CN108604063A - Exposure device, exposure system, substrate processing method using same and element fabricating device - Google Patents

Exposure device, exposure system, substrate processing method using same and element fabricating device Download PDF

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Publication number
CN108604063A
CN108604063A CN201680065114.1A CN201680065114A CN108604063A CN 108604063 A CN108604063 A CN 108604063A CN 201680065114 A CN201680065114 A CN 201680065114A CN 108604063 A CN108604063 A CN 108604063A
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CN
China
Prior art keywords
pattern
exposure
substrate
shade
exposure portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201680065114.1A
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Chinese (zh)
Inventor
铃木智也
宫地章
木内徹
加藤正纪
鬼头义昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
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Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Priority to CN201811346147.0A priority Critical patent/CN109375475A/en
Publication of CN108604063A publication Critical patent/CN108604063A/en
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70208—Multiple illumination paths, e.g. radiation distribution devices, microlens illumination systems, multiplexers or demultiplexers for single or multiple projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits

Abstract

Substrate P is transported along long side direction and in the exposure device EX for exposing electronic component pattern in substrate P by the present invention；And have：Aligming microscope ALG, detection are formed in the marker location information of multiple labels in substrate P；1st pattern exposure portion EXH1 in the exposure area exposing patterns in substrate P, and is projected after energy-ray corresponding with the design information of pattern is carried out position adjustment according to marker location information；And control device 14, to make mask pattern corresponding with the pattern that should be exposed in element-forming region, and exports and adjust at least one of relevant adjustment information and marker location information with the position for the energy-ray for being projected to exposure area.Also, exposure device has：Supporting member for substrate with bearing surface, the bearing surface make substrate be bent in above-mentioned conveyance direction and be supported to it；And multiple exposure portions, it configures, is configured to above-mentioned pattern exposure with mutually different Exposure mode in aforesaid substrate along conveyance direction.

Description

Exposure device, exposure system, substrate processing method using same and element fabricating device
Technical field
The present invention relates to a kind of exposure device, exposure system, substrates exposing electronic component pattern in sheet substrate Processing method and element fabricating device.
Background technology
All the time, in lithography step when being formed in electronic component on semiconductor substrate (silicon substrate), for example, such as As following patent documents 1 are disclosed, the photosensitive layer (photoresist that the fine pattern of electronic component is transferred to substrate surface is used Agent) exposure device.
In patent document 1, announcement has following technology：When the transferring member pattern on 1 plate base, using with eminence The step-by-step exposure machine (exposure device for using shade substrate) of reason amount and the electron beam with the excellent resolving power for surmounting light Both exposure devices are exposed the coarse patterns part of electronic component by step-by-step exposure machine, are exposed by electron beam lithography system Light fine pattern part.
On the other hand, in recent years, pacify in liquid crystal display element or organic EL display element or touch panel or high density In the manufacture for filling element etc., use will comprising display unit, sensor electrode, thin film transistor (TFT), IC chip, luminescence unit and The electronic component unit of any one of wiring layer etc. is formed in the step on flexible substrate.In the step, also include sometimes The photoetching of pattern transfer is carried out in the photosensitive layer on the flexible substrate being made of plastics, macromolecule resin etc. using exposure device Step.However, in being to be exposed in the pattern transfer of object with flexible substrate, be easy to generate because flexible substrate it is flexible due to cause Two dimension deformation.Therefore, even if to obtain format high throughput (production), and the shade made by design data is used to implement Step of exposure also can significantly be dropped to having been formed on the registration accuracy that the base pattern layer on flexible substrate overlaps when exposing new pattern It is low.
[background technology document]
[patent document]
[patent document 1] Japanese Patent Laid-Open 10-303125 bulletins
Invention content
The 1st aspect of the present invention is a kind of exposure device, and flexible strip sheet substrate is carried out along long side direction Conveyance, and in exposure electronic component pattern in above-mentioned sheet substrate；And have：Test section, detection is marked to be formed in above-mentioned The marker location information of multiple labels in sheet substrate；1st pattern exposure portion, in the upper of above-mentioned electronic component should be formed It states element-forming region in sheet substrate and exposes above-mentioned pattern, and by energy-ray corresponding with the design information of above-mentioned pattern It is projected after carrying out position adjustment according to above-mentioned marker location information；And output section, to make and above-mentioned member should be exposed to The corresponding mask pattern of above-mentioned pattern in part forming region, and export and be projected to the above-mentioned energy of said elements forming region The above-mentioned position of ray adjusts at least one of relevant adjustment information and above-mentioned marker location information.
The 2nd aspect of the present invention is a kind of exposure system, and flexible strip sheet substrate is carried out along long side direction Conveyance, and in exposure electronic component pattern in above-mentioned sheet substrate；And have：The exposure device of above-mentioned 1st aspect；Practical figure Case information generating part, at least one in the above-mentioned adjustment information and above-mentioned marker location information that are exported according to above-mentioned output section Person corrects above-mentioned design information, to make mask pattern corresponding with the above-mentioned pattern that should be exposed in said elements forming region And generate actual pattern information；And shade producing device, it is exposed using the 3rd pattern for projecting energy-ray according to design information Light portion makes above-mentioned mask pattern；Above-mentioned shade producing device is kept for forming the shade substrate of above-mentioned mask pattern, will be upper It states actual pattern information and is provided to above-mentioned 3rd pattern exposure portion as above-mentioned design information, to above-mentioned shade substrate upslide Energy-ray corresponding with above-mentioned actual pattern information is penetrated, it thereby will above-mentioned mask pattern corresponding with above-mentioned actual pattern information It is formed on above-mentioned shade substrate.
The 3rd aspect of the present invention is a kind of substrate processing method using same, by flexible strip sheet substrate along long side direction It is transported, and in being exposed processing with pattern to electronic component in above-mentioned sheet substrate；And include：Detecting step, inspection Survey the marker location information for being formed in multiple labels in above-mentioned sheet substrate；1st step of exposure is believed by projection and design The 1st pattern exposure portion for ceasing corresponding energy-ray, in the element shape in the above-mentioned sheet substrate that should form above-mentioned electronic component At region, after energy-ray corresponding with the design information of above-mentioned pattern is carried out position adjustment according to above-mentioned marker location information It is projected；And step is generated, according to the above-mentioned position with the above-mentioned energy-ray of said elements forming region to be projected to At least one of relevant adjustment information and above-mentioned marker location information and above-mentioned design information are adjusted, and is generated for answering It is exposed to the actual pattern information of the making of the mask pattern in said elements forming region.
The 4th aspect of the present invention is a kind of element fabricating device, using one side by flexible strip substrate along long ruler Very little direction conveyance, multiple exposures that exposure light corresponding with the pattern of electronic component is exposed to above-mentioned sheet substrate on one side Portion forms above-mentioned electronic component in aforesaid substrate；And above-mentioned multiple exposure portions are configured along the conveyance direction of aforesaid substrate, it is above-mentioned The each of multiple exposure portions has the supporting member for substrate with bearing surface, which makes illuminated and above-mentioned electronic component The aforesaid substrate of the corresponding exposure light of pattern is bent in above-mentioned conveyance direction and is supported to it；Above-mentioned multiple exposure portion structures As with mutually different Exposure mode by above-mentioned pattern exposure in aforesaid substrate.
Description of the drawings
Fig. 1 is the schematic configuration diagram of the device manufacturing system of the exposure device comprising the 1st implementation form.
Fig. 2 is the figure for the composition for showing the 1st pattern exposure portion shown in FIG. 1.
Fig. 3 is to show description line and formation that the luminous point on substrate is projected to by the 1st pattern exposure portion shown in Fig. 2 In the figure to mutatis mutandis label on substrate.
Fig. 4 is the figure of an example for the composition for showing the 2nd pattern exposure portion shown in FIG. 1.
Fig. 5 A are the vertical view that the illumination region on the cylinder shade of rotation holding cylinder is held in from the observation of -Z direction side, figure 5B is from the vertical view of the view field on the plane of illumination for the substrate that the observation of +Z direction side is supported on rotating cylinder.
Fig. 6 is another figure of the composition for showing the 2nd pattern exposure portion shown in FIG. 1.
Fig. 7 is the figure of the composition for the shade making exposure system for showing the 1st implementation form.
Fig. 8 is the figure of the composition for the exposure device for showing variation 1.
Fig. 9 is the exposure portion without shade for the exposure device for showing the 2nd implementation form and matching for the exposure portion using shade It sets relationship and shows the figure of state when being exposed without shade.
Figure 10 is displayed at the figure of state when shade exposes in the exposure device of Fig. 9.
Figure 11 is the figure of the composition of the exposure device for the variation 1 for showing the 2nd implementation form.
Figure 12 is the figure of the composition of the exposure device for the variation 2 for showing the 2nd implementation form.
Figure 13 is the figure of the element fabricating device for showing the 3rd implementation form being integrally formed.
Figure 14 is the figure for the composition for showing the exposure portion in the element fabricating device for being assembled to Figure 13.
Figure 15 is to thin in the flexibility for carrying out pattern exposure on substrate in a manner of roll-to-roll suitable for the exposure portion by Figure 14 The figure that the composition of piece sensor illustrates.
Drawing reference numeral
10：Device manufacturing system
12、12a：Substrate transport mechanism
14、36：Control device
20、22、24：Light supply apparatus
30：Exposure system
32：Actual pattern information generating part
34：Shade producing device
ALG, ALG1~ALG4, ALGa, ALGb：Aligming microscope
ALGA、ALGB、ALGC：To Barebone
AX1、AXo、AXo1、AXo2、AXa、AXb、AXc：Central shaft
DR、DRa、DRb、DRA、DRB、DRC、RS1：Rotating cylinder
DR2、DR3：Rotate holding cylinder
EL、EL1：Illuminating bundle
EL2：Imaging beam
EX、EX2、EXa、EXb、EXC：Exposure device
EXc1、EXc2、EXc3：Exposure portion
EXH1：1st pattern exposure portion
EXH2：2nd pattern exposure portion
EXH3：3rd pattern exposure portion
LB：Beam
MK, MK1~MK4：Label
M、M1、M2：Cylinder shade
MP：Shade substrate
P：Substrate
PL, PL1~PL6：Projection module
RSS1、RSS2、RSS3、RSS4：Thin slice sensor
SP：Luminous point
W：Exposure area (element-forming region)
Vdd、Vss(GND)：Power cord
CBL：Signal wire
FPA：Fine pattern region
Specific implementation mode
Exposure device, exposure system, substrate processing method using same and the element fabricating device of aspect about the present invention, in Preferable implementation form disclosed below, and one side is described in detail with reference to the schema of accompanying.Furthermore aspect of the invention is not It is defined in such implementation form, also includes applying various changes or improveing and winner.That is, being wrapped in following recorded inscape It can be easy imagination person, substantially the same person containing those skilled in the art, and following recorded inscape can be appropriately combined. Also, various omissions, displacement or change can be carried out to inscape in the range of the purport for not departing from the present invention.
[the 1st implementation form]
Fig. 1 is in the 1st implementation form comprising the exposure for implementing exposure-processed to substrate (object as irradiated body) P The schematic configuration diagram of the device manufacturing system 10 of electro-optical device EX.Furthermore in the following description, as long as not illustrating, just set Determine XYZ orthogonal coordinate system system, and arrow as illustrated, X-direction, Y-direction and Z-direction are illustrated.
Device manufacturing system 10 is, for example, to be assembled to manufacture as the system in the production line of the flexible display of electronic component Make system.As flexible display, for example there is organic el display, liquid crystal displays etc..Device manufacturing system 10 has institute The construction of roll-to-roll (Roll To Roll) mode is called, i.e.,：It is rolled into roll from by flexible plate shape substrates (sheet substrate) P Supply roller (not shown) sends out substrate P, and the substrate P to being sent out continuously implements various processing, then passes through (not shown) time It receives roller and batches various treated substrate Ps.It is long side direction (long size) and width side that substrate P, which has the conveyance direction of substrate P, To the band-like shape for short side direction (short size).Various treated substrate Ps become the respective formation of multiple electronic components The state that region (exposure area) is connected along long dimension direction, and become so-called more chamfering substrates.It is sent from above-mentioned supply roller The substrate P gone out is sequentially subjected to various processing by processing unit PR1, exposure device EX and processing unit PR2 etc., and passes through Above-mentioned recycling roll and be taken up.Herein, one or more display panels are formed in 1 exposure area on flexible substrate P, But as other electronic components, the flexible sensor of biology, liquid crystal display flexible color optical filter and orientation can be also formed Film film or flexible multi-layer wiring film (strip wiring harness) etc..
Furthermore X-direction be in horizontal plane from processing unit PR1 via exposure device EX towards the side of processing unit PR2 To.Y-direction is in direction orthogonal with X-direction in horizontal plane, and is the width direction of substrate P.Z-direction is and X-direction and the side Y To orthogonal direction (upper direction), -Z direction is parallel with the direction that gravity works.
Substrate P is such as the foil (foil) etc. that resin film or the metal or alloy by stainless steel can be used to be constituted.As tree The material of adipose membrane, such as can be used comprising polyvinyl resin, acrylic resin, polyester resin, ethylene-vinyl ester copolymer tree Fat, Corvic, celluosic resin, polyamide, polyimide resin, polycarbonate resin, polystyrene resin, And the above person of at least one of vinyl acetate resin.Also, thickness and the rigidity (young's modulus) of substrate P are as long as in such as logical Substrate P not will produce in the range of the gauffer of folding line and irreversibility caused by buckling i.e. when the transport path of overexposure electro-optical device EX It can.As the base material of substrate P, PET (polyethylene terephthalate) and PEN (poly- naphthalenes two that thickness is 25 μm~200 μm or so Formic acid second diester) etc. films be preferable sheet substrate typical case.
Substrate P is present in managing everywhere in processing unit PR1, exposure device EX and processing unit PR2 are applied in Heated situation, therefore preferably select the substrate P of the less big material of coefficient of thermal expansion.For example, can be by by inorganic filler It is mixed in resin film and inhibits coefficient of thermal expansion.Inorganic filler may be, for example, titanium oxide, zinc oxide, aluminium oxide or silica Deng.Also, substrate P may be either the individual layers for the very thin glass that the thickness manufactured bys float method etc. is 100 μm or so, also can be In being bonded laminate made of above-mentioned resin film, foil etc. on the very thin glass.
Even if moreover, the pliability of so-called substrate P refer to substrate P apply dead weight degree power, will not also wreck or Fracture, and the property that the substrate P can be curved.Also, the property of buckling is also contained in pliability by the power for degree of conducting oneself with dignity. Also, flexible degree can be according to the material of substrate P, size, thickness, film forming in layer construction, temperature, humidity etc. in substrate P Environment etc. and change.As long as in short, in by substrate P certainly wound on being set in the device manufacturing system 10 of this implementation form Transport path on various conveyance rollers, the situation of conveyance direction conversion component such as rotating cylinder when buckling can not occur and make Substrate P is smoothly transported at folding line or generation damaged (broken or crackle occurs), flexible range can be known as.
The substrate P that processing unit PR1 one sides will be exposed processing by exposure device EX is continuous along long dimension direction Conveyance to +X direction side, one carries out the processing of preceding step in face of substrate P.The substrate P of the processing of step was filled to exposure before carrying out Set EX conveyances.By the processing of the preceding step, the substrate P sent out to exposure device EX becomes is formed with photonasty in its surface Substrate (sensitive substrate) P of functional layer (photosensitive layer).
The photonasty functional layer is to be coated in substrate P and be dried in the form of a solution, thereby becomes layer (film).It is photosensitive The typical case of sexual function layer is photoetching jelly, but as the material without development treatment, there is the part being irradiated with The photonasty silane coupling agent (SAM) of close liquid repellency modification appears plating also former base in the part being irradiated with Photonasty reducing agent etc..When using situation of the photonasty silane coupling agent as photonasty functional layer, pass through purple in substrate P Outside line and the pattern part that exposes from liquid repellency modification be lyophily.It therefore, can be by being selected on the part as lyophily Liquid etc. of the coating containing conductive ink (ink containing the conductive nanometers particle such as silver or copper) or semi-conducting material is selected, and Form pattern layer.When using situation of the photonasty reducing agent as photonasty functional layer, by substrate P by ultraviolet light The pattern part of exposure appears plating also former base.Therefore, after exposure, by substrate P immediately in the plating liquid containing palladium ion etc. The set time is impregnated, the pattern layer that (precipitation) is made of palladium is thereby formed.Such plating is addition (additive) work Skill, but in addition, when using as situation premised on the etching processing for subtracting into (subtractive) technique, to exposure device EX The substrate P sent out also can be base material to be set as PET or PEN and in its surface whole face or selectively AM aluminum metallization (Al) or copper (Cu) metallic diaphragms, and then lamination layer of photoresist and former thereon such as.
Exposure device EX one sides continuously transport the substrate P moved from processing unit PR1 along long dimension direction to the sides+X To side, one faces to be formed with the circuit of plane of illumination (photosurface) exposure display of the substrate P of photonasty functional layer or match The specific patterns such as line.Thereby, latent image formation corresponding with the specific pattern exposed is in the photonasty functional layer of substrate P.Yin Ji Plate P is continuously transported along conveyance direction, therefore long size sides of the exposure area W along substrate P of pattern is exposed by exposure device EX Multiple (with reference to Fig. 3) are provided with to separating specific interval.Because W-shaped at electronic component in the exposure area, therefore exposure area W is also For element-forming region.Furthermore because electronic component by make multiple pattern layers (forming figuratum layer) overlap by constitutes, therefore lead to Overexposure electro-optical device EX exposes pattern corresponding with each layer.
Processing unit PR2 one sides connect the substrate P for carrying out overexposure light processing by exposure device EX along long dimension direction Continuous conveyance to +X direction side, one carries out the processing of subsequent step (for example, plating or development, etching processing in face of substrate P Deng).By the processing of the subsequent step, pattern layer corresponding with latent image is formed in substrate P.
