CN108615696B - Die bonding process structure and die bonding machine - Google Patents
Die bonding process structure and die bonding machine Download PDFInfo
- Publication number
- CN108615696B CN108615696B CN201810613156.5A CN201810613156A CN108615696B CN 108615696 B CN108615696 B CN 108615696B CN 201810613156 A CN201810613156 A CN 201810613156A CN 108615696 B CN108615696 B CN 108615696B
- Authority
- CN
- China
- Prior art keywords
- arm
- wafer
- die bonding
- die
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
Abstract
The invention discloses a die bonding process structure and a die bonding machine, wherein the die bonding process structure comprises the following steps: solid brilliant arm control mechanism, lead frame anchor clamps and wafer that from top to bottom set gradually, the lead frame anchor clamps include: first overlap portion and overhead portion, the wafer includes: a second overlapping portion and an exposed portion, the first overlapping portion and the second overlapping portion being overlapped in a plan view; solid brilliant arm control mechanism includes: the longitudinal moving assembly is connected with the die bonding arm and used for driving the die bonding arm to move longitudinally; the rotating assembly is used for driving the die bonding arm to rotate from the wafer to the lead frame clamp and from the lead frame clamp to the wafer. According to the invention, the partial projection areas of the lead frame and the wafer are mutually overlapped in the overlooking state, and the lead frame and the wafer are staggered by a certain height difference in the horizontal view state. The length of the die fixing arm is shortened, the die can be quickly and stably grabbed, and the production efficiency, speed and precision of the equipment are integrally improved.
Description
Technical Field
The invention relates to the technical field of electronic components, in particular to a die bonding process structure and a die bonding machine.
Background
At present, the existing equipment has two ways to realize the die bonding process of the semiconductor wafer: in the first mode, a die bonding arm of the die bonding head horizontally swings 180 degrees and moves up and down, and a crystal-membered ring and a lead frame are combined on the same plane; the disadvantages are as follows: 1. the rotation and swing angle of the die bonding arm is large, so that the inertia of the die bonding arm is increased, the angular speed is increased, and the precision is difficult to control; 2. the ring is in the same plane as the lead frame, and when the ring is 8 inches and 12 inches or the lead frame is widened, the die bond arm length is too long.
The length of a die bonding arm of the existing equipment is as follows: when the wafer size is larger than 200MM for an 8-inch wafer and larger than 300MM for a 12-inch wafer, the longer the wafer fixing arm is, the larger the swing inertia is, the more difficult the wafer fixing arm is to stop stably, and the accuracy and the speed are influenced, so that the efficiency is influenced. The second mode is a structural mode that a die bonding arm of the die bonding head moves horizontally and linearly forwards and backwards and moves up and down, and meanwhile, a die-crystal ring and a lead frame are staggered by a certain plane height, and the current plane height difference is larger than 30 MM; the disadvantages are as follows: 1. the front and back horizontal linear motion of the die bonding arm is loaded, the moving distance is long, and the speed is relatively slow; 2. the up-down lifting distance is long, so that the speed is relatively slow, and the efficiency and the productivity are influenced; in the practical use process, the two modes are difficult to meet the increasing production requirements.
Accordingly, the prior art is yet to be improved and developed.
Disclosure of Invention
In view of the defects of the prior art, the invention aims to provide a die bonder process structure and a die bonder, and aims to solve the problems that in the prior art, due to the fact that a die bonder arm is too long, swing inertia is increased, stopping is difficult, and precision and speed are affected.
The technical scheme of the invention is as follows:
a die bonding process structure comprises: solid brilliant arm control mechanism, lead frame anchor clamps and wafer that from top to bottom set gradually, the lead frame anchor clamps include: a first overlapping portion and an overhead portion, the wafer comprising: a second overlapping portion and an exposed portion, wherein the first overlapping portion and the second overlapping portion are overlapped in a top view state; the die bonding arm control mechanism comprises: the longitudinal moving assembly is connected with the die bonding arm and used for driving the die bonding arm to move longitudinally; the rotating assembly is connected with the longitudinal moving assembly and used for driving the die bonding arm to rotate from the wafer to the lead frame clamp and from the lead frame clamp to rotate from the wafer.
