring frequencies; Arrangements for analysing frequency spectra
- G01R23/02—Arrangements for measuring frequency, e.g. pulse repetition rate; Arrangements for measuring period of current or voltage
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
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- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
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Abstract
The invention discloses a kind of communication component evaluation system based on big data, including information acquisition module, categorization module, environment temperature adjustment module, dominant frequency adjustment module, test module, detection module, data processing module and evaluation module；By information acquisition module, categorization module, the cooperation of environment temperature adjustment module, the condition setting for acquiring data in further detail and rationally.Test module cooperates detection module, realizes that the range of test is wider, conducive to chip in each equipment of subsequent analysis for the relationship of environment temperature, dominant frequency and power consumption.Data processing module cooperates evaluation module to determine the highest environment temperature of equipment operating efficiency and frequency again, is conducive to easily understand efficiency of the equipment in each middle use environment and whole scoring according to the suitable equipment of specifically used environmental selection.
Description
Technical field
The present invention relates to a kind of evaluation system fields, and in particular to a kind of communication component test based on big data
Assessment system.
Background technique
Chip plays an important role as the component for carrying out data processing in communication equipment, in ideal model,
The energy consumption mathematical formulae of chip can be expressed as P=C*V2* f, wherein C is constant, and V represents voltage, and f is frequency, ideal situation
In, frequency and energy consumption are linear, and in actual use, distinct device uses different chips, or using identical
The distinct device of chip leads to chip temperature and energy consumption difference due to the difference of radiating condition and environment temperature, and then makes energy consumption
It is not identical as in the relationship and ideal model of frequency, meanwhile, P is dynamic energy consumption in above-mentioned formula, in actual use, also
It need to consider short-circuit energy consumption and electric leakage energy consumption, therefore to determine chip each by chip entirety energy consumption, dominant frequency and environment temperature
Actual performance in equipment is very difficult.
Such as the patent document of Publication No. CN105629052B, a kind of chip power-consumption real-time detection method is disclosed, comprising:
Test circuit is set up, the test circuit includes: the fuse, power circuit and electronic load being sequentially connected in series, and is connected to insurance
The voltage measuring apparatus of the voltage value for measuring fuse both ends at silk both ends, the analog-to-digital conversion being connect with voltage measuring apparatus
Device, and the computing device being connect with analog-digital commutator；Setting electronic load is different power consumption value, is surveyed using test circuit
Amount flows through the input current value of fuse；Curve equation is fitted using electronic load actual power loss value and input current value,
Middle curve equation is using input current value as independent variable, using power consumption number as dependent variable；Based on curve equation, according to the defeated of chip under test
Enter the actual power loss value that current value extrapolates chip under test.But the method only detected power consumption number, while the curve utilized is public
Formula is also more single, is unable to satisfy the complex situations of true use environment, but be not directed to different dominant frequency, varying environment temperature and
Chip energy consumption difference between distinct device carries out further testing and evaluation.
Therefore a kind of system that can be tested for chip entirety energy consumption, dominant frequency and environment temperature is needed, with
Solve the difference of actual consumption of each chip in distinct device.
Summary of the invention
In order to solve the above technical problems, the purpose of the present invention is to provide a kind of communication components based on big data
Evaluation system is cooperated, the condition for acquiring data by information acquisition module, categorization module, environment temperature adjustment module
Be arranged in further detail and rationally.Test module cooperates detection module, realizes that the range of test is wider, and it is each to be conducive to subsequent analysis
Relationship of the chip for environment temperature, dominant frequency and power consumption in equipment.Data processing module cooperates evaluation module to determine that equipment is transported again
The highest environment temperature of line efficiency and frequency are conducive to easily be understood according to the suitable equipment of specifically used environmental selection
Efficiency of the equipment in each middle use environment and whole scoring.
The technical problems to be solved by the invention are as follows:
(1) how to be tested for chip entirety energy consumption, dominant frequency and environment temperature, set with understanding each chip in difference
The difference of actual consumption in standby.
