CN108531855A - The manufacturing method of mask plate, evaporation coating device and display device - Google Patents
The manufacturing method of mask plate, evaporation coating device and display device Download PDFInfo
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- CN108531855A CN108531855A CN201810552853.4A CN201810552853A CN108531855A CN 108531855 A CN108531855 A CN 108531855A CN 201810552853 A CN201810552853 A CN 201810552853A CN 108531855 A CN108531855 A CN 108531855A
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- mask plate
- registration holes
- opening
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- substrate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention provides the manufacturing method of a kind of mask plate, evaporation coating device and display device, the periphery of each opening for evaporation material of the mask plate is provided with multiple registration holes, the positional precision and frame precision of mask plate can be controlled by the position of the registration holes of each open circumferential of control, increase the reliability thrown the net；The stress at region between these registration holes discrete openings can also be utilized simultaneously, reduce strain, reduce mask plate fold, improve the flatness of mask plate, increase the Anawgy accuracy of mask plate and substrate to be deposited, to promote vapor deposition yield and production yield, promoted clearly especially for high PPI and narrow frame product.
Description
Technical field
The present invention relates to a kind of display technology field more particularly to mask plate, the manufacturers of evaporation coating device and display device
Method.
Background technology
With the rapid development of display technology, organic electroluminescence device (Organic Light Emitting Diode,
OLED) with its self-luminous, all solid state, high contrast, it is flexible the advantages that, become most potential New Type Display Devices.OLED
The structure of organic illuminating element in display device generally comprises anode layer, middle layer and cathode layer, and the middle layer may include
The organic luminous layer of red, green, blue or white light can be emitted, can also have hole injection layer (HIL), hole transmission layer (HTL),
At least one layer in electron transfer layer (ETL) and electron injecting layer (EIL), and usually hole injection layer (HIL), hole transport
Layer (HTL), organic luminous layer, electron transfer layer (ETL) and electron injecting layer (EIL) be successively set on anode layer and cathode layer it
Between.In addition, in OLED display device, the OLED element (White OLED structures) that either organic luminous layer emits white light, also
It is the OLED element (RGB OLED structures) of organic luminous layer hair red, green, blue, it is all interconnected with some and with electric
The film layer of sub- transfer function, i.e. these film layers are directed to the common formation of a plurality of organic illuminating elements, thus referred to as common layer
(common layer), such as can be hole injection layer (HIL), hole transmission layer (HTL), electron transfer layer (ETL), electronics
Implanted layer (EIL) and carrier generating layer (CGL) etc., these common layers be required to using mask plate (common metal mask,
CMM it) makes.The precision of CMM can influence the evaporation effect of common layer, and vapor deposition is bad to cause common layer electric leakage in side direction etc. to ask
Topic, and then display effect and the product yield etc. for influencing OLED.As OLED device product frame is more and more narrow, keep for it each
The space of film layer is smaller and smaller, and the precision of CMM will directly affect the quality of evaporation product, also therefore to the crucial ruler of CMM openings
More stringent requirements are proposed for very little (CD) precision and the precision of position dimension (TP), but is constrained to CMM manufacturing technology level, CMM
CD, TP and the technical specifications such as flatness threatened the production yield of screen and the narrow frame technique pole of OLED designs
Limit.
Invention content
The purpose of the present invention is to provide the manufacturing methods of a kind of mask plate, evaporation coating device and display device, can cover
Under the premise of diaphragm plate manufacturing technology level is constant, the opening size of mask plate and the available accuracy of position dimension are improved, reduction is covered
Diaphragm plate fold increases the Anawgy accuracy of mask plate and substrate to be deposited, promotes production yield.
To achieve the goals above, the present invention provides a kind of mask plate, and the mask plate includes multiple for evaporation material
Opening and be set to each parameatal at least one registration holes, the registration holes are for determining a base to be deposited
The contraposition of plate and mask plate, each without being connected between the registration holes and the opening.
Optionally, the shape of each opening is that circle, ellipse, diamond shape, rectangle or number of edges are just more more than or equal to 3
Side shape.
