CN108590098B - 一种高导热且均匀发热的电热瓷砖及制作方法 - Google Patents
一种高导热且均匀发热的电热瓷砖及制作方法 Download PDFInfo
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- CN108590098B CN108590098B CN201810338722.6A CN201810338722A CN108590098B CN 108590098 B CN108590098 B CN 108590098B CN 201810338722 A CN201810338722 A CN 201810338722A CN 108590098 B CN108590098 B CN 108590098B
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- ceramic
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- ceramic tile
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- thin plate
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Abstract
本发明公开了一种高导热且均匀发热的电热瓷砖，包括高导热陶瓷薄板、发热膜和多孔陶瓷板，高导热陶瓷薄板和多孔陶瓷板相平行设置，多孔陶瓷板位于高导热陶瓷薄板的下方，发热膜附着于高导热陶瓷薄板的底面；高导热陶瓷薄板与多孔陶瓷板通过液体瓷砖胶层和固体瓷砖胶层粘接，液体瓷砖胶层和固体瓷砖胶层均与高导热陶瓷薄板平行设置。本发明还公开了上述高导热且均匀发热的电热瓷砖的制作方法。该电热瓷砖具有质量轻薄、阻燃性能优异、使用寿命长的特点，VOC排放量忽略不计，真正做到了绿色环保。
Description
技术领域
本发明涉及建筑装饰材料技术领域，尤其涉及一种高导热且均匀发热的电热瓷砖及制作方法。
背景技术
电热瓷砖已经广泛应用于家庭采暖、保暖房等空间，通常多采用电热丝、碳纤维或者电热膜作为发热元件，以有机聚氨酯类板材或者发泡陶瓷作为底部保温隔热材料。
如中国专利CN 105135507 A《一种发泡陶瓷复合地暖砖及其制备方法》，提出以0.2～0.8比重的发泡陶瓷作为基板，在发泡陶瓷表面开槽内设碳纤维加热丝且以迂回方式布线，陶瓷砖与发泡陶瓷粘合层为快凝水泥，该工艺存在的问题为：1、泡沫陶瓷表面为多孔状，以快凝水泥作为粘合剂，水泥、陶瓷砖和发泡陶瓷三者皆为刚性材料，粘合性不够，无缓冲易出现脱胶现象，影响使用寿命；2、发泡陶瓷的导热率较传统聚氨酯类有机物板材高，是聚氨酯保温材料的4-5倍，电热损耗较大。
中国专利CN 105025598 A《一种电热复合陶瓷砖及其制备方法》采用电热膜作为发热元件，其中组分中含有55—75wt％的有机粘结剂如环氧树脂、聚氨酯树脂或者改性硅树脂等，这些有机物在加热过程中易出现挥发气体。
因此，目前的发热瓷砖存在瓷砖与基板粘结耐疲劳性、有效电热转化率、产品阻燃性和VOC释放绿色环保等问题。
发明内容
本发明的目的在于提出一种高导热且均匀发热的电热瓷砖，具有使用寿命长的特点。
本发明的目的在于提出一种高导热且均匀发热的电热瓷砖的制备方法，获得的电热瓷砖具有使用寿命长的特点。
为达此目的，本发明采用以下技术方案：
一种高导热且均匀发热的电热瓷砖，包括高导热陶瓷薄板、发热膜和多孔陶瓷板，高导热陶瓷薄板和多孔陶瓷板相平行设置，多孔陶瓷板位于高导热陶瓷薄板的下方，发热膜附着于高导热陶瓷薄板的底面，高导热陶瓷薄板与多孔陶瓷板通过液体瓷砖胶层和固体瓷砖胶层粘接，液体瓷砖胶层和固体瓷砖胶层均与高导热陶瓷薄板平行设置；高导热陶瓷的化学成分为：氧化硅61～63％、氧化铝29～31％、氧化铁1～1.5％、氧化钛0.85～0.9％、氧化钙0.27～0.31％、氧化镁1.1～1.15％、氧化钾2.1～2.35％、氧化钠1.75～2％、氧化锂0.4～0.6％；