The purpose of the present invention can be achieved through the following technical solutions:
A kind of communication component evaluation system based on big data, including information acquisition module, categorization module, environment
Temperature adjustment module, dominant frequency adjustment module, test module, detection module, data processing module and evaluation module；
The information acquisition module is used to obtain the category, device model, chip model, operating temperature model of communication equipment
It encloses, chip dominant frequency range；
The categorization module is used to category, device model and chip model equipment all the same being divided into one group and mark
For level-one similar group；Category and chip model equipment all the same are divided into one group and labeled as second level similar group；By category
Identical level-one similar group is divided into one group and labeled as three-level similar group；
The environment temperature adjustment module is used for build environment temperature gradient table, is also used to carrying out chip power-consumption test
When, environment temperature is maintained at a fixed range according to environment temperature gradient table；
Specific step is as follows for the environment temperature adjustment module build environment temperature gradient table:
The operating temperature range of all devices in three-level similar group is read, and filters out maximum value tmaxWith minimum value tmin,
Operating temperature range T=[t as the categorymin,tmax], then filter out in T promising 5 DEG C of multiple temperature value side by side
Sequence is denoted as tem={ t1, t2, t3 ..., tj ..., tm } as the environment temperature gradient table of the category；
The dominant frequency adjustment module is also used to for generating dominant frequency gradient table when carrying out chip power-consumption test, according to master
Frequency gradient table makes chip keep full load operation in a fixed dominant frequency；
Specific step is as follows for generating dominant frequency gradient table for the dominant frequency adjustment module:
The chip dominant frequency range of all devices in second level similar group is read, and filters out maximum value fmaxWith minimum value fmin,
Dominant frequency range F=[f as the categorymin,fmax], then filter out in F the dominant frequency value of the multiple of promising 100Mhz and sort,
As dominant frequency gradient table, it is denoted as S={ s1, s2 ..., si ..., sn }；
The test module is used to carry out core to each level-one similar group according to environment temperature gradient table and dominant frequency gradient table
Piece power consumption test；
The detection module is used for when carrying out chip power-consumption test to the working condition of equipment, chip power-consumption and chip temperature
Degree is detected and is recorded, wherein whether working condition is to work normally；
The chip power-consumption and chip temperature that the data processing module acquires detection module calculate, and generate fitting letter
Number；
The evaluation module is used to determine the suitable environment temperature range and most of each level-one similar group according to fitting function
Excellent operation dominant frequency section, and determine chip function of the equipment of all identical categories in each fixed environment temperature and fixed dominant frequency
Consume the sequence of size.
Further, specific step is as follows for the test module progress chip power-consumption test:
S1, successively select equipment in a level-one similar group as test object, and transfer environment temperature adjustment module
Environment temperature is adjusted to t1, and environmental temperature fluctuation range when test is made to be maintained at ± 0.5 DEG C；
S2, it calls dominant frequency adjustment module that dominant frequency is adjusted to s1, and after so that chip full load is run 30min, calls detection
Module records real-time chip power-consumption p1 1And chip temperature k1 1；
S3, to chip temperature k1 1When being down to t1, then dominant frequency is adjusted to s2, and after so that chip full load is run 30min, note
Record real-time chip power-consumption p1 2And chip temperature k1 2；
S4, and so on, by dominant frequency value in dominant frequency gradient table from as low as big sequence, obtain when environment temperature is t1,
Chip power-consumption set P of the equipment under all dominant frequency when full load operation1 i={ p1 1, p1 2..., p1 nAnd chip temperature set Ki 1
={ k1 1, k1 2..., k1 n}；
Environment temperature is adjusted to t2 by S5, transfer environment temperature adjustment module, when chip temperature k1 is down to t2, is held again
Row S2-S4 is obtained when environment temperature is t2, chip power-consumption set P of the equipment under all dominant frequency when full load operation2 i=
{p2 1, p2 2..., p2 nAnd chip temperature set Ki 2={ k2 1, k2 2..., k2 n}；
S6, and so on, when chip temperature is down to identical as environment temperature, by environment temperature gradient table from as low as big
Temperature value, execute S1-S5 again, obtain the chip power-consumption P of equipment under any fixed temperature and fixed dominant frequencyj iAnd chip temperature
Kj i；
The average value and core of the same environment temperature of all devices and the chip power-consumption under dominant frequency in S7, first order calculation similar group
The average value of piece temperature, and the real chip power consumption w as the equipment at the temperature and dominant frequencyj iWith corresponding real chip temperature
Spend hj i, and the power consumption thermometer that the level-one similar group corresponds to equipment is generated, wherein j indicates that the environment temperature of test is environment temperature
The temperature value of j-th of element in gradient table, i indicate that the dominant frequency of test is the dominant frequency value of i-th of element in dominant frequency gradient table.
