CN108597705A - A kind of production method of Chip-R - Google Patents
A kind of production method of Chip-R Download PDFInfo
- Publication number
- CN108597705A CN108597705A CN201810351449.0A CN201810351449A CN108597705A CN 108597705 A CN108597705 A CN 108597705A CN 201810351449 A CN201810351449 A CN 201810351449A CN 108597705 A CN108597705 A CN 108597705A
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- CN
- China
- Prior art keywords
- layer
- chip
- completion
- printed
- production method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
Abstract
The invention discloses a kind of production methods of Chip-R, and the preparation method comprises the following steps：Step scribing:White substrate scribing is marked into breakaway line；Step C2：Conductor layer back up；Step OR：Printed conductor layer:By halftone conductor layer front is stamped by printing machine on semi-finished product after the completion of step C2, is then printed and be sintered, then stamp conductor layer reverse side；Step G1；Step G2；Step CR；Step PL：Step 6 face CCD；Step PK；Step is put in storage.The Chip-R of the present invention reaches the few resistance back face printing processing procedure of deceleration by merging to combine with production procedure in printing egative film design, has no effect on resistance and uses characteristic, but be the reduction of one of flow, improves production efficiency.
Description
Technical field
The present invention relates to production of electronic components fields, and in particular to a kind of production method of Chip-R.
Background technology
Surface mount elements are with small, light-weight, packing density is high, shock resistance is strong, strong antijamming capability, high frequency characteristics
The advantages that good, is widely used in computer, mobile phone, e-dictionary, medical electronics product, video camera, electronic electric meter and VCD
Machine etc..
The resistance value size of resistive element generally also has that cross-sectional area is related with temperature, material, length, gauge resistor by
The physical quantity that temperature influences size is temperature coefficient, is defined as resistance value changed percentage when temperature often increases 1 DEG C
Number.The main physical characteristics of resistance are to become electric energy as thermal energy, as soon as can also say it is a dissipative cell, electric current is generated by it
Interior energy.Resistance usually plays partial pressure, shunting in circuit.For signal, exchange can pass through electricity with direct current signal
Resistance.The method and step of production Chip-R is in the prior art：Scribing-C2-0R-G1-G2-the faces C3-CR-PL-six
CCD-PK-storages.The fabrication steps are complicated, thereby result in that production efficiency is low, and production cost is high.
Invention content
For deficiency in the prior art, the purpose of the present invention is to provide a kind of production methods of Chip-R, reduce
Processing procedure in production.
To achieve the above object, technical solution disclosed by the invention is as follows：A kind of production method of Chip-R, packet
Include following steps：
Step scribing:White substrate scribing is marked into breakaway line, facilitates stripping mechanism journey stripping item and folding grain；
Step C2：Conductor layer back up：Shape and the position of the conductor printed will be needed, by screen painting in substrate
Back side hole on, ink is sucked into hole inner wall using vacuum pump, and reaches certain depth；
Step OR：Printed conductor layer:Conductor layer is stamped on semi-finished product after the completion of step C2 by printing machine by halftone
Then front is printed and is sintered, conductor layer reverse side is then stamped；
Step G1：Print first resistor layer protective layer：By halftone by printing machine on semi-finished product after the completion of step R
Stamp resistive layer protective layer；The first resistor layer protective layer is covered on the resistive layer of step R；
Step G2：Print second resistance layer protective layer：By halftone by printing machine on semi-finished product after the completion of step LT
Stamp second resistance layer protective layer；The second resistance layer protective layer is covered on the first resistor layer protective layer of step G1；
Step CR：It is fitted into strips in jig by semi-finished product stripping of stripping machine after the completion of step G2 and carries out vacuum coating,
It is converted into again by folding grain machine strip-shaped product after vacuum coating granular；
Step PL：By electroplating machine, pelletized product is electroplated after the completion of step CR, first nickel coating tin coating again；
Step 6 face CCD：The test in six faces is carried out after the completion of step PL by six face CCD cameras；
Step PK：Table is tested by surveying chartered plane semi-finished product after the completion of the CCD of step 6 face by resistance value, carries out second test
Resistance value is packed after test passes, will package and enter to warehouse with product；
Step is put in storage：By being put into corresponding storage space after the completion of step PK.
Preferably, in step OR sintering the specific steps are：Required resistance is stamped in substrate front side by printing machine by halftone
Shape and position, and the conductor layer printed in resistive layer and step C1 overlaps, and then carries out conductor by 850 ° of stove
Sintering；
Preferably, in the conductor layer printed in the step C1 made of ink material, the viscosity of ink material is
400-500Pa.s。
Preferably, in the step R resistive layer made of ink material.