As described above, electronic component is constituted by so that multiple pattern layers is overlapped, therefore undergo device manufacturing system 10 At least each processing, forms 1 pattern layer.Therefore, it is formation electronic component, it is necessary to experience at least 2 element systems as shown in Figure 1 It makes and is managed everywhere in system 10.It is installed on another device manufacturing system 10 by regarding the recycling roll for batching substrate P as supply roller, It can be by pattern laminated layer.Action so is repeated, and forms electronic component.Substrate P that treated becomes multiple electronics member Part or the region of specific pattern pattern layer for being formed with electronic component separate specific interval along the connected shape of the long dimension direction of substrate P State.
Recycling has the recycling roll for the morphogenetic substrate P of shape being connected with electronic component to be also mountable to cutting dress (not shown) It sets.Be equipped with recycling roll cutter device will treated substrate P segmentation (cutting) at each electronic component, thereby formed multiple Electronic component.About the size of substrate P, such as the size of width direction (direction for becoming short size) is 10cm~2m or so, The size of length direction (direction for becoming long size) is 10m or more.Furthermore the size of substrate P is not limited to above-mentioned size.
Secondly, exposure device EX is described in detail.Exposure device EX is accommodated in tempering room ECV.Tempering room ECV Inside is remained into specific temperature, is thereby inhibited because of the change in shape caused by temperature of the substrate P of inside conveyance.Tempering room ECV is configured at the setting face E of manufacturing works by being passively or actively antivibration cell S U1, SU2.Antivibration cell S U1, SU2 is reduced Vibration from setting face E.Setting face E may be either the face being arranged on base station, also can be ground.Exposure device EX at least has Substrate transport mechanism 12, the 1st pattern exposure portion (exposure portion) EXH1, the 2nd pattern exposure portion (exposure portion) EXH2, control device 14 and multiple aligming microscope ALG (ALG1~ALG4).Control device 14 controls each portion (substrate transporter of exposure device EX Structure 12, the 1st pattern exposure portion EXH1, the 2nd pattern exposure portion EXH2, aligming microscope ALG etc.) person.The control device 14 includes It computer and has program stored therein or the storage media etc. of pattern data etc., above procedure is executed by above-mentioned computer, and conduct The control device 14 of this implementation form functions.1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 are set to substrate The top (+Z direction side) of the rotating cylinder DR of transport mechanism 12.
Substrate transport mechanism (carrying device) 12 transports the substrate P transported from processing unit PR1 to place with specific speed Manage device PR2.By the substrate transport mechanism 12, and it is specified in the transport path of the substrate P transported in exposure device EX.Substrate The upstream side (-X direction side) of the conveyance direction of 12 self-reference substrate P of transport mechanism sequentially has marginal position controller EPC, driving rolling Cylinder R1, tension adjustment roller RT1, rotating cylinder (cylinder rotating cylinder) DR, tension adjustment roller RT2, driving drum R2 and driving drum R3。
Width direction (Y-direction and substrate P of the marginal position controller EPC adjustment from the substrate P of processing unit PR1 conveyances Short dimensional directions) on position.That is, marginal position controller EPC is the base to be transported in the state for being applied in specific tensile The position of the end (edge) of the width direction of plate P is in the range relative to several μm~tens of μm or so of target location ± ten The mode of (permissible range) makes substrate P be moved in width direction, and adjusts the position in the width direction of substrate P.Marginal position There is controller EPC the edge sensor (not shown) of the position of the end (edge) of the width direction of detection substrate P (to examine end Survey portion), the detection signal detected by edge sensor adjusts the position in the width direction of substrate P.Driving drum R1 The both sides for keeping the substrate P from marginal position controller EPC conveyance on one side, rotate on one side, and by substrate P to rotating cylinder DR Conveyance.Marginal position controller EPC is to transport the center to the long dimension direction of the substrate P of rotating cylinder DR relative to rotating cylinder DR Mode orthogonal axis AXo adjusts the position in the width direction of substrate P.
Rotating cylinder DR has the central shaft for extending along Y-direction and extending along the direction intersected with the direction that gravity works AXo and with central shaft AXo at a distance of the cylindric peripheral surface of radii fixus, follow peripheral surface (periphery) on one side in long size A part of direction supporting substrates P is rotated centered on central shaft AXo and transports base along conveyance direction (sub-scanning direction) on one side Plate P.In the both sides of the Y-direction of rotating cylinder DR, it is provided with the axis Sft supported by bearing in a manner of around central shaft AXo rotations.It should Axis Sft is by being endowed the rotary driving source (not shown) controlled come free control device 14 (for example, motor or deceleration mechanism Deng) torque and around central shaft AXo rotate.
Driving drum R2, R3 separates specific interval along +X direction and configures, and specific relaxation is assigned to the substrate P after exposure It spends (nargin).Driving drum R2, R3 keep the both sides of substrate P, rotate on one side on one side in the same manner as driving drum R1, and Substrate P is transported to processing unit PR2.Driving drum R2, R3 is set to the downstream side of conveyance direction relative to rotating cylinder DR (+X direction side), driving drum R2 are set to the upstream side (-X direction side) of conveyance direction relative to driving drum R3.Tension Adjust that roller RT1, RT2 is energized to -Z direction, to the substrate P that is wound to rotating cylinder DR and is supported in long dimension direction Assign specific tension.Thereby, imparting to the tension stability of the long dimension direction for the substrate P being wound on rotating cylinder DR is made to turn to spy Determine in range.By in the distance in X-direction between shortening tension adjustment roller RT1, RT2, it is possible to increase substrate P is relative to rotating cylinder The winding angle of DR.Furthermore control device 14 by controlling rotary driving source (for example, motor or deceleration mechanism etc.) (not shown), And driving drum R1~R3 is made to rotate.According to driving drum R1, R2 and the rotary speed of rotating cylinder DR, and provide to be supported on The conveyance speed of the substrate P of rotating cylinder DR, the i.e. speed of the sub-scanning direction of substrate P.
Secondly, it is illustrated using the composition of Fig. 2 couples of the 1st pattern exposure portion EXH1.1st pattern exposure portion EXH1 is not to make With direct imaging mode, that is, so-called grating scanning mode exposing patterns of shade.1st pattern exposure portion EXH1 is to passing through rotation Cylinder DR one side conveyance, a surface bearing substrate P exposure area W, project as exposure energy-ray beam LB luminous point SP, and in one-dimensionally scanning (main scanning) luminous point along main scanning direction (Y-direction) (on the plane of illumination of substrate P) in substrate P SP (energy-ray).Then, the 1st pattern exposure portion EXH1 is according to the pattern data of the design information as the pattern to be described The intensity for the luminous point SP that (describing the data) high speed modulation (on/off) is scanned along main scanning direction.Thereby, in the quilt of substrate P Shadow surface describes exposure and the corresponding light pattern of the specific patterns such as the circuit of display or wiring.That is, the pair by substrate P is swept It retouches and the main scanning of luminous point SP, in relativity on the plane of illumination of substrate P two-dimensional scan luminous point SP, and in the exposure of substrate P Region W describes exposure specific pattern.
1st pattern exposure portion EXH1 have light supply apparatus 20, multiple smooth import optical system BDU (BDU1~BDU6) and Multiple scanning element U (U1~U6).Light supply apparatus 20 has light-pulse generator, projects beam (pulsed light, laser) LB of pulse type. Beam LB is the ultraviolet for having peak wavelength in 370nm wavelength bands below, and the glow frequency of beam LB is set as Fe.Light supply apparatus 20 can will be in ultraviolet wavelengths and the continuous beam of high brightness by high glow frequency Fe as can shake The fiber amplifier laser light source swung.Fiber amplifier laser light source is red by being shone with the high-frequency pulse of 100MHz or more The semiconductor laser of outer wavelength region, by the fiber amplifier of the pulse light amplification of infrared wavelength region and will be amplified The pulsed light of infrared wavelength region is converted to Wavelength changing element (harmonic wave generating element) institute of the pulsed light of ultraviolet wavelength region It constitutes.The pulsed light of infrared wavelength region from semiconductor laser also referred to as kind of light, passes through the luminous spy of change kind light Property (pulse duration and the rapidly property etc. risen or fallen), can be changed fiber amplifier amplification efficiency (magnifying power), from And can high speed modulation final output ultraviolet wavelength region continuous beam intensity.Also, defeated from fiber amplifier laser light source Its lighting time interval extremely can be shorten to several picosecond~tens of picoseconds by the continuous beam of the ultraviolet wavelength region gone out.Cause This, even if being grating scanning mode, by luminous point SP that the pulsed illumination of continuous beam is formed on the plane of illumination of substrate P Also without substantially departing from and keeping the shape in the section of beam and intensity distribution (for example, circular Gaussian Profile).
1st pattern exposure portion EXH1 constitutes mutually the same multiple scanning element U (U1~U6) by having, and becomes institute The multi-beam type pattern exposure portion of meaning.Multiple scanning element U (U1~U6) are across following median plane Poc1 and in rotating cylinder DR's Circumferencial direction is configured in 2 rows.Odd number scanning element U1, U3, U5 relative to median plane Poc1 substrate P conveyance direction Upstream side configured in 1 row along Y-direction.Even number scanning element U2, U4, U6 is relative to median plane Poc1 in substrate P The downstream side of conveyance direction is configured along Y-direction in 1 row.Luminous point SP is projected to substrate P by each scanning element U (U1~U6) on one side Plane of illumination, specific description line (scan line) SL extended on one side in Y-direction in the plane of illumination upper edge of substrate P one-dimensionally sweeps Retouch luminous point SP.Furthermore in order to distinguish the description line SL of each scanning element U (U1~U6), exists and shown with SL1 by scanning list The description line SL of first U1 scanning points SP similarly shows retouching by scanning element U2~U6 scanning points SP with SL2~SL6 Line drawing SL.
The position of the luminous point SP on the plane of illumination of substrate P is exposed to by the scanning element U1, U3, U5 to be become in substrate Identical position in the conveyance direction of P becomes 1 row along Y-direction.Base is exposed to by even number scanning element U2, U4, U6 The position of luminous point SP on the plane of illumination of plate P becomes in identical position in the conveyance direction of substrate P, i.e., becomes 1 along Y-direction Row.It, will be by being exposed on the plane of illumination of substrate P by scanning element U1, U3, U5 furthermore in the conveyance direction of substrate P Luminous point SP position and exposed to by scanning element U2, U4, U6 in the position of the luminous point SP on the plane of illumination of substrate P The central shaft AXo of heart point and rotating cylinder DR and along Y-direction extend face be set as median plane Poc1.Also, in Fig. 2, it will be in The direction vertical with Y-direction is set as Z1' in the Poc1 of heart face, and the direction orthogonal with median plane Poc1 is set as X1'.The sides-Z1' To being direction side that gravity works, the directions+X1' are the conveyance direction sides of substrate P.Odd number scanning element U1, U3, U5 with Even number scanning element U2, U4, U6 by the directions X1' relative to median plane Poc1 it is symmetrical in a manner of configure.
Herein, using Fig. 3, the description line SL (SL1~SL6) of each scanning element U (U1~U6) is briefly described.It is more A scanning element U (U1~U6) with a plurality of description line SL (SL1~SL6) as shown in Figure 3 in Y-direction not be separated from each other but The mode of connecting configures.To pass through the entirety of the width direction of multiple scanning element U (U1~U6) whole covering exposure area W Mode, each scanning element U (U1~U6) share scanning area.Thereby, each scanning element U (U1~U6) can be in the width along substrate P Each depicting pattern for the multiple regions that degree direction is split to form.If for example, the scanning of the Y-direction of 1 scanning element U is grown The degree length of SL (describe line) is set as 20~50mm or so, then by Y-direction configure odd number scanning element U1, U3, U5 this 3 and even number scanning element U2, U4, U6 this 3 amount to 6 scanning element U, and by the width of describable Y-direction Degree is extended to 120~300mm or so.Each length for describing line SL1~SL6 is set as identical in principle.That is, along line SL1 is described The each of~SL6 and the scanning distance of the luminous point SP of beam LB that scans is set as identical in principle.Furthermore in desire prolonged exposure When the situation of the width of region W, the length of line SL itself can be described by extension or be added to the scanning element U of Y-direction configuration Quantity cope with.
Describe line SL (SL1~SL6) to configure in 2 rows in the circumferencial direction of rotating cylinder DR across median plane Poc1.The strange Several numbers descriptions line SL1, SL3, SL5 are located at the upstream side (-X direction side) of the conveyance direction of substrate P relative to median plane Poc1 On the plane of illumination of substrate P.Even number describes the conveyance side that line SL2, SL4, SL6 are located at substrate P relative to median plane Poc1 To downstream side (+X direction side) substrate P plane of illumination on.Describe the width direction (side Y of line SL1~SL6 and substrate P To) substantially parallel.
Describe line SL1, SL3, SL5 to separate specific interval along the width direction (scanning direction) of substrate P and be configured at straight line On.Describe line SL2, SL4, SL6 also similarly to separate specific interval along the width direction of substrate P (scanning direction) and be configured at straight On line.Describe line SL1 at this point, describing line SL2 and describe between line SL3 in the width direction of substrate P, being configured at.Similarly, Describe line SL3 and describes line SL2 and describe between line SL4 in the width direction of substrate P, being configured at.Describe line SL4 in substrate P Width direction on, be configured between describing line SL3 and describing line SL5, describe line SL5 in the width direction of substrate P, configuration Between description line SL4 and description line SL6.It, will be along the beam LB for describing line SL1, SL3, SL5 and scanning in this implementation form The scanning direction of luminous point SP be set as -Y direction, will be along describing line SL2, SL4, SL6 and the luminous point SP of beam LB that scans Scanning direction is set as +Y direction.
Secondly, the composition of scanning element U (U1~U6) is illustrated using Fig. 2.Because scanning element U (U1~U6) has Identical composition, therefore only scanning element U1 is illustrated, and omit the explanation of scanning element U2~U6.Also, in scanning element U1 Explanation in, illustrated using XtYZt orthogonal coordinate systems.The directions Zt expose to the beam of substrate P with self-scanning unit U1 The direction of travel of LB is parallel, and the directions Xt are the directions orthogonal with YZt planes.Furthermore the directions-Zt are the directions that gravity works Side, the directions+Xt are the conveyance direction sides of substrate P.
Scanning element U1 has cylindrical lens CYa, CYb, polygonal mirror PM, f θ lens FT and can fit the light path of beam LB As the light path regulation component RG of warpage.Light path provides that component RG has multiple speculums etc..Cylindrical lens CYa, CYb, multi-panel Mirror PM, f θ lens FT are set to by the light path of light path provides component RG defined beam LB.From light import optical system The beam LB of BDU1 incidences is incident to polygonal mirror PM.Polygonal mirror PM reflects incident beam LB to f θ lens FT.Polygonal mirror PM is the luminous point SP that scanning exposes on the plane of illumination of substrate P, and incident beam LB is biased to and is reflected.Polygonal mirror PM With the polygonal rotating mirror along the rotary shaft AXp that the directions Zt extend and the multiple reflectings surface being formed in around rotary shaft AXp, about Its details is simultaneously not shown.It is rotated centered on rotary shaft AXp by making polygonal mirror PM, can make to be incident to polygonal mirror PM Above-mentioned reflecting surface pulse type beam LB angle of reflection consecutive variations.Thereby, just make beam LB using 1 above-mentioned reflecting surface Reflection direction (be biased to direction) consecutive variations, and expose to the illuminated of substrate P along describing to scan along line SL1 (with reference to Fig. 3) The luminous point SP of beam LB on face.Polygonal mirror PM's rotates under the control of control device 14, by comprising motor etc. not The polygonal mirror driving portion of diagram and rotated with fixed speed.
In on the direction of travel of beam LB, cylindrical lens CYa is nearby provided in polygonal mirror PM.To, beam LB in By being incident to polygonal mirror PM after cylindrical lens CYa.By the busbar cylindrical lens CYa parallel with Y-direction, that is, it is convenient for polygonal mirror (the inclined situation of the normal there are reflecting surface relative to XtY planes when inclined relative to the directions the Zt situation of the reflecting surface of PM When), it also can inhibit its influence.For example, inhibiting to expose to the irradiation position of the luminous point SP of the beam LB on the plane of illumination of substrate P It is deviated to the directions Xt.
F θ lens FT in a manner of parallel with the optical axis of f θ lens FT in XtY planes to pass through the beam from polygonal mirror PM The telecentricity of LB is scanning lens.The optical axis of f θ lens FT is parallel with the directions Xt.Pass through column by the beam LB after f θ lens FT Face lens CYb and the plane of illumination for being projected to substrate P.By its busbar cylindrical lens CYb parallel with Y-direction, it is projected to base The beam LB of plate P is in the tiny spot SP for being converged to diameter approximate number μm or so (for example, 3 μm) on the plane of illumination of substrate P.It throws The luminous point SP on the plane of illumination of the substrate P is incident upon by polygonal mirror PM, is swept along the description line SL1 extended in main scanning direction It retouches.To make luminous point SP be overlapped specific quantity (for example, 1/2 of the diameter of luminous point SP, i.e., 1.5 μm) every time on one side, on one side along description line SL1 irradiates the mode of luminous point SP, it is specified that the rotary speed of polygonal mirror PM and the glow frequency Fe of light supply apparatus 20.
Beam LB relative to f θ lens FT incidence angle θ b according to the rotary angle position (range of θ b/2) of polygonal mirror PM And change.The luminous point SP of beam LB is projected on the plane of illumination of the substrate P directly proportional to incidence angle θ b by f θ lens FT Image height position.If focal length is set as f, image height position is set as y, then f θ lens FT has the relationship of y=f θ b.To lead to The f θ lens FT are crossed, it can be in Y-direction accurately with the luminous point SP of constant-speed scanning beam LB.In beam LB relative to f θ lens FT's When incidence angle θ b is 0 degree, the beam LB for being incident to f θ lens FT advances along the optical axis of f θ lens FT.