Further, specific step is as follows for the data processing module generation fitting function:
SS1, it successively obtains under each environment temperature, the corresponding chip power-consumption of all dominant frequency, in input data processing module
The relevant power consumption fitting function B (s) of dominant frequency is generated, then derivation is carried out to all B (s), obtains corresponding derivative function b (s)；
SS2, it successively obtains under each dominant frequency, the corresponding chip power-consumption of all environment temperatures, in input data processing module
The relevant power consumption fitting function G (t) of build environment temperature, then derivation is carried out to all G (t), obtain corresponding derivative function g
(t)；
SS3, it calculates in section F=[fmin,fmax] in, each point corresponds to the set bs of the value of b (s) in dominant frequency gradient table, and
The average value α of set of computations bs, then calculate the section of b (s) < α；
SS4, it calculates in section T=[tmin,tmax] in, each point corresponds to the set of the value of g (t) in environment temperature gradient table
Gt, and the average value β of set of computations gt, then calculate the section of g (t) < β.
Further, the evaluation module is using the section of b (s) < α as the optimized operation dominant frequency of corresponding level-one similar group
Section, using the section of g (t) < β as the suitable environment temperature range of corresponding level-one similar group, by three-level similar group each one
Chip power-consumption of the grade similar group at each fixed environment temperature and dominant frequency is according to from being as low as ranked up greatly, if power consumption is identical,
Then more corresponding chip temperature, the low ranking of chip temperature is higher, obtain ranking first three level-one similar group carry out bonus point,
Middle first place adds 3 points, and second place adds 2 points, and third adds 1 point, calculates all environment temperatures and each level-one similar group of dominant frequency
Total score, and be ranked up according to total score from high to low.
Beneficial effects of the present invention:
(1) it data acquisition aspect: is acquired by relevant information of the information acquisition module to equipment, facilitates subsequent number
According to processing and comparison, equipment is divided by identical equipment, the distinct device of identical chips, same type equipment by categorization module,
The environment temperature gradient table for covering the operating temperature range of the category is generated by environment temperature adjustment module, and according to environment temperature
Environment temperature when degree gradient table is to test controls；The dominant frequency range for covering the category is generated by dominant frequency adjustment module
Dominant frequency gradient table, and dominant frequency when testing is controlled according to dominant frequency gradient table, compared with the prior art, the item of data acquisition
Part setting in further detail and rationally.
(2) in terms of testing process: test module carries out energy consumption testing to all equipment, cooperates detection module, and acquisition is each
Real-time chip energy consumption and real-time chip temperature when a equipment is tested, compared with the prior art, the range of test is wider, covering
Different environment temperatures and dominant frequency is conducive in each equipment of subsequent analysis chip for environment temperature, dominant frequency and power consumption
Relationship.
(3) data processing and aspect is excavated: data processing module calculates the chip power-consumption and chip temperature of acquisition,
It finds a function, tabulate, then evaluation module is cooperated to determine optimized operation dominant frequency section and suitable environment temperature range, pass through optimized operation
Dominant frequency section and suitable environment temperature range can determine the highest environment temperature of equipment operating efficiency and frequency, be conducive to according to tool
Body use environment selects suitable equipment, while same category of device is ranked up and being scored, and can easily understand equipment in each
Efficiency and whole scoring in use environment.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is system block diagram of the invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts all other
Embodiment shall fall within the protection scope of the present invention.
Refering to Figure 1, present embodiments providing a kind of communication component evaluation system based on big data, wrap
Include information acquisition module, categorization module, environment temperature adjustment module, dominant frequency adjustment module, test module, detection module, data
Processing module and evaluation module；
The information acquisition module is used to obtain the category, device model, chip model, operating temperature model of communication equipment
It encloses, chip dominant frequency range；If the category of communication equipment is mobile communication terminal, device model abc-001, chip model is
A73, operating temperature range are -10 DEG C to 60 DEG C, and chip dominant frequency range is 760Mhz-2.9Ghz.