Optionally, all openings are in array distribution.
Optionally, the shape of each registration holes is that circle, ellipse, diamond shape, rectangle or number of edges are being more than or equal to 3 just
Polygon.
Optionally, the surrounding of each opening lays four registration holes, and each registration holes setting is opened described
The quartering position of mouthful corresponding opening spacing, the opening spacing are pair between the opening and its diagonal adjacent opening
Angular distance.
Optionally, each registration holes do not penetrate the mask plate, or each registration holes penetrate the mask
Plate, or each parameatal a part of registration holes penetrate the mask plate and another part registration holes do not penetrate it is described
Mask plate.
Optionally, the Vertical Square of extending direction of the registration holes in the mask plate and plane where the mask plate
To angle be 10 degree to 50 degree.
The present invention also provides a kind of evaporation coating devices, including：One of above-mentioned mask plate；Evaporation source is arranged at intervals at described
The side of mask plate, the material for providing vapor deposition, to form film layer；And heating device, for heating the evaporation source.
Optionally, the evaporation coating device is set to vacuum and in closed space, and the material of the vapor deposition is with electronics
The film material of transfer function.
The present invention also provides a kind of manufacturing methods of display device, including：
One substrate to be deposited and an above-mentioned evaporation coating device are provided；
Mask plate in the evaporation coating device is arranged on the substrate to be deposited, and according to pair on the mask plate
Position hole site adjusts the position of the mask plate, and the substrate to be deposited is made to be aligned with the mask plate；
By the heating devices heat evaporation source in the evaporation coating device, with the opening by the mask plate in institute
It states and forms film layer on substrate to be deposited.
Compared with prior art, technical scheme of the present invention has the following effects that：
1, mask plate and evaporation coating device of the invention are arranged on the periphery of each opening for evaporation material of mask plate
Multiple registration holes (being, for example, 4), can control the position of mask plate by the position of the registration holes of each open circumferential of control
Precision and frame precision (i.e. position dimension TP/ opening size CD) are set, the reliability thrown the net is increased；While these registration holes are also
Strain can be reduced with the stress at region between discrete openings (i.e. the not opening area of mask plate), reduce mask plate fold, raising is covered
The flatness of diaphragm plate increases the Anawgy accuracy of mask plate and substrate to be deposited, to promote vapor deposition yield and production yield, especially
It is that high PPI and narrow frame product are promoted clearly.
2, the manufacturing method of display device of the invention, evaporation coating device using the present invention are corresponding in substrate to be deposited vapor deposition
The film layer (such as common layer in organic light emitting display) with electron-transport function, the essence of the film layer of formation can be improved
Degree, improves the display effect and product yield of OLED display.
Description of the drawings
Figure 1A is a kind of structural schematic diagram of mask plate；
Figure 1B is a kind of CD and TP instrumentation plans of mask plate；
Fig. 2A is the structural schematic diagram of the mask plate of the specific embodiment of the invention；
Fig. 2 B are the cross-sectional views of the LL ' lines in Fig. 2A；
Fig. 2 C are the position views of the registration holes on the mask plate of the specific embodiment of the invention；
Fig. 2 D are CD the and TP instrumentation plans of the mask plate of the specific embodiment of the invention；
Fig. 3 is the Contrast on effect of mask plate shown in FIG. 1 and the mask plate of the specific embodiment of the invention；
Fig. 4 is the structural schematic diagram of the evaporation coating device of the specific embodiment of the invention.
Specific implementation mode
Please referring to Fig.1 A, a kind of known mask plate 10 includes being arranged in array and for multiple openings 101 of sputtering, this
Kind mask plate 10 is arranged by way of throwing the net on substrate to be deposited, and when throwing the net, region (is not carved between the opening of mask plate 10
Lose region) by larger stress, it is not easy to fallen by dispersion, easily causes and occur larger fold on mask plate, lead to part
There is deviation (i.e. 10 artoregistration of mask plate is inaccurate) in the position of opening 101, then causes to be deposited to oled display substrate etc.