Preferably, the printed steel plate thickness used in the step G1 is 10 μ, and the mesh number of printed steel plate is 400H.
Preferably, the printed steel plate thickness used in the step G2 is 15 μ, and the mesh number of printed steel plate is 400H.
Preferably, during the PL, the thickness of the nickel coating of each wafer resistor is 3.5-5.5 μm.
Preferably, during the PL, the thickness of the tin coating of each wafer resistor is 5.5-7.5 μm.
The beneficial effects of the invention are as follows：The Chip-R of the present invention passes through in printing egative film design merging and production procedure
In conjunction with few resistance back face printing processing procedure that slows down is reached, has no effect on resistance and uses characteristic, but be the reduction of one of flow,
Improve production efficiency.
Specific implementation mode
A kind of production method of Chip-R comprising following steps：
Step scribing:White substrate scribing is marked into breakaway line, facilitates stripping mechanism journey stripping item and folding grain；
Step C2：Conductor layer back up：Shape and the position of the conductor printed will be needed, by screen painting in substrate
Back side hole on, ink is sucked into hole inner wall using vacuum pump, and reaches certain depth；
Step OR：Printed conductor layer:Conductor layer is stamped on semi-finished product after the completion of step C2 by printing machine by halftone
Then front is printed and is sintered, conductor layer reverse side is then stamped；
Step G1：Print first resistor layer protective layer：By halftone by printing machine on semi-finished product after the completion of step R
Stamp resistive layer protective layer；The first resistor layer protective layer is covered on the resistive layer of step R；
Step G2：Print second resistance layer protective layer：By halftone by printing machine on semi-finished product after the completion of step LT
Stamp second resistance layer protective layer；The second resistance layer protective layer is covered on the first resistor layer protective layer of step G1；
Step CR：It is fitted into strips in jig by semi-finished product stripping of stripping machine after the completion of step G2 and carries out vacuum coating,
It is converted into again by folding grain machine strip-shaped product after vacuum coating granular；
Step PL：By electroplating machine, pelletized product is electroplated after the completion of step CR, first nickel coating tin coating again；
Step 6 face CCD：The test in six faces is carried out after the completion of step PL by six face CCD cameras；
Step PK：Table is tested by surveying chartered plane semi-finished product after the completion of the CCD of step 6 face by resistance value, carries out second test
Resistance value is packed after test passes, will package and enter to warehouse with product；
Step is put in storage：By being put into corresponding storage space after the completion of step PK.
In the present embodiment, in step OR sintering the specific steps are：Institute is stamped in substrate front side by printing machine by halftone
Resistance shape and position are needed, and the conductor layer printed in resistive layer and step C1 overlaps, then conductor is passed through to 850 ° of stove
Son is sintered；
In the present embodiment, in the conductor layer printed in the step C1 made of ink material, ink material
Viscosity is 400-500Pa.s.
In the present embodiment, in the step R resistive layer made of ink material.
In the present embodiment, the printed steel plate thickness used in the step G1 is 10 μ, and the mesh number of printed steel plate is
400H。
In the present embodiment, the printed steel plate thickness used in the step G2 is 15 μ, and the mesh number of printed steel plate is
400H。
In the present embodiment, during the PL, the thickness of the nickel coating of each wafer resistor is 3.5-5.5 μm.
In the present embodiment, during the PL, the thickness of the tin coating of each wafer resistor is 5.5-7.5 μm.
In conclusion the present invention provides a kind of production method of Chip-R, Chip-R of the invention is by printing
Egative film design, which merges to combine with production procedure, reaches the few resistance back face printing processing procedure of deceleration, has no effect on resistance and uses spy
Property, but it is the reduction of one of flow, improve production efficiency.So the present invention effectively overcome it is in the prior art it is various lack
It puts and has high industrial utilization.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology can all carry out modifications and changes to above-described embodiment without violating the spirit and scope of the present invention.Cause
This, those of ordinary skill in the art institute without departing from the spirit and technical ideas disclosed in the present invention such as
All equivalent modifications completed or change should be covered by the claim of the present invention.