Further, the die bonding process structure, wherein the rotating assembly comprises: the clamping shaft is connected with the upper end of the rotating shaft in a threaded manner and then fixed on the outer edge of an output shaft in the rotating drive source, the lower end of the rotating shaft is movably connected with the crystal arm seat, and the lower end of the crystal arm seat is connected with the crystal fixing arm.
Further, the die bonding process structure is characterized in that a rotary inductor sheet is fixedly connected to the outer edge of the rotary shaft, an R-axis photoelectric inductor is arranged on one side of the rotating assembly, and the height of the rotary inductor sheet is matched with that of the R-axis photoelectric inductor.
Further, the die bonding process structure is characterized in that a transfer block is arranged between the die arm seat and the die bonding arm, a die arm accommodating groove is formed in the middle of the transfer block, an arm force adjusting bolt is arranged in the die arm accommodating groove, the arm force adjusting bolt penetrates through the transfer block and the die bonding arm after one end of the die bonding arm is inserted into the die arm accommodating groove, an arm force adjusting spring is sleeved on the outer edge of the arm force adjusting bolt, and the arm force adjusting spring is located between the die bonding arm and the transfer block.
Further, the die bonding process structure, wherein the die bonding process structure further includes: and one end of the elastic sheet is in threaded connection with the switching block, and the other end of the elastic sheet is in rotating connection with the die fixing arm.
Further, the die bonding process structure, wherein the die bonding process structure further includes: the rotary driving source is fixed on the upper end face of the driving source fixing seat, and the R-axis photoelectric inductor is fixed on the lower end face of the driving source fixing seat.
Further, the die bonding process structure, wherein the longitudinal moving assembly comprises: the movable driving source is fixed on the lower end face of the driving source fixing seat, the movable guide rail is fixed on the side face of the movable driving source, the sliding block is matched with the movable guide rail and is connected with the connecting plate through the sliding plate, and the connecting plate is fixedly connected to the lower end face of an output shaft in the movable driving source and is connected with the die bonding arm.
Furthermore, in the die bonding process structure, a tension spring is arranged between the sliding plate and the driving source fixing seat, and the tension spring, the sliding plate and the sliding block are all provided with two tension springs; and a Z-direction reading head for measuring the moving distance of the connecting plate is fixed on one side of the connecting plate.
Further, the die bonding process structure is characterized in that one end, away from the mobile driving source, of the sliding plate is provided with a rotating groove, an angular contact bearing is arranged in the rotating groove, a rotating connecting rod is arranged at the inner edge of the angular contact bearing, and the upper end of the rotating connecting rod is fixedly connected with the wafer arm seat;
the crystal arm seat is fixedly connected with a first cross guide rail towards one side of the rotating shaft, the rotating shaft is fixedly connected with a second cross guide rail towards one side of the crystal arm, and the first cross guide rail can longitudinally move along the second cross guide rail.
A die bonder comprises the die bonder process structure.
The invention provides a die bonding process structure and a die bonding machine, wherein the die bonding process structure comprises the following steps: solid brilliant arm control mechanism, lead frame anchor clamps and wafer that from top to bottom set gradually, the lead frame anchor clamps include: a first overlapping portion and an overhead portion, the wafer comprising: a second overlapping portion and an exposed portion, wherein the first overlapping portion and the second overlapping portion are overlapped in a top view state; the die bonding arm control mechanism comprises: the longitudinal moving assembly is connected with the die bonding arm and used for driving the die bonding arm to move longitudinally; the rotating assembly is connected with the longitudinal moving assembly and is used for driving the die bonding arm to rotate from the wafer to the lead frame clamp and from the lead frame clamp to the wafer, and meanwhile, the die bonding arm moves vertically; according to the invention, the die bonding arm is controlled to move longitudinally and rotationally through the die bonding process structure, and the center distance for grabbing and releasing the wafer is shortened in the overlapping part area of the lead frame clamp and the wafer, so that the length of the die bonding arm is shortened, the wafer is quickly and stably grabbed and released, the processing precision and efficiency of the wafer are improved, and the production efficiency, speed and precision of the equipment are integrally improved.