所述高导热陶瓷薄板的导热系数为2.5～3.5W/m·K。
多孔陶瓷板可以是泡沫陶瓷、蜂窝陶瓷或粒状陶瓷结体，均为高温烧制硅酸盐类陶瓷材料。采用多孔陶瓷板作为基板使得该电热瓷砖质量轻薄及阻燃性能优异。采用液体瓷砖胶和固体瓷砖胶对高导热陶瓷薄板和多孔陶瓷板进行粘接，液体瓷砖胶层和固体瓷砖胶层形成缓冲结合，使得两陶瓷板的结合性和抗老化性能更强，从而提高电热瓷砖的使用寿命。同时，该电热瓷砖多采用无机材料，VOC排放量忽略不计，真正做到了绿色环保。
进一步的，高导热陶瓷薄板的底面和多孔陶瓷板的顶面均涂覆有液体瓷砖胶层，固体瓷砖胶层位于两液体瓷砖胶层之间。固体瓷砖胶层的上下两面分别通过液体瓷砖胶层与两陶瓷板形成缓冲结合层，进一步提高两陶瓷板的粘合行和耐老化性能。
进一步的，多孔陶瓷板的顶面或所述高导热陶瓷薄板的底面涂覆有保温隔热层，保温隔热层是纳米气凝胶二氧化硅涂层。保温隔热涂层在高导热陶瓷薄板的底面或多孔陶瓷板的顶面大面积涂覆。保温隔热层的设置能够有效阻止热量向下散发，促使热量向上传递，提高该电热瓷砖的有效热转化率，进而可节省能源。纳米气凝胶二氧化硅涂层具有高比表面积及高孔隙率，热导率低，有优异的隔热性能。
进一步的，保温隔热层20℃温度下热导率为0.04±0.005w/(m·K)，零下10℃到120℃时，导热系数为0.018～0.02w/(m·K)。保温隔热层有很低的导热系数，具有优异的隔热性能。
进一步的，发热膜为氮化钛发热膜，氮化钛发热膜具有较高的发热效率和较长的使用寿命。
进一步的，高导热瓷砖的坯体原料包括以重量百分比计的：台山中温砂2～4％、莲塘中温砂2～4％、新丰砂8～12％、中山石粉7～9％、北海石粉18～22％、四会泥7～9％、新会泥13～17％、滑石粉2～4％、铝矾土19～23％、锂辉石8～10％。。
一种上述高导热且均匀发热的电热瓷砖的制备方法，包括以下步骤：
在高导热陶瓷薄板的底面采用真空镀膜的方式附着发热膜；
采用液体瓷砖胶和固体瓷砖胶将高导热陶瓷薄板和多孔陶瓷板粘接，使高导热陶瓷薄板和多孔陶瓷板相平行设置，并且高导热陶瓷薄板位于多孔陶瓷板的上方。
进一步的，采用液体瓷砖胶和固体瓷砖胶将高导热陶瓷薄板和多孔陶瓷板粘接时，在瓷砖薄板的底面和多孔陶瓷板的顶面分别涂覆液体瓷砖胶，当液体瓷砖胶干燥后，通过固体瓷砖胶将瓷砖薄板和多孔陶瓷板粘接，即固体瓷砖胶位于两层液体瓷砖胶之间。
进一步的，在高导热陶瓷薄板附着发热膜之后，在高导热陶瓷薄板的底面涂覆保温隔热材料，干燥形成保温隔热层；或者在多孔陶瓷板的顶面涂覆保温隔热材料，干燥形成保温隔热层；保温隔热层为纳米气凝胶二氧化硅涂层。
进一步的，在高导热陶瓷薄板的底面采用真空镀膜的方式附着发热膜的镀膜温度为280℃、镀膜真空环境为6.6×10-3Pa，真空镀膜完成后关闭加热器继续抽真空使高导热陶瓷薄板在高真空度环境下冷却，防止镀膜表面被氧化。
本发明的有益效果为：
1、采多孔陶瓷作为基板，使得该电热瓷砖质量轻薄及阻燃性能优异；2、液体瓷砖胶和固体瓷砖胶联合使用，使得两陶瓷板的结合性和抗老化性能更强，从而提高电热瓷砖的使用寿命；3、该电热瓷砖多采用无机材料，VOC排放量忽略不计，真正做到了绿色环保；4、采用纳米气凝胶二氧化硅涂层作为保温隔热层，有效提高该电热瓷砖的有效热转化率；5、采用氮化钛发热膜，在加热过程中不会出现挥发气体，更加绿色环保；6、采用高导热陶瓷薄板，提高导热性能，提高能源利用率。
因此，本发明的高导热且均匀发热的电热瓷砖具有结构简单、安装便捷、质量轻薄、单向传热率高、节能安全的特点。该电热瓷砖的制备方法工艺简单易操作。
附图说明