The categorization module is used to category, device model and chip model equipment all the same being divided into one group and mark
For level-one similar group；Category and chip model equipment all the same are divided into one group and labeled as second level similar group；By category
Identical level-one similar group is divided into one group and labeled as three-level similar group；Equipment in level-one similar group is identical equipment, two
Equipment in grade similar group is the same category of device using identical chips, such as the communication terminal of different brands, is all used identical
Chip, the equipment in three-level similar group is same category equipment, as the communication terminal of different brands uses different chips.
The environment temperature adjustment module is used for build environment temperature gradient table, is also used to carrying out chip power-consumption test
When, environment temperature is maintained at a fixed range according to environment temperature gradient table；Environment temperature gradient table is for temperature
Collection point needs to cover temperature range when such equipment uses, and the operating temperature range of distinct device is not necessarily identical, because
This needs the working range in view of entire category to carry out production environment temperature gradient table.
Specific step is as follows for the environment temperature adjustment module build environment temperature gradient table:
The operating temperature range of all devices in three-level similar group is read, and filters out maximum value tmaxWith minimum value tmin,
Operating temperature range T=[t as the categorymin,tmax], then filter out in T promising 5 DEG C of multiple temperature value side by side
Sequence is denoted as tem={ t1, t2, t3 ..., tj ..., tm } as the environment temperature gradient table of the category.As T=[- 15 DEG C, 70
DEG C], then { -15, -10, -5 ..., 30 ..., 70 } environment temperature gradient table tem=.
The dominant frequency adjustment module is also used to for generating dominant frequency gradient table when carrying out chip power-consumption test, according to master
Frequency gradient table makes chip keep full load operation in a fixed dominant frequency；Identical as environment temperature gradient table, each chip is most
Low dominant frequency and highest dominant frequency be not identical, therefore dominant frequency gradient table needs to cover the working frequency of entire category.
Specific step is as follows for generating dominant frequency gradient table for the dominant frequency adjustment module:
The chip dominant frequency range of all devices in second level similar group is read, and filters out maximum value fmaxWith minimum value fmin,
Dominant frequency range F=[f as the categorymin,fmax], then filter out in F the dominant frequency value of the multiple of promising 100Mhz and sort,
As dominant frequency gradient table, it is denoted as S={ s1, s2 ..., si ..., sn }；Such as F=[430Mhz, 2Ghz], then dominant frequency gradient table S=
{ 500Mhz, 600Mhz ..., 1Ghz ..., 2Ghz }.
The test module is used to carry out core to each level-one similar group according to environment temperature gradient table and dominant frequency gradient table
Piece power consumption test；The test module carries out chip power-consumption test, and specific step is as follows:
S1, successively select equipment in a level-one similar group as test object, and transfer environment temperature adjustment module
Environment temperature is adjusted to t1, and environmental temperature fluctuation range when test is made to be maintained at ± 0.5 DEG C；
S2, it calls dominant frequency adjustment module that dominant frequency is adjusted to s1, and after so that chip full load is run 30min, calls detection
Module records real-time chip power-consumption p1 1And chip temperature k1 1；After running for a period of time, chip temperature just reaches flat chip
Weighing apparatus, it is therefore desirable to run the acquisition for carrying out data after a period of time again.
S3, to chip temperature k1 1When being down to t1, then dominant frequency is adjusted to s2, and after so that chip full load is run 30min, note
Record real-time chip power-consumption p1 2And chip temperature k1 2；
S4, and so on, by dominant frequency value in dominant frequency gradient table from as low as big sequence, obtain when environment temperature is t1,
Chip power-consumption set P of the equipment under all dominant frequency when full load operation1 i={ p1 1, p1 2..., p1 nAnd chip temperature set Ki 1
={ k1 1, k1 2..., k1 n}；Such as p1 1Indicate that environment temperature is chip power-consumption when t1 and dominant frequency are fixed as s1, k1 1Indicate environment
Temperature is chip temperature when t1 and dominant frequency are fixed as s1.