Drawings
FIG. 1 is a front view of a preferred embodiment of a die attach process structure according to the present invention.
FIG. 2 is a schematic view of a rotating assembly in a preferred embodiment of a die attach process structure according to the present invention.
FIG. 3 is a schematic view of a longitudinal moving assembly in a preferred embodiment of a die attach process structure according to the present invention.
FIG. 4 is a schematic view of a clamping shaft of a rotating assembly according to a preferred embodiment of the die bonding process structure of the present invention.
FIG. 5 is a schematic view of a cross-guide in a rotating assembly according to a preferred embodiment of the die attach process of the present invention.
FIG. 6 is a perspective view of a preferred embodiment of a die attach process structure according to the present invention.
The reference numbers in the drawings correspond to the following: a die bonding arm control mechanism 10, a lead frame clamp 20 and a die 30; the first overlapped portion 21, the overhead portion 22, the second overlapped portion 31, the exposed portion 32; the device comprises a die bonding arm 11, a longitudinal moving assembly 12, a rotating assembly 13, a rotary inductor sheet 14, an R-axis photoelectric inductor 15, a switching block 16, an arm force adjusting bolt 17, an elastic sheet 18 and a driving source fixing seat 19; a moving drive source 121, a moving guide rail 122, a sliding block 123, a sliding plate 124, a connecting plate 125, a tension spring 126, a Z-direction reading head 127, a rotating groove 128, an angular contact bearing 1281, a rotating connecting rod 1282, a first cross guide rail 1291 and a second cross guide rail 1292; a rotation driving source 131, a rotation shaft 132, a clamp shaft 133 and a wafer holder 134.
Detailed Description
The invention provides a die bonding process structure and a die bonding machine, and in order to make the purpose, technical scheme and effect of the invention clearer and clearer, the invention is further described in detail below by referring to the attached drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1 to 6, the present invention provides a die bonding process structure, which includes: solid brilliant arm control mechanism 10, lead frame anchor clamps 20 and Wafer 30(Wafer, the Wafer is the used carrier of integrated circuit of production, indicates the monocrystalline silicon disk more) that from top to bottom set gradually, lead frame anchor clamps 20 include: first overlapping portion 21 and overhead portion 22, said wafer 30 comprising: the second overlapped part 31 and the exposed part 32 are overlapped with the first overlapped part 21 and the second overlapped part 31 in a overlooking state, and the purpose is to shorten the central distance for grabbing and releasing a wafer, thereby effectively shortening the length of the wafer fixing arm, and the problem that the rotation and swing inertia of the wafer fixing arm is increased and the precision and the speed are influenced due to the overlong wafer fixing arm can be solved by shortening the length of the wafer fixing arm; the die bonding arm control mechanism 10 includes: the die bonder comprises a die bonding arm 11, a longitudinal moving assembly 12 and a rotating assembly 13, wherein the longitudinal moving assembly 12 is connected with the die bonding arm 11 and is used for driving the die bonding arm 11 to move longitudinally; the rotating assembly 13 is connected to the die bonding arm 11, and is configured to drive the die bonding arm 11 to rotate from the die 30 to the lead frame fixture 20, and to rotate from the lead frame fixture 20 to the die 30.
Specifically, as shown in fig. 2 to 4, the rotating assembly 13 includes: the wafer fixing device comprises a rotary driving source 131 (a rotary motor), a rotating shaft 132, a clamping shaft 133 and a wafer arm seat 134, wherein the clamping shaft 133 is connected with the upper end of the rotating shaft 132 in a threaded manner and then fixed on the outer edge of an output shaft in the rotary driving source 131, the lower end of the rotating shaft 132 is movably connected with the wafer arm seat 134, and the lower end of the wafer arm seat 134 is connected with a wafer fixing arm 11.