When substrate is deposited, the outs open 101 on mask plate 10 can not precisely be aligned with the region to be deposited on substrate to be deposited,
Product yield is reduced, manufacturing cost is increased.In addition, mask plate 10 is needed when throwing the net by controlling opening 101
The aligning accuracy of control opening 101, the i.e. aligning accuracy of control mask plate 10 and substrate to be deposited are come in the position on four sides, thus
So that during vapor deposition, the opening size CD and position dimension TP of mask plate 10 are intended to the region to be deposited with substrate to be deposited
It is corresponding, do not allow, beyond the offset in error range, otherwise to will appear the problems such as product is bad.Specifically, B is please referred to Fig.1,
Four positions 1021 (X1, Y1) on 101 4 side of mouth, 1022 (X2, Y2), 1023 (X3, Y3), 1024 (X4, Y4) are usually taken away,
It is to calculate the size CD being open and position dimension TP, calculation formula using the transverse and longitudinal coordinate of four positions：CD
=(X2-X4, Y1-Y3)；TP=[(X2+X4)/2, (Y1+Y3)/2].This measurement mode, due to taking the position on four sides, accidentally
Difference is relatively large, and error rate is high, and the aligning accuracy of mask plate 10 and substrate to be deposited can be caused relatively low.Based on above-mentioned
Problem, if it is desired to which the yield for improving the film of mask plate 10 carries out 101 molding etch process of opening when manufacturing mask plate 10
It adjusts (i.e. etch effects are big), to the manufacturing cost and technology difficulty of increased mask plate 10.
Based on this, the present invention proposes a kind of new mask plate technical solution, mainly in original mask plate manufacturing process
On the basis of, a registration holes (being, for example, 4) are added in the surrounding that each of mask plate is open, when mask plate is thrown the net, with contraposition
On the basis of hole, the positional precision and frame of mask plate are controlled by the position of multiple registration holes of each open circumferential of control
Precision (i.e. TP/CD) increases the precision that opening measures, improves the reliability thrown the net；Disperse not carve using registration holes simultaneously
The stress in (region between being open), reduces strain at the concentration of region, reduces fold, improves compactness, good to promote vapor deposition
Rate and production yield.
To make the purpose of the present invention, feature be clearer and more comprehensible, the specific implementation mode of the present invention is made below in conjunction with the accompanying drawings
Further instruction, however, the present invention can be realized with different forms, should not be to be confined to the embodiment described.
A is please referred to Fig.2, the present invention provides a kind of mask plate 20, and the mask plate 20 includes multiple for evaporation material
It opening (Cell) 201 and is set at least one for determining that a substrate to be deposited (is not schemed around each opening 201
Show, can refer to 21 in Fig. 4) and mask plate contraposition registration holes (i.e. the holes TP) 202, each the registration holes 202 opened with described
Without connection between mouth 201.
The mask plate of the present invention can be used for being deposited the common layer of a plurality of organic illuminating elements in OLED display, this
When mask plate on each opening 201 correspond to OLED display corresponding subpixel area and its these subpixel areas it
Between interval region.Since the sub-pixel in OLED display is in usually array distribution, to reduce design difficulty and manufacture
Technology difficulty, therefore the opening 201 of the mask plate of the present invention is also in array distribution.And the shape of opening 201 is depending on to be formed
Common layer shape, preferably regular shape, e.g. circle, ellipse, diamond shape, rectangle or number of edges are more than or equal to 3
Regular polygon (such as equilateral triangle, square, regular pentagon, regular hexagon etc.) reduces technology difficulty in order to manufacture,
Save the process cost.
The registration holes of the surrounding of each opening are used when mask plate (CMM) is thrown the net, and control 201 peripheries of each opening
Registration holes position, so that it may to control the positional precision (i.e. TP) and frame precision (i.e. CD) of mask plate 20.It is each described
The registration holes of the surrounding of opening 201 can be uniformly distributed, the shape for being preferably shaped to rule of each registration holes 202, with
Convenient for manufacture, reduce technology difficulty, save the process cost, the shapes of each registration holes 202 be, for example, round, ellipse,
Diamond shape, rectangle or number of edges are more than or equal to 3 regular polygon.