Claims (8)
1. a kind of production method of Chip-R, which is characterized in that it includes the following steps：
Step scribing:White substrate scribing is marked into breakaway line, facilitates stripping mechanism journey stripping item and folding grain；
Step C2：Conductor layer back up：Shape and the position of the conductor printed will be needed, by screen painting at the back side of substrate
On hole, ink is sucked into hole inner wall using vacuum pump, and reach certain depth；
Step OR：Printed conductor layer:By halftone conductor layer front is stamped by printing machine on semi-finished product after the completion of step C2,
Then it is printed and is sintered, then stamp conductor layer reverse side；
Step G1：Print first resistor layer protective layer：Electricity is stamped on semi-finished product after the completion of step R by printing machine by halftone
Resistance layer protective layer；The first resistor layer protective layer is covered on the resistive layer of step R；
Step G2：Print second resistance layer protective layer：It is stamped on semi-finished product after the completion of step LT by printing machine by halftone
Second resistance layer protective layer；The second resistance layer protective layer is covered on the first resistor layer protective layer of step G1；
Step CR：It is fitted into strips in jig by semi-finished product stripping of stripping machine after the completion of step G2 and carries out vacuum coating, then by
Folding grain machine strip-shaped product after vacuum coating is converted into granular；
Step PL：By electroplating machine, pelletized product is electroplated after the completion of step CR, first nickel coating tin coating again；
Step 6 face CCD：The test in six faces is carried out after the completion of step PL by six face CCD cameras；
Step PK：Table is tested by survey chartered plane semi-finished product after the completion of the CCD of step 6 face by resistance value, carries out second test resistance value,
It is packed after test passes, will package and enter to warehouse with product；
Step is put in storage：By being put into corresponding storage space after the completion of step PK.
2. a kind of production method of Chip-R according to claim 1, which is characterized in that be sintered specific step in step OR
Suddenly it is：Required resistance shape and position are stamped in substrate front side by printing machine by halftone, and resistive layer is printed with step C1
The conductor layer of brush overlaps, and is then sintered conductor by 850 ° of stove.
3. a kind of production method of Chip-R according to claim 1, which is characterized in that printed in the step C1
In conductor layer made of ink material, the viscosity of ink material is 400-500Pa.s.
4. a kind of production method of Chip-R according to claim 1, which is characterized in that resistive layer in the step R
Made of ink material.
5. a kind of production method of Chip-R according to claim 1, which is characterized in that used in the step G1
Printed steel plate thickness is 10 μ, and the mesh number of printed steel plate is 400H.
6. a kind of production method of Chip-R according to claim 1, which is characterized in that used in the step G2
Printed steel plate thickness is 15 μ, and the mesh number of printed steel plate is 400H.
7. a kind of production method of Chip-R according to claim 1, which is characterized in that during the PL, each
The thickness of the nickel coating of wafer resistor is 3.5-5.5 μm.
8. a kind of production method of Chip-R according to claim 1, which is characterized in that during the PL, each
The thickness of the tin coating of wafer resistor is 5.5-7.5 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810351449.0A CN108597705A (en) | 2018-04-19 | 2018-04-19 | A kind of production method of Chip-R |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810351449.0A CN108597705A (en) | 2018-04-19 | 2018-04-19 | A kind of production method of Chip-R |
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| Publication Number | Publication Date |
|---|---|
| CN108597705A true CN108597705A (en) | 2018-09-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810351449.0A Pending CN108597705A (en) | 2018-04-19 | 2018-04-19 | A kind of production method of Chip-R |
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| Country | Link |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1338890A (en) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | Electronic elements and manufacture thereof |
| CN101916635A (en) * | 2009-09-18 | 2010-12-15 | 昆山厚声电子工业有限公司 | Manufacturing method of patch concave electrode network resistor and product thereof |
| CN105551701A (en) * | 2015-12-31 | 2016-05-04 | 旺诠科技(昆山)有限公司 | Chip resistor production method capable of avoiding failure of resistance value |
| CN107195410A (en) * | 2017-06-14 | 2017-09-22 | 昆山厚声电子工业有限公司 | The manufacture method of flat electrodes arrayed chip resistor |
-
2018
- 2018-04-19 CN CN201810351449.0A patent/CN108597705A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1338890A (en) * | 2000-07-28 | 2002-03-06 | 松下电器产业株式会社 | Electronic elements and manufacture thereof |
| CN101916635A (en) * | 2009-09-18 | 2010-12-15 | 昆山厚声电子工业有限公司 | Manufacturing method of patch concave electrode network resistor and product thereof |
| CN105551701A (en) * | 2015-12-31 | 2016-05-04 | 旺诠科技(昆山)有限公司 | Chip resistor production method capable of avoiding failure of resistance value |
| CN107195410A (en) * | 2017-06-14 | 2017-09-22 | 昆山厚声电子工业有限公司 | The manufacture method of flat electrodes arrayed chip resistor |
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Application publication date: 20180928 |