Self-scanning unit U1 is exposed to the optical axis setting for the beam LB for describing the arbitrary point (for example, midpoint) on line SL1 For irradiation axis Le1.Similarly, self-scanning unit U2~U6 is exposed into the arbitrary point on description line SL2~SL6 (in for example, Point) the optical axis of beam LB be set as irradiation axis Le2~Le6.(XZ is flat in X1'Z1' planes for each irradiation axis Le (Le1~Le6) Face) in, become the line that line SL (SL1~SL6) and central shaft AXo are described in connection.To which each scanning element U (U1~U6) is in X1' In Z1' planes (XZ planes), beam LB is irradiated in a manner of orthogonal with the plane of illumination of substrate P.That is, each scanning element U (U1~ U6 it) in X1'Z1' planes (XZ planes), is irradiated in such a way that beam LB is towards the central shaft AXo of rotating cylinder DR.Irradiation In becoming identical direction in X1'Z1' planes (XZ planes), irradiation axis Le2, Le4, Le6 are flat in X1'Z1' by axis Le1, Le3, Le5 Become identical direction in face (XZ planes).Also, in X1'Z1' planes (XZ planes), irradiation axis Le1, Le3, Le5 and irradiation Axis Le2, Le4, Le6 are set in a manner of becoming ± θ relative to the angle of median plane Poc1 (with reference to Fig. 2).
Beam LB from light supply apparatus 20 is directed to multiple sweep by multiple smooth import optical system BDU (BDU1~BDU6) Retouch unit U (U1~U6).Light beam LB is directed to scanning element U1, light import optical system BDU2 by light import optical system BDU1 Light beam LB is directed to scanning element U2.Similarly, light beam LB is directed to scanning list by light import optical system BDU3~BDU6 First U3~U6.Light import optical system BDU (BDU1~BDU6) projects along irradiation axis Le (Le1~Le6) beam LB to sweeping Retouch unit U (U1~U6).That is, the beam LB for being directed to scanning element U1 from light import optical system BDU1 passes through irradiation axis Le1 On.Similarly, the beam LB for scanning element U2~U6 being directed to from light import optical system BDU2~BDU6 passes through irradiation axis Le2 On~Le6.Furthermore the beam LB from light supply apparatus 20 is divided into 6 by spectroscope (not shown) or speculum etc. and penetrates Beam LB and be incident to each smooth import optical system BDU (BDU1~BDU6).
Multiple smooth import optical system BDU (BDU1~BDU6) have according to pattern data and high speed modulation (connects on/off Open) description of the intensity of beam LB that is guided to multiple scanning element U (U1~U6) is with optical element AOM (AOM1~AOM6). Light import optical system BDU1 has description optical element AOM1, and similarly, light import optical system BDU2~BDU6 has Describe and uses optical element AOM2~AOM6.It is to have passability to beam LB to describe with optical element AOM (AOM1~AOM6) Acousto-optic light modulation (Acousto-Optic Modulator).Description optical element AOM (AOM1~AOM6) generations make to come from light The beam LB of source device 20 is using 1 diffraction made of diffraction angle diffraction corresponding with the frequency of the high-frequency signal as drive signal Light, and projected using the 1 diffraction light as the beam LB towards each scanning element U (U1~U6).Describe and uses optical element AOM (AOM1~AOM6) basis carrys out the on/off of the drive signal (high-frequency signal) of self-control device 14, and turning on/off makes institute The generation of 1 diffraction light made of incident beam LB diffractions.
Description is disconnected in carrying out the drive signal (high-frequency signal) of self-control device 14 with optical element AOM (AOM1~AOM6) When open state, make incident beam LB not diffraction and pass through, thereby beam LB is directed to and is set to light import optical system Absorber (not shown) in BDU (BDU1~BDU6).To when drive signal is off-state, pass through description optics Beam LB after element AOM (AOM1~AOM6) is not incident to scanning element U (U1~U6).That is, by scanning element U (U1~ U6 the intensity of the beam LB in) becomes low level (zero).If this it is meant that observed on the plane of illumination of substrate P, is exposed to The intensity of the luminous point SP of beam LB on plane of illumination is tuned as low level (zero).On the other hand, describe and use optical element AOM (AOM1~AOM6) makes incident beam LB when it is on-state to carry out the drive signal (high-frequency signal) of self-control device 14 Diffraction and project 1 diffraction light, beam LB is thereby directed to scanning element U (U1~U6).To be to connect in drive signal When state, high levels are become by the intensity of the beam LB in scanning element U (U1~U6).If this is it is meant that in the quilt of substrate P It is observed on shadow surface, then the intensity of the luminous point SP of the beam LB exposed on plane of illumination is tuned as high levels.In this way, passing through The drive signal for applying on/off with optical element AOM (AOM1~AOM6) to description, can be by description optical element AOM (AOM1~AOM6) is switched to on/off.
Pattern data is arranged for each scanning element U (U1~U6), and control device 14 is according to passing through each scanning element U (U1~U6) and describe pattern pattern data (for example, keeping specific pixel unit corresponding with 1, with logical value " 0 " or " 1 " Show the data line of off-state and on-state), the driving of each description optical element AOM (AOM1~AOM6) will be applied to Signal switches at high speed as on-state/off-state.
Herein, pattern data is briefly described, the size that pattern data is set according to the size according to luminous point SP Pixel the pattern described by each scanning element U is split, each of multiple pixels is patrolled with corresponding with pattern Collect information (pixel data) shower.That is, the pattern data is by with will be along the scanning direction of luminous point (main scanning direction, Y-direction) Direction be set as column direction and will be set as along the direction of the conveyance direction of substrate P (sub-scanning direction, X-direction, the directions X1') The dot matrix diagram data that the mode of line direction is constituted by multiple pixel datas of two-dimensional decomposition.The pixel data is " 0 " or " 1 " 1 data.The pixel data of " 0 " shows that the intensity for the luminous point SP for making to expose to substrate P is low level, the pixel data of " 1 " The intensity that display makes to expose to the luminous point SP in substrate P is high levels.To which control device 14, will when pixel data is " 0 " It is applied to description and is set to OFF state with the drive signal of optical element AOM, when pixel data is " 1 ", retouched being applied to It paints and is set as on-state with the drive signal of optical element AOM.1 row pixel data of pattern data and 1 description line SL (SL1~SL6) is corresponding, and the intensity of the luminous point SP of substrate P is projected to along 1 description line SL (SL1~SL6) according to 1 row pixel number According to and carry out modulation.The 1 row pixel data is known as serial data DL.That is, pattern data is the 1st row serial data DL1, the 2nd Row serial data DL2 ..., line n serial data DLn in line direction arrangement made of dot matrix diagram data.
The body frame UB of Fig. 2 keeps multiple smooth import optical system BDU (BDU1~BDU6) and multiple scanning element U (U1~U6).Body frame UB has the 1st frame Ub1 for keeping multiple smooth import optical system BDU (BDU1~BDU6) and protects Hold the 2nd frame Ub2 of multiple scanning element U (U1~U6).What the 1st frame Ub1 was kept by by the 2nd frame Ub2 multiple sweeps The top (+Z1' direction sides) of unit U (U1~U6) is retouched, multiple smooth import optical system BDU (BDU1~BDU6) are kept.1st frame Frame Ub1 supports multiple smooth import optical system BDU (BDU1~BDU6) from lower section (- Z1' direction sides).Odd number light imports light System BDU1, BDU3, BDU5 is corresponding with the position of odd number scanning element U1, U3, U5, and with relative to median plane Poc1 for the conveyance direction of substrate P upstream side (- X1' direction sides) along Y-direction in such a way that 1 row configures, be supported on the 1st frame Frame Ub1.The position pair of even number light import optical system BDU2, BDU4, BDU6 and even number scanning element U2, U4, U6 Answer, and using relative to median plane Poc1 as the downstream side (+X1' direction sides) of the conveyance direction of substrate P along Y-direction in 1 row and The mode of configuration is supported on the 1st frame Ub1.In the 1st frame Ub1, with multiple smooth import optical system BDU (BDU1~BDU6) It corresponds to and is provided with multiple opening portion Hs (Hs1~Hs6).By multiple opening portion Hs (Hs1~Hs6), imported from multiple light The beam LB that each of optical system BDU (BDU1~BDU6) projects will not be by the 1st frame Ub1 maskings, and are incident to corresponding Scanning element U (U1~U6).
2nd frame Ub2 only can be (such as ± 2 ° micro around irradiation axis Le (Le1~Le6) with each scanning element U (U1~U6) Left and right) turn mode, scanning element U (U1~U6) can be kept to turn.It is convenient for scanning element U (U1~U6) around irradiation When the situation of axis Le (Le1~Le6) turn, beam LB be incident to position in the faces XtY of scanning element U (U1~U6) with and respectively The relative position relation of center in the corresponding faces XtY for describing line SL (SL1~SL6) scanning element U (U1~U6) is also It remains unchanged.To, that is, be convenient for scanning element U (U1~U6) turn situation when, scanning element U (U1~U6) also can on one side by The luminous point SP of beam LB is projected to substrate P, on one side along description line SL (SL1~SL6) scanning points SP.Pass through scanning element U The rotation of (U1~U6) is described line SL (SL1~SL6) and is rotated centered on irradiation axis Le (Le1~Le6), therefore describes line SL (SL1~SL6) can be tilted relative to the state parallel with Y-axis in (such as ± 2 °) in small range.Furthermore the scanning Unit U (U1~U6) around irradiation axis Le (Le1~Le6) turn under the control of control device 14, pass through actuating (not shown) Device and carry out.
The aligming microscope ALG (ALG1~ALG4) of exposure device EX is detecting pair shown in Fig. 3 for being formed in substrate P The mark position test section of the location information (marker location information) of mutatis mutandis label MK (MK1~MK4), is arranged along Y-direction. Label MK (MK1~MK4) is having made to be depicted in the specific pattern of the exposure area W on the plane of illumination of substrate P with substrate P or Align to the base pattern layer relativity being formed in substrate P the reference mark of (alignment).Aligming microscope ALG (ALG1~ ALG4) shooting is by the label MK (MK1~MK4) in the substrate P of the circumference surface bearing of rotating cylinder DR.Aligming microscope ALG (ALG1 ~ALG4) it is set to luminous point SP compared with the beam LB being projected to from the 1st pattern exposure portion EXH1 on the plane of illumination of substrate P and leans on base The upstream side (-X direction side) of the conveyance direction of plate P.
Aligming microscope ALG (ALG1~ALG4) have will be projected to the light source of substrate P to mutatis mutandis illumination light and shoot it The photographing elements such as CCD, CMOS of reflected light.The image pickup signal of aligming microscope ALG (ALG1~ALG4) shooting gained is sent to Control device 14.Control device 14 marks the location information in the substrate P of MK (MK1~MK4) according to image pickup signal, detection.One As for, such aligming microscope ALG in the detection zone (image pickup scope) in substrate P be 1mm square hereinafter, according to camera shooting The position measurement (position offset etc. of label) of the label MK of signal is not limited in detection zone (image pickup scope).Cause This, for it is specific go out substrate P on real marking position, rotary angle position (the i.e. substrate P of setting critically measurement rotating cylinder DR Shift position and amount of movement) encoder system, also in advance to aligming microscope ALG detection zone (image pickup scope) in The measurement information of the moment self-encoding encoder system output of shot mark MK is sampled.It thereby, can be with the rotation angle of rotating cylinder DR Degree position accordingly finds out the position of each label MK (MK1~MK4) in substrate P.Aligming microscope ALG or alignment are micro- Mirror ALG and encoder system are equivalent to the label test section of the present invention.Furthermore it is the photonasty to substrate P to mutatis mutandis illumination light Functional layer does not have the light of the wavelength region of sensitivity substantially, such as the light that wavelength is 500~800nm or so.
Label MK1~MK4 is set to around each exposure area W.Label MK (MK1~MK4) also can be in the 1st layer of formation It is formed together when the pattern of (passing through the basal layer that instantaneous exposure is formed).It, can be in for example, when exposing the 1st layer of pattern It is exposed the pattern for also exposing label MK (MK1~MK4) around the exposure area W of pattern together.Also, label MK (MK1~ MK4 pattern) can be also formed in before the pattern for exposing the 1st layer in substrate P.It, can be from the 1st layer of exposure when the situation From the stage of pattern, just using label MK (MK1~MK4), the alignment that the deformation etc. of substrate P is taken into account is moved in implementation Make.Furthermore label MK can be also formed in the W of exposure area.For example, also can be in the W of exposure area and along the profile of exposure area W Form label MK (MK1~MK4).
Existing label MK1 in aligming microscope ALG1 shootings viewing area (detection zone) Vw1.Similarly, it is aligned Existing label MK2~MK4 in microscope ALG2~ALG4 shooting viewing areas Vw2~Vw4.To which multiple alignments are micro- Accordingly, the -Y direction side of self-reference substrate P is risen according to aligming microscope for the position of mirror ALG1~ALG4 and multiple label MK1~MK4 The sequence of ALG1~ALG4 is arranged.Aligming microscope ALG (ALG1~ALG4) in X-direction with exposure position (describe line SL1~ SL6) compared with exposure region at a distance from the circumferencial direction of the viewing area Vw of aligming microscope ALG (ALG1~ALG4) (Vw1~Vw4) The mode that the length of the X-direction of domain W is short is arranged.Furthermore the quantity and configuration along the aligming microscope ALG of Y-direction setting can roots It is changed according to the quantity and configuration of the label MK of the width direction formation along substrate P.Also, the substrate P of viewing area Vw1~Vw4 Plane of illumination on size according to label MK1~MK4 size and alignment precision (position measurement precision) and set, be 100 The size of~500 μm of square or so.
1st pattern exposure portion EXH1 under the control of control device 14, according to use aligming microscope ALG (ALG1~ ALG4 (practical be corresponding with the rotary angle position of rotating cylinder DR to the location information of the label MK (MK1~MK4)) detected Location information), pair light corresponding with design information (pattern data) of pattern described by scanning element U (U1~U6) by Point SP is projected after carrying out position adjustment.When the W not inclined situations of exposure area or when unstrained situation, such as Fig. 3 institutes Show, multiple label MK (MK1~MK4) are rectangle and are arranged, but when the situation of exposure area W inclinations or deformation, mark MK The arrangement of (MK1~MK4) also correspondingly tilts or deformation.Therefore, when exposure area W inclined situations or the situation of deformation When, expose to the luminous point SP of substrate P position also need and correspondingly adjusted.For example, in newly being weighed on base pattern layer When closing description specific pattern, according to the inclination or deformation of the entirety of base pattern layer or part, discribed specific pattern also needs Inclination or deformation.To which control device 14 is according to the location information of label MK (MK1~MK4), and adjustment and design information are accordingly The position of the luminous point SP of substrate P is projected to by the 1st pattern exposure portion EXH1.
For example, control device 14 can also be such that scanning element U (U1~U6) is adjusted around irradiation axis Le (Le1~Le6) turns Each inclination angle for describing line SL (SL1~SL6) relative to Y-direction, thereby adjusts the position of luminous point SP.Also, if line is described in adjustment The inclination of SL (SL1~SL6), then in the end of the adjacent description line SL (SL1~SL6) of Y-direction be separated from each other or end each other Overlapping, therefore description line SL1~SL6 will not be connected in Y-direction.To be connect in Y-direction with the end of adjacent description line SL Continuous mode corrects each sweep length (multiplying power of main scanning direction) for describing line SL (SL1~SL6) and each description line SL At least one of the position of main scanning direction of (SL1~SL6).
By adjusting the multiplying power for the main scanning direction for describing line SL (SL1~SL6), changes and describe line SL (SL1~SL6) Sweep length.Thereby, it is finely tuned the position of the Y-direction of the luminous point SP for the pulse type being projected in substrate P.The main scanning side As long as to multiplying power adjustment adjustment such as light supply apparatus 20 glow frequency Fe.In will describe along 1 line SL (SL1~ SL6) quantity of the luminous point SP (pulsed light) irradiated with the quantity of the pixel arranged in main scanning direction to form unification relationship The situation set in a manner of (for example, relative to 1 pixel, the luminous point of 2 pulsed quantities is by the state of 1/2 or so overlapping of diameter) When, as long as glow frequency Fe is slightly got higher, the pulse spacing along the luminous point SP of main scanning direction projection just shortens.As a result, logical Cross description line SL (SL1~SL6) and the pattern described on main scanning direction in integrally shortening.As long as on the contrary, glow frequency Fe Slightly be lower, along main scanning direction projection luminous point SP pulse spacing it is just elongated, as a result, by describe line SL (SL1~ SL6 the pattern) described is in whole elongated on main scanning direction.Also, being used by being arranged in the inside of scanning element U (U1~U6) With correct scanning direction multiplying power, the multiplying power amendment optical component (illustration omitted) that is made of lens element etc., also may be used The sweep length of line SL (SL1~SL6) is described in change.
Also, by making each description line SL (SL1~SL6) be deviated in main scanning direction pettiness, it can be in main scanning direction pair The pattern exposed by describing line SL (SL1~SL6) carries out position correction.In each scanning element U (U1~U6), it is provided with light Learn the origin sensor that detection starts sequential by the scanning of the polygonal mirror PM of scanning element U (U1~U6) the luminous point SP scanned (illustration omitted).The origin sensor receives the reflected light of the measurement light for the reflecting surface for being projected to polygonal mirror PM and exports origin letter Number detector.If the angle position of the reflecting surface of polygonal mirror PM, which becomes luminous point SP, is projected to sweeping for description line SL (SL1~SL6) The special angle position before starting point is retouched, then origin sensor exports origin signal.In general, in exporting origin signal by After set time Ts, description is switched over optical element AOM (AOM1~AOM6) according to the serial data DL of pattern data And start to describe.It is risen to the description optical element AOM according to serial data DL however, exporting origin signal by change Time Ts at the beginning of the switching of (AOM1~AOM6) until sequence can make each description line SL (SL1~SL6) in main scanning direction Offset.