In order to not influence the rigidity and aperture opening ratio of mask plate 20, while can maximumlly disperse not carve at the concentration of region
The stress in (at the region i.e. between adjacent apertures 201) reduces strain, improves the opening size and position dimension of mask plate 20
Available accuracy reduces mask plate fold, increases the Anawgy accuracy of mask plate and substrate to be deposited, promotes production yield, please refers to
Fig. 2A and Fig. 2 C can lay four registration holes 202 in the surrounding of each opening 201, and each setting of the registration holes 202 exists
The quartering position of 201 corresponding opening spacing of the opening, the opening spacing are that the opening diagonally adjacent is opened with it
Diagonal distance between mouthful.Come with reference to the region between four openings 201a, 201b, 201c and 201d in Fig. 2 C detailed
Illustrate that the setting of registration holes, four openings 201a, 201b, 201c and 201d correspond to four common layer vapor depositions of OLED display
Four opening 201a, 201b, 201c and 201d whole regions are not shown in Fig. 2 C, it is adjacent to illustrate only four openings by region
Angle, wherein (Fig. 2 C are only shown opening 201a (Fig. 2 C only show an angle of the opening) opening 201c for diagonally being abutted with it
One angle of the opening) between diagonal distance (i.e. be open 201a and be open 201c it is adjacent diagonally the distance between, such as Fig. 2 C
Shown in the dotted line of middle connection 201a and 201c) being defined as the first opening spacing, (example, the spacing can be equal to 1 or 1 or more
Pel spacing), the close opening 201a in the first opening spacing is arranged in the registration holes 202a being arranged on the angle for the 201a that is open
Quartering position, the close opening in the first opening spacing is arranged in the registration holes 202c being arranged on the angle for the 201c that is open
The quartering position of 202c, the opening 201d (figures that opening 201b (Fig. 2 C only show an angle of the opening) is diagonally abutted with it
2C only shows an angle of the opening) between diagonal distance (be open between 201b and adjacent diagonal of 201d that be open away from
From as shown in the dotted line for connecting 201b and 201d in Fig. 2 C) it is defined as the second opening spacing, which can be with the
One opening spacing is equal, can not also be equal, and the registration holes 202b settings being arranged on the angle of 201b that is open are opened described second
The quartering position of close the opening 201b of mouthful spacing, the registration holes 202d settings being arranged on the angle for the 201d that is open are described second
The quartering position of the close opening 202d for the spacing that is open.The set-up mode of this registration holes can disperse not carving region concentration
Locate the stress in (at the region i.e. between adjacent apertures 201), reduces strain, to reduce the fold generated on mask plate 20, carry
Compactness between high mask plate 20 and substrate to be deposited ensures the quality for the film layer being deposited on substrate to be deposited, to manufacture
The influence of the etch process of opening 201 on mask plate 20 is smaller.
According to the design requirement of mask plate 20, registration holes 202 can be used half quarter mode formed, full etching side can also be used
Formula is formed.Wherein, the registration holes 202 for mode being carved using half do not penetrate the mask plate 20, can enhance mask plate 20
Rigidity, please refers to Fig.2 B, the depth H of registration holes 202 can be the 30%~70% of the thickness of mask plate 20, such as registration holes
202 depth H is the half (i.e. 50%) of the thickness of mask plate 20.In addition, in order to further enhance 202 dispersive stress of registration holes
Ability, registration holes 202 along its hole depth direction (i.e. extending direction of the registration holes 201 in the mask plate 20) for
The hole that 20 inner inclination of mask plate extends, and extension side of the registration holes 202 around each opening 201 in the mask plate 20
Inclined to (i.e. the hole depth directions of registration holes 201), and the bottom of the bottom of each registration holes 202 and the opening 201 it
Between distance be more than the registration holes 202 top with it is described opening 201 the distance between top, it is preferred that the registration holes
201 extending direction (i.e. the hole depth directions of registration holes 201) in the mask plate 20 and 20 place plane of the mask plate
The angle theta of vertical direction is 10 degree to 50 degree, for example, 30 degree or 45 degree, thus can ensure that the machinery of mask plate 20 is strong
Degree, can also enhance the ability of 202 dispersive stress of registration holes.The registration holes 202 formed using full quarter mode penetrate the mask
Plate 20 can reduce technology difficulty so that the stress of mask plate 20 everywhere is relatively uniform when throwing the net, and is formed using full quarter mode
Registration holes 202 can vertically penetrate mask plate 20, can tilt to penetrate the mask plate 20.In order to both so that mask plate 20
With enough rigidity, have so that mask plate 20 can make one around each opening 201 with enough toughness
Point registration holes 202 penetrate the mask plate 20 and another part registration holes 202 do not penetrate the mask plate 20.