图1是本发明一个实施例的高导热且均匀发热的电热瓷砖的分解示意图；
图2是本发明另一个实施例的高导热且均匀发热的电热瓷砖的分解示意图；
图3是对比例1的电热瓷砖的分解示意图；
图4是对比例2的电热瓷砖的分解示意图。
其中：高导热陶瓷薄板1、液体瓷砖胶层2、固体瓷砖胶层3、发热膜5、保温隔热层6、多孔陶瓷板7、瓷砖层11、快凝水泥层12、发泡陶瓷板13、陶瓷砖基底21、电热涂层22、绝缘封装防水层23、发泡陶瓷层24。
具体实施方式
下面结合附图及具体实施方式进一步说明本发明的技术方案。
如图1和图2所示，一种高导热且均匀发热的电热瓷砖，包括高导热陶瓷薄板1、发热膜5和多孔陶瓷板7，高导热陶瓷薄板1和多孔陶瓷板7相平行设置，多孔陶瓷板7位于高导热陶瓷薄板1的下方，发热膜5附着于高导热陶瓷薄板1的底面，高导热陶瓷薄板1与多孔陶瓷板7通过液体瓷砖胶层2和固体瓷砖胶层3粘接，液体瓷砖胶层2和固体瓷砖胶层3均与高导热陶瓷薄板1平行设置。
高导热陶瓷的化学成分为：氧化硅61～63％、氧化铝29～31％、氧化铁1～1.5％、氧化钛0.85～0.9％、氧化钙0.27～0.31％、氧化镁1.1～1.15％、氧化钾2.1～2.35％、氧化钠1.75～2％、氧化锂0.4～0.6％；高导热陶瓷薄板的导热系数为2.5～3.5W/m·K。
该高导热陶瓷中的金属氧化物含量较高，使得瓷砖具有较高的导热系数，当该高导热陶瓷应用于电热瓷砖时，能提高热量传导速度，节省能源。
优选的，高导热陶瓷薄板的坯体原料包括以重量百分比计的：台山中温砂2～4％、莲塘中温砂2～4％、新丰砂8～12％、中山石粉7～9％、北海石粉18～22％、四会泥7～9％、新会泥13～17％、滑石粉2～4％、铝矾土19～23％、锂辉石8～10％。
经检测，高导热陶瓷薄板的各坯体原料的化学成分百分比如表1所示，其中L.O.I是指烧失量。
通过在配方中添加铝矾土来调整坯体中铝含量，当瓷砖中铝含量提高时，瓷砖有较高的导热性能。
通过添加锂辉石作为强助融剂，在烧成过程中能够在较低的温度下发生晶相转变，产生莫来石晶相，烧成后的高导热陶瓷中玻璃相存在较少，结构致密，有较高的导热系数。
在该高导热陶瓷薄板的坯体配方中，石粉采用原矿形式，未经过预煅烧等工艺处理，采用多个产地的石粉能够相互弥补成分波动，稳定生产，还可以改善烧成温度的波动，还能够降低原料成本和工艺成本。在该高导热陶瓷薄板的坯体配方中，还采用了多个产地的砂和粘土，能够相互弥补成分波动，稳定生产，还可以改善烧成温度的波动，还能够降低原料成本和工艺成本。其中，四会泥和新会泥为粘土。
上述的高导热陶瓷薄板的制备方法，包括以下步骤：
将高导热陶瓷薄板的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：250～500MPa，4～6次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时8～12min、500～1185℃需时23～27min、1185℃保温8～12min，之后冷却至出窑的时间13～17min；获得成品。
在上述的制备方法中坯体的烧成温度为1185℃，烧成时间为1小时左右，有较低的烧成温度和较短的烧成时间，降低生产成本，生产过程易控。
需要说明的是，在实际生产应用中，可根据需要增加设置装饰层的步骤，提高该电热瓷砖的装饰效果。设置装饰层步骤可以是施釉和/或印花。
发热膜5为氮化钛发热膜。高导热陶瓷薄板1的厚度为6～7mm，高导热陶瓷薄板吸水率为＜0.5％。高导热陶瓷薄板1可采用现有的原料配方和工艺制成，但要求厚度小于现有瓷砖的厚度，以实现热量的快速传导。多孔陶瓷板7可以是泡沫陶瓷、蜂窝陶瓷或粒状陶瓷结体，均为高温烧制硅酸盐类陶瓷材料，具有耐高温、防火、耐老化、强度较高、不易产生体积变形，有较好的抗压承载性且绝缘防。多孔陶瓷板7的导热系数≤0.15W/(m·K)。泡沫陶瓷的气孔率为80～90％，蜂窝陶瓷的气孔率为70％，粒状陶瓷结体的气孔率为30～50％，其中，气孔率是指陶瓷材料的开口孔道体积占材料总体积的百分比。