If for example, shortening time Ts, the description of luminous point SP starts sequential and shifts to an earlier date, therefore in description line SL1, SL3, SL5 Situation when deviated to +Y direction side, to -Y direction side offset (with reference to Fig. 3) when describing the situation of line SL2, SL4, SL6.Phase Instead, if extend time Ts, in describe line SL1, SL3, SL5 situation when to -Y direction side deviate, in describe line SL2, To the offset of +Y direction side when the situation of SL4, SL6 (with reference to Fig. 3).In this manner, corresponding with design information (pattern data) And the position for being projected to the main scanning direction of the luminous point SP of substrate P is finely tuned.Furthermore such description line SL (SL1~SL6) is each From in the position of main scanning direction adjustment also using can make by the beam LB in each scanning element U (U1~U6) to master sweep It retouches the corresponding direction offset in direction or changes the optical component of angle (for example, tiltable parallel plate glass, adjustable angle The speculum etc. of degree).Describe line SL in the adjustment of the position of main scanning direction by retouching in each tilt correction for describing line SL or respectively The multiplying power of the main scanning direction of line drawing SL carries out together when correcting, and can inhibit in description respective end line SL (SL1~SL6) The deterioration of joining accuracy.The position of the description line SL (SL1~SL6) of scanning track as luminous point SP adjusts as described above, having Describe the tilt correction of line SL, the main scanning direction for describing line SL multiplying power amendment, describe line SL in the inclined of main scanning direction Amendment etc. is moved, relevant information (margin of error and correction amount etc.) will be adjusted with such position and be known as adjustment information.
Secondly, the 2nd pattern exposure portion EXH2 is illustrated.Fig. 4 is the one of the composition for showing the 2nd pattern exposure portion EXH2 The figure of example.2nd EXH2 systems of pattern exposure portion are and right by making cylindric reflection-type shade (hereinafter, being cylinder shade) M rotate The pattern (mask pattern) of cylinder shade M is projected by the exposure area W of the conveyance of rotating cylinder DR one sides, the substrate P of a surface bearing Picture scanning exposure apparatus.So using the exposure device of reflection-type shade in such as International Publication No. 2013/ Disclosed in having in No. 094286 pamphlet, therefore it is briefly described below.
Multiple lighting module IL (IL1 that 2nd pattern exposure portion EXH2 has light supply apparatus 22, constitutes lamp optical system ~IL6), keep rotation holding cylinder (the cylindric or columned base material) DR2 of cylinder shade M and constitute projection optical system Multiple projection module PL (PL1~PL6) poly-lens formula pattern exposure portion.Cylinder shade M is, for example, to use made of metal cylinder The reflection-type shade of body.Cylinder shade M is formed in the side extended along Y-direction and edge intersects with the direction that gravity works To the central shaft AX1 of extension and with central shaft AX1 at a distance of the base material surface of the cylinder of the cylindric peripheral surface of radii fixus. The circumferential surface of cylinder shade M becomes the shade face P1 for being formed with specific mask pattern.In shade face P1, it is formed in anti-with high efficiency Penetrate illumination light high reflection region and non-reflective light or with the low reflector space of extremely low efficiency reflective light patterning and At mask pattern.Such cylinder shade M can make at a low price because base material is made of metal cylinder.It, can shape in cylinder shade M The corresponding mask pattern of all or part of 1 pattern layer of Cheng Youyu.Also, can also be formed with multiple corresponding with 1 pattern layer Mask pattern.That is, also can along the circumferential direction make mask pattern corresponding with 1 pattern layer be formed with repeatedly in cylinder shade M It is multiple.
Rotation holding cylinder DR2 keeps cylinder shade M in such a way that the central shaft AX1 of cylinder shade M becomes rotation center.It should Rotation holding cylinder DR2 is by being endowed the rotary driving source (not shown) controlled come free control device 14 (for example, motor or subtracting Fast mechanism etc.) torque and around central shaft AX1 rotate.Thereby, cylinder shade M is scanned.The rotation side of rotation holding cylinder DR2 To the direction opposite with the direction of rotation of rotating cylinder DR, rotation holding cylinder DR2 is synchronous with the rotation of rotating cylinder DR and rotates.That is, The rotary speed for rotating holding cylinder DR2 is identical as the rotary speed of rotating cylinder DR.Furthermore the central shaft of rotating cylinder DR will be passed through The central shaft AX1 of AXo and cylinder shade M and along Y-direction extend face be known as median plane Poc2.Also, in Fig. 4, it will be in center The direction orthogonal with Y-direction is known as Z2' in the Poc2 of face, and the direction orthogonal with median plane Poc2 is known as X2'.The directions-Z2' are weights The direction side that power works, the directions+X2' are conveyance direction (scanning direction) sides of substrate P.
Light supply apparatus 22 is to generate the light such as the ultraviolet light irradiated to substrate P (illumination light) EL person.Light supply apparatus 22 for example wraps Include the solid light sources such as the lamp sources such as mercury vapor lamp, laser diode, light emitting diode.Illumination light caused by light supply apparatus 22 is for example It is directed to multiple lighting module IL (IL1~IL6) by light conducting members such as optical fiber (not shown).Lighting module IL (IL1~ IL6) such as including multiple optical components integrator optical system, rod lens or fly's-eye lens.Lighting module IL (IL1~ IL6) cylinder will be exposed to as the illumination light EL (hereinafter referred to as illuminating bundle EL1) of the energy-ray of uniform Illumination Distribution Multiple illumination region IR (IR1~IR6) on the shade face P1 of shade M.Illuminating bundle EL1 is exposed to circle by lighting module IL1 Illumination region IR1 on cylinder shade M.Similarly, lighting module IL2~IL6 exposes to illuminating bundle EL1 on cylinder shade M Illumination region IR2~IR6.Multiple lighting module IL (IL1~IL6) constitutes identical each other.
Between multiple lighting module IL (IL1~IL6) and cylinder shade M, it is provided with multiple polarisation spectroscope PBS (PBS1~PBS6) and the wavelength plates of multiple λ/4 QW (QW1~QW6).Polarisation spectroscope PBS (PBS1~PBS6) is for example reflected towards spy The light for determining the linear polarization (for example, P polarisations) of direction polarisation, makes the linear polarization to the direction polarisation orthogonal with specific direction The light of (for example, S polarisations) passes through.To which the illuminating bundle EL1 from lighting module IL (IL1~IL6) is (for example, P polarisations Light) after polarisation spectroscope PBS (PBS1~PBS6) reflections, cylinder is exposed to by the wavelength plates of λ/4 QW (QW1~QW6) and is hidden Cover M.Then, pass through the wavelength of λ/4 in the reflected light of the illuminating bundle EL1 of cylinder shade M reflection (hereinafter, being imaging beam EL2) Plate QW (QW1~QW6) and polarisation spectroscope PBS (PBS1~PBS6), and it is incident to projection module PL (PL1~PL6).Multiple throwings Imaging beam EL2 (energy-ray) is projected to by the illuminated of the rotating cylinder DR substrate Ps supported by shadow module PL (PL1~PL6) Multiple view field PA (PA1~PA6) on face.Furthermore from the illuminating bundle EL1 of lighting module IL and its reflected light As light beam EL2 is incident to the polarisation spectroscope wavelength plate of PBS1 and λ/4 QW1.Similarly, the illumination from lighting module IL2~IL6 Light beam EL1 and its reflected light, that is, imaging beam EL2 is incident to the polarisation spectroscope wavelength plate of PBS2~PBS6 and λ/4 QW2~QW6.
Multiple lighting module IL (IL1~IL6) are matched along the circumferencial direction of cylinder shade M in 2 rows across median plane Poc2 It sets.Odd number lighting module IL1, IL3, IL5 is relative to scanning direction (the rotation side that median plane Poc2 is cylinder shade M To) upstream side (- X2' direction sides), configured in 1 row along Y-direction.Even number lighting module IL2, IL4, IL6 are opposite Downstream side (+X2' direction sides) in the scanning direction (direction of rotation) that median plane Poc2 is cylinder shade M is in 1 row along Y-direction And it configures.
Fig. 5 A are the illumination region IR being held in from the observation of-Z2' direction sides on the cylinder shade M of rotation holding cylinder DR2 The vertical view of (IR1~IR6).As shown in Figure 5A, multiple illumination region IR (IR1~IR6) hide across median plane Poc2 along cylinder The circumferencial direction (directions X2') of cover M is configured in 2 rows.Upstream side (- X2' direction sides) in the scanning direction of cylinder shade M Illumination region IR1, IR3, IR5, the downstream side (directions+X2' in the scanning direction of cylinder shade M are configured on cylinder shade M Side) cylinder shade M on be configured with illumination region IR2, IR4, IR6.Illumination region IR (IR1~IR6) is with being hidden along cylinder Cover the region of the elongated trapezoidal shape of the parallel short side and long side of width direction (Y-direction) extension of M.At this point, odd number shines Area pellucida domain IR1, IR3, IR5 is arranged to even number illumination region IR2, IR4, IR6, and short side is in a manner of mutually opposite direction It is configured inside, and long side becomes outside.
Odd number illumination region IR1, IR3, IR5 separates specific interval along Y-direction and is configured in 1 row.Similarly, idol Number illumination region IR2, IR4, IR6 also separate specific interval along Y-direction and are configured in 1 row.At this point, illumination region IR2 is in the side Y Upwards, it is configured between illumination region IR1 and illumination region IR3.Also, illumination region IR3 is configured at lighting area in Y-direction Between domain IR2 and illumination region IR4.Illumination region IR4 in Y-direction, be configured at illumination region IR3 and illumination region IR5 it Between, illumination region IR5 is in Y-direction, being configured between illumination region IR4 and illumination region IR6.
Each illumination region IR (IR1~IR6) on the directions X2' with the triangular part weight of the illumination region IR of adjacent trapezoidal shape The mode (mode of overlapping) of conjunction configures.Furthermore each illumination region IR (IR1~IR6) although being set as the region of trapezoidal shape, Also can be the region of oblong-shaped.Furthermore cylinder shade M has the pattern forming region A1 for forming mask pattern and is not formed The non-pattern forming region A2 of mask pattern.Non- pattern forming region A2 absorbs the low reflector space of illuminating bundle EL1.With such Mode, multiple illumination region IR (IR1~IR6) configure in a manner of the overall with of the Y-direction of overlay pattern forming region A1.It should Pattern forming region A1 corresponds to the exposure area W of substrate P.
Imaging beam EL2 from cylinder shade M is projected to positioned at substrate P by multiple projection module PL (PL1~PL6) Multiple view field PA (PA1~PA6) on plane of illumination.Projection module PL1 is by the illumination region IR1 from cylinder shade M Imaging beam EL2 be projected to view field PA1.Similarly, projection module PL2~PL6 is by the lighting area from cylinder shade M The reflected light of domain IR2~IR6, that is, imaging beam EL2 is projected to view field PA2~PA6.Thereby, projection module PL (PL1~ PL6) picture of the mask pattern of the illumination region IR (IR1~IR6) on cylinder shade M can be projected the projected area to substrate P Domain PA (PA1~PA6).
Multiple projection module PL are corresponding with multiple lighting module IL (IL1~IL6) and configure.Multiple projection module PL (PL1 ~PL6) it is configured in 2 rows along the circumferencial direction of rotating cylinder DR across median plane Poc2.Odd number projection module PL1, PL3, PL5 is corresponding with the position of odd number lighting module IL1, IL3, IL5, and relative to the conveyance that median plane Poc2 is substrate P The upstream side (- X2' direction sides) in direction, configures along Y-direction in 1 row.Even number projection module PL2, PL4, PL6 and idol The position of number lighting module IL2, IL4, IL6 correspond to, and in the downstream relative to the conveyance direction that median plane Poc2 is substrate P Side (+X2' direction sides) is configured along Y-direction in 1 row.
Fig. 5 B are from the view field PA (PA1 on the plane of illumination for the substrate P that the observation of +Z direction side is supported on rotating cylinder DR ~PA6) vertical view.Multiple view field PA (PA1~PA6) in substrate P and multiple illumination region IR on cylinder shade M (IR1~I6) is corresponding and configures.That is, multiple view field PA (PA1~PA6) across median plane Poc2 along the circumference of rotating cylinder DR Direction (directions X2') is configured in 2 rows.It is configured in the substrate P of the upstream side (- X2' direction sides) of the conveyance direction of substrate P View field PA1, PA3, PA5 are projected in being configured in the substrate P in the downstream side (+X2' direction sides) of the conveyance direction of substrate P Region PA2, PA4, PA6.View field PA (PA1~PA6) is with the width direction (Y-direction) along substrate P (rotating cylinder DR) The region of the elongated trapezoidal shape of the parallel short side and long side extended.At this point, odd number view field PA1, PA3, PA5 and Even number view field PA2, PA4, PA6 are arranged to, and short side is configured inside in a manner of mutually opposite direction, and long side becomes Outside.
Odd number view field PA1, PA3, PA5 separates specific interval along Y-direction and is configured in 1 row.Similarly, idol Number view field PA2, PA4, PA6 also separate specific interval along Y-direction and are configured in 1 row.At this point, view field PA2 is in the side Y Upwards, it is configured between view field PA1 and view field PA3.Also, view field PA3 is configured at projected area in Y-direction Between domain PA2 and view field PA4.View field PA4 in Y-direction, be configured at view field PA3 and view field PA5 it Between, view field PA5 is in Y-direction, being configured between view field PA4 and view field PA6.
Each view field PA (PA1~PA6) on the directions X2' with the triangular part weight of the view field PA of adjacent trapezoidal shape The mode (mode of overlapping) of conjunction configures.Furthermore each view field PA (PA1~PA6) although being set as the region of trapezoidal shape, Also can be the region of oblong-shaped.In this manner, multiple view field PA (PA1~PA6) are set in covering in substrate P The mode of overall with of Y-direction of exposure area W configure.
Illumination by scanning (rotation) of cylinder shade M on the shade face P1 of the directions-X2' scanning cylinder shade M Region IR (IR1~IR6), the projected area by rotation of rotating cylinder DR on the plane of illumination of-X2' direction scanning substrate P Domain PA (PA1~PA6).To corresponding to the picture of mask pattern of illumination region IR (IR1~IR6) along the scanning of the directions-X2' Imaging beam EL2 by projection module PL (PL1~PL6), and be projected to the plane of illumination of the substrate P along the scanning of-X2' directions On view field PA (PA1~PA6).Thereby, the mask pattern being formed on the shade face P1 of cylinder shade M is exposed to substrate The exposure area W of P.
Furthermore in each projection module PL (PL1~PL6), being provided with can be to projection to the view field PA (PA1 in substrate P ~PA6) the amendment optical system that is adjusted of position, size (multiplying power) and at least one of the inclination relative to Y-direction It unites (illustration omitted), this is not described in detail.Thereby, it can adjust the illumination region IR (IR1~IR6) on cylinder shade M Mask pattern picture substrate P on position, size (multiplying power) and at least one of the inclination relative to Y-direction.In this When kind carrying out projection exposure using cylinder shade M, correct the pattern exposure portion of the poly-lens mode of the projection image of mask pattern in Also have in No. 2013/094286 pamphlet of International Publication No. listed above disclosed.Control device 14 also can be according to using pair Quasi- microscope ALG (ALG1~ALG4) and the location information of label MK (MK1~MK4) detected, driving projection module PL The amendment optical system of (PL1~PL6), and correct the picture of projected mask pattern.The amendment optical system is in control Under the control of device 14, not shown actuator driving.
Fig. 6 is an example for the composition for showing the another way using the 2nd pattern exposure portion EXH2 by type cylinder shade Figure.2nd pattern exposure portion EXH2 shown in fig. 6 exposes specific pattern person by so-called proximity mode in substrate P.Furthermore Identical reference marks is marked for composition identical with Fig. 4.The 2nd pattern exposure portion EXH2 of Fig. 6 have light supply apparatus 24 and Keep the rotation holding cylinder DR2 by type cylinder shade M.When the situation of Fig. 6, holding cylinder DR2 is by with fixed thickness for rotation The pipe of quartz etc. constituted, in the peripheral surface of the pipe, be formed with made of being patterned with the layer of light-proofness (chromium etc.) and hide Cover pattern.Cylinder shade M is arranged in such a way that the gap with rotation holding cylinder DR2 becomes small.On one side sweep the edges cylinder shade M Direction (direction of rotation) rotation is retouched, makes light supply apparatus 24 to the substrate P direct irradiation supported by rotating cylinder DR as energy on one side Illumination light (illuminating bundle) EL of ray, thereby illumination light corresponding with the image of mask pattern being formed on cylinder shade M Beam EL is projected on the plane of illumination of substrate P.The illuminating bundle EL that substrate P is exposed to from light supply apparatus 24 is irradiated along the directions-Z2' To median plane Poc2.Furthermore holding cylinder DR2 is rotated to rotate for the direction of opposite side along the direction of rotation with rotating cylinder DR, and It is synchronous with the rotation of rotating cylinder DR and rotate.
As described above, 2 kind of the 2nd pattern exposure portion EXH2 is illustrated, but the mode of the 2nd pattern exposure portion EXH2 is simultaneously It is without being limited thereto.That is, as long as the 2nd pattern exposure portion EXH2 is to be formed in the cylinder shade to the exposure area W scan exposures of substrate P The scanning of the picture (picture or the image by being formed by light that are formed by reflected light) of the mask pattern of the shade face P1 of M Type exposure device.
Fig. 7 is the figure of the composition for the exposure system 30 for showing the 1st implementation form.Exposure system 30 have exposure device EX, Actual pattern information generating part 32 and shade producing device 34.In Fig. 7 be by actual pattern information generating part 32 as with exposure Electro-optical device EX and 34 fission person of shade producing device and illustrate, but actual pattern information generating part 32 also may be disposed at exposure device Among EX or shade producing device 34.The exposure system 30 of 1st implementation form is following system：Because substrate P is flexible thin sheet base Plate, therefore the change for being formed in the exposure area W in substrate P is estimated according to result of the position of label MK (MK1~MK4) measurement etc. The tendency of shape, and the tendency of the deformation of exposure area W is accounted for and makes to have to overlap to be exposed on the W of exposure area The shade of new pattern；By the way that the shade produced is installed on exposure device (the 2nd pattern exposure portion EXH2), and improve substrate P Coincidence exposure when registration accuracy, and improve productivity.