The mask plate 20 of the present embodiment is arranged by way of throwing the net when on substrate to be deposited, it is only necessary to be opened by control
The position of the registration holes 202 of the surrounding of mouth 201 can control the aligning accuracy of opening 201, that is, control mask plate 20 and wait steaming
The aligning accuracy of plated substrate so that the size CD and position TP of the opening 201 of mask plate 20 are to be deposited with substrate to be deposited
Region (such as each subpixel area) is corresponding, without departing from the offset in error range, avoids common layer electric leakage in side direction etc.
The generation of problem, and then avoid luminous influence between adjacent subpixels and product bad etc..Specifically, D is please referred to Fig.2,
Utilize the registration holes 2021 (X1, Y1) in 201 4 jiaos of an opening, 2022 (X2, Y2), 2023 (X3, Y3), 2024 (X4, Y4)
Transverse and longitudinal coordinate come calculate carry out mask plate 20 opening 201 opening size CD and position dimension TP, calculation formula be：CD
=(X2+X3-X1-X4, Y2+Y3-Y1-Y4)；TP=[(X1+X2+X3+X4)/4, (Y1+ is with+Y3+Y4)/4].Referring to FIG. 3,
Fig. 3 shows the Contrast on effect of the mask plate 20 and mask plate shown in figure 1A 10 of the present invention, wherein the measurement mode of the present invention,
Due to taking the position of the registration holes 202 of 201 surroundings of each opening to calculate CD and TP, error is small, error rate is very low, and aligns
Drawing force when hole 202 can disperse to throw the net so that mask plate 20 is more flat, ensures the shape of opening 201, is covered so as to improve
The aligning accuracy of diaphragm plate 20 and substrate to be deposited, and then product yield is improved, reduce manufacturing cost.
Referring to FIG. 4, the present invention also provides a kind of evaporation coating devices, including：The present invention mask plate 20, heating device 22 with
And evaporation source 23；Mask plate 20 is arranged by way of throwing the net on the substrate 21 to be deposited, and evaporation source 23 is arranged at intervals at
The side of the mask plate 20, for providing the material being deposited, with by the opening 201 of the mask plate 20 to described to be deposited
Substrate 21 provides required filmogen, and to form required film layer on the substrate 21 to be deposited, heating device 22 is used for
Heat the evaporation source 23.The mask plate 20, heating device 22, evaporation source 23 may be contained in a vacuum chamber 24, vacuum chamber
24 for providing vacuum and closed space.When the evaporation coating device is used for the manufacture of OLED display, evaporation source 23 can
To provide the film material with electron-transport function.
In conclusion the mask plate and evaporation coating device of the present invention, in each opening for evaporation material of mask plate
Multiple registration holes (being, for example, 4) are arranged in periphery, can be covered by controlling the position of the registration holes of each open circumferential to control
The positional precision and frame precision (i.e. position dimension TP/ opening size CD) of diaphragm plate, increase the reliability thrown the net；While these
Registration holes can reduce strain with the stress at region between discrete openings (i.e. the not opening area of mask plate), reduce mask plate fold,
The flatness of mask plate is improved, the Anawgy accuracy of mask plate and substrate to be deposited is increased, to promote vapor deposition yield and produce good
Rate is promoted clearly especially for high PPI and narrow frame product.