采用多孔陶瓷板7作为基板使得该电热瓷砖质量轻薄及阻燃性能优异。采用液体瓷砖胶和固体瓷砖胶对高导热陶瓷薄板和多孔陶瓷板进行粘接，液体瓷砖胶层2和固体瓷砖胶层3形成缓冲结合，使得两陶瓷板的结合性和抗老化性能更强，从而提高电热瓷砖的使用寿命。同时，该电热瓷砖多采用无机材料，VOC排放量忽略不计，真正做到了绿色环保。
优选的，液体瓷砖胶的配方原料包括以重量百分比计的：水溶性酚醛树脂胶10～18％、聚醋酸乙烯共聚物55～65％、有机硅改性环氧树脂2～3％、氟改性环氧树3～4％、聚丙烯酸类增稠剂0.2％、聚醚改性硅氧烷0.3％、对羟基苯甲酸0.1％、醇酯十二0.4％、石英粉5％、去离子水14％。采用上述配方的液体瓷砖胶具有很好的耐热性能、流平性能、与基板的粘结性能以及抗压性。
进一步优选的，液体瓷砖胶可以采用配方1～3，具体的，配方1：水溶性酚醛树脂胶14％、聚醋酸乙烯共聚物60％、有机硅改性环氧树脂3％、氟改性环氧树脂3％、聚丙烯酸类增稠剂0.2％、聚醚改性硅氧烷0.3％、对羟基苯甲酸0.1％、醇酯十二0.4％、石英粉5％、去离子水14％；
配方2：水溶性酚醛树脂胶18％、聚醋酸乙烯共聚物55％、有机硅改性环氧树脂3％、氟改性环氧树脂4％、聚丙烯酸类增稠剂0.2％、聚醚改性硅氧烷0.3％、对羟基苯甲酸0.1％、醇酯十二0.4％、石英粉5％、去离子水14％；
配方3：水溶性酚醛树脂胶10％、聚醋酸乙烯共聚物65％、有机硅改性环氧树脂2％、氟改性环氧树脂3％、聚丙烯酸类增稠剂0.2％、聚醚改性硅氧烷0.3％、对羟基苯甲酸0.1％、醇酯十二0.4％、石英粉5％、去离子水14％。
液体瓷砖胶形成一层膜，且对吸水率低的玻化砖有粘结性，从而大大降低了瓷砖空鼓、脱落的风险。液体瓷砖胶热老化后的压缩剪切胶粘强度为0.2MPa，加长晾置时间30min拉伸胶粘强度0.2MPa，符合JC/T547-2005标准。液体瓷砖胶需符合国标GB18582-2008《室内装饰装修材料、胶粘剂有害物质限量》。液体瓷砖胶可以采用佛山新石界有限公司的博匠精工品牌。
优选的，固体瓷砖胶的配方原料包括：普通硅酸水泥55％、石英砂25％、重钙10％、可再分散乳胶粉4～6％、氟改性环氧树脂1～3％、有机硅改性环氧树脂0.5～1.5％、羟丙基甲基纤维素0.5～1.5％、羧甲基淀粉醚0.4～0.6％、聚醚改性硅氧烷0.4～0.6％。采用上述配方的固体瓷砖胶具有更好的流平性能和粘结性能。
进一步优选的：固体瓷砖胶可以采用配方1～3，具体的，配方1：普通硅酸水泥55％、石英砂25％、重钙10％、可再分散乳胶粉5％、氟改性环氧树脂2％、有机硅改性环氧树脂1％、羟丙基甲基纤维素1％、羧甲基淀粉醚0.5％、聚醚改性硅氧烷0.5％；
配方2：普通硅酸水泥55％、石英砂25％、重钙10％、可再分散乳胶粉4％、氟改性环氧树脂3％、有机硅改性环氧树脂0.5％、羟丙基甲基纤维素1.5％、羧甲基淀粉醚0.6％、聚醚改性硅氧烷0.4％；
配方3：普通硅酸水泥55％、石英砂25％、重钙10％、可再分散乳胶粉6％、氟改性环氧树脂1％、有机硅改性环氧树脂1.5％、羟丙基甲基纤维素0.5％、羧甲基淀粉醚0.4％、聚醚改性硅氧烷0.6％。
固体瓷砖胶是粉末状，使用时加水调和成粘稠状。固体瓷砖胶拉伸粘结强度≥0.5MPa(含浸水粘结强度、热老化、晾置20min后粘结强度)，符合JC/T547-2005中C1标准。固体瓷砖胶也可以采用立邦品牌。
优选的，高导热陶瓷薄板1的底面和多孔陶瓷板7的顶面均涂覆有液体瓷砖胶层2，固体瓷砖胶层3位于两液体瓷砖胶层2之间。固体瓷砖胶层3的上下两面分别通过液体瓷砖胶层2与两陶瓷板形成缓冲结合层，进一步提高两陶瓷板的粘合行和耐老化性能。