In Fig. 7, the control device (output section) 14 of exposure device EX is the figure that makes with should be exposed in the W of exposure area The corresponding mask pattern of case, and by the location information of the label MK (MK1~MK4) gradually detected by aligming microscope ALG and Adjustment information (is swept for describing the multiplying power amendment of the tilt correction of line SL, the main scanning direction for describing line SL, describing line SL in master Retouch the margin of error or adjustment amount of the offset correction in direction etc.) at least one of output to actual pattern information generating part 32.Institute It refers to the pattern gone out by the 1st pattern exposure portion EXH1 actual exposures, i.e. luminous point to call " pattern that should be exposed in the W of exposure area " Pattern of the launching position (describing position) of SP after position adjusts.That is, control device 14 is to make and pass through the 1st pattern exposure The corresponding mask pattern of pattern that portion's EXH1 actual exposures go out, and the location information of output token MK (MK1~MK4) and adjustment letter At least one of breath.Furthermore so-called adjustment information refers to adjusting relevant information with position (to describe the inclination angle of line SL, retouch The multiplying power of the scanning direction of line drawing SL describes line SL in the offset etc. of scanning direction), position adjustment is basis as described above The location information for marking MK (MK1~MK4), pair with design information (pattern data) luminous point SP's that is corresponding and being projected to substrate P The position person of being adjusted.Control device 14 is when the situation of output adjustment information, the light of output and each scanning element U (U1~U6) The position of point SP adjusts relevant information.
Actual pattern information generating part 32 includes computer and the storage media etc. having program stored therein etc., passes through above-mentioned electricity Brain executes above procedure, and the actual pattern information generating part 32 as this implementation form functions.Actual pattern information is produced Life portion 32 is according at least one of the location information of the label MK (MK1~MK4) sent and adjustment information, amendment design letter It ceases (pattern data), and generates to make mask pattern corresponding with the pattern in the exposure area W that should be exposed in substrate P Actual pattern information (pattern data).That is, actual pattern information generating part 32 is believed according to the position of label MK (MK1~MK4) Breath and at least one of adjustment information and amendment design information (pattern data), generate and pass through the 1st figure to make can get The actual pattern information (pattern data) of the mask pattern for the pattern that case exposure portion EXH1 actual exposures go out.So-called " design information " It refer to the design information (pattern data) used in the 1st pattern exposure portion EXH1 of exposure device EX.The pattern data (is set Meter information) it is stored in the storage media of actual pattern information generating part 32.Actual pattern information generating part 32 is by generated reality Border pattern-information is exported to shade producing device 34.Furthermore actual pattern information generating part 32 generates respectively corrects each scanning list Actual pattern information obtained by the design information (pattern data) of first U (U1~U6).
Shade producing device 34 by pattern exposure corresponding with actual pattern information in cylindric shade substrate MP, by Mask pattern corresponding with actual pattern information is formed on shade substrate MP by this.It is formed with corresponding with actual pattern information The shade of mask pattern become cylinder shade M used in the 2nd pattern exposure portion EXH2 with substrate MP.Shade makes dress It sets 34 and has exposure device EX2.Exposure device EX2 has the 3rd pattern exposure portion EXH3, is held in surface and is formed with photonasty work( The rotation holding cylinder DR3 and control device 36 of the cylindric shade substrate MP of ergosphere (for example, layer of photoresist).Control Device 36 is the computer of the exposure for controlling the 3rd pattern exposure portion EXH3 and the rotation of rotation holding cylinder DR3.3rd pattern exposure portion EXH3 has composition identical with the 1st pattern exposure portion EXH1.Therefore, composition of the appropriate reference to the 1st pattern exposure portion EXH1 The symbol marked, and the 3rd pattern exposure portion EXH3 is illustrated.Furthermore rotating holding cylinder DR3 has and rotation holding cylinder The identical compositions of DR2 keep shade substrate MP in such a way that shade becomes rotation center with the central shaft AX1 of substrate MP.
Each scanning element U (U1~U6) of 3rd pattern exposure portion EXH3 is under the control of control device 36, for being held in The shade substrate MP for rotating holding cylinder DR3 and rotating, is projected to screening by the luminous point SP of the beam LB as energy-ray on one side Cover substrate MP, one-dimensionally scans (main scanning) luminous point SP in shade substrate MP upper edges main scanning direction (Y-direction) on one side.This When, control device 36 is provided to by the actual pattern information (pattern data) that will be sent from actual pattern information generating part 32 3rd pattern exposure portion EXH3, and the 3rd pattern exposure portion EXH3 is made to use pattern exposure corresponding with actual pattern information in shade On the plane of illumination of substrate MP.That is, the 3rd pattern exposure portion EXH3 is under the control of control device 36, according to actual pattern information And the intensity for the luminous point SP that high speed modulation (on/off) is scanned along main scanning direction, thereby expose and actual pattern information pair The pattern answered.In the 3rd pattern exposure portion EXH3, the actual pattern information become to by pattern exposure in shade substrate MP Design information.The modulation of the intensity of luminous point SP is set to the exposure of the 3rd pattern by switching in the same manner as the 1st pattern exposure portion EXH1 The description of the light import optical system BDU (BDU1~BDU6) of light portion EXH3 is carried out with optical element AOM (AOM1~AOM6). Also can be purple furthermore the beam LB for the pulse type that the light supply apparatus 20 of the 3rd pattern exposure portion EXH3 is sent out may be either electron beam The light beams such as outside line.
In this way, the 3rd pattern exposure portion EXH3 is according to actual pattern information, and modulation is projected to being shone for shade substrate MP Penetrate the intensity of the luminous point SP on face, thus by the 3rd pattern exposure portion EXH3 by the pattern described becomes obtaining by the 1st The mask pattern for the pattern that pattern exposure portion EXH1 actual exposures go out.
Herein, shade producing device 34 has forms photonasty functional layer (for example, photoetching in the surface of shade substrate MP Glue agent layer) film formation device, develop to being subjected to the shade after exposure-processed by exposure device EX2 with substrate MP it is aobvious Image device and the etching device etc. performed etching with substrate to the shade after developing, do not illustrate this especially.Film forming Device, exposure device EX2, developing apparatus and etching device etc. to shade with substrate MP implementations handle, be thereby formed with and The cylinder shade M of the corresponding mask pattern of actual pattern information.That is, shade is become with substrate MP is carried with shade figure with cylindrical shape The cylinder shade of case.It, will furthermore when making situation of the shade with substrate MP with flexible transparent resin flake or plate glass etc. The shade of sheet is attached at the peripheral surface of the cylindric rotation holding cylinder DR2 in exposure device EX with substrate MP.It is used in by shade When substrate MP is directly made in the peripheral surface of cylindric base material and forms the situation of cylinder shade, rotation holding cylinder DR2 is replaced Entirety.
The control device 14 of exposure device EX is constantly conveyed in the supply roller to self installation in device manufacturing system 10 Substrate P when carrying out overlapping the situation of exposure for the first time, because not knowing substrate P has the deformation tendency of which kind of state, therefore by that can make The 1st pattern exposure portion EXH1 that the pattern to be described flexibly deforms and the exposure for carrying out the pattern that should be overlapped.That is, according to making The location information of the label MK (MK1~MK4) detected with aligming microscope ALG (ALG1~ALG4), fine tuning are believed with design Breath (describing the data) is corresponding and is projected to the position of the luminous point SP of substrate P, depicting pattern.Control device 14 gradually stores and luminous point The position of SP adjusts at least one of the location information of relevant adjustment information and detected label MK (MK1~MK4).
Thereafter, in the location information according to label MK (MK1~MK4), distinguish that exposure area W has fixed deformation tendency When situation, control device 14 will be with the location information and root of a series of label MK (MK1~MK4) of fixed deformation tendency arrangement At least one of adjustment information of luminous point SP of position adjustment output to actual pattern information is carried out according to the location information to generate Portion 32.In bridgeing across the multiple exposure area W configured along long dimension direction, the location information of label MK (MK1~MK4) reflects exposure When the situation of the fixed tendency of light region W, bridge across the label MK of multiple exposure area W location information and adjustment information in extremely Few one is exported to actual pattern information generating part 32.Fixed error is found in the location information in label MK (MK1~MK4) When the situation of tendency, exposure area W also has fixed deformation (deformation) tendency.
Then, actual pattern information generating part 32 according to location information and at least one of adjustment information of label MK and Generate actual pattern information.Shade producing device 34 generates the cylinder shade with mask pattern corresponding with actual pattern information M.That is, in finding fixed tendency (rule in the deformation (linear deformation, 2 times~3 times or so high order deformation) of exposure area W Property) situation when, shade producing device 34 generates the mask pattern for reflecting the systematicness in cylinder shade M.At this point, shade system Make the 3rd pattern exposure portion EXH3 of device 34 according to actual pattern information and the luminous point SP that scans along main scanning direction of modulation it is strong Degree, thereby will pattern exposure corresponding with actual pattern information in shade substrate MP.
The 2nd pattern exposure portion EXH2 is installed on by the cylinder shade M that exposure system 30 are produced as above, the 2 pattern exposure portion EXH2 carry out pattern exposure under the control of control device 14, using produced cylinder shade M to substrate P Light.That is, the mask pattern that will be formed in cylinder shade M is projected to the plane of illumination of substrate P.Control device 14 is in the 2nd figure of beginning Before the exposure of case exposure portion EXH2, suspend the exposure of the 1st pattern exposure portion EXH1.Thereby, it is mounted on the 2nd figure in cylinder shade M It after case exposure portion EXH2, is only exposed by the 2nd pattern exposure portion EXH2, therefore the conveyance speed of substrate P can be improved, can shortened The processing time (improving productivity) of pattern exposure.As a result, the formation time of pattern layer shortens.
Control device 14 also uses aligming microscope ALG during being just exposed the 2nd pattern exposure portion EXH2 The location information of (ALG1~ALG4) detection label MK (MK1~MK6).In using scanning exposure apparatus conduct shown in Fig. 4 When the situation of the 2nd pattern exposure portion EXH2, control device 14 also can be in the exposure of the 2nd pattern exposure portion EXH2, according to label The location information of MK (MK1~MK4), driving are set to repairing for projection module PL (PL1~PL6) of the 2nd pattern exposure portion EXH2 Optical system is just used, thereby corrects projection to the picture of the mask pattern of substrate P.In the stage, it is formed in and is installed on the exposure of the 2nd pattern The two dimension deformation of base pattern layer of the mask pattern of the cylinder shade M of light portion EXH2 in the exposure area W in substrate P, In a manner of it can integrally substantially overlap, (correction) is corrected according to layout.Therefore, be set to projection module PL (PL1~ PL6) as long as the drive volume of the amendment optical system of each is also a little, this also helps to improve the conveyance speed of substrate P.
Also, control device 14 is in the exposure actions in the 2nd pattern exposure portion EXH2 (in the scan exposure of substrate P), root The tendency of the deformation of the exposure area W estimated according to the location information of the label MK (MK1~MK4) gradually detected is seemingly intended to beyond appearance Perhaps range (the amendment boundary of amendment optical system of the 2nd pattern exposure portion EXH2 etc.) and change situation when, suspend the 2nd figure The exposure of case exposure portion EXH2.That is, its reason is：When the deformation tendency of such as exposure area W exceeds the situation of permissible range, It can not have been coped with by the mask pattern being formed on cylinder shade M.Therefore, control device 14 starts again at the 1st pattern exposure The exposure of portion EXH1.Thereby, the pattern described according to the conveyance state of substrate P or the deformation of exposure area W can be made flexibly Deformation, can continue the exposure-processed of substrate P.Furthermore control device 14 is in the feelings being exposed by the 1st pattern exposure portion EXH1 When shape, the conveyance speed of substrate P can be made to be reduced to can be by the speed of the 1st pattern exposure portion EXH1 depicting pattern.
But at the exposure that 1 exposure area W in EXH2 pairs of the 2nd pattern exposure portion by using cylinder shade M is carried out Reason is completed, when beginning through the 1st pattern exposure portion EXH1 from next exposure area W and being exposed the situation of processing, in Fig. 1 institutes In the configuration of the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 that show, the front end of next exposure area W is possible to Excessively pass through the exposure position of the 1st pattern exposure portion EXH1 (position for describing line SL1~SL6).Therefore, in the 2nd pattern exposure After the completion of the exposure-processed of portion EXH2, not make substrate P in a manner of being slided on rotating cylinder DR, the rotation of pause rotating cylinder DR and The transporting operation of substrate transport mechanism 12.Thereafter, as long as in making rotating cylinder DR in such a way that substrate P is reversely transported fixed range Rotation or substrate transport mechanism 12 action reversion after, be suitable for the specific conveyance speed of the 1st pattern exposure portion EXH1 again Substrate P is transported along forward direction.
Moreover, thereafter, according to use aligming microscope ALG (ALG1~ALG4) and detect label MK (MK1~ MK4 when the deformation for the exposure area W that location information) is estimated has the situation of fixed tendency, control device 14 also will label At least one of the location information of MK (MK1~MK4) and adjustment information are exported to actual pattern information generating part 32.Then, Actual pattern information generating part 32 generates actual pattern information again, and shade producing device 34 believes the actual pattern generated again Breath forms mask pattern corresponding with actual pattern information as design information and in another shade on substrate MP.Then, it controls Device 14 processed again pauses for the exposure of the 1st pattern exposure portion EXH1, and makes the 2nd pattern exposure portion EXH2 that brand-new be begun to use to make Shade substrate MP exposure.
In this way, the exposure device EX of the 1st implementation form has：Aligming microscope ALG (ALG1~ALG4), to detect The position of the label MK (MK1~MK4) in the substrate P of electronic component should be formed；1st pattern exposure portion EXH1, in substrate P On exposure area (element-forming region) W exposing patterns, and according to the position of detected label MK (MK1~MK4) believe Breath projects after the luminous point SP of beam LB corresponding with pattern data (design information) is carried out position adjustment；And control dress (output section) 14 is set, to make mask pattern corresponding with the pattern that should be exposed to exposure area W, and exports and is adjusted with position At least one of the location information of relevant adjustment information and label MK (MK1~MK4).Pass through to can make and reflect The pattern that 1st pattern exposure portion EXH1 actual exposures go out (is obtained in a manner of corresponding with the deformation of exposure area W in substrate P Depicting pattern after adjustment) mask pattern.
Also, exposure device EX has the 2nd pattern exposure portion EXH2, the EXH2 uses of the 2nd pattern exposure portion are filled according to control The shade figure set at least one of location information of adjustment information and label MK (MK1~MK4) that 14 are exported and produced Case projects illuminating bundle EL corresponding with the picture of mask pattern to exposure area W.Thereby, it can be carried out by using cylinder shade M 2nd pattern exposure portion EXH2 of exposure exposes the pattern gone out by the 1st pattern exposure portion EXH1 actual exposures of no shade.That is, Even if do not use the 1st pattern exposure portion EXH1, the 2nd pattern exposure portion EXH2 also using be adjusted (amendments) for by the 1st The same mask pattern of pattern that pattern exposure portion EXH1 actual exposures go out executes exposure-processed.
2nd pattern exposure portion EXH2 makes to be projected according to the location information of detected label MK (MK1~MK4) Mask pattern distortion of image.Thereby, in the exposure of the 2nd pattern exposure portion EXH2, that is, it is convenient for the conveyance state because of substrate P It, just also can be right as long as the deformation is in permissible range and (corrects in boundary) when changing and causing the situation that exposure area W is deformed According to deformation exposure area W and exposing patterns.
In the exposure of the 2nd pattern exposure portion EXH2, such as according to the position of detected label MK (MK1~MK4) Information and when situation that the tendency of the deformation of exposure area W that estimates changes beyond specific permissible range, suspend the 2nd pattern The exposure actions of exposure portion EXH2, and the exposure actions of the 1st pattern exposure portion EXH1 are switched to, the sequential of the switching also can be logical The function using reversed conveyance substrate P is crossed, 1 exposure area W is just exposed by the 2nd pattern exposure portion EXH2 in processing On the way.
1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 is the piece in the peripheral surface for being supported on 1 rotating cylinder DR Exposing patterns in the substrate P of shape.Therefore, exposing patterns by the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 The conveyance state (contiguity is supported on the state of rotating cylinder DR) of substrate P is identical.To, by the 1st pattern exposure portion EXH1 by expose The registration accuracy of exposure area W (base pattern) on the pattern and substrate P of light is exposed by the 2nd pattern exposure portion EXH2 Pattern and substrate P on exposure area W (base pattern) registration accuracy become equal extent, can inhibit manufactured electronics The quality discrepancy of element.
Actual pattern information generating part 32 is such as being pushed away according to the location information of detected label MK (MK1~MK4) When the tendency of the deformation of fixed exposure area W exceeds the situation of permissible range, actual pattern information is generated again, and shade makes dress 34 are set mask pattern is formed on another shade substrate MP according to the actual pattern information generated again.Thereby, it uses The shade that brand-new is made substrate MP (cylinder shade M), the pattern exposure of the 2nd pattern exposure portion EXH2 of continuation.Therefore, that is, it is convenient for When roller length (overall length of substrate P) reaches the situation of several Km, it is carried out continuously at exposure with can also not stopping the conveyance of substrate P substantially Reason, to which productivity improves.
Furthermore as long as the 1st pattern exposure portion EXH1 is the person of being exposed in a manner of no shade.To which the 1st pattern exposes Light portion EXH1 also can be to use digital micromirror elements (DMD：Digital Micromirror Device) it exposes and describes the data Corresponding specific pattern person.
[variation]
Above-mentioned 1st implementation form can also deform as follows.