Further, a semicircular first clamping groove is formed in the upper end of the rotating shaft 132 facing the clamping shaft 133, a semicircular second clamping groove is formed in the clamping shaft 133 facing the rotating shaft 132, the first clamping groove and the second clamping groove are combined to form a clamping groove matched with the output shaft of the rotating drive source 131, and the rotating shaft 132 and the clamping shaft 133 are fixed on the outer edge of the output shaft through the clamping grooves.
As shown in fig. 2, a rotation sensor sheet 14 is fixedly connected to an outer edge of the rotation shaft 132 for sensing a rotation angle of the die bonding arm 11; as shown in fig. 3, an R-axis photoelectric sensor 15 (for converting a measured change into a change of an optical signal and then further converting the optical signal into an electric signal by means of a photoelectric element) is disposed on one side of the rotating assembly 13, and the height of the rotation sensor piece 14 is adapted to the height of the R-axis photoelectric sensor 15.
As shown in fig. 2, a transfer block 16 is arranged between the wafer arm seat 134 and the wafer fixing arm 11, and the transfer block 16 is used for connecting and fixing the wafer fixing arm 11 and the wafer arm seat 134; a wafer arm accommodating groove is formed in the middle of the transfer block 16, an arm force adjusting bolt 17 is arranged in the wafer arm accommodating groove, the arm force adjusting bolt 17 penetrates through the transfer block 16 and the wafer fixing arm 11 after one end of the wafer fixing arm 11 is inserted into the wafer arm accommodating groove, an arm force adjusting spring is sleeved on the outer edge of the arm force adjusting bolt 17 and located between the wafer fixing arm 11 and the transfer block 16, and the arm force adjusting spring is used for playing a buffering role when the wafer fixing arm 11 grabs a wafer.
As shown in fig. 2 and fig. 3, the die bonding process structure further includes: one end of the elastic sheet 18 is in threaded connection with the switching block 16, and the other end of the elastic sheet 18 is in rotary connection with the die bonding arm 11; the die bonding process structure further comprises: the driving source fixing base 19, the rotary driving source 131 is fixed on the upper end surface of the driving source fixing base 19, and the R-axis photoelectric sensor 15 is fixed on the lower end surface of the driving source fixing base 19.
As shown in fig. 3, the longitudinal moving assembly 12 includes: the driving device comprises a moving driving source 121 (a voice coil motor), a moving guide rail 122, a slider 123, a sliding plate 124 and a connecting plate 125, wherein the moving driving source 121 is fixed on the lower end face of a driving source fixing seat 19, the moving guide rail 122 is fixed on the side face of the moving driving source 121, the slider 123 is matched with the moving guide rail 122 and is connected with the connecting plate 125 through the sliding plate 124, and the connecting plate 125 is fixedly connected on the lower end face of an output shaft in the moving driving source 121 and is connected with a die bonding arm 11.
A tension spring 126 is arranged between the sliding plate 124 and the driving source fixing seat 19, and two tension springs 126, two sliding plates 124 and two sliding blocks 123 are arranged; a Z-direction reading head 127 (shown in fig. 2) for measuring the moving distance of the connecting plate 125 is fixed on one side of the connecting plate 125.
A rotating groove 128 is formed in one end, away from the moving driving source 121, of the sliding plate 124, an angular contact bearing 1281 is arranged in the rotating groove 128, a rotating connecting rod 1282 is arranged on the inner edge of the angular contact bearing 1281, and the upper end of the rotating connecting rod 1282 is fixedly connected with the wafer arm seat 134; as shown in fig. 3 and 5, a first cross rail 1291 is fixedly connected to a surface of the wafer arm base 134 facing the rotating shaft 132, a second cross rail 1292 is fixedly connected to a surface of the rotating shaft 132 facing the wafer fixing arm 11, and the first cross rail 1291 is longitudinally movable along the second cross rail 1292.
In addition, the invention also provides a die bonder which comprises the die bonding process structure.