如图1所示，多孔陶瓷板7附着发热膜5之后，在高导热陶瓷薄板1的底面涂覆保温隔热材料，干燥形成保温隔热层6。在其他实施方式中，如图2所示，在多孔陶瓷板7的顶面涂覆保温隔热材料，干燥形成保温隔热层。保温隔热层6是纳米气凝胶二氧化硅涂层。保温隔热涂层6可以在高导热陶瓷薄板1的底面或多孔陶瓷板7的顶面大面积涂覆。保温隔热层6的设置能够有效阻止热量向下散发，促使热量向上传递，提高该电热瓷砖的有效热转化率，进而可节省能源。纳米气凝胶二氧化硅涂层具有高比表面积及高孔隙率，热导率低，有优异的隔热性能。
保温隔热层6在20℃温度下热导率为0.04±0.005w/(m·K)，零下10℃到120℃时，导热系数为0.018-0.02w/(m·K)。保温隔热层的浆料密度0.55-0.65g/cm3，干膜密度0.35-0.45g/cm3，粘度4000-45000mPa.s。
一种上述高导热且均匀发热的电热瓷砖的制备方法，包括步骤(1)～(4)：
步骤(1)、在高导热陶瓷薄板1的底面采用真空镀膜的方式附着发热膜。
在高导热陶瓷薄板的底面采用真空镀膜的方式附着发热膜的镀膜温度为280℃、镀膜真空环境为6.6×10-3Pa，真空镀膜完成后关闭加热器继续抽真空使高导热陶瓷薄板在高真空度环境下冷却，防止镀膜表面被氧化。
步骤(2)、在高导热陶瓷薄板1附着发热膜5之后，在高导热陶瓷薄板1的底面涂覆保温隔热材料，干燥形成保温隔热层6；或者在多孔陶瓷板7的顶面涂覆保温隔热材料，干燥形成保温隔热层6；保温隔热层6为纳米气凝胶二氧化硅涂层。在高导热陶瓷薄板1附着发热膜5之后在发热膜5的边缘引出两个电极，该电极用于与外部电源连接。
步骤(3)、采用液体瓷砖胶和固体瓷砖胶将高导热陶瓷薄板1和多孔陶瓷板7粘接，使高导热陶瓷薄板1和多孔陶瓷板7相平行设置，并且高导热陶瓷薄板1位于多孔陶瓷板7的上方。
优选的，在瓷砖薄板1的底面和多孔陶瓷板7的顶面分别涂覆液体瓷砖胶，当液体瓷砖胶干燥后，通过固体瓷砖胶将瓷砖薄板和多孔陶瓷板粘接，即固体瓷砖胶位于两层液体瓷砖胶之间。
涂覆液体瓷砖胶时，用毛刷在瓷砖薄板1的底面和多孔陶瓷板7的顶面分别涂覆一层液体瓷砖胶，静置10～15min，待液体瓷砖胶干透后，使用调和成粘稠状的固体瓷砖胶将瓷砖薄板和多孔陶瓷板粘合，之后静置24小时。
液体瓷砖胶可充分渗入瓷砖薄板和多孔陶瓷板，与固体瓷砖胶形成缓冲结合层，两中瓷砖胶相互结合，电热瓷砖产品粘合性和耐老化性能更强。
步骤(4)、在复合后的瓷砖薄板和多孔陶瓷板的四个侧面各层接缝处用瓷砖胶填缝，特别是发热元件接线处做密封防水工作，防止电线松动。
经过上述步骤(1)～(4)获得的电热瓷砖厚度为22～28mm，优选的为25mm。该电热瓷砖可安装温度控制系统，最高发热温度可调至50℃，接电5min后电热瓷砖表面温度可达到设定温度要求。
对比例1
如图3所示，该对比例的电热瓷砖由上至下依次为瓷砖层11、快凝水泥层12和发泡陶瓷板13。瓷砖层11和发泡陶瓷板13仅通过快凝水泥层12粘结，发泡陶瓷板13上设置有碳纤维加热丝。
对比例2
如图4所示，该对比例的电热瓷砖由上至下依次为陶瓷砖基底21、电热涂层22、绝缘封装防水层23和发泡陶瓷层24。陶瓷砖基底21的厚度为10mm。电热涂层22涂覆在陶瓷砖基底21的底面。电热涂层22的原料为：碳发热材料、粘结剂、溶剂和助剂。绝缘封装防水层23可以采用无机粘结剂，即水泥砂浆。
下表是本发明的电热瓷砖与对比例的电热瓷砖的比较。
由上述对比可以看出：
本发明的电热瓷砖联合使用液体瓷砖胶和固体瓷砖胶对高导热陶瓷薄板和多孔陶瓷板进行粘合，使得两陶瓷板的结合性和抗老化性能更强，从而提高电热瓷砖的使用寿命；本发明的电热瓷砖设置保温隔热涂层，保温隔热涂层采用纳米气凝胶二氧化硅涂层，使得发热丝产生的热量向上散发，实现热量的单向传导，提高电热瓷砖的热效率。