In addition, please referring to Fig.2 A and Fig. 4, the present invention also provides a kind of manufacturing methods of display device, include the following steps：
First, 21 and one evaporation coating device shown in Fig. 4 of substrate to be deposited is provided, the evaporation coating device includes mask plate
20, heating device 22 and evaporation source 23, the mask plate 20 include multiple for the film layer with electron-transport function to be deposited
It the opening 201 of material and is set at least one for determining 21 He of substrate to be deposited around each opening 201
The registration holes 202 that mask plate 20 aligns, without being connected between each registration holes 202 and the opening 201；The base to be deposited
It can be provided with alignment mark on plate 20, for establishing coordinate system, determine that the position of each registration holes 202 on mask plate 20 is sat
Mark, the evaporation source 23 can provide luminous organic material；
Then, the mask plate 20 is arranged on the substrate 21 to be deposited by way of throwing the net, and according to described
202 position of registration holes on mask plate 20 adjusts the position of the mask plate 20, makes the opening 201 on the mask plate 20
Position is corresponding with the position in region to be deposited on the substrate 21 to be deposited, realizes the substrate to be deposited 21 and the mask
Plate 20 aligns；
Then, it by the substrate to be deposited 21 aligned and the mask plate 20, is put together with heating device 22, evaporation source 23 etc.
Enter in vacuum chamber 24, by 22 heating and continuous evaporation source 23 of the heating device, evaporation source 23 is evaporated after reaching certain temperature
The film material particle of electron-transport function is provided, a part of film material particle with electron-transport function is passed through and covered
The opening 201 of diaphragm plate 20, and being deposited with crystalline state after touching the lower substrate 21 to be deposited of temperature, in vacuum and
In closed space, luminous organic material is provided to the substrate 21 to be deposited by the opening 201 of the mask plate 20, with
The film layer with electron-transport function is formed on the substrate to be deposited 21, that is, forms a certain common layer.
When OLED display there are many common layer when, can according to 202 position of registration holes on the mask plate 20 come
The different contrapositions for realizing the mask plate 20 and the substrate to be deposited 21 respectively, every time after contraposition, on the mask plate 20
The position of opening 201 is corresponding with a certain position in region to be deposited of common layer on the substrate 21 to be deposited, to described
Vapor deposition forms required common layer on substrate 21 to be deposited.Such as when OLED display has hole injection layer (HIL), hole to pass
It is two or more common in defeated layer (HTL), electron transfer layer (ETL), electron injecting layer (EIL) and carrier generating layer (CGL)
When the position of layer and these common layers is not exactly the same, first, adjusted according to the position of the registration holes 202 on the mask plate 20
The position of the whole mask plate 20 makes the position and on the substrate 21 to be deposited first of the opening 201 on the mask plate 20
The region to be deposited of the common layer of position corresponds to, and then heats evaporation source 23 by heating device 22, in the substrate to be deposited
Vapor deposition forms the common layer of first position on 21；Then, it is adjusted again according to the position of the registration holes 202 on the mask plate 20
The position of the mask plate 20, the position and the second position on the substrate 21 to be deposited for making the opening on the mask plate 20
The region to be deposited of common layer corresponds to, then heats evaporation source 23 by heating device 22, is deposited on the substrate 21 to be deposited
Form the common layer of the second position；..., and so on, until all positions and all layers of common layer are deposited and complete.It needs
Illustrate, when the position of the common layer of adjacent two layers is identical, mask plate 20 can not be moved, but by replacing evaporation source 23
In evaporation material method, carry out the common layer of the identical adjacent two layers of forming position.
The manufacturing method of the display device of the present invention, since phase is deposited in substrate to be deposited in evaporation coating device using the present invention
The film layer (i.e. common layer) answered, mask plate therein and substrate Anawgy accuracy to be deposited are high, can improve the common layer of formation
Precision the problems such as avoiding causing common layer electric leakage in side direction, improves the display effect and product yield of OLED display.
It should be noted that in the manufacturing method of display device described in above-described embodiment, mainly with OLED display
In film layer with electron-transport function vapor deposition for illustrate, but the technology of the manufacturing method of the display device of the present invention
Scheme is not merely defined in this, and those skilled in the art can carry out the replacement of the material in evaporation source as needed, with
The film layer with other functions needed for substrate manufacture to be deposited.