(variation 1) in above-mentioned 1st implementation form, the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 are pair The substrate P exposing patterns supported by same rotating cylinder DR, but the base that bearing can also be exposed by the 1st pattern exposure portion EXH1 The rotating cylinder DR of plate P is different from the rotating cylinder DR of substrate P that bearing is exposed by the 2nd pattern exposure portion EXH2.
Fig. 8 is the figure of the composition for the exposure device EXa for showing variation 1.Furthermore for above-mentioned 1st implementation form phase Same composition marks identical symbol and the description thereof will be omitted, and only a pair part different from above-mentioned implementation form illustrates.Exposure The upstream side (-X direction side) of the conveyance direction of the substrate transport mechanism 12a self-reference substrates P of device EXa sequentially has marginal position control Device EPC processed, driving drum R1, tension adjustment roller RT1, rotating cylinder DR (DRa), tension adjustment roller RT2, rotating cylinder DR (DRa), tension adjustment roller RT3 and driving drum R3.The substrate P moved out from marginal position controller EPC is set up in driving rolling Cylinder R1, tension adjustment roller RT1, rotating cylinder DRa, tension adjustment roller RT2, rotating cylinder DRb, tension adjustment roller RT3 and drive After dynamic roller R3, it is transported to processing unit PR2.
2 rotating cylinders DRa, the DRb have composition identical with the rotating cylinder DR of Fig. 1~illustrated in fig. 6.Furthermore such as Shown in Fig. 8, rotating cylinder DRa is configured at the upstream side (-X direction side) of the conveyance direction of substrate P, is shown wherein with AXo1, Sft1 Mandrel AXo and axis Sft.Moreover, rotating cylinder DRb is configured at the downstream side (+X direction side) of the conveyance direction of substrate P, with AXo2, Sft2 shows central shaft AXo and axis Sft.Tension adjustment roller RT3 is also in the sides-Z in the same manner as tension adjustment roller RT1, RT2 It is energized upwards.Tension adjustment roller RT1, RT2 is to the substrate P for being wound to rotating cylinder DRa and being supported in long dimension direction Specific tensile is assigned, tension adjustment roller RT2, RT3 is to the substrate P for being wound to rotating cylinder DRb and being supported in long size side To imparting specific tensile.Thereby, make imparting to the tension stability of the long dimension direction for the substrate P being wound on rotating cylinder DRa, DRb It turns in particular range.
1st pattern exposure portion EXH1 is set to the top (+Z direction side) of rotating cylinder DRa, and the 2nd pattern exposure portion EXH2 is set It is placed in the top (+Z direction side) of rotating cylinder DRb.Thereby, the 1st pattern exposure portion EXH1 can be to being supported on the substrate of rotating cylinder DRa P is exposed, and the 2nd pattern exposure portion EXH2 can be exposed the substrate P for being supported on rotating cylinder DRb.In Fig. 8, Poc1 is By the central shaft AXo1 of rotating cylinder DRa and along the face that Z-direction extends.Also, Poc2 is the central shaft AXo2 by rotating cylinder DRb And along the face that Z-direction extends.
In this way, making bearing by the rotating cylinder DR of the 1st pattern exposure portion EXH1 substrate Ps being exposed and bearing by the 2nd figure The rotating cylinder DR for the substrate P that case exposure portion EXH2 is exposed is different, thereby, the 1st pattern exposure portion EXH1 and the 2nd pattern exposure The degree of freedom of the configuration of portion EXH2 improves.
Furthermore aligming microscope ALGa (ALGa1~ALGa4) shootings are supported on the label MK in the substrate P of rotating cylinder DRa (MK1~MK4), aligming microscope ALGb (ALGb1~ALGb4) shootings are supported on the label MK in the substrate P of rotating cylinder DRb (MK1~MK4).The aligming microscope ALGa, ALGb have structure identical with the above-mentioned aligming microscope ALG of 1st implementation form At.1st pattern exposure portion EXH1 is according to the label MK (MK1 for using aligming microscope ALGa (ALGa1~ALGa4) and detecting ~MK4) location information, couple corresponding with a design information luminous point SP carries out position adjustment, and carries out figure in a raster scanning mode Case is described.Also, in the situation that the 2nd pattern exposure portion EXH2 is the scanning exposure apparatus shown in Fig. 4 using cylinder shade M When, the 2nd pattern exposure portion EXH2 is according to the label MK for using aligming microscope ALGb (ALGb1~ALGb4) and detecting When the situation that the deformation tendency for the exposure area W that the location information of (MK1~MK4) is estimated changes, projected shade is corrected The position of the projection image of pattern and the shape (multiplying power, rotation) of projection image.Also, the tendency of the deformation of exposure area W in substrate P Whether label MK that the judgement of permissible range by using aligming microscope ALGa (ALGa1~ALGa4) detected is exceeded The location information of (MK1~MK4) and detected using aligming microscope ALGb (ALGb1~ALGb4) label MK (MK1~ MK4 at least one of location information) and judged.
(variation 2) is configured at substrate P in above-mentioned 1st implementation form and variation 1, by the 1st pattern exposure portion EXH1 Conveyance direction upstream side (-X direction side), the 2nd pattern exposure portion EXH2 is configured to the downstream side of the conveyance direction of substrate P (+X direction side), but configuration relation also can with it is opposite.That is, can also be located at compared with the 2nd pattern exposure by the 1st pattern exposure portion EXH1 Portion EXH2 configures the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion by the mode in the downstream side of the conveyance direction of substrate P EXH2。
(variation 3) in above-mentioned 1st implementation form and above-mentioned each variation, the 1st pattern exposure portion EXH1 and the 2nd pattern Exposure portion EXH2 is carried out in the substrate P that the circumferencial direction bending of the peripheral surface along rotating cylinder DR (DRa, DRb) is supported Pattern exposure, but also can be in the planar substrate P progress pattern exposure being supported.Also, the 2nd pattern of this variation 3 exposes Light portion EXH2 may be either the scanning exposure apparatus (scanning stepper) using plane shade, also can be stepping ＆ repetitive modes Projection aligner (stepper).Scanning stepper makes plane shade be scanned to substrate P in X-direction synchronizing moving with substrate P Exposure imaging beam EL2 person corresponding with the picture of the mask pattern of plane shade.Stepper is in keeping plane shade and substrate P static In the state of, exposure mask pattern is all together to exposure area W, then makes substrate P stepping mobile and again in the shape for keeping its static It is all together exposure mask pattern person under state.When so using the situation of the 2nd pattern exposure portion EXH2 of mounting plane shade, pass through Shade producing device 34 and shade substrate (reticle substrate) MP for being formed are to hold mask pattern with planar, and as quartz Deng parallel flat.
(variation 4) in above-mentioned 1st implementation form and above-mentioned each variation, with according to label MK (MK1~MK4) Location information and the corresponding mode of deformation of exposure area W (or substrate P) estimated, make the description of the 1st pattern exposure portion EXH1 Line SL (SL1~SL6) tilts or is changed relative to Y-axis the sweep length (multiplying power) for describing line SL (SL1~SL6) or makes to retouch Line drawing SL (SL1~SL6) is deviated in main scanning direction, and thereby fine tuning is projected to the scan position of the luminous point SP of substrate P.In this change In shape example 4, in addition to the methods of this, or substitution the methods of is somebody's turn to do, also can by with the location information according to label MK (MK1~MK4) And the corresponding mode of deformation of the exposure area W (or substrate P) estimated, it generates and corrects former design information (initial data of pattern) The pattern data (correction design information) of gained.1st pattern exposure portion EXH1 uses the correction design information (dot chart of the generation Data), and the intensity of the luminous point SP in modulation scanning.By correcting former design information (original pattern data) itself, luminous point is utilized The scanning of SP and be depicted in the position of pattern in substrate P finally by small amendment.When the situation, generated correction design Information is also delivered to actual pattern information generating part 32, and actual pattern information generating part 32 is designed using only the correction come is conveyed At least one of location information and adjustment information of information or use label MK (MK1~MK4) and correction design information, and Generate actual pattern information.At this point, the location information of label MK (MK1~MK4) also can be used in actual pattern information generating part 32 And at least one of adjustment information corrects correction design information again, and generate actual pattern information.
[the 2nd implementation form]
Fig. 9, Figure 10 are the vertical views of the composition for the exposure device EXb that the 2nd implementation form is observed from Z-direction.Furthermore for Identical with above-mentioned 1st implementation form composition marks identical symbol and description is omitted, not pair with above-mentioned implementation form Same part illustrates.Exposure device EXb has the carrying device for transporting substrate P in X direction with specific tensile state, base Plate P is supported by exposure position is by rotating cylinder DR with flexuosity, or by platform (for example, passing through liquid-bearing layer The plane holder of supporting substrates P) and be supported with planar.As shown in figure 9, the exposure device EXb tools of this implementation form Have：The 1st pattern exposure portion EXH1 without shade mode is that dislocation configuration is formed using 6 projection module U1 '~U6 ' of DMD Person；And the 2nd pattern exposure portion EXH2, it is that the peripheral surface being used in around the rotation holding cylinder DR2 of central shaft AX1 rotations is formed with Mask pattern passes through type cylinder shade M (identical as Fig. 6) person.1st pattern exposure portion EXH1 and the 2nd pattern exposure portion edges EXH2 Y-direction (width direction orthogonal with the long dimension direction of substrate P) is arranged and is configured on exposure portion scaffold 200, can be divided It is not guided by linear guide portion 200a, 200b of exposure portion scaffold 200 extended along Y-direction and is moved in Y-direction.Again Person, as by platform with the composition of planar supporting substrates P, for example, also can be used International Publication No. it is No. 2013/150677 small Composition disclosed in book.
Thus, can be by making in the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 in this implementation form Any one is slided in a manner of with substrate P opposite direction along Y-direction, and selects the exposure of exposure-processed and shade mode without shade mode Light processing.Fig. 9 shows state when being exposed without shade for making the 1st pattern exposure portion EXH1 and substrate P opposite direction, and Figure 10, which is shown, makes State when 2 pattern exposure portion EXH2 and the shade of substrate P opposite direction expose.In the same manner as the 1st implementation form, 4 alignments are micro- Mirror ALG1~ALG4 is configured at the upstream side of the conveyance direction of substrate P relative to the exposure position in substrate P, Deng examining respectively Survey the label MK (MK1~MK4) in substrate P.Furthermore as the 1st pattern exposure portion EXH1 without shade mode for using DMD, Such as using the composition disclosed in No. 2008/090942 pamphlet of International Publication No., as using through type cylinder shade M The 2nd pattern exposure portion EXH2, such as using the proximity mode disclosed in No. 2013/136834 pamphlet of International Publication No. Exposure mechanism.
In substrate P, (sub-scanning direction) is conveyed the 1st pattern exposure portion EXH1 of this implementation form with fixed speed in X direction Period passes through the Two dimensional Distribution of DMD dynamically modulation partial projection light corresponding with the pattern that should describe.At this point, driving DMD The signals of multiple micro mirror each correct former design information by the deformation quantity caused by deformation by the exposure area W estimated etc. (CAD information) and make.To as long as making the sub-scanning direction of the state change and substrate P of the signal of each micro mirror of driving DMD The shift position shift position of MK (or label) it is critically corresponding and store, can be generated by the actual pattern information of Fig. 7 Portion 32 and generate the information of the actual pattern of the practical exposure area W for overlapping and being exposed to substrate P (revised correction design believed Breath).Thereby, in the same manner as the 1st implementation form, can immediately be made by the shade producing device 34 of Fig. 7 should be installed on the 2nd pattern The cylinder shade M of exposure portion EXH2.
According to this implementation form, in using any one of the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 into During the exposure-processed of row substrate P, another one is configured with exiting to the state of outer (side) of the transport path of substrate P.Cause This, is easy to carry out the maintenance inspection (maintenance) of pattern exposure portion EXH1, EXH2.In turn, in the 2nd pattern exposure portion EXH2, easily In installation (replacement) operation of progress cylinder shade M, and it can easily assemble to carry out the shade of shade replaced automatically Replace mechanism.Also, in the 1st pattern exposure portion EXH1,6 projection module U1 '~U6 ' of DMD can will be used to measure oneself Each projection light distribution mutual alignment relation and the correction unit portion calibrated be configured at be in it is as shown in Figure 10 The underface (-Z direction side) of 1st pattern exposure portion EXH1 of position.
[variation]
Above-mentioned 2nd implementation form can also deform as follows.
(variation 1) Figure 11 is the figure of the planar configuration of the exposure device EXb for the variation 1 for showing the 2nd implementation form.In In variation 1, by the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 be integrally formed at can centered on axis 210a and The exposure portion of turn supports capstan head 210.Moreover, when switching the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2, make Exposure portion supports after capstan head 210 rises fixed range (for example, 1cm or so) to +Z direction, be allowed to centered on axis 210a by Clockwise or counterclockwise turn 180 degree.In this way, in be configured to by exposure portion support capstan head 210 turn by into It, can be by the precision (± several μm) of the bearing of support shaft 210a, by the 1st pattern exposure portion EXH1 and the 2nd figure when the situation of row switching Case exposure portion EXH2 machineries are set in specific position.When the situation of the variation 1, be also prone to carry out pattern exposure portion EXH1, Maintenance inspection (maintenance) operation of EXH2, installation (replacement) operation of cylinder shade M, and also can easily assemble shade changing machine Structure or correction unit portion.
(variation 2) Figure 12 is the schematic configuration from the exposure device EXb of the variation 2 of the 2nd implementation form of front observation Figure.In the variation 2, pass through the guide part 220a bearings the 1st of linearly extended exposure portion scaffold 220 in X direction Pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2.Guide part 220a plays work(as the guide rail that straight line in X direction is formed Can, each of the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 are set as to move in X-direction along guide part 220a. When the situation of the variation 2, make pattern exposure portion EXH1, EXH2 in the conveyance direction (when crosscutting median plane Poc2 of substrate P The moving direction of substrate P) it is mobile, and switch shade exposure mode and no shade exposure mode.To although can not be as above As Fig. 9~Figure 11, any one of the 1st pattern exposure portion EXH1 and the 2nd pattern exposure portion EXH2 are configured in the faces XY Nei Guan The outside of the transport path of substrate P when examining, but the footprint area (setting area) of exposure device EXb entirety can be reduced.
[the 3rd implementation form]
Figure 13 shows being integrally formed for the element fabricating device of the 3rd implementation form, and Figure 14, which is shown, is assembled to Figure 13 The figure of the composition of exposure portion in element fabricating device.The element fabricating device of this implementation form is as shown in figure 13 by such as lower member It is constituted：Supply unit SU, step before pulling out the flexible strip substrate P for being wound in supply roller FR1 and supplying it to Processing unit (processing unit) PR1；Exposure device EXC, to treated by the processing unit PR1 by, substrate P is exposed place Reason；Processing unit (processing unit) PR2 implements subsequent step to the substrate P after exposure；And recoverer PU, it will be through locating later The substrate P of reason is batched to recycling roll FR2.Exposure device EXC is as shown in figure 14, for example, have 3 exposure portion EXc1, EXc2, EXc3, and have and control such exposure control unit ECT to be all together.
Processing unit PR1 is made of such as lower member：Rotating cylinder RS1 automatically supplies portion SU conveyings by periphery surface bearing Come substrate P and be allowed in long dimension direction move；Mould mouth coating head DH, in the surface of the substrate P supported by rotating cylinder RS1 It is coated with liquid photosensitive material (photoetching jelly, photonasty silane coupling material etc.)；Solvent removal portion HS1 is coated with certainly Photosensitive material remove solvent；And drying section HS2, pass through the heat dryings substrate P such as heater or hot wind.Pass through processing unit PR1 and be formed with the substrate P of the photonasty functional layer being made of photosensitive material in being exposed processing using exposure device EXC Afterwards, the wet processed for photonasty functional layer is subjected to by processing unit PR2.Processing unit PR2 is by to photonasty The liquid tank that functional layer is implemented chemically treated liquid tank WB1 with wet type, will be cleaned by chemically treated substrate P using pure water WB2 and clean substrate P is heated and is allowed to dry drying section HS3 and is constituted.
As shown in figure 14, the exposure device EXC of this implementation form is by using through the identical with Fig. 6 of type cylinder shade M1 The exposure portion EXc1 of proximity mode, the exposure portion EXc2 without shade mode that by scanning beam is realized identical with Fig. 2, make With the exposure portion EXc3 of the projection pattern identical with Fig. 4 of reflection-type cylinder shade M2 and comprising to according to exposure portion EXc1, Sequence conveyance multiple roller R11, R12 of the substrate P from processing unit PR1 of EXc2, EXc3, R13, R14, R15, R16, R17, The conveying unit of R18 is constituted.Exposure portion EXc1 has：Driving mechanism (not shown) makes cylinder shade M1 be revolved around central shaft AX1 Turn；Light supply apparatus (lighting system) 24 (with reference to Fig. 6), is configured at the inside of cylinder shade M1, to substrate P irradiation exposure It uses up；Rotating cylinder (supporting member for substrate) DRA, can be on one side by peripheral surface (bearing surface) supporting substrates P, on one side around central shaft AXa rotates；Driving mechanism (not shown) makes rotating cylinder DRA rotate and substrate P is made to be moved in long dimension direction；Encoder system The scale disk SD of system, the rotary angle position (amount of movement of substrate P) of measurement rotating cylinder DRA；And to Barebone ALGA, It is made of Fig. 1 and aligming microscope ALG1~ALG4 shown in Fig. 3.Exposure portion EXc1 so is in such as International Publication No. Disclosed in having in No. 2013/146184 pamphlet of No. 2013/136834 pamphlet and International Publication No., therefore omit specifically It is bright.