以下为本发明电热瓷砖中的高导热陶瓷薄板的实施方式，以下实施方式中的高导热陶瓷薄板均能够满足电热瓷砖的要求。
实施方式1
本实施例中高导热陶瓷薄板的坯体配方为：
| 原料 | 台山中温砂 | 莲塘中温砂 | 新丰砂 | 中山石粉 | 北海石粉 |
| 重量百分比 | 2 | 2 | 12 | 7 | 22 |
| 原料 | 四会泥 | 新会泥 | 滑石粉 | 铝矾土 | 锂辉石 |
| 重量百分比 | 9 | 13 | 4 | 19 | 10 |
本实施例中高导热陶瓷薄板的化学成分为：
| 化学成分 | 氧化硅 | 氧化铝 | 氧化铁 | 氧化钛 | 氧化钙 |
| 百分比 | 62.44 | 28.61 | 1.2 | 0.84 | 0.3 |
| 化学成分 | 氧化镁 | 氧化钾 | 氧化钠 | 氧化锂 | 杂质 |
| 百分比 | 1.29 | 2.24 | 1.85 | 0.6 | 余量 |
该高导热瓷砖的导热系数为3.5W/m·K，该高导热陶瓷薄板的厚度为6～7mm。高导热瓷砖烧成后成品强度47～52MPa。高导热瓷砖烧成后成品吸水率0.01％。
上述高导热瓷砖的制备方法为：
将高导热瓷砖的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：250MPa，6次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时8min、500～1185℃需时23min、1185℃保温8min，之后冷却至出窑的时间13min；获得成品。
实施方式2
本实施方式中高导热陶瓷薄板的坯体配方为：
| 原料 | 台山中温砂 | 莲塘中温砂 | 新丰砂 | 中山石粉 | 北海石粉 |
| 重量百分比 | 2.5 | 2.5 | 11 | 7.5 | 21 |
| 原料 | 四会泥 | 新会泥 | 滑石粉 | 铝矾土 | 锂辉石 |
| 重量百分比 | 7.5 | 16 | 2.5 | 20 | 9.5 |
本实施方式中高导热陶瓷薄板的化学成分为：
| 化学成分 | 氧化硅 | 氧化铝 | 氧化铁 | 氧化钛 | 氧化钙 |
| 百分比 | 62.5 | 29.55 | 1.23 | 0.85 | 0.28 |
| 化学成分 | 氧化镁 | 氧化钾 | 氧化钠 | 氧化锂 | 杂质 |
| 百分比 | 0.94 | 2.21 | 1.88 | 0.55 | 余量 |
该高导热陶瓷薄板的导热系数为3W/m·K。该高导热陶瓷薄板的厚度为6～7mm。高导热陶瓷薄板烧成后成品强度47～52MPa。高导热陶瓷薄板烧成后成品吸水率0.01％。
上述高导热陶瓷薄板的制备方法为：
将高导热陶瓷薄板的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：300MPa，6次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时9min、500～1185℃需时24min、1185℃保温9min，之后冷却至出窑的时间14min；获得成品。
实施方式3
本实施方式中高导热陶瓷薄板的坯体配方为：
| 原料 | 台山中温砂 | 莲塘中温砂 | 新丰砂 | 中山石粉 | 北海石粉 |
| 重量百分比 | 3 | 3 | 10 | 8 | 20 |
| 原料 | 四会泥 | 新会泥 | 滑石粉 | 铝矾土 | 锂辉石 |
| 重量百分比 | 8 | 15 | 3 | 21 | 9 |
本实施方式中高导热陶瓷薄板的化学成分为：
| 化学成分 | 氧化硅 | 氧化铝 | 氧化铁 | 氧化钛 | 氧化钙 |
| 百分比 | 61.99 | 29.9 | 1.25 | 0.87 | 0.29 |
| 化学成分 | 氧化镁 | 氧化钾 | 氧化钠 | 氧化锂 | 杂质 |
| 百分比 | 1.06 | 2.27 | 1.86 | 0.5 | 余量 |