Environment temperature is adjusted to t2 by S5, transfer environment temperature adjustment module, when chip temperature k1 is down to t2, is held again
Row S2-S4 is obtained when environment temperature is t2, chip power-consumption set P of the equipment under all dominant frequency when full load operation2 i=
{p2 1, p2 2..., p2 nAnd chip temperature set Ki 2={ k2 1, k2 2..., k2 n}；After environment temperature is completed when being t1, then into
Test when row environment temperature is t2, but be guarantee accuracy, it needs to be tested again after chip temperature reduces,
S6, and so on, when chip temperature is down to identical as environment temperature, by environment temperature gradient table from as low as big
Temperature value, execute S1-S5 again, obtain the chip power-consumption P of equipment under any fixed temperature and fixed dominant frequencyj iAnd chip temperature
Kj i；Wherein subscript j corresponds to j-th of element in environment temperature gradient table, and subscript i corresponds to i-th of element in dominant frequency gradient table.
The average value and core of the same environment temperature of all devices and the chip power-consumption under dominant frequency in S7, first order calculation similar group
The average value of piece temperature, it is excessive to prevent the specificity of individual from data being caused to deviate, it is protected by multiple identical equipment average values
Demonstrate,prove the validity of data, and the real chip power consumption w as the equipment at the temperature and dominant frequencyj iWith corresponding real chip temperature
Spend hj i, and the power consumption thermometer that the level-one similar group corresponds to equipment is generated, such as 1 form of table, the first behavior environment temperature gradient table
Corresponding temperature acquisition point, corresponding first row is the corresponding collection point of dominant frequency gradient table, and wherein j indicates the environment temperature of test
For the temperature value of j-th of element in environment temperature gradient table, i indicates that the dominant frequency of test is i-th of element in dominant frequency gradient table
Dominant frequency value.The power consumption test that a kind of equipment is completed to this, continues the test of other equipment, until all devices are completed
Test facilitates the power consumption difference compared between different chips or same chip distinct device.
| t1 | t2 | … | tj | … | tm | |
| s1 | w1 1,h1 1 | w2 1,h2 1 | … | wj 1,hj 1 | … | wm 1,hm 1 |
| s2 | w1 2,h1 2 | w2 2,h2 2 | … | wj 2,hj 2 | … | wm 2,hm 2 |
| … | … | … | … | … | … | … |
| si | w1 i,h1 1 | w2 i,h2 i | … | wj i,hj i | … | wm i,hm i |
| … | … | … | … | … | … | … |
| sn | w1 n,h1 n | w2 n,h2 n | … | wj n,hj n | … | wm n,hm n |
1 power consumption thermometer of table
The detection module is used for when carrying out chip power-consumption test to the working condition of equipment, chip power-consumption and chip temperature
Degree is detected and is recorded, wherein whether working condition is to work normally；It is abnormal data, number for detection working condition
According to processing module without operation.
The chip power-consumption and chip temperature that the data processing module acquires detection module calculate, and generate fitting letter
Number；By matlab progress data fitting when being wherein fitted, fit approach chooses quadratic function, cubic function, and exponential function is right
Number function etc., first fits a variety of matched curves, by calculating average fit deviation, selects average fit deviation minimum
Function as fitting function.
The data processing module generates fitting function, and specific step is as follows:
SS1, it successively obtains under each environment temperature, the corresponding chip power-consumption of all dominant frequency, in input data processing module
The relevant power consumption fitting function B (s) of dominant frequency is generated, then derivation is carried out to all B (s), obtains corresponding derivative function b (s)；
SS2, it successively obtains under each dominant frequency, the corresponding chip power-consumption of all environment temperatures, in input data processing module
The relevant power consumption fitting function G (t) of build environment temperature, then derivation is carried out to all G (t), obtain corresponding derivative function g
(t)；Derivative function can be used to describe the variation tendency that chip power-consumption changes with independent variable.
SS3, it calculates in section F=[fmin,fmax] in, each point corresponds to the set bs of the value of b (s) in dominant frequency gradient table, and
The average value α of set of computations bs, then calculate the section of b (s) < α；The value of b (s) is bigger, indicates faster, the energy that power consumption rises
Effect is lower than also, therefore after being higher than some value, Energy Efficiency Ratio is begun to decline, and α is average power consumption change rate, therefore α can make
For reference value.