The invention adopts a brand-new structure mode with higher efficiency and higher precision, a die bonding arm 11 of the die bonding binding head horizontally swings 90 degrees and goes up and down, and simultaneously, a die-ring and a lead frame clamp are combined by staggering the height difference of a 15MM plane, and the invention has the advantages that: 1. the die bonding arm of the die bonding binding head horizontally swings 90 degrees, so that the problems of accuracy and efficiency caused by overlarge swinging angle can be solved; 2. the crystal-membered ring and the lead frame clamp are staggered by the height difference of the plane in 15MM, so that the problem of efficiency reduction caused by too long up-down movement distance can be solved; 3. the lead frame clamp and the wafer ring overlap part area shorten the central distance of wafer grabbing (wafer ring) and releasing (lead frame), thereby shortening the length of the die bonding arm, and solving the problems that the inertia is increased due to overlong die bonding arm and the die bonding arm is difficult to stop stably. The structure mode of the invention can effectively shorten the length of the die bonding arm, and the problem that the rotational swing inertia of the die bonding arm is increased and the precision and the speed are influenced due to the overlong die bonding arm can be solved by shortening the length of the die bonding arm, thereby integrally improving the production efficiency, the speed and the precision of the equipment.
It is to be understood that the invention is not limited to the examples described above, but that modifications and variations may be effected thereto by those of ordinary skill in the art in light of the foregoing description, and that all such modifications and variations are intended to be within the scope of the invention as defined by the appended claims.
Claims (7)
1. A die bonding process structure comprises: solid brilliant arm control mechanism, lead frame anchor clamps and wafer that from top to bottom set gradually, the lead frame anchor clamps include: a first overlapping portion and an overhead portion, the wafer comprising: a second overlapping portion and an exposed portion, wherein the first overlapping portion and the second overlapping portion are overlapped in a top view state; the die bonding arm control mechanism comprises: the longitudinal moving assembly is connected with the die bonding arm and used for driving the die bonding arm to move longitudinally; the rotating assembly is connected with the longitudinal moving assembly and is used for driving the die bonding arm to rotate from the wafer to the lead frame clamp and from the lead frame clamp to the wafer;
the rotating assembly includes: the clamping shaft is in threaded connection with the upper end of the rotating shaft and then fixed on the outer edge of an output shaft in the rotating drive source, the lower end of the rotating shaft is movably connected with the wafer arm seat, and the lower end of the wafer arm seat is connected with the wafer fixing arm;
a transfer block is arranged between the wafer arm seat and the wafer fixing arm, a wafer arm accommodating groove is formed in the middle of the transfer block, an arm force adjusting bolt is arranged in the wafer arm accommodating groove, the arm force adjusting bolt penetrates through the transfer block and the wafer fixing arm after one end of the wafer fixing arm is inserted into the wafer arm accommodating groove, an arm force adjusting spring is sleeved on the outer edge of the arm force adjusting bolt, and the arm force adjusting spring is located between the wafer fixing arm and the transfer block and used for playing a buffering role when the fixed arm grabs a wafer; the die bonding process structure further comprises: and one end of the elastic sheet is in threaded connection with the switching block, and the other end of the elastic sheet is in rotating connection with the die fixing arm.
2. The die bonding process structure according to claim 1, wherein a rotary inductor sheet is fixedly connected to the outer edge of the rotary shaft, an R-axis photoelectric inductor is arranged on one side of the rotating assembly, and the height of the rotary inductor sheet is matched with that of the R-axis photoelectric inductor.
3. The die attach process structure of claim 2, further comprising: the rotary driving source is fixed on the upper end face of the driving source fixing seat, and the R-axis photoelectric inductor is fixed on the lower end face of the driving source fixing seat.
4. The die bonding process structure according to claim 3, wherein the longitudinal moving assembly comprises: the movable driving source is fixed on the lower end face of the driving source fixing seat, the movable guide rail is fixed on the side face of the movable driving source, the sliding block is matched with the movable guide rail and is connected with the connecting plate through the sliding plate, and the connecting plate is fixedly connected to the lower end face of an output shaft in the movable driving source and is connected with the die bonding arm.
5. The die bonding process structure according to claim 4, wherein a tension spring is arranged between the sliding plate and the driving source fixing seat, and the tension spring, the sliding plate and the sliding block are all provided with two; and a Z-direction reading head for measuring the moving distance of the connecting plate is fixed on one side of the connecting plate.