该高导热陶瓷薄板的导热系数为3W/m·K。该高导热陶瓷薄板的厚度为6～7mm。高导热陶瓷薄板烧成后成品强度47～52MPa。高导热陶瓷薄板烧成后成品吸水率0.01％。
上述高导热陶瓷薄板的制备方法为：
将高导热陶瓷薄板的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：400MPa，5次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时10min、500～1185℃需时25min、1185℃保温10min，之后冷却至出窑的时间15min。
实施方式4
本实施方式中高导热陶瓷薄板的坯体配方为：
| 原料 | 台山中温砂 | 莲塘中温砂 | 新丰砂 | 中山石粉 | 北海石粉 |
| 重量百分比 | 3.5 | 3.5 | 9 | 8.5 | 19 |
| 原料 | 四会泥 | 新会泥 | 滑石粉 | 铝矾土 | 锂辉石 |
| 重量百分比 | 8.5 | 14 | 3.5 | 22 | 8.5 |
本实施方式中高导热陶瓷薄板的化学成分为：
| 化学成分 | 氧化硅 | 氧化铝 | 氧化铁 | 氧化钛 | 氧化钙 |
| 百分比 | 61.5 | 3.02 | 1.27 | 0.89 | 0.3 |
| 化学成分 | 氧化镁 | 氧化钾 | 氧化钠 | 氧化锂 | 杂质 |
| 百分比 | 1.17 | 2.28 | 1.87 | 0.45 | 余量 |
该高导热陶瓷薄板的导热系数为2.5W/m·K。该高导热陶瓷薄板的厚度为6～7mm。高导热陶瓷薄板烧成后成品强度47～52MPa。高导热陶瓷薄板烧成后成品吸水率0.01％。
上述高导热陶瓷薄板的制备方法为：
将高导热陶瓷薄板的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：450MPa，4次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时11min、500～1185℃需时26min、1185℃保温11min，之后冷却至出窑的时间16min；获得成品。
实施方式5
本实施方式中高导热陶瓷薄板的坯体配方为：
本实施方式中高导热陶瓷薄板的化学成分为：
| 化学成分 | 氧化硅 | 氧化铝 | 氧化铁 | 氧化钛 | 氧化钙 |
| 百分比 | 61.57 | 30.5 | 1.3 | 0.91 | 0.28 |
| 化学成分 | 氧化镁 | 氧化钾 | 氧化钠 | 氧化锂 | 杂质 |
| 百分比 | 0.81 | 2.3 | 2.3 | 0.4 | 余量 |
该高导热陶瓷薄板的导热系数为2.5W/m·K。该高导热陶瓷薄板的厚度为6～7mm。高导热陶瓷薄板烧成后成品强度47～52MPa。高导热陶瓷薄板烧成后成品吸水率0.01％。
上述高导热陶瓷薄板的制备方法为：
将高导热陶瓷薄板的坯体原料按比例混合均匀，压制成为坯体，坯体压制成型的工艺参数为：500MPa，4次/min；
将坯体入辊道窑烧制，烧制过程中各阶段温度及时间依次为：100～500℃需时12min、500～1185℃需时27min、1185℃保温12min，之后冷却至出窑的时间17min；获得成品。
陶瓷薄板对比例
本对比例中的瓷砖坯体配方为：
| 原料 | 石英砂 | 粘土 | 长石 |
| 重量百分比 | 30 | 40 | 30 |
该瓷砖为普通地板砖，厚度为12～18mm，导热系数为1.3～1.5W/m·K，吸水率为0.5％。
该瓷砖的生产工艺为：将坯体原料按配方比例混合均匀，压制成为坯体，体压制成型的工艺参数为：700MPa，4次/min；烧成温度为1250℃，烧成周期为90min。
下表是本发明高导热陶瓷薄板与对比例普通瓷砖的产品性能和工艺对比。