SS4, it calculates in section T=[tmin,tmax] in, each point corresponds to the set of the value of g (t) in environment temperature gradient table
Gt, and the average value β of set of computations gt, then calculate the section of g (t) < β.Similarly with α, the value of g (t) is bigger, illustrates environment
The influence that temperature rises to energy consumption is bigger, is more than after a certain value, environment temperature rises a bit, more, the Energy Efficiency Ratio that power consumption rises
Also just worse, therefore average influence coefficient of the β as environment temperature, it can be used as reference value.
The evaluation module is used to determine the suitable environment temperature range and most of each level-one similar group according to fitting function
Excellent operation dominant frequency section, and determine chip function of the equipment of all identical categories in each fixed environment temperature and fixed dominant frequency
Consume the sequence of size.
The evaluation module is using the section of b (s) < α as the optimized operation dominant frequency section of corresponding level-one similar group, by g
(t) suitable environment temperature range of the section of < β as corresponding level-one similar group, by level-one similar group each in three-level similar group
Chip power-consumption at each fixed environment temperature and dominant frequency is according to from being as low as ranked up greatly, if power consumption is identical, compares pair
The chip temperature answered, the low ranking of chip temperature is higher, obtains ranking first three level-one similar group and carries out bonus point, wherein first place
Add 3 points, second place adds 2 points, and third adds 1 point, calculates the total score of all environment temperatures and each level-one similar group of dominant frequency, and press
It is ranked up according to total score from high to low.Such as two kinds of distinct devices a, b, at t1, the test environment of s1, a is third, b the
Five, then a remembers 1 point, and b does not score, and at t4, the test environment of s5, a is first place, and b is third, then a remembers 3 points, b note 1
Point, if some is tested under environment, does not work normally, then do not score, according to table 1, and so on, every score in statistical form 1,
A and b total score can be obtained, the two total score is compared, and can be used as the superiority and inferiority for judging two equipment power dissipations.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (4)
1. a kind of communication component evaluation system based on big data, which is characterized in that including information acquisition module, classification
Module, environment temperature adjustment module, dominant frequency adjustment module, test module, detection module, data processing module and assessment mould
Block；
The information acquisition module is used to obtain category, device model, chip model, the operating temperature range, core of communication equipment
Piece dominant frequency range；
The categorization module is used to category, device model and chip model equipment all the same are divided into one group and labeled as one
Grade similar group；Category and chip model equipment all the same are divided into one group and labeled as second level similar group；Category is identical
Level-one similar group be divided into one group and labeled as three-level similar group；
The environment temperature adjustment module is used for build environment temperature gradient table, is also used to press when carrying out chip power-consumption test
Environment temperature is maintained at a fixed range according to environment temperature gradient table；
Specific step is as follows for the environment temperature adjustment module build environment temperature gradient table:
The operating temperature range of all devices in three-level similar group is read, and filters out maximum value tmaxWith minimum value tmin, as
Operating temperature range T=[the t of the categorymin,tmax], then filter out the temperature value of promising 5 DEG C of the multiple of institute and sequence, work in T
For the environment temperature gradient table of the category, it is denoted as tem={ t1, t2, t3 ..., tj ..., tm }；
The dominant frequency adjustment module is also used to when carrying out chip power-consumption test, for generating dominant frequency gradient table according to dominant frequency ladder
Degree table makes chip keep full load operation in a fixed dominant frequency；
Specific step is as follows for generating dominant frequency gradient table for the dominant frequency adjustment module:
The chip dominant frequency range of all devices in second level similar group is read, and filters out maximum value fmaxWith minimum value fmin, as
The dominant frequency range F=[f of the categorymin,fmax], then filter out in F the dominant frequency value of the multiple of promising 100Mhz and sort, as
Dominant frequency gradient table is denoted as S={ s1, s2 ..., si ..., sn }；
The test module is used to carry out chip function to each level-one similar group according to environment temperature gradient table and dominant frequency gradient table
Consumption test；
The detection module be used for when carrying out chip power-consumption test to the working condition of equipment, chip power-consumption and chip temperature into
Row detection and record, wherein whether working condition is to work normally；
The chip power-consumption and chip temperature that the data processing module acquires detection module calculate, and generate fitting function；
The evaluation module is used to determine the suitable environment temperature range and optimal fortune of each level-one similar group according to fitting function
Row dominant frequency section, and determine that chip power-consumption of the equipment of all identical categories in each fixed environment temperature and fixed dominant frequency is big
Small sequence.