Exposure portion EXc2 identically as Fig. 2, has：Rotating cylinder (supporting member for substrate) DRB, can pass through peripheral surface on one side (bearing surface) bearing by roller R13, R14 of conveying unit from exposure portion EXc1 conveying come substrate P, on one side around central shaft AXb Rotation；Driving mechanism (not shown) makes rotating cylinder DRB rotate and substrate P is made to be moved in long dimension direction；Encoder system Scale disk SD, the rotary angle position (amount of movement of substrate P) of measurement rotating cylinder DRB；To Barebone ALGB, by Fig. 1 And aligming microscope ALG1~ALG4 shown in Fig. 3 is constituted；And multiple scanning element U1~U6 of beam scan mode, etc. Scan-off beam (exposure light) according to CAD data and after modulation intensity is agglomerated into luminous point SP and in being scanned in substrate P, Thereby depicting pattern.About exposure portion EXc2 so, in such as No. 2015/152217 pamphlet of International Publication No. and the world It discloses and is also illustrated in No. 2015/152218 pamphlet, therefore detailed description will be omitted herein, scanning element U1~U6 roots According to the ordered state of label MK1~MK4 (with reference to Fig. 3) by being measured to Barebone ALGB, and correct single by each scanning First U1~U6 and the description position of the pattern described tilt (pettiness rotation), description multiplying power etc., thereby can realize and be supported on rotation The deforming of the substrate P of rotating cylinder DRB itself is stretched or the two dimension deformation (deformation) of exposure area W in substrate P is corresponding high-precision The patterning (overlapping exposure etc.) of degree.
Exposure portion EXc3 identically as Fig. 4, has：Driving mechanism (not shown), make the cylinder shade M2 of reflection-type around Central shaft AX1 rotations；Rotating cylinder (supporting member for substrate) DRC can pass through conveyance by peripheral surface (bearing surface) bearing on one side Roller R15, the R16 in portion and from the substrate P that exposure portion EXc2 conveying comes, rotated on one side around central shaft AXc；Driving machine (not shown) Structure makes rotating cylinder DRC rotate and substrate P is made to be moved in long dimension direction；The scale disk SD of encoder system, measurement rotation The rotary angle position (amount of movement of substrate P) of rotating cylinder DRC；It is micro- by Fig. 1 and alignment shown in Fig. 3 to Barebone ALGC Mirror ALG1~ALG4 is constituted；And multiple projection module (optical projection system) PL1~PL6, etc. will be in being formed in cylinder shade M2 Pattern reflection imaging (exposure light) projection exposure in substrate P.The exposure portion of poly-lens projection pattern so EXc3 also has disclosed, therefore detailed description will be omitted in such as No. 2014/073535 pamphlet of International Publication No., according to passing through The ordered state for multiple label MK1~MK4 in substrate P that Barebone ALGC is measured, presumption substrate P (or exposure area W two dimension deformation), in a manner of compareing the deformation, adjustment is set to the inclined of the projection image of each of projection module PL1~PL6 Move update the system, the pettiness of projection image rotates update the system, the multiplying power update the system of projection image.Also about update the system so Have in No. 2014/073535 pamphlet of International Publication No. disclosed.
In above composition, rotating cylinder DRA, DRB, the DRC for being set to each of exposure portion EXc1, EXc2, EXc3 are each It is made from identical size, in addition, optical reflective characteristics of the peripheral surface as surface characteristic and with the frictional behavior of substrate P etc. Unanimously.As long as consistent as any one of the style characteristic of such surface characteristic, optical characteristics, frictional behavior.This Place, so-called style characteristic include curvature (diameter), roughness, hardness, the material of peripheral surface, and so-called frictional behavior includes peripheral surface Friction coefficient.Optical characteristics includes the reflectivity to exposure light (beam, illuminating bundle, imaging beam etc.).Also, substrate P Start to be supported on the position (contact start position) of each rotating cylinder DRA, DRB, DRC to each couple of Barebone ALGA, ALGB, ALGC The distance of the substrate P of detection zone (Vw1~Vw4 in Fig. 3) is set at essentially identical.In turn, measure each rotating cylinder DRA, The encoder system (scale disk SD) of the rotation angle of DRB, DRC also uses identical person.Also, the conducts such as roller R12, R14, R16 Be set at essentially identical jockey pulley will assign to the tension of the substrate P of the upstream side of each rotating cylinder DRA, DRB, DRC and It constitutes.But for the exposure portion without the exposure-processed of substrate P in exposure portion EXc1, EXc2, EXc3, can not will also assign Tension to substrate P is set as identical as the tension in other exposure portions.
The exposure device EXC of this implementation form is to utilize the conveyance state of substrate P, substrate P or be set in substrate P The deformation state of the exposure area W of electronic component pattern or productivity etc. take into account and the optimum exposure mode that selects The mode for carrying out good pattern exposure, using different multiple (being herein 3) the exposure portion EXc1, EXc2 of Exposure mode, At least one of EXc3 executes the exposure-processed of substrate P.For example, having copper in the substrate P vapor deposition come from processing unit PR1 conveyings The PET film of foil or aluminium foil and when not forming the situation of substrate of the 1st layer of any pattern exposure (instantaneous exposure), substrate P base This considers productivity without deformation, and uses in the exposure portion EXc1 of the proximity mode and exposure portion EXc3 of projection pattern Any one.In turn, in having been formed with base pattern layer in the exposure area W in the substrate P come from processing unit PR1 conveying When situation, become coincidence exposure (re-expose), therefore to keep registration accuracy good, select the exposure portion EXc2 without shade mode Or the exposure portion EXc3 of projection pattern.But when instantaneous exposure or when re-expose, can and with exposure portion EXc1, EXc2, EXc3 In the two and processing is exposed to substrate P.
It is had the following advantages that by the exposure-processed for the proximity mode that exposure portion EXc1 is implemented using cylinder shade M1：It answers The minimum dimension (minimum feature) of the pattern of exposure is relatively large, is tens of μm or more, in the feelings without higher registration accuracy When shape, higher productivity (production away from) can get.On the other hand, pass through the exposure of poly-lens projection pattern using cylinder shade M2 Portion EXc3 and the exposure-processed implemented have the following advantages that：The minimum dimension (minimum feature) that can get the pattern that should be exposed is number μm or so higher solution picture, and can get by the amendment of the projection image of each poly-lens (projection module PL) higher heavy Precision is closed, and can get relatively high productivity (production away from).On the other hand, by the exposure portion EXc2 of no shade mode The exposure-processed of implementation has following tendency：The higher solution picture that minimum dimension (minimum feature) is several μm or so is can get, and And the exposure portion EXc3 high for the capability for correcting of substrate P (or exposure area W) substantially deformed compared with projection pattern, it is available compared with High registration accuracy, but another side is then, productivity (production away from) are lower compared with exposure portion EXc1 and exposure portion EXc3.
In this implementation form, it is contemplated that the speciality of each exposure portion EXc1, EXc2, EXc3 as described above, shown in Figure 13 The exposure control unit ECT selection exposure mode of substrate P that is suitable for coming from processing unit PR1 conveyings and implement to expose.1st exposure Pattern merely one of using 3 exposure portions EXc1, EXc2, EXc3, the 2nd exposure mode and with 2 exposure portion EXc1 and EXc2, the 3rd exposure mode and with 2 exposure portions EXc2 and EXc3.In the 1st exposure mode, in the feelings that substrate P is instantaneous exposure When shape, when the fine degree for the pattern that should be exposed with instantaneous exposure higher (minimum dimension is smaller), using exposure portion EXc2 with Any one of exposure portion EXc3.When the fine degree for the pattern that should be exposed with instantaneous exposure relatively low (minimum dimension is larger), Use any one of exposure portion EXc1 and exposure portion EXc3.But when using the situation of exposure portion EXc1 or exposure portion EXc3, Prepare the cylinder shade M1 or M2 that are formed with instantaneous exposure pattern.Also, in the 1st exposure mode, in substrate P be re-expose Situation when, when registration accuracy is preferential, use any one of exposure portion EXc2 and exposure portion EXc3.When for registration accuracy Requirement it is not stringent when, when the situation of re-expose also use any one of exposure portion EXc1 or exposure portion EXc3.But In using exposure portion EXc1 or exposure portion EXc3 situation when, prepare be formed with re-expose pattern cylinder shade M1 or M2.The re-expose can be made of cylinder shade M1 or M2 in the way of the 1st implementation form (Fig. 7) above.
In the 2nd exposure mode, the exposure area that should be transferred in substrate P is exposed in a manner of proximity by exposure portion EXc1 After a part for the pattern of W, the another of the pattern that should be transferred to exposure area W is exposed in a manner of no shade by exposure portion EXc2 A part.2nd exposure mode both can be applied to instantaneous exposure, be equally applicable for re-expose, be exposed by exposure portion EXc1 A part of pattern be set as it is fine spend relatively low (minimum dimension is larger) part, pass through another portion that exposure portion EXc2 exposes Sub-pattern is set as the fine part for spending higher (minimum dimension is smaller) or needs the part of higher registration accuracy.That is, by quick Exposure is used or the pattern of re-expose is decomposed into fine degree (or registration accuracy) lower part and higher part, preparation shape At have it is fine degree (or registration accuracy) lower part pattern cylinder shade M1, and prepare fine degree (or registration accuracy) compared with The pattern of high part is described the data as exposure portion EXc2's.To in the 2nd exposure mode, to the exposure area of substrate P W certain interval of time carries out 2 exposures, and the pattern exposed for the first time by exposure portion EXc1 is exposed with the 2nd time by exposure portion EXc2 The pattern of light is believed according to the position of label MK1~MK4 in the substrate P detected by each to Barebone ALGA, ALGB Breath, is aligned with the required accuracy.Furthermore when carrying out the situation of re-expose with the 2nd exposure mode, it is being installed on exposure portion EXc1 Cylinder shade M1 form re-expose pattern, cylinder shade M1 can pass through the 1st implementation form (Fig. 7) by system above Make.
In the 3rd exposure mode, the exposure area that should be transferred to substrate P is exposed in a manner of no shade by exposure portion EXc2 After a part for the pattern of W, the another of the pattern of exposure area W should be transferred to projection pattern exposure by exposure portion EXc3 Part.3rd exposure mode also both can be applied to instantaneous exposure, be equally applicable for re-expose, but be particularly suited for re-expose.And And be set as deforming larger part by a part of the exposure portion EXc2 exposure area W exposed, pass through exposure portion EXc3 And another part of the exposure area W exposed is set as deforming smaller part.That is, the exposure in presumption in advance or measurement substrate P The tendency of the deformation of light region W, pattern corresponding with more part (region) of deformation are exposed in a manner of no shade, with The corresponding pattern in part (region) that the degree of deformation is smaller is formed in cylinder shade M2 and is exposed with projection pattern.Furthermore in In 3rd exposure mode, the pattern of re-expose (or instantaneous exposure) can be also decomposed into the lower part of fine degree with it is higher Part, the pattern of the lower part of fine degree is formed in cylinder shade M2, and the pattern of the fine higher part of degree is as exposure Portion EXc2's describes the data and prepares.The cylinder shade M2 that exposure portion EXc3 is installed in 3rd exposure mode can be by above 1st implementation form (Fig. 7) and make.
More than, it, can be according to when being transferred to the strip substrate P (exposure area W) continuously transported according to this implementation form Fine degree, productivity or the registration accuracy of pattern, multiple exposure portion EXc1, EXc2, the EXc3 for selecting exposure form different are continuous It is exposed processing, therefore both can ensure that the quality for being manufactured in the electronic component in substrate P, also can ensure that productivity.Particularly, When the situation of exposure portion EXc2 of no shade mode such as the 2nd exposure mode or the 3rd exposure mode, is used in combination, it is formed in cylinder A part for pattern in the exposure area W of shade M1, M2 is with the part that is exposed by exposure portion EXc2 in not exposed in substrate P The mode of light is set.To be defined in the W of exposure area in the part in the substrate P exposed by exposure portion EXc2 It, can be only in exposing the fore-end or terminal by exposure portion EXc2 when the situation of the fore-end of conveyance direction or terminal part During part, the conveyance speed of substrate P is made to be reduced to the speed suitable for exposure portion EXc2.That is, substrate P can be made in exposure portion Conveyance speed in EXc2 is between the speed suitable for the speed of exposure portion EXc2 and suitable for other exposure portions EXc1 (or EXc3) Intermittently switch.In this way, when the intermittently situation of conveyance speed of the change substrate P in exposure portion EXc2, in Figure 14 Shown between roller R13 and roller R14 or between roller R15 and roller R16, can be arranged accumulate the slow of substrate P with capable of bridgeing across specific length Punch mechanism (accumulator).If it does, being then convenient for and when with the situation of the exposure portion EXc2 of no shade mode, and make substrate P The same lower speed that conveyance speed is suitable for exposure portion EXc2 is compared when fixing and being exposed the situation of processing, can also be carried High productivity.
In turn, in this implementation form, substrate P is supported on exposure position and transport rotating cylinder DRA, DRB, The respective compositions of DRC or surface characteristic, the conveyance condition of substrate P (tension etc. of substrate P) are identical, therefore exposure portion EXc1, The each of EXc2, EXc3 can be exposed it processing in the state of with same state supporting substrates P.Therefore, can make in base A little situation one deformed or deviate that plate P (or exposure area W) may will produce when being supported on each rotating cylinder DRA, DRB, DRC It causes, to can inhibit the quality discrepancy for the electronic component for being formed in exposure area W.
[variation]
Above-mentioned 3rd implementation form can also deform as follows.
(variation 1) in above-mentioned implementation form, for example, when the exposure-processed of exposure portion EXc2 (EXc3), according only to Deformation information by the substrate P (or exposure area W) measured to Barebone ALGB (ALGC) is implemented the 2nd (the 3rd) Amendment when exposure portion EXc2 (EXc3) is to substrate P exposing patterns.However, in the composition of Figure 14, such as also can will be according to logical Acquired by the ordered state for crossing the label MK1~MK4 for the substrate P of the 1st exposure portion EXc1 detected to Barebone ALGA The deformation information of substrate P (exposure area W) be added to according to detecting to Barebone ALGB by the 2nd exposure portion EXc2 The deformation information of substrate P (exposure area W) acquired by the ordered state of label MK1~MK4 of the substrate P gone out, in the 2nd exposure When light portion EXc2 is to substrate P depicting pattern, the relative position relation of scan-off beam (exposure light) and substrate P is corrected.Thereby, 2 exposure portion EXc2 can be before it will expose by grasping substrate P (exposure area W) before being measured to Barebone ALGB Deformation condition, it can be ensured that the temporal ampleness that correction amount and fine adjustment when precision setting is described describe the data etc., it can be into And reduce coincidence error.
Also, the label that also can basis be passed through the substrate P of the 2nd exposure portion EXc2 detected to Barebone ALGB The deformation information of substrate P (exposure area W) acquired by the position relationship of MK1~MK4 is added to according to by the 3rd exposure portion Substrate P (exposure region acquired by the position relationship of the label MK1~MK4 for the substrate P of EXc3 detected to Barebone ALGC Domain W) deformation information, when by the 3rd exposure portion EXc3 to substrate P projection pattern, correct projection image (exposure light) with The relative position relation of substrate P.When the situation, the 3rd exposure portion EXc3 also can be before it will expose by Barebone ALGC measured before grasp substrate P (exposure area W) deformation condition, it can be ensured that precision setting projection image correction amount when Between on ampleness, coincidence error can be reduced in turn.The management of deformation information as described above and Correction and Control are as shown in Figure 13 Exposure control unit ECT instructions.
(variation 2) is in Figure 14 along the transport path of substrate P according to proximity mode, without shade mode, projection pattern It is arranged in order and constitutes exposure portion EXc1, EXc2, EXc3 of exposure device EXC, but this sequentially can be arbitrary.Also, being installed on proximity Cylinder the shade M1 or M2 of the exposure portion EXc1 of the mode or exposure portion EXc3 of projection pattern also can be by the 1st implementation form above The mode of (Fig. 7) makes.In turn, in the same manner as the 1st implementation form above, also exposure can only be configured along the conveyance direction of substrate P 2 different exposure portion EXc1 of light mode and exposure portion EXc2, or only 2 different exposure portion EXc2 of configuration Exposure mode and exposure Light portion EXc3.In turn, in by production line as shown in fig. 13 that (manufacturing method), plate shape substrates P is formed in a manner of roll-to-roll Electronic component pattern quality (registration accuracy and the reproducibility etc. of pattern dimension) stablize situation when, can also be used in combination The 4th exposure mode of the exposure portion EXc1 of proximity mode and the exposure portion EXc3 of projection pattern.At this point, also can be in mounted on proximity The cylinder shade M1 of the exposure portion EXc1 of mode forms the fine lower pattern part of degree, in the exposure portion mounted on projection pattern The cylinder shade M2 of EXc3 forms the fine higher pattern part of degree, and the two is made to overlap and be exposed in exposure area W.Also, The exposure portion EXc2 of no shade mode also can be using the design information (CAD data etc.) according to pattern and to the more of two-dimensional arrangements The digital micromirror elements (DMD) that the respective posture of a micro mirror and position are controlled, after generating according to pattern modulation intensity distribution Exposure light, then by the exposure light in such a way that optical projection system is projected to substrate P, i.e., so-called DMD without shade Mode.
(variation 3) in a manner of roll-to-roll in plate shape substrates P exposing patterns the step of (instantaneous exposure or re-expose) In, except in surface be formed with coating as photosensitive material solution (photoetching jelly liquid, ultraviolet hardening resin liquid, photonasty plate Cover reducing solution, photonasty silane coupling solution etc.) and the substrate P of photosensitive layer made of being allowed to dry other than, sometimes using allowing shape Being transferred in surface by superposing machine (make-up machine) etc. with substrate P at the laminar film for having dry film layer of photoresist has dry film photoetching The substrate P of glue agent layer.Because of dry film layer of photoresist (hereinafter, also known as DFR layers) if with illuminated 400nm~300nm or so Ultraviolet wavelengths exposure light then transparency reduce and change colour characteristic, even if therefore without development treatment, also may be used Barebone ALGB, ALGC are detected the pattern exposed or alignment mark as latent image shown in Figure 14.In Figure 14 Composition situation when, for example, being exposed to substrate by the exposure portion EXc1 of the upstream side of conveyance direction by being set to substrate P A part for the pattern of the DRF layers of P or to mutatis mutandis label can by the exposure portion EXc2 in downstream side to Barebone ALGB or EXc3's detects Barebone ALGC.Thus by Barebone ALGB (or ALGC), to passing through, exposure portion EXc1 is practical to expose Light is detected in the position of the picture (or picture of label) of a part for the pattern in the exposure area W in substrate P, can thereby be made By exposure portion EXc1 be exposed to substrate P the lower pattern part of fine degree, with then by exposure portion EXc2 (or EXc3 (connecting) is critically combined in the higher pattern part of fine degree for) being exposed to substrate P.