Obviously, those skilled in the art can carry out invention spirit of the various modification and variations without departing from the present invention
And range.If in this way, these modifications and changes of the present invention belong to the claims in the present invention and its equivalent technologies range it
Interior, then the present invention is also intended to include these modifications and variations.
Claims (10)
1. a kind of mask plate, which is characterized in that the mask plate includes multiple openings for evaporation material, and is set to every
A parameatal at least one registration holes, the registration holes are used to determine pair of a substrate to be deposited and the mask plate
Position, each without being connected between the registration holes and the opening.
2. mask plate as described in claim 1, which is characterized in that the shape of each opening is round, oval, water chestnut
Shape, rectangle or number of edges are more than or equal to 3 regular polygon.
3. mask plate as described in claim 1, which is characterized in that all openings are in array distribution.
4. mask plate as described in claim 1, which is characterized in that the shape of each registration holes is round, oval, water chestnut
Shape, rectangle or number of edges are more than or equal to 3 regular polygon.
5. mask plate as described in claim 1, which is characterized in that the substrate to be deposited is display base plate, each described to open
The surrounding of one pixel of the corresponding display base plate of mouth, each opening lays four registration holes, and each contraposition
Hole is separately positioned on the quartering position of the corresponding opening spacing of the opening, and the opening spacing is that the opening is diagonal with it
Opening between diagonal distance.
6. mask plate as described in claim 1, which is characterized in that each registration holes do not penetrate the mask plate, or
Each registration holes penetrate the mask plate, or each parameatal a part of registration holes penetrate the mask plate
And another part registration holes do not penetrate the mask plate.
7. such as mask plate according to any one of claims 1 to 6, which is characterized in that the registration holes are in the mask plate
Extending direction and the mask plate where the angle of vertical direction of plane be 10 degree to 50 degree.
8. a kind of evaporation coating device, which is characterized in that including：
Mask plate described in any one of claim 1 to 7；
Evaporation source is arranged at intervals at the side of the mask plate, the material for providing vapor deposition, to form film layer；And
Heating device, for heating the evaporation source.
9. evaporation coating device according to claim 8, which is characterized in that the evaporation coating device is set to vacuum and closed sky
In, the material of the vapor deposition is the film material with electron-transport function.
10. a kind of manufacturing method of display device, which is characterized in that including：
Evaporation coating device described in one substrate to be deposited and a claim 8 or 9 is provided；
Mask plate in the evaporation coating device is arranged on the substrate to be deposited, and according to the registration holes on the mask plate
Position adjusts the position of the mask plate, and the substrate to be deposited is made to be aligned with the mask plate；
By the heating devices heat evaporation source in the evaporation coating device, to be waited for described by the opening of the mask plate
Film layer is formed on vapor deposition substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810552853.4A CN108531855B (en) | 2018-05-31 | 2018-05-31 | Mask plate, evaporation device and manufacturing method of display device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN109609911A (en) * | 2019-01-10 | 2019-04-12 | 云谷（固安）科技有限公司 | Mask plate, evaporation coating device and mask plate alignment method |
| CN109868452A (en) * | 2019-03-19 | 2019-06-11 | 武汉华星光电半导体显示技术有限公司 | Coldplate and vacuum deposition apparatus |
| CN110066975A (en) * | 2019-05-14 | 2019-07-30 | 京东方科技集团股份有限公司 | The design method of opening is deposited in mask plate, evaporation coating device, evaporation coating method and mask plate |
| CN110246989A (en) * | 2019-05-07 | 2019-09-17 | 信利半导体有限公司 | A kind of production method of Full-color OLED display |
| CN112962055A (en) * | 2021-01-29 | 2021-06-15 | 合肥维信诺科技有限公司 | Mask plate, display substrate evaporation assembly and display substrate |
| CN115627444A (en) * | 2022-11-02 | 2023-01-20 | 合肥维信诺科技有限公司 | Mask assembly and mask assembly carrying method |
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