2. a kind of communication component evaluation system based on big data according to claim 1, which is characterized in that institute
Stating test module progress chip power-consumption test, specific step is as follows:
S1, successively select equipment in a level-one similar group as test object, and transfer environment temperature adjustment module is by ring
Border temperature is adjusted to t1, and environmental temperature fluctuation range when test is made to be maintained at ± 0.5 DEG C；
S2, it calls dominant frequency adjustment module that dominant frequency is adjusted to s1, and after so that chip full load is run 30min, calls detection module
Record real-time chip power-consumption p1 1And chip temperature k1 1；
S3, to chip temperature k1 1When being down to t1, then dominant frequency is adjusted to s2, and after so that chip full load is run 30min, record is real
When chip power-consumption p1 2And chip temperature k1 2；
S4, and so on, by dominant frequency value in dominant frequency gradient table from as low as big sequence, obtain when environment temperature is t1, equipment
Chip power-consumption set P when full load is run under all dominant frequency1 i={ p1 1, p1 2..., p1 nAnd chip temperature set Ki 1=
{k1 1, k1 2..., k1 n}；
Environment temperature is adjusted to t2 by S5, transfer environment temperature adjustment module, when chip temperature k1 is down to t2, is executed again
S2-S4 is obtained when environment temperature is t2, chip power-consumption set P of the equipment under all dominant frequency when full load operation2 i=
{p2 1, p2 2..., p2 nAnd chip temperature set Ki 2={ k2 1, k2 2..., k2 n}；
S6, and so on, when chip temperature is down to identical as environment temperature, by environment temperature gradient table from as low as big temperature
Angle value executes S1-S5 again, obtains the chip power-consumption P of equipment under any fixed temperature and fixed dominant frequencyj iWith chip temperature Kj i；
The average value and chip temperature of the same environment temperature of all devices and the chip power-consumption under dominant frequency in S7, first order calculation similar group
The average value of degree, and the real chip power consumption w as the equipment at the temperature and dominant frequencyj iWith corresponding real chip temperature
hj i, and the power consumption thermometer that the level-one similar group corresponds to equipment is generated, wherein j indicates that the environment temperature of test is environment temperature ladder
The temperature value of j-th of element in table is spent, i indicates that the dominant frequency of test is the dominant frequency value of i-th of element in dominant frequency gradient table.
3. a kind of communication component evaluation system based on big data according to claim 2, which is characterized in that number
Generating fitting function according to processing module, specific step is as follows:
SS1, it successively obtains under each environment temperature, the corresponding chip power-consumption of all dominant frequency, is generated in input data processing module
The relevant power consumption fitting function B (s) of dominant frequency, then derivation is carried out to all B (s), obtain corresponding derivative function b (s)；
SS2, it successively obtains under each dominant frequency, the corresponding chip power-consumption of all environment temperatures, is generated in input data processing module
The relevant power consumption fitting function G (t) of environment temperature, then derivation is carried out to all G (t), obtain corresponding derivative function g (t)；
SS3, it calculates in section F=[fmin,fmax] in, each point corresponds to the set bs of the value of b (s) in dominant frequency gradient table, and calculates
The average value α of set bs, then calculate the section of b (s) < α；
SS4, it calculates in section T=[tmin,tmax] in, each point corresponds to the set gt of the value of g (t) in environment temperature gradient table, and
The average value β of set of computations gt, then calculate the section of g (t) < β.
4. a kind of communication component evaluation system based on big data according to claim 3, which is characterized in that comment
Estimate module using the section of b (s) < α as the optimized operation dominant frequency section of corresponding level-one similar group, using the section of g (t) < β as
The suitable environment temperature range of corresponding level-one similar group, by level-one similar group each in three-level similar group in each fixed environment temperature
Chip power-consumption under degree and dominant frequency is according to from being as low as ranked up greatly, if power consumption is identical, more corresponding chip temperature, and chip
The low ranking of temperature is higher, obtain ranking first three level-one similar group carry out bonus point, wherein first place adds 3 points, and second place adds 2
Point, third adds 1 point, calculates the total score of all environment temperatures and each level-one similar group of dominant frequency, and according to total score from high to low
It is ranked up.
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