To exposure portion EXc1~EXc3 each illustrated in the 3rd implementation form of above Figure 14 and each variation The light supply apparatus 20,22,24 of setting may be either that laser light source, mercury discharge lamp, high-brightness LED of gas or solid etc. be not of the same race Class person also can be the light source of identical type.When the situation of light supply apparatus of the same race or identical light supply apparatus can be used, Adjustment operation, maintenance operation or replacement (replace) operation of light supply apparatus are common, therefore can inhibit operating cost. In turn, exposure portion EXc1 shown in Figure 14 to Barebone ALGA, exposure portion EXc2 to Barebone ALGB, exposure portion EXc3 It is multiple by being configured with specific interval in the short dimensional directions (Y-direction) of substrate P as shown in Figure 3 to Barebone ALGC each Aligming microscope ALG1~ALG4 is constituted.When the situation, each viewing area (detection zone of aligming microscope ALG1~ALG4 Domain) configuration relation of Y-direction of Vw1~Vw4 is set as in identical between Barebone ALGA, ALGB, ALGC, but can also set For different configuration relations.Also, the configuration quantity of the Y-direction of aligming microscope ALG is not limited at as shown in Figure 34, also can be In different configuration quantity between Barebone ALGA, ALGB, ALGC (more than at least 2).
The one of which of (variation 4) as the electronic component suitable for being manufactured in a manner of roll-to-roll, has strip to scratch Property thin slice sensor.Figure 15 be shown in X-direction be long size plate shape substrates P (PET or PEN) in X-direction bridge across several m~ The length of tens of m or more and the configuration example for being formed as 4 band-like thin slice sensors RSS1, RSS2, RSS3, RSS4.4 thin slices If sensor RSS1~RSS4 each is in forming a plurality of power cord Vdd, Vss (GND), signal wire CBL in substrate P, and in dotted line Shown in the FPA of fine pattern region, form various sensors, microcomputer chip, TFT (thin film transistor (TFT)), capacitor, resistance Equal elements then by being referred to as the cutter device of cutting machine, and are cut off along Y-direction (width direction of substrate P).Thin slice sensor RSS1~RSS4 each is identical composition, therefore is described in detail thin slice sensor RSS1 as representative.
Thin slice sensor RSS1 is for example embedded in the soil (farm) for cultivating crops, every between fixation in soil Every Lsp, amount of moisture, ph values, temperature, amount of nutrients (nitrogen component, phosphorus composition etc.) etc. are measured by various sensors, passed through The measured value is converted into numerical data by the electronic component (microcomputer chip etc.) for being formed in fine pattern region FPA, is then led to Cross information collection apparatus (the data repeater that its tandem is communicated to the end for being installed on thin slice sensor RSS1 by signal wire CBL Device).If thin slice sensor RSS1~RSS4 changes the type or micro computer for being formed in the sensor in the FPA of fine pattern region The measurement algorithm (measurement software) of chip in the soil that just cannot be only used for crops, can also be used as supporting in fishery Grow the sensor that the interval Lsp in the seawater of field every depth direction measures flow velocity, the seawater component etc. of temperature, seawater And it uses.
The copper foil layer for being several μm~tens of μm to thickness in band-like thin slice sensor RSS1 as shown in figure 15 carries out Power cord Vss (GND), the signal wire CBL of etching and the positive power cord Vdd or cathode (ground connection) of formation, but be connected to sometimes The distance of information collection apparatus to another end of an end of thin slice sensor RSS1 is up to tens of m or more, to mitigate voltage Decline (loss of signal), power cord Vdd, Vss, each lines of signal wire CBL width can be made to as possible it is relatively thick.On the other hand, shape At the thickness of the Wiring pattern in the electronic circuit in the FPA of fine pattern region according to the shape of the electronic component installed and Density etc. and it is different, but minimum tens of μm~hundreds of μm or so.In turn, in need to directly be formed in the FPA of fine pattern region When the situation of multiple TFT, the grid line of TFT, the line width of source/drain lines be tens of μm hereinafter, preferably 20 μm hereinafter, and Also the patterning (re-expose) overlapped is needed.
Therefore, it in this variation, is formed in substrate P when by thin slice sensor RSS1~RSS4 as shown in figure 15 When, it is shared for example, proceeding as follows：Being configured with interval Lsp by exposure portion EXc2 (or EXc3) exposures in Figure 14, The length of X-direction is the fine pattern in the fine pattern region FPA of Lfa (Lfa ＜ Lsp), passes through the exposure portion in Figure 14 EXc1 exposes the thicker patterns (coarse patterns) such as signal wire CBL and power cord Vdd, Vss between fine pattern region FPA.In When the situation, buffer gear (accumulator) is set between the roller R13 in Figure 14 and roller R14.Moreover, being exposed in by exposure portion EXc1 The conveyance speed of substrate P when light coarse patterns is set as V1, by exposure portion EXc2 when the FPA exposing patterns of fine pattern region It, also can be in the figure of EXc2 couples of 1 fine pattern region FPA of exposure portion when the conveyance speed of substrate P is set as V2 (setting V2 ＜ V1) After the completion of case exposure, the rotary speed of the rotating cylinder DRB of exposure portion EXc2 is improved, to be faster than the speed V3 conveyings of conveyance speed V1 Substrate P makes it be reduced to former conveyance speed V2 then before the pattern exposure to next fine pattern region FPA starts.Pass through So the conveyance speed (rotary speed of rotating cylinder DRB) of substrate P is made to change, the accumulation accumulated in the substrate P of buffer gear is grown The case where degree passs and is continuously increased (or reduction) at any time is inhibited.Furthermore in substrate P, interval Lsp is 1m~number The length Lfa of m or so, fine pattern region FPA are that number cm~ten counts cm or so.
Even if also, being that the thin slice sensor RSS1~RSS4 formed in substrate P has 2 layers or more of multilayer wiring structure Make, and by as be necessary in interlayer the part of high registration accuracy and registration accuracy it is relatively low also can part mix as pattern exposure When, it at least two in 3 exposure portion EXc1~EXc3 shown in Figure 14 can be used (exposure portion EXc1 and exposure portion EXc2, to expose Light portion EXc2 and exposure portion EXc3, exposure portion EXc1 and exposure portion EXc3) continuous exposure-processed is carried out, it can carry out efficient Production.By in 3 exposure portion EXc1~EXc3 shown in Figure 14 exposure portion EXc1 and production arranged side by side exposure portion EXc3 In line, due to that must prepare cylinder shade M1, M2 respectively, the expense for making shade increases, therefore makes fortune sometimes This (original cost in production) is changed into increase.However, due to the use of cylinder shade M1, M2, therefore the conveyance speed of substrate P can be improved Degree, and due to can by fine pattern part and the coarse pattern part of line width, or require high registration accuracy pattern part and Registration accuracy it is relatively low also can pattern part in the primary conveyance of substrate P in sequentially being exposed in the W of exposure area, therefore can improve Productivity (production away from), can inhibit total producing cost.

Claims (24)

1. a kind of exposure device, which is characterized in that it transports flexible strip sheet substrate along long side direction, and in Electronic component pattern is exposed in the sheet substrate；And have：
Test section, detection is marked to be formed in the marker location information of multiple labels in the sheet substrate；
1st pattern exposure portion, in the element-forming region exposure in the sheet substrate that should form the electronic component The pattern, and energy-ray corresponding with the design information of the pattern is subjected to position tune according to the marker location information It is projected after whole；And
Output section, to make mask pattern corresponding with the pattern that should be exposed in the element-forming region, and it is defeated The position of the energy-ray for going out and being projected to the element-forming region adjusts relevant adjustment information and the mark Remember at least one of location information.
2. exposure device as described in claim 1, which is characterized in that it has the 2nd pattern exposure portion,
2nd pattern exposure portion uses in the adjustment information and the marker location information exported according to the output section At least one and the mask pattern produced, projected to the element-forming region corresponding to the picture of the mask pattern Energy-ray.
3. exposure device as claimed in claim 2, which is characterized in that
The 2nd pattern exposure portion makes the distortion of image of the mask pattern to be projected according to the marker location information.
4. exposure device as claimed in claim 2 or claim 3, which is characterized in that
The 2nd pattern exposure portion is begun through and the screening when the shade for being formed with the mask pattern is when completing Cover pattern is exposed as corresponding energy-ray；And
The 1st pattern exposure portion in begin through the 2nd pattern exposure portion carry out the mask pattern picture exposure it Before, suspend the exposure carried out by corresponding with the design information of pattern energy-ray.
5. exposure device as claimed in claim 4, which is characterized in that
The tendency of the marker location information of the 1st pattern exposure portion detected by the label test section, which exceeds, allows Range and when the situation changed, start again at and be exposed by energy-ray corresponding with the design information of the pattern； And
The 2nd pattern exposure portion is before starting again at and carrying out the exposure of the pattern by the 1st pattern exposure portion, temporarily Stop by with the mask pattern as the exposure that carries out by corresponding energy-ray.
6. the exposure device as described in any claim in claim 2 to 5, which is characterized in that it has rotating cylinder,
The rotating cylinder have the central shaft extended along the width direction orthogonal with the long side direction of the sheet substrate and with For the central shaft at a distance of the cylindric peripheral surface of radii fixus, following the peripheral surface on one side makes one of the sheet substrate Divide and be bent in the long side direction and it is supported, is rotated centered on the central shaft on one side and transport the thin slice base Plate thereby transports the sheet substrate；And
The 1st pattern exposure portion and the 2nd pattern exposure portion are to being supported on described in the peripheral surface of the rotating cylinder The energy-ray is projected in sheet substrate.
7. the exposure device as described in any claim in claim 2 to 5, which is characterized in that it has：
1st rotating cylinder, the central shaft for the width direction extension for having edge orthogonal with the long side direction of the sheet substrate, And with the central shaft at a distance of the cylindric peripheral surface of radii fixus, following the peripheral surface on one side makes the sheet substrate A part is bent in the long side direction and is supported to it, is rotated and is transported described thin centered on the central shaft on one side Plate base thereby transports the sheet substrate；And
2nd rotating cylinder is set to the downstream side or upstream side of the 1st rotating cylinder, has identical with the 1st rotating cylinder It constitutes；And
One of the 1st pattern exposure portion and the 2nd pattern exposure portion are to being supported on the described outer of the 1st rotating cylinder Project the energy-ray in the sheet substrate of circumferential surface, another one is to the peripheral surface for being supported on the 2nd rotating cylinder The sheet substrate on project the energy-ray.
8. a kind of exposure system, which is characterized in that it transports flexible strip sheet substrate along long side direction, and in Electronic component pattern is exposed in the sheet substrate；And have：
Exposure device as described in any claim in claim 1 to 7；
Actual pattern information generating part, the adjustment information and the marker location information exported according to the output section At least one of correct the design information, it is corresponding with the pattern that should be exposed in the element-forming region to make Mask pattern and generate actual pattern information；And
Shade producing device makes the shade using the 3rd pattern exposure portion for projecting energy-ray according to design information Pattern；
The shade producing device keeps the shade substrate for forming the mask pattern, using the actual pattern information as The design information and be provided to the 3rd pattern exposure portion, on the shade substrate projection with the actual pattern believe Corresponding energy-ray is ceased, the mask pattern corresponding with the actual pattern information is thereby formed in the shade base On plate.
9. exposure system as claimed in claim 8, which is characterized in that
The tendency of the marker location information of the actual pattern information generating part detected by the label test section is super Go out permissible range and change situation when, generate the actual pattern information again；And
The mask pattern is formed in another by the shade producing device according to the actual pattern information generated again On shade substrate.
10. a kind of substrate processing method using same, which is characterized in that it removes flexible strip sheet substrate along long side direction It send, and in being exposed processing with pattern to electronic component in the sheet substrate；And include：
Detecting step, detection are formed in the marker location information of multiple labels in the sheet substrate；
1st step of exposure, by projecting the 1st pattern exposure portion of corresponding with design information energy-ray, in institute should be formed The element-forming region in the sheet substrate of electronic component is stated, by energy-ray corresponding with the design information of the pattern It is projected after carrying out position adjustment according to the marker location information；And
Step is generated, according to related to the adjustment of the position for the energy-ray that be projected to the element-forming region Adjustment information and at least one of the marker location information and the design information, and generate for institute should to be exposed to State the actual pattern information of the making of the mask pattern in element-forming region.
11. substrate processing method using same as claimed in claim 10, which is characterized in that it includes shade making step,
In the shade making step, by being held on the shade substrate in the 2nd pattern exposure portion projection and the reality The corresponding energy-ray of pattern-information, and the mask pattern corresponding with the actual pattern information is formed in the shade With on substrate.
12. substrate processing method using same as claimed in claim 11, which is characterized in that it includes the 2nd step of exposure,
In the 2nd step of exposure, the 2nd pattern exposure portion uses the shade substrate for being formed with the mask pattern, to The element-forming region projects the energy-ray corresponding with the mask pattern.
13. substrate processing method using same as claimed in claim 12, which is characterized in that
2nd step of exposure has the shade of the mask pattern to be installed on the 2nd pattern exposure with substrate in making Start behind portion；And
Before the exposure of the mask pattern of 1st step of exposure in the 2nd step of exposure starts, described in pause utilization The exposure for the pattern that 1st pattern exposure portion carries out.
14. substrate processing method using same as claimed in claim 13, which is characterized in that
In the situation that the tendency of the marker location information detected in the detecting step changes beyond permissible range When, start again at the 1st step of exposure；And
Before starting again at the exposure of the pattern of the 1st step of exposure, suspend the 2nd step of exposure.
15. substrate processing method using same as claimed in claim 14, which is characterized in that
The step that generates exceeds permissible range in the tendency of the marker location information detected in the detecting step And when the situation of variation, the actual pattern information is generated again；And
The shade making step makes in another shade of on substrate according to the actual pattern information generated again The mask pattern corresponding with the actual pattern information.
16. the substrate processing method using same as described in any claim in claim 11 to 15, which is characterized in that
The shade substrate with the planar plane shade for holding the mask pattern or with cylindrical shape by holding the screening The morphosis of at least one of the cylinder shade of cover pattern.
17. a kind of element fabricating device, which is characterized in that it is removed flexible strip substrate along long dimension direction using one side It send, exposure light corresponding with the pattern of electronic component is exposed to multiple exposure portions of the sheet substrate on one side, in described Substrate forms the electronic component；And
The multiple exposure portion is configured along the conveyance direction of the substrate,
The each of the multiple exposure portion has the supporting member for substrate with bearing surface, which makes the illuminated and electricity The substrate of the corresponding exposure light of pattern of subcomponent is bent in the conveyance direction and is supported to it；
The multiple exposure portion is configured to the pattern exposure with mutually different Exposure mode in the substrate.
18. element fabricating device as claimed in claim 17, which is characterized in that
The surface characteristic of the bearing surface of the multiple respective supporting member for substrate of exposure portion is consistent.
19. element fabricating device as claimed in claim 18, which is characterized in that
The style characteristic of the bearing surface of the surface characteristic comprising the supporting member for substrate, optical characteristics, frictional behavior At least one of.
20. element fabricating device as claimed in claim 19, which is characterized in that
The style characteristic includes curvature, the roughness of the bearing surface, and the optical characteristics includes to the exposure light Reflectivity, the frictional behavior include the friction coefficient of the bearing surface.
21. the element fabricating device as described in any claim in claim 17 to 20, which is characterized in that
The multiple exposure portion of different Exposure modes is at least the two in following exposure portion or more：It will be formed in a manner of proximity In shade pattern exposure in the exposure portion of the substrate, will be formed in by projection optical system the figure of shade with projection pattern Case is exposed to the exposure portion of the substrate and exposure light by the data according to pattern after modulation by pattern exposure in institute State the exposure portion without shade mode of substrate.
22. element fabricating device as claimed in claim 21, which is characterized in that
The each of the multiple exposure portion has the position for multiple labels that detection is formed in along long dimension direction on the substrate Information to Barebone, and
The 1st exposure portion in the multiple exposure portion positioned at the downstream side of the conveyance direction of the sheet substrate is according to by being located at The location information that Barebone is detected of 2nd exposure portion of upstream side and the institute by the 1st exposure portion State the location information detected to Barebone, correct the exposure light corresponding with the pattern of the electronic component and The relative position relation of the substrate.
23. element fabricating device as claimed in claim 22, which is characterized in that
A part for the pattern of the electronic component is exposed on the substrate by the 1st exposure portion, and the 2nd exposure portion will Another part of the pattern of the electronic component with by the 1st exposure portion be exposed to the pattern on the substrate contraposition and Exposure.
24. the element fabricating device as described in any claim in claim 21 to 23, which is characterized in that
The shade is hidden in what the mobile synchronous of long dimension direction rotated by the cylinder of type or reflection-type with the substrate Cover, and
The exposure portion of the no shade mode is by the exposure according to the data of the pattern by digital micromirror elements after modulation Use up the mode for being projected to the substrate and on one side by data of the rotating multisurface scarnning mirror according to the pattern after modulation Beam one side is projected to any one of the mode of the substrate.
CN201680065114.1A 2015-11-30 2016-11-30 Exposure device, exposure system, substrate processing method using same and element fabricating device Pending CN108604063A (en)

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WO2017094770A1 (en) 2017-06-08

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