6. The die bonding process structure as claimed in claim 4, wherein a rotating groove is formed in one end of the sliding plate, which is far away from the mobile driving source, an angular contact bearing is arranged in the rotating groove, a rotating connecting rod is arranged on the inner edge of the angular contact bearing, and the upper end of the rotating connecting rod is fixedly connected with the wafer arm seat;
the crystal arm seat is fixedly connected with a first cross guide rail towards one side of the rotating shaft, the rotating shaft is fixedly connected with a second cross guide rail towards one side of the crystal arm, and the first cross guide rail can longitudinally move along the second cross guide rail.
7. A die bonder, characterized in that the die bonder comprises the die bonder process structure as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613156.5A CN108615696B (en) | 2018-06-14 | 2018-06-14 | Die bonding process structure and die bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810613156.5A CN108615696B (en) | 2018-06-14 | 2018-06-14 | Die bonding process structure and die bonding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108615696A CN108615696A (en) | 2018-10-02 |
| CN108615696B true CN108615696B (en) | 2020-11-13 |
Family
ID=63665204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810613156.5A Active CN108615696B (en) | 2018-06-14 | 2018-06-14 | Die bonding process structure and die bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108615696B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207038489U (en) * | 2017-05-03 | 2018-02-23 | 深圳翠涛自动化设备股份有限公司 | A kind of interchangeable automatic bonder of wafer ring size |
-
2018
- 2018-06-14 CN CN201810613156.5A patent/CN108615696B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207038489U (en) * | 2017-05-03 | 2018-02-23 | 深圳翠涛自动化设备股份有限公司 | A kind of interchangeable automatic bonder of wafer ring size |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108615696A (en) | 2018-10-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7303111B2 (en) | Lightweight bondhead assembly | |
| US7396005B2 (en) | Clamping device and transport mechanism for transporting substrates | |
| WO2019095564A1 (en) | Substrate clamping device | |
| WO2007010971A1 (en) | Stage device | |
| CN103472679A (en) | Double-workpiece table long travel measurement apparatus and use method thereof | |
| CN217007403U (en) | Mask and wafer detection clamp | |
| CN108615696B (en) | Die bonding process structure and die bonding machine | |
| CN113477543A (en) | High accuracy electricity core test machine | |
| CN209327403U (en) | A kind of vertical flying probe machine clamp | |
| CN216161693U (en) | Intelligent wafer measuring platform | |
| CN216084827U (en) | Wafer moving mechanism | |
| CN112129234A (en) | Be used for jumbo size wafer thickness testing platform | |
| JPH0951007A (en) | Die bonding apparatus and fabrication of semiconductor device | |
| CN218602412U (en) | Automatic mechanism of changing of thimble cap | |
| CN110828339A (en) | Material taking unit and die bonder | |
| CN108807237A (en) | A kind of die bond process structure, bonder and die bond control method | |
| CN208385363U (en) | A kind of die bond process structure and bonder | |
| TWI344546B (en) | ||
| CN108045857A (en) | A kind of support plate clamps automatic straightening device and method | |
| CN210022870U (en) | Cleaning head assembly for automatic sorting machine of LED (light-emitting diode) wafers | |
| CN117405945B (en) | Pin voltage detection device for microelectronic integrated circuit board | |
| CN111347347A (en) | Be used for sapphire crystal bar centering support | |
| CN220783683U (en) | Electric clamp with cleaning function | |
| CN218786334U (en) | Hoop loading attachment | |
| CN212872859U (en) | Electromagnetic type tensioner suction measuring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 3rd Floor, Building 4, Xintang Industrial Zone, Baishixia Community, Fuyong Subdistrict, Bao'an District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen silicon valley semiconductor equipment Co.,Ltd. Address before: 3rd Floor, Building 4, Xintang Industrial Zone, Baishixia Community, Fuyong Subdistrict, Bao'an District, Shenzhen, Guangdong 518000 Patentee before: SHENZHEN XIGU TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |