CN101945539A - Integrated planar resistor PCB (Printed Circuit Board) and manufacturing method thereof - Google Patents
Integrated planar resistor PCB (Printed Circuit Board) and manufacturing method thereof Download PDFInfo
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- CN101945539A CN101945539A CN2009103127003A CN200910312700A CN101945539A CN 101945539 A CN101945539 A CN 101945539A CN 2009103127003 A CN2009103127003 A CN 2009103127003A CN 200910312700 A CN200910312700 A CN 200910312700A CN 101945539 A CN101945539 A CN 101945539A
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- pcb
- resistance
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- planar resistor
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Abstract
The invention discloses an integrated planar resistor PCB (Printed Circuit Board) comprising a PCB base layer, a circuit pattern and a planar resistor, wherein the planar resistor is provided with a soldering-resistant ink layer. The planar resistor of the integrated planar resistor PCB is damaged in a subsequent process course, and the integrated planar resistor PCB can also enable a film of the planar resistor to be isolated from the external world, thereby keeping the long-time stability of properties. Besides, the invention also discloses a manufacturing method of the integrated planar resistor PCB, comprising the following steps of: (1) preparing a PCB base plate with a planar resistor material layer; (2) manufacturing a circuit and a planar resistor pattern on the PCB base plate; (3) manufacturing a silk screen identical with planar resistor arrangement obtained from the step (2); (4) printing soldering-resistant ink to a target planar resistor through the silk screen obtained from the step (3); (5) baking the plate so that the soldering-resistant ink is solidified; and (6) carrying out a subsequent process.
Description
Technical field
The present invention relates to integrated component PCB, specifically is a kind of integrated planar resistance PCB and preparation method thereof.
Background technology
Integrated component PCB (Printed Circuit Board, printed circuit board (PCB)) is passive component, for example resistance, electric capacity and inductance etc., respectively or comprehensive integration make to PCB.Integrated component PCB also adopts laminated sheet base materials such as special planar resistor, plane capacitance except adopting conventional covering the copper foil base material, by the PCB production equipment and the technological process of routine, resistance, the electric capacity that mates is integrated in the PCB internal layer.
For the PCB of integrated planar resistance, then generally include dielectric layer, planar resistor figure, copper foil circuit figure.The metallic film of the resistive layer formation that is Ni-P composite material electroplating deposition to the Copper Foil wherein, its thickness is micron order, almost can ignore.
Yet the resistive film of the PCB with planar resistor that makes by existing manufacture method partly is exposed outside without any protection; so planar resistor is very easily impaired in processing and follow-up erection welding process; cause resistance value to change, make that the product yield is on the low side.In addition, exposed planar resistor is unstable easily in the long-term back of using, and it is limited to cause this series products to use.
Summary of the invention
First technical problem that the present invention solves provides a kind of integrated planar resistance PCB, and it is impaired that wherein planar resistor is difficult for, and still can keep stable performance after long-time the use.
Second technical problem that the present invention solves provides the manufacture method of a kind of integrated planar resistance PCB.
The 3rd technical problem that the present invention solves provides a kind of welding resistance printing ink that is used to make integrated planar resistance PCB.
First technical scheme that the present invention adopts is:
A kind of integrated planar resistance PCB comprises PCB basic unit, line pattern and some planar resistors, and wherein: described planar resistor is provided with the welding resistance ink lay.
As one of improvement of the technical scheme: described welding resistance ink lay is the hot curing photosensitive printing ink layer.
As two of improvement of the technical scheme: the component of described welding resistance printing ink is: the thermosetting curing agent of 70-80 weight portion epoxy thermosetting resin, 20-30 weight portion.
Second technical scheme that the present invention adopts is:
The manufacture method of a kind of integrated planar resistance PCB may further comprise the steps:
Step 1: the PCB substrate of preparing to have the planar resistor material layer;
Step 2: on the PCB substrate, make circuit and planar resistor figure;
Step 3: the silk screen that the planar resistor layout in making and the step 2 matches;
Step 4: the silk screen by step 3 with the welding resistance ink printing to objective plane resistance;
Step 5: drying-plate makes the welding resistance ink solidification;
Step 6: subsequent handling.
As one of improvement of the technical scheme: the welding resistance printing ink of described step 4 is the hot curing photosensitive-ink.
As two of improvement of the technical scheme: the silk screen grenadine order number of described step 3 is the 80-140 order, and the grenadine diameter is 120-180um.
As three of improvement of the technical scheme: described silk screen grenadine order number is 110 orders, and the grenadine diameter is 150um.Why determine that grenadine order number is 110 orders, the grenadine diameter is 150um, is in order to guarantee to print the uniformity and the thickness of welding resistance.
As four of improvement of the technical scheme: described step 5 comprises: being 75 ℃ of following drying-plates 45 minutes in temperature earlier, is 110 ℃ of following drying-plates 45 minutes in temperature then, is 150 ° of following drying-plates 60 minutes in temperature then.
As five of improvement of the technical scheme: described subsequent handling comprises detection, packaging process.
Compared with prior art; the beneficial effect of first technical scheme is: owing to apply one deck welding resistance ink lay as protective layer on planar resistor; can prevent that not only integrated planar resistance PCB is impaired in technical processs such as following process and assembling; can also make the planar resistor film be hedged off from the outer world, keep the long-time stable of performance.
Compared with prior art, the beneficial effect of second technical scheme is: the planar resistor on the integrated planar resistance PCB that makes by this method is difficult for impaired, and can keep stability for a long time.