根据上述对比可以看出：
本发明的高导热陶瓷薄板的导热系数为2.5～3.5W/m·K，具有较高的高热性能；成品的厚度小，更加能提高热量传导的速度；成品强度47～52MPa满足国家标准中的≥27MPa；成品结构致密，吸水率低；烧成周期较短、烧成时间短，使得烧制工艺易控，烧制成本低。
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理，而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释，本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式，这些方式都将落入本发明的保护范围之内。
Claims (8)
1.一种高导热且均匀发热的电热瓷砖，其特征在于，包括高导热陶瓷薄板、发热膜和多孔陶瓷板，所述高导热陶瓷薄板和多孔陶瓷板相平行设置，所述多孔陶瓷板位于高导热陶瓷薄板的下方，所述发热膜附着于高导热陶瓷薄板的底面；
所述高导热陶瓷薄板与多孔陶瓷板通过液体瓷砖胶层和固体瓷砖胶层粘接，所述液体瓷砖胶层和固体瓷砖胶层均与高导热陶瓷薄板平行设置；所述高导热陶瓷薄板的底面和多孔陶瓷板的顶面均涂覆有液体瓷砖胶层，所述固体瓷砖胶层位于两液体瓷砖胶层之间；
所述高导热陶瓷的化学成分为：氧化硅61～63％、氧化铝29～31％、氧化铁1～1.5％、氧化钛0.85～0.9％、氧化钙0.27～0.31％、氧化镁1.1～1.15％、氧化钾2.1～2.35％、氧化钠1.75～2％、氧化锂0.4～0.6％；所述高导热瓷砖的坯体原料包括以重量百分比计的：台山中温砂2～4％、莲塘中温砂2～4％、新丰砂8～12％、中山石粉7～9％、北海石粉18～22％、四会泥7～9％、新会泥13～17％、滑石粉2～4％、铝矾土19～23％、锂辉石8～10％；
所述高导热陶瓷薄板的导热系数为2.5～3.5W/m·K。
2.根据权利要求1所述的高导热且均匀发热的电热瓷砖，其特征在于，所述多孔陶瓷板的顶面或所述高导热陶瓷薄板的底面涂覆有保温隔热层，所述保温隔热层是纳米气凝胶二氧化硅涂层。
3.根据权利要求2所述的高导热且均匀发热的电热瓷砖，其特征在于，所述保温隔热层在20℃温度下热导率为0.04±0.005w/(m·K)。
4.根据权利要求1所述的高导热且均匀发热的电热瓷砖，其特征在于，所述发热膜为氮化钛发热膜。
5.一种权利要求1所述的高导热且均匀发热的电热瓷砖的制备方法，其特征在于，包括以下步骤：
在所述高导热陶瓷薄板的底面采用真空镀膜的方式附着发热膜；
采用液体瓷砖胶和固体瓷砖胶将高导热陶瓷薄板和多孔陶瓷板粘接，使所述高导热陶瓷薄板和多孔陶瓷板相平行设置，并且所述高导热陶瓷薄板位于多孔陶瓷板的上方。
6.根据权利要求5所述的高导热且均匀发热的电热瓷砖的制备方法，其特征在于，采用液体瓷砖胶和固体瓷砖胶将高导热陶瓷薄板和多孔陶瓷板粘接时，在所述高导热陶瓷薄板的底面和多孔陶瓷板的顶面分别涂覆液体瓷砖胶，当液体瓷砖胶干燥后，通过固体瓷砖胶将高导热陶瓷薄板和多孔陶瓷板粘接，即固体瓷砖胶位于两层液体瓷砖胶之间。
7.根据权利要求5所述的高导热且均匀发热的电热瓷砖的制备方法，其特征在于，在所述高导热陶瓷薄板附着发热膜之后，在所述高导热陶瓷薄板的底面涂覆保温隔热材料，干燥形成保温隔热层；
或者在所述多孔陶瓷板的顶面涂覆保温隔热材料，干燥形成保温隔热层；
所述保温隔热层为纳米气凝胶二氧化硅涂层。
8.根据权利要求5所述的高导热且均匀发热的电热瓷砖的制备方法，其特征在于，在所述高导热陶瓷薄板的底面采用真空镀膜的方式附着发热膜的镀膜温度为280℃、镀膜真空环境为6.6×10-3Pa，真空镀膜完成后使高导热陶瓷薄板在高真空度环境下冷却。
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