Embodiment
Execution mode one
Present embodiment is the embodiment of first technical scheme.The integrated planar resistance PCB of first technical scheme comprises PCB basic unit, planar resistor and copper foil circuit figure.Wherein be coated with at least one planar resistor and have the welding resistance ink lay.
In addition, described welding resistance ink lay is the hot curing photosensitive printing ink layer, and its components by weight percent is: the thermosetting curing agent of 70-80 part epoxy thermosetting resin, 20-30 part.
Execution mode two
Present embodiment is the embodiment of second technical scheme.The manufacture method of the integrated planar resistance PCB of second technical scheme may further comprise the steps:
Step 1: the PCB substrate of preparing to have the planar resistor material layer;
Step 2: on the PCB substrate, make line pattern and some planar resistors;
Step 3: the silk screen that the planar resistor layout in making and the step 2 matches;
Step 4: the silk screen by step 3 with the welding resistance ink printing to objective plane resistance;
Step 5: drying-plate makes the welding resistance ink solidification;
Step 6: subsequent handling.
Wherein: the welding resistance printing ink of step 4 is the hot curing photosensitive-ink.
Wherein: step 3 silk screen grenadine order number is 110 orders, and the grenadine diameter is 150um.
Wherein: step 5 comprises: being 75 ℃ of following drying-plates 45 minutes in temperature earlier, is 110 ℃ of following drying-plates 45 minutes in temperature then, is 150 ° of following drying-plates 60 minutes in temperature then.
Wherein: the described subsequent handling of step 6 comprises conventional operations such as detection, packing at least.
Claims (9)
1. an integrated planar resistance PCB comprises PCB basic unit, line pattern and some planar resistors, and it is characterized in that: described planar resistor is provided with the welding resistance ink lay.
2. integrated planar resistance PCB according to claim 1 is characterized in that: described welding resistance ink lay is the hot curing photosensitive printing ink layer.
3. integrated planar resistance PCB according to claim 2, it is characterized in that: the weight portion of described welding resistance printing ink is: the thermosetting curing agent of 70-80 part epoxy thermosetting resin, 20-30 part.
4. the manufacture method of an integrated planar resistance PCB is characterized in that may further comprise the steps:
Step 1: the PCB substrate of preparing to have the planar resistor material layer;
Step 2: on the PCB substrate, make circuit and planar resistor figure;
Step 3: the silk screen that the planar resistor layout in making and the step 2 matches;
Step 4: the silk screen by step 3 with the welding resistance ink printing to objective plane resistance;
Step 5: drying-plate makes the welding resistance ink solidification;
Step 6: subsequent handling.
5. the manufacture method of integrated planar resistance PCB according to claim 4 is characterized in that: the welding resistance printing ink of described step 4 is the hot curing photosensitive-ink.
6. the manufacture method of integrated planar resistance PCB according to claim 4 is characterized in that: the grenadine order number of described step 3 is the 80-140 order, and the grenadine diameter is 120-180um.
7. the manufacture method of integrated planar resistance PCB according to claim 6 is characterized in that: grenadine order number is 110 orders, and the grenadine diameter is 150um.
8. the manufacture method of integrated planar resistance PCB according to claim 4, it is characterized in that, described drying-plate parameter step comprises: be 75 ℃ of following drying-plates 45 minutes in temperature earlier, be 110 ℃ of following drying-plates 45 minutes then in temperature, be 150 ° of following drying-plates 60 minutes in temperature then, wherein the heating-up time is controlled in the 10min between different temperatures.
9. according to the manufacture method of claim 4 or 6 or 7 or 8 arbitrary described integrated planar resistance PCB, it is characterized in that: described subsequent handling comprises operations such as detection, packing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103127003A CN101945539A (en) | 2009-12-30 | 2009-12-30 | Integrated planar resistor PCB (Printed Circuit Board) and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103127003A CN101945539A (en) | 2009-12-30 | 2009-12-30 | Integrated planar resistor PCB (Printed Circuit Board) and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101945539A true CN101945539A (en) | 2011-01-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009103127003A Pending CN101945539A (en) | 2009-12-30 | 2009-12-30 | Integrated planar resistor PCB (Printed Circuit Board) and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN101945539A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| CN102858091A (en) * | 2011-06-28 | 2013-01-02 | 北大方正集团有限公司 | Method for clearing resin flowing glue of mixed pressing formed PCB (printed circuit board) |
| WO2014106332A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Carbon ink printing device |
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
-
2009
- 2009-12-30 CN CN2009103127003A patent/CN101945539A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102858091A (en) * | 2011-06-28 | 2013-01-02 | 北大方正集团有限公司 | Method for clearing resin flowing glue of mixed pressing formed PCB (printed circuit board) |
| CN102523698A (en) * | 2011-12-14 | 2012-06-27 | 景旺电子（深圳）有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| CN102523698B (en) * | 2011-12-14 | 2014-07-30 | 深圳市景旺电子股份有限公司 | Method for filling through-holes of printed circuit board (PCB) with solder mask ink for double-sided opening |
| WO2014106332A1 (en) * | 2013-01-05 | 2014-07-10 | 上海卓凯电子科技有限公司 | Carbon ink printing device |
| CN110911067A (en) * | 2019-11-08 | 2020-03-24 | 广东风华高新科技股份有限公司 | Current sensing resistor and manufacturing method thereof |
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Application publication date: 20110112 |